Jlab Approved Abbreviations
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components. -
Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical -
Best Practices for Board Layout of Motor Drivers
Application Report SLVA959A–November 2018–Revised January 2019 Best Practices for Board Layout of Motor Drivers .................................................................................................................. Motor Drive Business Unit ABSTRACT PCB design of motor drive systems is not trivial and requires special considerations and techniques to achieve the best performance. Power efficiency, high-speed switching frequency, low-noise jitter, and compact board design are few primary factors that designers must consider when laying out a motor drive system. Texas Instruments' DRV devices are ideal for such type of systems because they are highly integrated and well-equipped with protection circuitry. The goal of this application report is to highlight the primary factors of a motor drive layout when using a DRV device and provide a best practice guideline for a high performance solution that reduces thermal stress, optimizes efficiency, and minimizes noise in a motor drive application. Contents 1 Grounding Optimization ..................................................................................................... 3 2 Thermal Overview ........................................................................................................... 7 3 Vias........................................................................................................................... 11 4 General Routing Techniques ............................................................................................. 14 5 Bulk and Bypass -
UNIX Version 7 Volume 1
UNIXTM TIME-SHARING SYSTEM: UNIX PROGRAMMER'S MANUAL Seventh Edition, Volume 1 January, 1979 Bell Telephone Laboratories, Incorporated Murray Hill, New Jersey PREFACE Although this Seventh Edition no longer bears their byline, Ken Thompson and Dennis Ritchie remain the fathers and preceptors of the UNIX² time-sharing system. Many of the improvements here described bear their mark. Among many, many other people who have contributed to the further ¯owering of UNIX, we wish especially to acknowledge the contributions of A. V. Aho, S. R. Bourne, L. L. Cherry, G. L. Chesson, S. I. Feldman, C. B. Haley, R. C. Haight, S. C. Johnson, M. E. Lesk, T. L. Lyon, L. E. McMahon, R. Morris, R. Muha, D. A. Nowitz, L. Wehr, and P. J. Weinberger. We appreciate also the effective advice and criticism of T. A. Dolotta, A. G. Fraser, J. F. Maranzano, and J. R. Mashey; and we remember the important work of the late Joseph F. Ossanna. B. W. Kernighan M. D. McIlroy __________________ ²UNIX is a Trademark of Bell Laboratories. INTRODUCTION TO VOLUME 1 This volume gives descriptions of the publicly available features of the UNIX² system. It does not attempt to provide perspective or tutorial information upon the UNIX operating system, its facilities, or its implementation. Various documents on those topics are contained in Volume 2. In particular, for an overview see `The UNIX Time-Sharing System' by Ritchie and Thompson; for a tutorial see `UNIX for Beginners' by Kernighan. Within the area it surveys, this volume attempts to be timely, complete and concise. Where the latter two objectives con¯ict, the obvious is often left unsaid in favor of brevity. -
V'j/SO14 RCA's Broadcast Antenna Center
V'J/SO14 Broadcast and Teleproduction Happenings PTL-'The Inspirational Network" Expands WDZL -TV, New 24 -Hour UHF RCA's Broadcast Antenna Center Quality Video's Mobile Unit www.americanradiohistory.com On the move. for you! 4,-. ..._V,. at" \ ,,\ 1 bt, . V I . O.. I . ` . .,S{+?f " \ Y '1 y^$(.. 4 , ,. P .. 1N " 1 , ; rÿ: I:IYf . ;-- ' !Í "' II-, i..R . a. : RCA Y{RWJä1sCAb7 6Y&Taa -1 f, ...,p,a- -.Ni l¡ JI ^ Idi.1 0 1 f' .i.w , +u. --^jyL ' r +,., p _ f ÿ'S 1, y, wpkM3.xyn. ,, nasr : . l . r -.-- / ( ,r w. }'Y, ) `r---._ .:. , a./ _ .*.Yd.g j 'i2N'-rE .., 3 s!Y ` 5 -,:. .` 'ß` ,...7.!: r.i/ .. 1 c.i` 1,'fy.VrY, *--rit, j+i .. ;j -'' - , }. - r* 1,:& r.1. `da .a ..\.". 47-77::` N1u " ` yy',, C ` .a..s"ç. _- 1, - l'3aa-y..í.-,.+D:.. `... View from United Slates Avenue There is a new RCA Broadcast Systems Di- We're moving toward a full integrated vision, operating from a new headquar- operation -consolidating administration, ters location in Gibbsboro, New Jersey. engineering and manufacturing in one Administrative operations- marketing, area for added efficiency and customer - product management, Tech Alert, cus- responsive service. tomer service and finance -are already in RCA Broadcast Systems move to Gibbs - place on site, and a new building is under boro reaffirms our commitment to remain construction. When completed later this the industry's leading supplier of quality year, TV transmitter engineering and pro- products, with unequalled support duction will move from Meadow Lands, services. -
MAT 253 Operating Manual - Rev
MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING -
Rve P.Vp:Corelventura
® M-8400RVe Thermal Transfer Printer Operator and Technical Reference Manual PN 9001075A SATO America, Inc. 10350-A Nations Ford Rd. Charlotte, NC 28273 Main Phone: (704) 644-1650 Fax: (704) 644-1661 Technical Support Hotline: (704) 644-1660 E-Mail:[email protected] © Copyright 2000 SATO America, Inc. Warning: This equipment complies with the requirements in Part 15 of FCC rules for a Class A computing device. Operation of this equipment in a residential area may cause unacceptable interference to radio and TV reception requiring the operator to take whatever steps are necessary to correct the interference. All rights reserved. No part of this document may be reproduced or issued to third parties in any form whatsoever without the express permission of SATO America, Inc. The materials in this document is provided for general information and is subject to change without notice. SATO America, Inc. assumes no responibilities for any errors that may appear. SATOM8400RVe PREFACE M-8400RVe PRINTER OPERATOR’S MANUAL The M-8400RVe Printer Operator’s Manual contains basic information about the printer such as setup, installation, cleaning and maintenance. It also contains complete instructions on how to use the operator panel to configure the printer. The following is a brief description of each section in this manual. SECTION 1. PRINTER OVERVIEW This section contains a discussion of the printer specifications and optional features. SECTION 2. INSTALLATION This section contains instructions on how to unpack and set up the printer, load the labels and ribbon. SECTION 3. CONFIGURATION This section contains instructions on how to configure the printer using the DIP switches and the LCD/Menu/Control panel. -
Manually-Allocated Contributions in Research Unix Editions Identifier Name Contributions Aho Alfred V
Table 1: Manually-Allocated Contributions in Research Unix Editions Identifier Name Contributions aho Alfred V. Aho awk, dbm, egrep, fgrep, libdbm bsb Brenda S. Baker struct bwk Brian W. Kernighan adv, awk, beg, beginners, ctut, ed, edtut, eqn, eqnchar, learn, m4, neqn, rat, ratfor, trofftut, uprog csr C. S. Roberts tss dan D. A. Nowitz uucp dmr Dennis Ritchie a.out, ar, as, assembler, atan, bcd, c, cacm, cat, cc, cdb, check, chmod, chown, cmp, core, cp, ctime, ctour, date, db, dev, df, dir, dmr, dp, dsw, du, ed, exit, exp, f77, fc, fort, fptrap, getc, getty, glob, goto, hypot, if, init, iolib, iosys, istat, ld, libc, ln, login, ls, m4, man2, man3, man4, mesg, mkdir, mount, mv, nm, od, pr, ptx, putc, regen, rew, rf, rk, rm, rmdir, rp, secur, security, setup, sh, sin, sort, sqrt, strip, stty, su, switch, tp, tty, type, umount, unix, uprog, utmp, who, write, wtmp doug Doug McIlroy diff, echo, graph, join, look, m6, sort, spell, spline, tmg jfm J. F. Maranzano adb jfo Joe Ossanna azel, ed, getty, nroff, ov, roff, s7, stty, troff, wc ken Ken Thompson ar, atan, atof, bas, bj, bproc, cacm, cal, cat, check, chess, chmod, chown, core, cp, dc, dd, df, dir, dli, dp, dsw, dtf, ed, exp, f77, fc, fed, form, fort, fptrap, getty, grep, hypot, implement, init, itoa, ken, libplot, ln, log, login, ls, mail, man, man2, man4, mesg, mkdir, moo, mount, mv, nlist, nm, od, password, plot, pr, qsort, rew, rf, rk, rm, rmdir, roff, rp, sa, sh, sin, sort, sqrt, stty, su, sum, switch, sync, sys, tabs, tp, ttt, tty, umount, uniq, unix, utmp, who, write, wtmp lem Lee E. -
Series Catalog
Conductive Polymer Aluminum Electrolytic Capacitors Surface Mount Type CY,SY series [Guaranteed at 85 ℃] Features ● Endurance 85 ℃ 2000 h ● Product height (3.0 mm max.) ● High ripple current (5100 mA rms to 6300 mA rms max.) ● RoHS compliance, Halogen free Specifications Series CY / SY Category temp. range –55 ℃ to +85 ℃ Rated voltage range 4.0 V, 6.3V Nominal cap. range 330 μF to 470 μF Capacitance tolerance ±20 % (120 Hz / +20 ℃) DC leakage current I ≦ 0.1 CV (μA) 2 minutes Dissipation factor (tan δ) ≦ 0.06 (120 Hz / + 20 ℃) Surge voltage (V) Rated voltage × 1.25 (15 ℃ to 35 ℃) +85 ℃ 2000 h, rated voltage applied Capacitance change Within ±20 % of the initial value Endurance Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current ≦ 3 times of the initial limit +60 ℃, 90 % RH, 500 h, No-applied voltage Capacitance change of 4.0 V 6.3 V Damp heat initial measurd value +60 %, –20 % +50 %, –20 % (Steady state) Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current Within the initial limit Marking Dimensions (not to scale) Capacitance (μF) Polarity bar (Positive) ⊖ ⊕ H P P L W1 W2 Lot No. W2 R. voltage code R. voltage code Unit:V 単位:mm g 4.0 Series L±0.2 W1±0.2 W2±0.1 H±0.2 P±0.3 j 6.3 CY / SY 7.3 4.3 2.4 2.8 1.3 ✽ Externals of figure are the reference. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. -
Www . Electricalpartmanuals . Com' Com .·�
. -� GEH-764AB SupiJf'sedes GEH-764AA com . Polyphase Switc.hboard ) :., ltatt... our Meters -.:-.. / ii' . _/ •, TYPES DS-19, DSW-19, DSM�19, DS-20, DSW-20 DSM-20, DS-341 DSW-341. DSM-341 DS-35 c DSW-351 DSM-35, DS-381 DSW-381 DSM-38 DS-39 I . DSW·-39:· DSM-39 I DS-40 I DSM-40 DSW-4 W-41, DSM-411 DS-43 DSW-441 DSM-44 ElectricalPartManuals . GENERAL . ELECTRIC www . ElectricalPartManuals . com' com .·� . TYPES COVERED • TWO-ELEMENT CONSTRUCTION THREE-ELEMENT CONSTRUCTION DS-19, DSW-19, DSM-19 (Surface Mount DS-20, DSW-20, DSM-20 (Surface Mount ing) ing) DS-34, DSW-34, DSM-34 (Semiflush Mount DS-35, DSW-35, DSM-35 (Semiflush Mount ing) ing) DS-38, DSW-38, DSM-38 (Drawout, Semi DS-39, DSW-39, DSM-39 (Drawout, Semi flush Mounting) flush Mounting) DS-40, DSW-40, DSM-40 (Drawout, Surface DS-41, DSW-41, DSM-41 (Drawout, Surface Mounting) Mounting) DS-43, DSW-43, DSM-43 (Drawout, Semi DS-44, DSW-44, DSM-44 (Drawout, Semi flush or Surface Mounting) flush or Surface Mounting) ElectricalPartManuals . These instructions do not purport to cover all details or variations in equipment nor to provide for every possible contingency to be met in connection with installation, operation or maintenance. Should further information be desired or should particular problems arise which are not covered sufficiently for the purchaser's purposes, the matter should be referred to the General Electric Company. 0 2 www . ElectricalPartManuals . com c POLYPHASE com SWITCHBOARD WATTHOUR METERS . The Types DS-19, DS-34, DS-38, DS-40, and DS-43 next inserted completing the electric circuits through meters are back-connected, switchboard, two-stator, the meter and locking the latch on the cradle. -
Interface and Hardware Component Configuration Guide, Cisco IOS Release 15S
Interface and Hardware Component Configuration Guide, Cisco IOS Release 15S Americas Headquarters Cisco Systems, Inc. 170 West Tasman Drive San Jose, CA 95134-1706 USA http://www.cisco.com Tel: 408 526-4000 800 553-NETS (6387) Fax: 408 527-0883 THE SPECIFICATIONS AND INFORMATION REGARDING THE PRODUCTS IN THIS MANUAL ARE SUBJECT TO CHANGE WITHOUT NOTICE. ALL STATEMENTS, INFORMATION, AND RECOMMENDATIONS IN THIS MANUAL ARE BELIEVED TO BE ACCURATE BUT ARE PRESENTED WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED. USERS MUST TAKE FULL RESPONSIBILITY FOR THEIR APPLICATION OF ANY PRODUCTS. THE SOFTWARE LICENSE AND LIMITED WARRANTY FOR THE ACCOMPANYING PRODUCT ARE SET FORTH IN THE INFORMATION PACKET THAT SHIPPED WITH THE PRODUCT AND ARE INCORPORATED HEREIN BY THIS REFERENCE. IF YOU ARE UNABLE TO LOCATE THE SOFTWARE LICENSE OR LIMITED WARRANTY, CONTACT YOUR CISCO REPRESENTATIVE FOR A COPY. The Cisco implementation of TCP header compression is an adaptation of a program developed by the University of California, Berkeley (UCB) as part of UCB's public domain version of the UNIX operating system. All rights reserved. Copyright © 1981, Regents of the University of California. NOTWITHSTANDING ANY OTHER WARRANTY HEREIN, ALL DOCUMENT FILES AND SOFTWARE OF THESE SUPPLIERS ARE PROVIDED “AS IS" WITH ALL FAULTS. CISCO AND THE ABOVE-NAMED SUPPLIERS DISCLAIM ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING, WITHOUT LIMITATION, THOSE OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT OR ARISING FROM A COURSE OF DEALING, USAGE, OR TRADE PRACTICE. IN NO EVENT SHALL CISCO OR ITS SUPPLIERS BE LIABLE FOR ANY INDIRECT, SPECIAL, CONSEQUENTIAL, OR INCIDENTAL DAMAGES, INCLUDING, WITHOUT LIMITATION, LOST PROFITS OR LOSS OR DAMAGE TO DATA ARISING OUT OF THE USE OR INABILITY TO USE THIS MANUAL, EVEN IF CISCO OR ITS SUPPLIERS HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. -
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT of USED and SCRAP PERSONAL COMPUTERS (Pcs)
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT OF USED AND SCRAP PERSONAL COMPUTERS (PCs) Robert Tonetti US EPA, Office of Solid Waste Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations 28-29 September 2000 Vienna, Austria TABLE OF CONTENTS INTRODUCTION...........................................................................................................................................4 DEFINITION AND CHARACTERIZATION OF “USED AND SCRAP PCS” ...........................................5 PRINCIPAL ENVIRONMENTAL CONCERNS...........................................................................................7 Substances of Concern.................................................................................................................................7 Exposure to Substances of Concern.............................................................................................................8 OVERVIEW OF REUSE/RECYCLING PRACTICES..................................................................................9 Overview of Reuse.......................................................................................................................................9 Environmental Considerations of Reuse......................................................................................................9 Overview of Raw Material Recovery ........................................................................................................10 GUIDELINES FOR DOMESTIC PROGRAMS ..........................................................................................12