Design and Optimization of Printed Circuit Board Inductors for Wireless Power Transfer System
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Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components. -
Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical -
Best Practices for Board Layout of Motor Drivers
Application Report SLVA959A–November 2018–Revised January 2019 Best Practices for Board Layout of Motor Drivers .................................................................................................................. Motor Drive Business Unit ABSTRACT PCB design of motor drive systems is not trivial and requires special considerations and techniques to achieve the best performance. Power efficiency, high-speed switching frequency, low-noise jitter, and compact board design are few primary factors that designers must consider when laying out a motor drive system. Texas Instruments' DRV devices are ideal for such type of systems because they are highly integrated and well-equipped with protection circuitry. The goal of this application report is to highlight the primary factors of a motor drive layout when using a DRV device and provide a best practice guideline for a high performance solution that reduces thermal stress, optimizes efficiency, and minimizes noise in a motor drive application. Contents 1 Grounding Optimization ..................................................................................................... 3 2 Thermal Overview ........................................................................................................... 7 3 Vias........................................................................................................................... 11 4 General Routing Techniques ............................................................................................. 14 5 Bulk and Bypass -
Selecting the Optimal Inductor for Power Converter Applications
Selecting the Optimal Inductor for Power Converter Applications BACKGROUND SDR Series Power Inductors Today’s electronic devices have become increasingly power hungry and are operating at SMD Non-shielded higher switching frequencies, starving for speed and shrinking in size as never before. Inductors are a fundamental element in the voltage regulator topology, and virtually every circuit that regulates power in automobiles, industrial and consumer electronics, SRN Series Power Inductors and DC-DC converters requires an inductor. Conventional inductor technology has SMD Semi-shielded been falling behind in meeting the high performance demand of these advanced electronic devices. As a result, Bourns has developed several inductor models with rated DC current up to 60 A to meet the challenges of the market. SRP Series Power Inductors SMD High Current, Shielded Especially given the myriad of choices for inductors currently available, properly selecting an inductor for a power converter is not always a simple task for designers of next-generation applications. Beginning with the basic physics behind inductor SRR Series Power Inductors operations, a designer must determine the ideal inductor based on radiation, current SMD Shielded rating, core material, core loss, temperature, and saturation current. This white paper will outline these considerations and provide examples that illustrate the role SRU Series Power Inductors each of these factors plays in choosing the best inductor for a circuit. The paper also SMD Shielded will describe the options available for various applications with special emphasis on new cutting edge inductor product trends from Bourns that offer advantages in performance, size, and ease of design modification. -
Capacitors and Inductors
DC Principles Study Unit Capacitors and Inductors By Robert Cecci In this text, you’ll learn about how capacitors and inductors operate in DC circuits. As an industrial electrician or elec- tronics technician, you’ll be likely to encounter capacitors and inductors in your everyday work. Capacitors and induc- tors are used in many types of industrial power supplies, Preview Preview motor drive systems, and on most industrial electronics printed circuit boards. When you complete this study unit, you’ll be able to • Explain how a capacitor holds a charge • Describe common types of capacitors • Identify capacitor ratings • Calculate the total capacitance of a circuit containing capacitors connected in series or in parallel • Calculate the time constant of a resistance-capacitance (RC) circuit • Explain how inductors are constructed and describe their rating system • Describe how an inductor can regulate the flow of cur- rent in a DC circuit • Calculate the total inductance of a circuit containing inductors connected in series or parallel • Calculate the time constant of a resistance-inductance (RL) circuit Electronics Workbench is a registered trademark, property of Interactive Image Technologies Ltd. and used with permission. You’ll see the symbol shown above at several locations throughout this study unit. This symbol is the logo of Electronics Workbench, a computer-simulated electronics laboratory. The appearance of this symbol in the text mar- gin signals that there’s an Electronics Workbench lab experiment associated with that section of the text. If your program includes Elec tronics Workbench as a part of your iii learning experience, you’ll receive an experiment lab book that describes your Electronics Workbench assignments. -
MAT 253 Operating Manual - Rev
MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING -
Electromagnetic Induction, Ac Circuits, and Electrical Technologies 813
CHAPTER 23 | ELECTROMAGNETIC INDUCTION, AC CIRCUITS, AND ELECTRICAL TECHNOLOGIES 813 23 ELECTROMAGNETIC INDUCTION, AC CIRCUITS, AND ELECTRICAL TECHNOLOGIES Figure 23.1 This wind turbine in the Thames Estuary in the UK is an example of induction at work. Wind pushes the blades of the turbine, spinning a shaft attached to magnets. The magnets spin around a conductive coil, inducing an electric current in the coil, and eventually feeding the electrical grid. (credit: phault, Flickr) 814 CHAPTER 23 | ELECTROMAGNETIC INDUCTION, AC CIRCUITS, AND ELECTRICAL TECHNOLOGIES Learning Objectives 23.1. Induced Emf and Magnetic Flux • Calculate the flux of a uniform magnetic field through a loop of arbitrary orientation. • Describe methods to produce an electromotive force (emf) with a magnetic field or magnet and a loop of wire. 23.2. Faraday’s Law of Induction: Lenz’s Law • Calculate emf, current, and magnetic fields using Faraday’s Law. • Explain the physical results of Lenz’s Law 23.3. Motional Emf • Calculate emf, force, magnetic field, and work due to the motion of an object in a magnetic field. 23.4. Eddy Currents and Magnetic Damping • Explain the magnitude and direction of an induced eddy current, and the effect this will have on the object it is induced in. • Describe several applications of magnetic damping. 23.5. Electric Generators • Calculate the emf induced in a generator. • Calculate the peak emf which can be induced in a particular generator system. 23.6. Back Emf • Explain what back emf is and how it is induced. 23.7. Transformers • Explain how a transformer works. • Calculate voltage, current, and/or number of turns given the other quantities. -
Class D Audio Amplifier Application Note with Ferroxcube Gapped Toroid Output Filter
Class D audio amplifier Application Note with Ferroxcube gapped toroid output filter Class D audio amplifier with Ferroxcube gapped toroid output filter The concept of a Class D amplifier has input signal shape but with larger bridge configuration. Each topology been around for a long time, however amplitude. And audio amplifier is spe- has pros and cons. In brief, a half bridge only fairly recently have they become cially design for reproducing audio fre- is potentially simpler,while a full bridge commonly used in consumer applica- quencies. is better in audio performance.The full tions. Due to improvements in the bridge topology requires two half- speed, power capacity and efficiency of Amplifier circuits are classified as A, B, bridge amplifiers, and thus more com- modern semiconductor devices, appli- AB and C for analog designs, and class ponents. cations using Class D amplifiers have D and E for switching devices. For the become affordable for the common analog classes, each type defines which A Class D amplifier works in the same person.The mainly benefit of this kind proportion of the input signal cycle is way as a PWM power supply, except of amplifier is the efficiency, the theo- used to switch on the amplifying device: that the reference signal is the audio retical maximum efficiency of a class D Class A 100% wave instead of the accurate voltage design is 100%, and over 90% is Class AB Between 50% and 100% reference. achieve in practice. Class B 50% Class C less than 50% Let’s start with an assumption that the Other benefits of these amplifiers are input signal is a standard audio line level the reduction in consumption, their The letter D used to designate the class signal.This audio line level signal is sinu- smaller size and the lower weight. -
Effect of Source Inductance on MOSFET Rise and Fall Times
Effect of Source Inductance on MOSFET Rise and Fall Times Alan Elbanhawy Power industry consultant, email: [email protected] Abstract The need for advanced MOSFETs for DC-DC converters applications is growing as is the push for applications miniaturization going hand in hand with increased power consumption. These advanced new designs should theoretically translate into doubling the average switching frequency of the commercially available MOSFETs while maintaining the same high or even higher efficiency. MOSFETs packaged in SO8, DPAK, D2PAK and IPAK have source inductance between 1.5 nH to 7 nH (nanoHenry) depending on the specific package, in addition to between 5 and 10 nH of printed circuit board (PCB) trace inductance. In a synchronous buck converter, laboratory tests and simulation show that during the turn on and off of the high side MOSFET the source inductance will develop a negative voltage across it, forcing the MOSFET to continue to conduct even after the gate has been fully switched off. In this paper we will show that this has the following effects: • The drain current rise and fall times are proportional to the total source inductance (package lead + PCB trace) • The rise and fall times arealso proportional to the magnitude of the drain current, making the switching losses nonlinearly proportional to the drain current and not linearly proportional as has been the common wisdom • It follows from the above two points that the current switch on/off is predominantly controlled by the traditional package's parasitic -
How to Select a Proper Inductor for Low Power Boost Converter
Application Report SLVA797–June 2016 How to Select a Proper Inductor for Low Power Boost Converter Jasper Li ............................................................................................. Boost Converter Solution / ALPS 1 Introduction Traditionally, the inductor value of a boost converter is selected through the inductor current ripple. The average input current IL(DC_MAX) of the inductor is calculated using Equation 1. Then the inductance can be [1-2] calculated using Equation 2. It is suggested that the ∆IL(P-P) should be 20%~40% of IL(DC_MAX) . V x I = OUT OUT(MAX) IL(DC_MAX) VIN(TYP) x η (1) Where: • VOUT: output voltage of the boost converter. • IOUT(MAX): the maximum output current. • VIN(TYP): typical input voltage. • ƞ: the efficiency of the boost converter. V x() V+ V - V L = IN OUT D IN ΔIL(PP)- xf SW x() V OUT+ V D (2) Where: • ƒSW: the switching frequency of the boost converter. • VD: Forward voltage of the rectify diode or the synchronous MOSFET in on-state. However, the suggestion of the 20%~40% current ripple ratio does not take in account the package size of inductor. At the small output current condition, following the suggestion may result in large inductor that is not applicable in a real circuit. Actually, the suggestion is only the start-point or reference for an inductor selection. It is not the only factor, or even not an important factor to determine the inductance in the low power application of a boost converter. Taking TPS61046 as an example, this application note proposes a process to select an inductor in the low power application. -
Series Catalog
Conductive Polymer Aluminum Electrolytic Capacitors Surface Mount Type CY,SY series [Guaranteed at 85 ℃] Features ● Endurance 85 ℃ 2000 h ● Product height (3.0 mm max.) ● High ripple current (5100 mA rms to 6300 mA rms max.) ● RoHS compliance, Halogen free Specifications Series CY / SY Category temp. range –55 ℃ to +85 ℃ Rated voltage range 4.0 V, 6.3V Nominal cap. range 330 μF to 470 μF Capacitance tolerance ±20 % (120 Hz / +20 ℃) DC leakage current I ≦ 0.1 CV (μA) 2 minutes Dissipation factor (tan δ) ≦ 0.06 (120 Hz / + 20 ℃) Surge voltage (V) Rated voltage × 1.25 (15 ℃ to 35 ℃) +85 ℃ 2000 h, rated voltage applied Capacitance change Within ±20 % of the initial value Endurance Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current ≦ 3 times of the initial limit +60 ℃, 90 % RH, 500 h, No-applied voltage Capacitance change of 4.0 V 6.3 V Damp heat initial measurd value +60 %, –20 % +50 %, –20 % (Steady state) Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current Within the initial limit Marking Dimensions (not to scale) Capacitance (μF) Polarity bar (Positive) ⊖ ⊕ H P P L W1 W2 Lot No. W2 R. voltage code R. voltage code Unit:V 単位:mm g 4.0 Series L±0.2 W1±0.2 W2±0.1 H±0.2 P±0.3 j 6.3 CY / SY 7.3 4.3 2.4 2.8 1.3 ✽ Externals of figure are the reference. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. -
TSEK03: Radio Frequency Integrated Circuits (RFIC) Lecture 7: Passive
TSEK03: Radio Frequency Integrated Circuits (RFIC) Lecture 7: Passive Devices Ted Johansson, EKS, ISY [email protected] "2 Overview • Razavi: Chapter 7 7.1 General considerations 7.2 Inductors 7.3 Transformers 7.4 Transmission lines 7.5 Varactors 7.6 Constant capacitors TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "3 7.1 General considerations • Reduction of off-chip components => Reduction of system cost. Integration is good! • On-chip inductors: • With inductive loads (b), we can obtain higher operating frequency and better operation at low supply voltages. TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "4 Bond wires = good inductors • High quality • Hard to model • The bond wires and package pins connecting chip to outside world may experience significant coupling, creating crosstalk between parts of a transceiver. TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "5 7.2 Inductors • Typically realized as metal spirals. • Larger inductance than a straight wire. • Spiral is implemented on top metal layer to minimize parasitic resistance and capacitance. TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "6 • A two dimensional square spiral inductor is fully specified by the following four quantities: • Outer dimension, Dout • Line width, W • Line spacing, S • Number of turns, N • The inductance primarily depends on the number of turns and the diameter of each turn TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "7 Magnetic Coupling Factor TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "8 Inductor Structures in RFICs • Various inductor geometries shown below are result of improving the trade-offs in inductor design, specifically those between (a) quality factor and the capacitance, (b) inductance and the dimensions.