Rockwell Collins Printed Circuits

Precise leading-edge technology. KEY FEATURES —— Final finish >> Primarily address high technology, – Immersion silver complex, and specialty printed circuit – Immersion tin Rockwell Collins Printed Circuits offers board market – Electroless nickel/immersion gold Printed Circuit Board product that – Electroplated nickel/gold satisfy the highest standards of military, >> Focus is on low to medium volume – Tin lead plated telecommunications, and instrumentation quantity – HASL industries. Our history of expertise >> Standard technologies —— Heatsink assemblies in avionics, communications and —— 8 - 30 layers standard material —— Heavy copper manufacturing uniquely qualifies us to —— 2 - 12 layers specialty materials —— Controlled impedance meet the most rigid industry standards for —— Blind and buried vias —— Copper invar copper our customers. —— Sequential lamination —— Standard materials By leveraging our 40 years of history of – FR-4 world-class printed circuit manufacturing – Polyimide and quality, Rockwell Collins Printed – BT Circuits assures we will meet your —— Specialty exacting specifications. – Mixed dielectric – Rogers We are your trusted printed circuit board – Taconic (PCB) fabrication resource. – Arlon INNOVATIVE TECHNOLOGIES SPECIFICATIONS >> Fine circuit trace - .002” (review required) >> ANSI/NCSL Z540-1-1994 (calibrations) >> Small plated hole - .006” >> J-STD-003 >> Microvia >> IPC-6012 (committee member) >> RF AccuBond™ >> IPC-6018 (committee member) —— “Void Free” PCB to metal pallet bonding >> IPC-A-600 (committee member) —— Metal fused bond line >> IPC-SM-840 (committee member) —— Reduction or elimination of associated tuning requirements and costs >> MIL-PRF-55110 —— Superior grounding versus adhesive bonding —— Excellent thermal dissipation CERTIFICATIONS —— Consistent electrical performance >> ISO-9001:2000 —— Competitively priced >> MIL-PRF-55110 QPL —— Applications – Flat surface pallets >> Underwriters Laboratory (UL) 94-V0 – Multi-planar pallets with PCB in pallet cavities >> ISO 14001 – PCBs bonded to one or both sides —— Alternative and superior to other bonding processes: – Sweat soldering – Metalback PCBs – Adhesive bonding films

KEY BENEFITS >> Design definition and review Building trust every day. >> Prototype development Rockwell Collins delivers smart communication and aviation >> Design for manufacturability (DFM) electronic solutions to customers worldwide. Backed by a global >> Value engineering network of service and support, we stand committed to putting >> Quality engineering technology and practical innovation to work for you whenever and wherever you need us. In this way, working together, we >> Statistical process control build trust. Every day. >> Inventory management >> Electronic data exchange >> Comprehensive ramp-to-manufacturing services

FACILITY Rockwell Collins operates from a state-of-the-art 65,000 sq ft manufacturing facility that is part of the Rockwell Collins 4.5+ million sq ft campus in Cedar Rapids, Iowa. For more information contact: QUALITY Rockwell Collins Rockwell Collins Printed Circuits maintains a customer acceptance 400 Collins Road NE rate of 99.5% or better. This has been achieved by strict adherence Cedar Rapids, Iowa 52498 to the industry standards identified below, achieving the certifications also identified below, and by following the principles Attn: Manager, CPC Marketing of Lean Electronics. M/S: 110-123 319.295.3673 email: [email protected] www.rockwellcollins.com/about/additionalproducts/ collinsprintedcircuits/index.html