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onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. MTD1N50E
Preferred Device Power MOSFET 1 Amp, 500 Volts N−Channel DPAK This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage−blocking capability without degrading performance over time. In addition this advanced high voltage http://onsemi.com MOSFET is designed to withstand high energy in the avalanche and commutation modes. The energy efficient design also offers a 1 AMPERE drain−to−source diode with a fast recovery time. Designed for high 500 VOLTS voltage, high speed switching applications in power supplies, Ω converters and PWM motor controls, these devices are particularly RDS(on) = 5 well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin N−Channel against unexpected voltage transients. D • Robust High Voltage Termination • Avalanche Energy Specified • Source−to−Drain Diode Recovery Time Comparable to a G Discrete Fast Recovery Diode • Diode is Characterized for Use in Bridge Circuits S • IDSS and VDS(on) Specified at Elevated Temperature MARKING MAXIMUM RATINGS (TC = 25°C unless otherwise noted) DIAGRAM Rating Symbol Value Unit Drain−to−Source Voltage V 500 Vdc 4 DSS CASE 369A YWW T Drain−to−Gate Voltage (R = 1.0 MΩ) V 500 Vdc DPAK GS DGR 2 1N50E 1 STYLE 2 Gate−to−Source Voltage 3 − Continuous VGS ±20 Vdc − Non−repetitive (tp ≤ 10 ms) VGSM ±40 Vpk Y = Year WW = Work Week Drain Current − Continuous ID 1.0 Adc T = MOSFET − Continuous @ 100°C ID 0.8 − Single Pulse (t ≤ 10 µs) I 3.0 Apk p DM PIN ASSIGNMENT Total Power Dissipation @ TC = 25°C PD 40 Watts 4 Derate above 25°C 0.32 W/°C Drain Total Power Dissipation @ TA = 25°C, when 1.75 Watts mounted to minimum recommended pad size
Operating and Storage Temperature TJ, Tstg −55 to °C Range 150 1 2 3 Single Pulse Drain−to−Source Avalanche EAS 45 mJ Gate Drain Source Energy − Starting TJ = 25°C (VDD = 100 Vdc, VGS = 10 Vdc, ORDERING INFORMATION IL = 3.0 Apk, L = 10 mH, RG = 25 Ω) Device Package Shipping Thermal Resistance °C/W − Junction to Case RθJC 3.13 MTD1N50E DPAK 75 Units/Rail − Junction to Ambient RθJA 100 − Junction to Ambient, when mounted to RθJA 71.4 MTD1N50E1 DPAK 75 Units/Rail minimum recommended pad size MTD1N50ET4 DPAK 2500 Tape & Reel Maximum Temperature for Soldering TL 260 °C Purposes, 1/8″ from case for 10 seconds Preferred devices are recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2004 1 Publication Order Number: August, 2004 − Rev. XXX MTD1N50E/D MTD1N50E
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS
Drain−Source Breakdown Voltage V(BR)DSS (VGS = 0 Vdc, ID = 0.25 µAdc) 500 − − Vdc Temperature Coefficient (Positive) − 480 − mV/°C
Zero Gate Voltage Drain Current IDSS µAdc (VDS = 500 Vdc, VGS = 0 Vdc) − − 10 (VDS = 500 Vdc, VGS = 0 Vdc, TJ = 125°C) − − 100
Gate−Body Leakage Current (VGS = ±20 Vdc, VDS = 0) IGSS − − 100 nAdc ON CHARACTERISTICS (Note 1.)
Gate Threshold Voltage VGS(th) (VDS = VGS, ID = 250 µAdc) 2.0 3.2 4.0 Vdc Temperature Coefficient (Negative) − 6.0 − mV/°C
Static Drain−Source On−Resistance (VGS = 10 Vdc, ID = 0.5 Adc) RDS(on) − 4.3 5.0 Ohm
Drain−Source On−Voltage (VGS = 10 Vdc) VDS(on) Vdc (ID = 1.0 Adc) − 4.5 6.0 (ID = 0.5 Adc, TJ = 125°C) − − 5.3
Forward Transconductance (VDS = Vdc, ID = 0.5 Adc) gFS 0.5 0.9 − mhos DYNAMIC CHARACTERISTICS
Input Capacitance Ciss − 215 315 pF (V = 25 Vdc, Vd V = 10 Vdc, Vd Output Capacitance DS GS C − 30.2 42 f = 11.0.0 MHz)MHz) oss Reverse Transfer Capacitance Crss − 6.7 12 SWITCHING CHARACTERISTICS (Note 2.)
Turn−On Delay Time td(on) − 8.0 20 ns (V = 250 Vdc, I = 1.0 Adc, Rise Time DD D tr − 9.0 10 VGS ==10Vdc 10 Vdc, Turn−Off Delay Time t − 14 30 RG = 9.1 Ω) d(off) Fall Time tf − 17 30
Gate Charge QT − 7.4 9.0 nC (S(See Figure Fi 8) Q − 1.6 − (VDS = 400 Vdc,Vdc, ID = 1.01.0 Adc,Adc, 1 V = 10 Vdc) GS Q2 − 3.8 −
Q3 − 5.0 − SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage (Note 1.) (IS = 1.0 Adc, VGS = 0 Vdc) VSD Vdc (IS = 1.0 Adc, VGS = 0 Vdc, − 0.81 1.2 TJ = 125°C) − 0.68 −
Reverse Recovery Time trr − 141 − ns (S(See Figure Fi 14) ta − 82 − (IS ==10AdcV 1.0 Adc, VGS = 0 Vdc, Vdc t − 58.5 − dIS/dt = 100 A/µs) b Reverse Recovery Stored QRR − 0.65 − µC Charge
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance LD nH (Measured from contact screw on tab to center of die) − 3.5 − (Measured from the drain lead 0.25″ from package to center of die) − 4.5 −
Internal Source Inductance LS − 7.5 − nH (Measured from the source lead 0.25″ from package to source bond pad) 1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. 2. Switching characteristics are independent of operating junction temperature.
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TYPICAL ELECTRICAL CHARACTERISTICS
2.0 2.0 TJ = 25°C VGS = 10 V VDS ≥ 10 V 1.75 7 V 1.75 8 V 1.50 6 V 1.50
1.25 1.25
1.0 1.0
0.75 0.75 , DRAIN CURRENT (AMPS) 0.50 , DRAIN CURRENT (AMPS) 0.50 T = 100°C D 5 V D J I I 25°C 0.25 0.25 −55°C 0 0 0 2 4 6 8 10 12 14 16 2.0 2.5 3.0 3.5 4.0 4.5 5.05.5 6.0 6.5
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
10 6.0 V = 10 V GS TJ = 25°C T = 100°C J 5.5 8
5.0 6 VGS = 10 V 25°C 4.5
4 15 V 4.0 −55°C 2 3.5 , DRAIN−TO−SOURCE RESISTANCE (OHMS) , DRAIN−TO−SOURCE RESISTANCE (OHMS)
0 3.0 DS(on) DS(on)
R 0 0.4 0.8 1.2 1.6 2.0R 0 0.25 0.50 0.75 1.0 1.25 1.50 1.75 2.0
ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS)
Figure 3. On−Resistance versus Drain Current Figure 4. On−Resistance versus Drain Current and Temperature and Gate Voltage
2.5 10000 VGS = 10 V VGS = 0 V ID = 0.5 A 2.0 T = 125°C 1000 J
1.5 100°C 100 1.0 , LEAKAGE (nA) (NORMALIZED) DSS
I 10 25°C
, DRAIN−TO−SOURCE RESISTANCE 0.5 DS(on) R 0 1 − 50 − 25 0 25 50 75 100 125 150 0 100 200 300400 500
TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 5. On−Resistance Variation with Figure 6. Drain−To−Source Leakage Temperature Current versus Voltage
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POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted The capacitance (Ciss) is read from the capacitance curve at by recognizing that the power MOSFET is charge a voltage corresponding to the off−state condition when controlled. The lengths of various switching intervals (∆t) calculating td(on) and is read at a voltage corresponding to the are determined by how fast the FET input capacitance can on−state when calculating td(off). be charged by current from the generator. At high switching speeds, parasitic circuit elements The published capacitance data is difficult to use for complicate the analysis. The inductance of the MOSFET calculating rise and fall because drain−gate capacitance source lead, inside the package and in the circuit wiring varies greatly with applied voltage. Accordingly, gate which is common to both the drain and gate current paths, charge data is used. In most cases, a satisfactory estimate of produces a voltage at the source which reduces the gate drive average input current (IG(AV)) can be made from a current. The voltage is determined by Ldi/dt, but since di/dt rudimentary analysis of the drive circuit so that is a function of drain current, the mathematical solution is complex. The MOSFET output capacitance also t = Q/IG(AV) complicates the mathematics. And finally, MOSFETs have During the rise and fall time interval when switching a finite internal gate resistance which effectively adds to the resistive load, VGS remains virtually constant at a level resistance of the driving source, but the internal resistance known as the plateau voltage, VSGP. Therefore, rise and fall is difficult to measure and, consequently, is not specified. times may be approximated by the following: The resistive switching time variation versus gate tr = Q2 x RG/(VGG − VGSP) resistance (Figure 9) shows how typical switching tf = Q2 x RG/VGSP performance is affected by the parasitic circuit elements. If where the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. V = the gate drive voltage, which varies from zero to V GG GG The circuit used to obtain the data is constructed to minimize R = the gate drive resistance G common inductance in the drain and gate circuit loops and and Q and V are read from the gate charge curve. 2 GSP is believed readily achievable with board mounted During the turn−on and turn−off delay times, gate current is components. Most power electronic loads are inductive; the not constant. The simplest calculation uses appropriate data in the figure is taken with a resistive load, which values from the capacitance curves in a standard equation for approximates an optimally snubbed inductive load. Power voltage change in an RC network. The equations are: MOSFETs may be safely operated into an inductive load; td(on) = RG Ciss In [VGG/(VGG − VGSP)] however, snubbing reduces switching losses. td(off) = RG Ciss In (VGG/VGSP)
500 1000 V = 0 V V = 0 V 450 DS GS TJ = 25°C VGS = 0 V TJ = 25°C Ciss 400
Ciss 350 100 300
250 Ciss Coss 200 10 150
C, CAPACITANCE (pF) Crss C, CAPACITANCE (pF) 100 Crss Coss 50 Crss 0 1 10 5 0 5 10 15 20 25 10 100 1000
VGS VDS VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 7a. Capacitance Variation Figure 7b. High Voltage Capacitance Variation
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12 360 100 VDD = 250 V QT 10 300 ID = 1 A VGS = 10 V VGS TJ = 25°C 8 240 Q1 Q2 tf
td(off) 6 180 10 td(on) t, TIME (ns) t 4 120 r ID = 1 A TJ = 25°C 2 60 , GATE−TO−SOURCE VOLTAGE (VOLTS) , DRAIN−TO−SOURCE VOLTAGE (VOLTS)
GS V DS DS
V Q3 0 0 V 1 0 2 4 6 8 1 10 100
QT, TOTAL CHARGE (nC) RG, GATE RESISTANCE (OHMS)
Figure 8. Gate−To−Source and Drain−To−Source Figure 9. Resistive Switching Time Voltage versus Total Charge Variation versus Gate Resistance
DRAIN−TO−SOURCE DIODE CHARACTERISTICS 1.0
VGS = 0 V T = 25°C 0.8 J
0.6
0.4 , SOURCE CURRENT (AMPS)
S 0.2 I
0 0.5 0.54 0.58 0.62 0.660.70 0.74 0.78 0.82
VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define the reliable operation, the stored energy from circuit inductance maximum simultaneous drain−to−source voltage and drain dissipated in the transistor while in avalanche must be less current that a transistor can handle safely when it is forward than the rated limit and adjusted for operating conditions biased. Curves are based upon maximum peak junction differing from those specified. Although industry practice is temperature and a case temperature (TC) of 25°C. Peak to rate in terms of energy, avalanche energy capability is not repetitive pulsed power limits are determined by using the a constant. The energy rating decreases non−linearly with an thermal response data in conjunction with the procedures increase of peak current in avalanche and peak junction discussed in AN569, “Transient Thermal Resistance−General temperature. Data and Its Use.” Although many E−FETs can withstand the stress of Switching between the off−state and the on−state may drain−to−source avalanche at currents up to rated pulsed traverse any load line provided neither rated peak current current (IDM), the energy rating is specified at rated (IDM) nor rated voltage (VDSS) is exceeded and the continuous current (ID), in accordance with industry transition time (tr,tf) do not exceed 10 µs. In addition the total custom. The energy rating must be derated for temperature power averaged over a complete switching cycle must not as shown in the accompanying graph (Figure 12). Maximum exceed (TJ(MAX) − TC)/(RθJC). energy at currents below rated continuous ID can safely be A Power MOSFET designated E−FET can be safely used assumed to equal the values indicated. in switching circuits with unclamped inductive loads. For
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SAFE OPERATING AREA
10 50 VGS = 20 V ID = 1 A SINGLE PULSE 10 µs TC = 25°C 40
1.0 30 100 µs 1 ms 10 ms 20 0.1 dc , DRAIN CURRENT (AMPS) D AVALANCHE ENERGY (mJ) I RDS(on) LIMIT 10
THERMAL LIMIT , SINGLE PULSE DRAIN−TO−SOURCE AS
PACKAGE LIMIT E 0.01 0 0.1 1.0 10 100 1000 25 50 75 100 125 150
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 11. Maximum Rated Forward Biased Figure 12. Maximum Avalanche Energy versus Safe Operating Area Starting Junction Temperature
1.0 D = 0.5
0.2
0.1 0.05 0.1 P(pk) RθJC(t) = r(t) RθJC 0.02 D CURVES APPLY FOR POWER 0.01 PULSE TRAIN SHOWN t READ TIME AT t SINGLE PULSE 1 1 r(t), NORMALIZED EFFECTIVE t 2 TJ(pk) − TC = P(pk) RθJC(t) TRANSIENT THERMAL RESISTANCE DUTY CYCLE, D = t1/t2 0.01 1.0E−05 1.0E−04 1.0E−03 1.0E−02 1.0E−01 1.0E+00 1.0E+01 t, TIME (s)
Figure 13. Thermal Response
di/dt
IS
trr ta tb TIME
tp 0.25 IS
IS
Figure 14. Diode Reverse Recovery Waveform
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INFORMATION FOR USING THE DPAK SURFACE MOUNT PACKAGE
RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the interface between the board and the package. With the total design. The footprint for the semiconductor packages correct pad geometry, the packages will self align when must be the correct size to ensure proper solder connection subjected to a solder reflow process.
0.165 0.118 4.191 3.0 0.100 2.54 0.063 1.6 0.190 0.243 4.826 6.172
inches mm
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE The power dissipation for a surface mount device is a 150°C − 25°C PD = = 1.75 Watts function of the drain pad size. These can vary from the 71.4°C/W minimum pad size for soldering to a pad size given for The 71.4°C/W for the DPAK package assumes the use of maximum power dissipation. Power dissipation for a the recommended footprint on a glass epoxy printed circuit surface mount device is determined by T , the J(max) board to achieve a power dissipation of 1.75 Watts. There maximum rated junction temperature of the die, Rθ , the JA are other alternatives to achieving higher power dissipation thermal resistance from the device junction to ambient, and from the surface mount packages. One is to increase the the operating temperature, T . Using the values provided A area of the drain pad. By increasing the area of the drain on the data sheet, P can be calculated as follows: D pad, the power dissipation can be increased. Although one TJ(max) − TA PD = can almost double the power dissipation with this method, RθJA one will be giving up area on the printed circuit board The values for the equation are found in the maximum which can defeat the purpose of using surface mount ratings table on the data sheet. Substituting these values technology. For example, a graph of RθJA versus drain pad area is shown in Figure 15. into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device. For a DPAK device, PD is calculated as follows.
100 Board Material = 0.0625″ G−10/FR−4, 2 oz Copper 1.75 Watts 80 TA = 25°C °
60 3.0 Watts
TO AMBIENT ( C/W) 40 5.0 Watts , THERMAL RESISTANCE, JUNCTION JA θ R 20 0 2 4 6 8 10 A, AREA (SQUARE INCHES) Figure 15. Thermal Resistance versus Drain Pad Area for the DPAK Package (Typical)
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Another alternative would be to use a ceramic substrate board, the power dissipation can be doubled using the same or an aluminum core board such as Thermal Cladt. Using footprint. a board material such as Thermal Clad, an aluminum core
SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed pattern of the opening in the stencil for the drain pad is not circuit board, solder paste must be applied to the pads. critical as long as it allows approximately 50% of the pad to Solder stencils are used to screen the optimum amount. be covered with paste. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC−59, SC−70/SOT−323, SOD−123, SOT−23, SOT−143,
SOLDER PASTE
ÇÇÇÇÇÇ ÇÇ SOT−223, SO−8, SO−14, SO−16, and SMB/SMC diode ÇÇ
packages, the stencil opening should be the same as the pad OPENINGS
ÇÇÇÇÇÇ ÇÇ
size or a 1:1 registration. This is not the case with the DPAK ÇÇ
ÇÇÇÇÇÇ and D2PAK packages. If one uses a 1:1 opening to screen ÇÇ
STENCIL
ÇÇÇÇÇÇ solder onto the drain pad, misalignment and/or ÇÇ “tombstoning” may occur due to an excess of solder. For these two packages, the opening in the stencil for the paste Figure 16. Typical Stencil for DPAK and should be approximately 50% of the tab area. The opening D2PAK Packages for the leads is still a 1:1 registration. Figure 16 shows a typical stencil for the DPAK and D2PAK packages. The
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated • When shifting from preheating to soldering, the temperature of the device. When the entire device is heated maximum temperature gradient shall be 5°C or less. to a high temperature, failure to complete soldering within • After soldering has been completed, the device should a short time could result in device failure. Therefore, the be allowed to cool naturally for at least three minutes. following items should always be observed in order to Gradual cooling should be used as the use of forced minimize the thermal stress to which the devices are cooling will increase the temperature gradient and subjected. result in latent failure due to mechanical stress. • Always preheat the device. • Mechanical stress or shock should not be applied • The delta temperature between the preheat and during cooling. soldering should be 100°C or less.* • When preheating and soldering, the temperature of the * Soldering a device without preheating can cause leads and the case must not exceed the maximum excessive thermal shock and stress which can result in temperature ratings as shown on the data sheet. When damage to the device. using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. * Due to shadowing and the inability to set the wave height • The soldering temperature and time shall not exceed to incorporate other surface mount components, the D2PAK 260°C for more than 10 seconds. is not recommended for wave soldering.
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TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of The line on the graph shows the actual temperature that control settings that will give the desired heat pattern. The might be experienced on the surface of a test board at or operator must set temperatures for several heating zones, near a central solder joint. The two profiles are based on a and a figure for belt speed. Taken together, these control high density and a low density board. The Vitronics settings make up a heating “profile” for that particular SMD310 convection/infrared reflow soldering system was circuit board. On machines controlled by a computer, the used to generate this profile. The type of solder used was computer remembers these profiles from one operating 62/36/2 Tin Lead Silver with a melting point between session to the next. Figure 17 shows a typical heating 177−189°C. When this type of furnace is used for solder profile for use when soldering a surface mount device to a reflow work, the circuit boards and solder joints tend to printed circuit board. This profile will vary among heat first. The components on the board are then heated by soldering systems but it is a good starting point. Factors that conduction. The circuit board, because it has a large surface can affect the profile include the type of soldering system in area, absorbs the thermal energy more efficiently, then use, density and types of components on the board, type of distributes this energy to the components. Because of this solder used, and the type of board or substrate material effect, the main body of a component may be up to 30 being used. This profile shows temperature versus time. degrees cooler than the adjacent solder joints.
STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7 PREHEAT VENT HEATING HEATING HEATING VENT COOLING ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7 “RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C PEAK AT ° 200°C DESIRED CURVE FOR HIGH 170 C SOLDER MASS ASSEMBLIES 160°C JOINT 150°C
150°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS 100°C 140°C (DEPENDING ON MASS OF ASSEMBLY) 100°C
DESIRED CURVE FOR LOW MASS ASSEMBLIES 5°C
TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 7. Typical Solder Heating Profile
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PACKAGE DIMENSIONS
DPAK CASE 369A−13 ISSUE AA
NOTES: SEATING 1. DIMENSIONING AND TOLERANCING PER ANSI −T− PLANE Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. B C INCHES MILLIMETERS V R E DIM MIN MAX MIN MAX A 0.235 0.250 5.97 6.35 B 0.250 0.265 6.35 6.73 4 C 0.086 0.094 2.19 2.38 Z D 0.027 0.035 0.69 0.88 A E 0.033 0.040 0.84 1.01 S F 0.037 0.047 0.94 1.19 123 G 0.180 BSC 4.58 BSC U H 0.034 0.040 0.87 1.01 K J 0.018 0.023 0.46 0.58 K 0.102 0.114 2.60 2.89 L 0.090 BSC 2.29 BSC F J R 0.175 0.215 4.45 5.46 L S 0.020 0.050 0.51 1.27 H U 0.020 −−− 0.51 −−− V 0.030 0.050 0.77 1.27 D 2 PL Z 0.138 −−− 3.51 −−− G 0.13 (0.005) M T STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
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Thermal Clad is a registered trademark of the Bergquist Company.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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