Printed Circuit Board Recycling Methods
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Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components. -
Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical -
Best Practices for Board Layout of Motor Drivers
Application Report SLVA959A–November 2018–Revised January 2019 Best Practices for Board Layout of Motor Drivers .................................................................................................................. Motor Drive Business Unit ABSTRACT PCB design of motor drive systems is not trivial and requires special considerations and techniques to achieve the best performance. Power efficiency, high-speed switching frequency, low-noise jitter, and compact board design are few primary factors that designers must consider when laying out a motor drive system. Texas Instruments' DRV devices are ideal for such type of systems because they are highly integrated and well-equipped with protection circuitry. The goal of this application report is to highlight the primary factors of a motor drive layout when using a DRV device and provide a best practice guideline for a high performance solution that reduces thermal stress, optimizes efficiency, and minimizes noise in a motor drive application. Contents 1 Grounding Optimization ..................................................................................................... 3 2 Thermal Overview ........................................................................................................... 7 3 Vias........................................................................................................................... 11 4 General Routing Techniques ............................................................................................. 14 5 Bulk and Bypass -
MAT 253 Operating Manual - Rev
MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING -
IN-VITRO EVALUATION of the ANTICANCER ACTIVITY of Cu(II)AMINA(CYSTEINE)DITHIOCARBAMATE
Sys Rev Pharm 2020;11(9):43-51 A multifaceted review journal in the field of pharmacy IN-VITRO EVALUATION OF THE ANTICANCER ACTIVITY OF Cu(II)AMINA(CYSTEINE)DITHIOCARBAMATE Desy Kartina1, Abdul Wahid Wahab 2, Ahyar Ahmad3, Rizal Irfandi 4, Prihantono5, And Indah Raya6* 1Department of Chemistry, Faculty of Mathematics, and Natural Science, Hasanuddin University, Makassar 90245, Indonesia 2Department of Chemistry, Faculty of Mathematics, and Natural Science, Hasanuddin University, Makassar 90245, Indonesia 3Department of Chemistry, Faculty of Mathematics, and Natural Science, Hasanuddin University, Makassar 90245, Indonesia 4Department of Biology Education, Faculty of Teacher Training and Education, Puangrimaggalatung University Sengkang, 90915, Indonesia. 5Departement of Surgery, Faculty of Medicinal, Hasanuddin University, Makassar Indonesia, 90245 6*Department of Chemistry, Faculty of Mathematics, and Natural Science, Hasanuddin University, Makassar 90245, Indonesia ABSTRACT The Complex of Cu(II)cysteinedithiocarbamate has been synthesized, it Keywords: Anticancer, Cu(ll)Amina(cysteine)dithiocarbamate. was prepared by the “in situ method” and characterized by using Correspondance: Ultraviolet-Visible (UV-Vis), Infra-Red (IR) spectroscopy, X-Ray Indah Raya Fluorescence (XRF) instruments. While melting point and conductivity Department of Chemistry, also measured. The presence of UV-Vis maximum spectrums of Faculty of Mathematics, and Natural Science, Cu(II)cysteinedithiocarbamate at 296 nm and 436 nm indicated that Hasanuddin University, electronic transition π → π * dan n → π * of CS2 and N=C=S myotis. The Makassar 90245, Indonesia presence of the wavelength in the region of 399-540 cm-1 of IR spectra Email id : [email protected], [email protected] is indicated that has been coordination occurred between Cu(II) with Sulphur (S), Nitrogen (N), and Oxygen(O) atoms respectively from cysteinedithiocarbamate ligands. -
Series Catalog
Conductive Polymer Aluminum Electrolytic Capacitors Surface Mount Type CY,SY series ［Guaranteed at 85 ℃］ Features ● Endurance 85 ℃ 2000 h ● Product height (3.0 mm max.) ● High ripple current (5100 mA rms to 6300 mA rms max.) ● RoHS compliance, Halogen free Specifications Series CY / SY Category temp. range –55 ℃ to +85 ℃ Rated voltage range 4.0 V, 6.3V Nominal cap. range 330 μF to 470 μF Capacitance tolerance ±20 % (120 Hz / +20 ℃) DC leakage current I ≦ 0.1 CV (μA) 2 minutes Dissipation factor (tan δ) ≦ 0.06 (120 Hz / + 20 ℃) Surge voltage (V) Rated voltage × 1.25 (15 ℃ to 35 ℃) +85 ℃ 2000 h, rated voltage applied Capacitance change Within ±20 % of the initial value Endurance Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current ≦ 3 times of the initial limit +60 ℃, 90 % RH, 500 h, No-applied voltage Capacitance change of 4.0 V 6.3 V Damp heat initial measurd value +60 %, –20 % +50 %, –20 % (Steady state) Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current Within the initial limit Marking Dimensions (not to scale) Capacitance (μF） Polarity bar (Positive) ⊖ ⊕ H P P L W1 W2 Lot No. W2 R. voltage code R. voltage code Unit：V 単位：ｍｍ g 4.0 Series L±0.2 W1±0.2 W2±0.1 H±0.2 P±0.3 j 6.3 CY / SY 7.3 4.3 2.4 2.8 1.3 ✽ Externals of figure are the reference. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. -
Recent Advances in Microwave-Assisted Copper-Catalyzed Cross-Coupling Reactions
catalysts Review Recent Advances in Microwave-Assisted Copper-Catalyzed Cross-Coupling Reactions Younis Baqi Department of Chemistry, College of Science, Sultan Qaboos University, P.O. Box 36, Muscat 123, Oman; [email protected]; Tel.: +968-2414-1473 Abstract: Cross-coupling reactions furnishing carbon–carbon (C–C) and carbon–heteroatom (C–X) bond is one of the most challenging tasks in organic syntheses. The early developed reaction protocols by Ullmann, Ullman–Goldberg, Cadiot–Chodkiewicz, Castro–Stephens, and Corey–House, utilizing elemental copper or its salts as catalyst have, for decades, attracted and inspired scientists. However, these reactions were suffering from the range of functional groups tolerated as well as severely restricted by the harsh reaction conditions often required high temperatures (150–200 ◦C) for extended reaction time. Enormous efforts have been paid to develop and achieve more sustainable reaction conditions by applying the microwave irradiation. The use of controlled microwave heating dramatically reduces the time required and therefore resulting in increase in the yield as well as the efficiency of the reaction. This review is mainly focuses on the recent advances and applications of copper catalyzed cross-coupling generation of carbon–carbon and carbon–heteroatom bond under microwave technology. Keywords: cross-coupling reaction; Cu catalyst; microwave irradiation; methodology; synthesis 1. Introduction Carbon–carbon (C–C) and carbon–heteroatom (C–X) bond formations through cross- Citation: Baqi, Y. Recent Advances in coupling reactions represents as one of the most useful strategy in the synthetic organic Microwave-Assisted chemistry, hence many procedures and methodologies have been developed and published Copper-Catalyzed Cross-Coupling in the literature. -
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT of USED and SCRAP PERSONAL COMPUTERS (Pcs)
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT OF USED AND SCRAP PERSONAL COMPUTERS (PCs) Robert Tonetti US EPA, Office of Solid Waste Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations 28-29 September 2000 Vienna, Austria TABLE OF CONTENTS INTRODUCTION...........................................................................................................................................4 DEFINITION AND CHARACTERIZATION OF “USED AND SCRAP PCS” ...........................................5 PRINCIPAL ENVIRONMENTAL CONCERNS...........................................................................................7 Substances of Concern.................................................................................................................................7 Exposure to Substances of Concern.............................................................................................................8 OVERVIEW OF REUSE/RECYCLING PRACTICES..................................................................................9 Overview of Reuse.......................................................................................................................................9 Environmental Considerations of Reuse......................................................................................................9 Overview of Raw Material Recovery ........................................................................................................10 GUIDELINES FOR DOMESTIC PROGRAMS ..........................................................................................12 -
OPERATION ASSIGNMENT with BOARD SPLITTING and MULTIPLE MACHINES in PRINTED CIRCUIT BOARD ASSEMBLY by SAKCHAI RAKKARN Submitted
OPERATION ASSIGNMENT WITH BOARD SPLITTING AND MULTIPLE MACHINES IN PRINTED CIRCUIT BOARD ASSEMBLY by SAKCHAI RAKKARN Submitted in partial fulfillment of the requirements For the degree of Doctor of Philosophy Dissertation Adviser: Dr. Vira Chankong Department of Electrical Engineering and Computer Science CASE WESTERN RESERVE UNIVERSITY May, 2008 CASE WESTERN RESERVE UNIVERSITY SCHOOL OF GRADUATE STUDIES We hereby approve the thesis/dissertation of ______________________________________________________ candidate for the ________________________________degree *. (signed)_______________________________________________ (chair of the committee) ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ (date) _______________________ *We also certify that written approval has been obtained for any proprietary material contained therein. i Table of Contents Table of Contents…………………………………………………………………………..i List of Figures……………………………………………………………………………..v List of Tables…………………………………………………………………………….vii Acknowledgements………………………………………………………………………..x Abstract…………………………………………………………………………………...xi 1 Introduction……………………………………………………………………………...1 1.1 The Overview of Printed Circuit Board Assembly…………………………....1 1.2 Planning and Process for PCB Assembly……………………………………..2 1.3 Problem Statement and Rationale...…………………………………………...6 1.4 Research Objective……………………………………………………………8 -
Field Programmable Gate Array (FPGA) Based Trigger System for the Klystron Department
SLAC-TN-10-007 Field Programmable Gate Array (FPGA) Based Trigger System for the Klystron Department Darius Gray Office of Science, Science Undergraduate Laboratory Internship Program Texas A&M University, College Station SLAC National Accelerator Laboratory Menlo Park, California August 14, 2009 Prepared in partial fulfillment of the requirement of the Office of Science, Department of Energy’s Science Undergraduate Laboratory Internship under the direction of Michael G. Apte in the Environmental Energy and Technology division at Lawrence Berkeley National Laboratory. Participant: __________________________________ Signature Research Advisor: __________________________________ Signature Work supported in part by US Department of Energy contract DE-AC02-76SF00515. Table of Contents Abstract……….2 Introduction/Problem Description………….3 Materials and Methods…………..3 Literature Cited…………....…10 Acknowledgements…………..11 Figures and Tables…………12 1 Abstract Field Programmable Gate Array (FPGA) Based Trigger System for the Klystron Department. Darius Gray, Alternative Paper, Science Undergraduate Laboratory Internship, SLAC National Accelerator Laboratory, Summer 2009. The Klystron Department is in need of a new trigger system to update the laboratory capabilities. The objective of the research is to develop the trigger system using Field Programmable Gate Array (FPGA) technology with a user interface that will allow one to communicate with the FPGA via a Universal Serial Bus (USB). This trigger system will be used for the testing of klystrons. The key materials used consists of the Xilinx Integrated Software Environment (ISE) Foundation, a Programmable Read Only Memory (Prom) XCF04S, a Xilinx Spartan 3E 35S500E FPGA, Xilinx Platform Cable USB II, a Printed Circuit Board (PCB), a 100 MHz oscillator, and an oscilloscope. Key considerations include eight triggers, two of which have variable phase shifting capabilities. -
MTD1N50E Power MOSFET 1 Amp, 500 Volts
ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. -
Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development*
IJEE 1830 Int. J. Engng Ed. Vol. 22, No. 1, pp. 000±000, 2006 0949-149X/91 $3.00+0.00 Printed in Great Britain. # 2006 TEMPUS Publications. Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development* PHILLIP A.M.SANDBORN AND PETER A.SANDBORN CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD, USA.E-mail: [email protected] Embedded resistors are planar resistors that are fabricated inside printed circuit boards and used as an alternative to discrete resistor components that are mounted on the surface of the boards.The successful use of embedded resistors in many applications requires that the resistors be trimmed to required design values prior to lamination into printed circuit boards.This paper describes a simple emulation approach utilizing conductive paper that can be used to characterize embedded resistor operation and experimentally optimize resistor trimming patterns.We also describe a hierarchy of simple modeling approaches appropriate to both college engineering students and pre-college students that can be verified with the experimental results, and used to extend the experimental trimming analysis.The methodology described in this paper is a simple and effective approach for demonstrating a combination of measurement methods, uncertainty analysis, and associated engineering model development. Keywords: embedded resistors; embedded passives; trimming INTRODUCTION process that starts with a layer pair that is pre- coated with resistive material that is selectively EMBEDDING PASSIVE components (capaci- removed to create the resistors.The layer contain- tors, resistors, and possibly inductors) within ing the resistor is laminated together with other printed circuit boards is one of a series of technol- layers to make the finished printed circuit board.