US Bare Printed Circuit Board Industry Assessment – 2017
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Workshop on Computational Physics and Materials Science
Workshop on Computational Physics and Materials Science: Total Energy and Force Methods 2020 Donostia-San Sebastián, Spain January 8-10, 2020 Institutional support and funding Preface This workshop is organized within the well-established “Total Energy and Force” conference series, which is held at ICTP in Trieste every odd year, and at a different place in the world every even year. The previous most recent workshops of this series outside Trieste took place in Barcelona (2012), Lausanne (2014), Luxembourg (2016) and Cambridge (2018). The main objective of this event is to identify new developments and topics in the field of electronic-structure methods from the first-principles perspective, their diverse applications, and its mathematical foundations. As such, it provides a great opportunity to assemble a wide range of leading scientists working on different aspects of computational material science. The workshop aims to cover the following topics: • Electron-phonon • Dielectrics • 2D materials • Correlation effects • Superconductivity • Topological materials • Transport properties • Excitations Organizing committee • Aran Garcia-Lekue, DIPC • Ivo Souza, UPV/EHU • Ion Errea, UPV/EHU Scientific advisory board • O. Akin-Ojo, University of Ibadan • E. Artacho, University of Cambridge & Nanogune • W. Andreoni, Ecole Polytechnique Fédérale de Lausanne • S. Biermann, Ecole Polytechnique, Palaiseau • R. Car, Princeton University • C. Filippi, University of Twente • M. Finnis, Imperial College • R. Gebauer, International Centre for Theoretical Physics • X.-G. Gong, Fudan University • J. Ihm, Seoul National University • E. Koch, Forschungszentrum Jülich • G. Kresse, University of Vienna • R. M. Martin, Stanford University • F. Mauri, University “La Sapienza” • A. Mostofi, Imperial College London • S. Narasimhan, JNCASR Bangalore • J. B. -
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components. -
Nextflex Project Call 4.0 Guidebook
PROJECT CALL 4.0 Release Date: August 6, 2018 TABLE OF CONTENTS 1. FHE Definition 2. Introduction and Background 3. FHE Roadmap 4.0 4. Project Call Topics 4.1. Manufacturing Thrust Area (MTA) 4.2. Technology Platform Demonstrator (TPD) 5. Proposal Submission Process 5.1. Proposal Format Guidelines 5.2. Project Call 4.0 Timeline 5.3. Pre-Proposal Guidelines and Table of Contents 5.4. Full Proposal Guidelines and Table of Contents 6. Administrative Topics 6.1. Confidential Information 6.2. Financial and Cost Share Requirements 6.3. Work Requirements 6.4. Membership Requirements 7. Proposal Evaluation Criteria 7.1. General Overview and Guidelines 8. Contact Information 9. Reference Documents 10. Glossary of Terms Appendix A: Cover Sheet Template Appendix B: Instructions for Filling Out Proposal Cost Calculations Excel Workbook Appendix C: Pre-Proposal Evaluation Criteria Appendix D: Full Proposal Evaluation Criteria PROJECT CALL 4.0 SECTION 1. FHE DEFINITION This section is provided as an introduction to potential members of NextFlex® (“Institute” or “the Institute”) who may not be familiar with Flexible Hybrid Electronics (FHE) and the scope of our efforts in the Manufacturing USA network. NextFlex describes FHE as the intersection of additive circuitry, passive devices, and sensor systems that may be manufactured using printing methods (sometimes referred to as printed electronics) and thin flexible silicon chips or multichip interposer structures. These devices take advantage of the power of silicon and the economies and unique capabilities of printed circuitry to form a new class of devices for IoT, medical, robotics, consumer and communication markets. FHE devices conform to any shape, but are also bendable, twistable, and stretchable. -
Front Cover Sis V2.Indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS for HIGH-VOLUME MANUFACTURING
Volume 36 Issue 2 2014 @siliconsemi www.siliconsemiconductor.net Directed self assembly Wafer cleaning legislation Innovation in materials recovery Getting more out of graphene Chip spending increases MEMS microphones Features, News Review, Industry Analysis, Research News and much more. Free Weekly E News round up , go to www.siliconsemiconductor.net Front Cover SiS v2.indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS FOR HIGH-VOLUME MANUFACTURING Advanced Packaging for Logic and Memory Ultra-High Throughput and Productivity Mid-End and Back-End Interconnect Applications GET IN TOUCH to discuss your manufacturing needs www.EVGroup.com Untitled-1 1 26/03/2014 12:11 executiveview by Rich Rogoff, Vice President and General Manager, Lithography Systems Group, Rudolph Technologies, Inc. We must think “outside of the box” for new approaches in advanced packaging AS SEMICONDUCTOR DEVICES have continued to shrink Moving from round wafers to rectangular substrates in back- in size and grow in complexity, manufacturers have had to end advanced packaging saves corner space, delivering a develop advanced packaging techniques to accommodate roughly 10% improvement in surface utilization. In the case of the rapidly increasing number and density of connections lithography, the larger size of the substrate and the improved required to communicate with the outside world. Often these fit between the reticle and substrate can reduce the handling technologies have developed as adaptations of front-end and processing overhead by a factor of five. These productivity methods. While there is certainly value to be found improvements more than offset any potential reduction in using these well characterized processes, in throughput resulting from an increase in the number of we must be careful not to carry along old alignment points required for these larger substrates. -
Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical -
Best Practices for Board Layout of Motor Drivers
Application Report SLVA959A–November 2018–Revised January 2019 Best Practices for Board Layout of Motor Drivers .................................................................................................................. Motor Drive Business Unit ABSTRACT PCB design of motor drive systems is not trivial and requires special considerations and techniques to achieve the best performance. Power efficiency, high-speed switching frequency, low-noise jitter, and compact board design are few primary factors that designers must consider when laying out a motor drive system. Texas Instruments' DRV devices are ideal for such type of systems because they are highly integrated and well-equipped with protection circuitry. The goal of this application report is to highlight the primary factors of a motor drive layout when using a DRV device and provide a best practice guideline for a high performance solution that reduces thermal stress, optimizes efficiency, and minimizes noise in a motor drive application. Contents 1 Grounding Optimization ..................................................................................................... 3 2 Thermal Overview ........................................................................................................... 7 3 Vias........................................................................................................................... 11 4 General Routing Techniques ............................................................................................. 14 5 Bulk and Bypass -
MAT 253 Operating Manual - Rev
MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING -
Eindhoven University of Technology MASTER Concept Design for Reel To
Eindhoven University of Technology MASTER Concept design for reel to reel flex foil handling on a component mounting machine Wakker, R. Award date: 2005 Link to publication Disclaimer This document contains a student thesis (bachelor's or master's), as authored by a student at Eindhoven University of Technology. Student theses are made available in the TU/e repository upon obtaining the required degree. The grade received is not published on the document as presented in the repository. The required complexity or quality of research of student theses may vary by program, and the required minimum study period may vary in duration. General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. • Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain Concept design for reel to reel flex foil handling on a component mounting machine DCT 2005.93 Remko Wakker s454659 Concept design for reel to reel flex foil handling on a component mounting machine Master thesis committee: prof.dr.ir.M.Steinbuch chairmain dr.ir.P.C.J.N.Rosielle, coach TU/e ing.W.Wesseling, coach Assembl¶eon B.V. ir.F.G.A. Homburg TU/e TECHNISCHE UNIVERSITEIT EINDHOVEN DEPARTMENT OF MECHANICAL ENGINEERING SECTION CONTROL SYSTEMS TECHNOLOGY CONSTRUCTIONS AND MECHANISMS Eindhoven, 24th June 2005 Preface and acknowledgements This report describes the concept design for a reel to reel flex foil production line, that is developed during my Master thesis project at the Technische Universiteit Eindhoven, faculty Mechanical engineering, group Constructions and Mechanisms. -
Project Call 6.0 Guidebook B
PROJECT CALL 6.0 GUIDEBOOK Online Cover Sheet Submission Deadline: 3/29/2021 Proposal Submission Deadline: 4/6/2021 Original Release Date: February 15, 2021 v1.0 PROJECT CALL 6.0 PROJECT CALL 6.0 TABLE OF CONTENTS Preface 3 SECTION 1. FHE Definition ................................................................................................................ 3 SECTION 2. Introduction and Background .......................................................................................... 3 SECTION 3. FHE Roadmap – 2020 Update ........................................................................................ 6 SECTION 4. Project Call Topics .......................................................................................................... 7 4.1 NextFlex-Funded Topics .............................................................................................................. 8 4.2 DoD Agency-Funded Topics ...................................................................................................... 14 SECTION 5. PROPOSAL SUBMISSION PROCESS ......................................................................... 15 5.1 Project Call 6.0 Timeline ............................................................................................................ 15 5.2 Proposal Format Guidelines ...................................................................................................... 16 5.3 Proposal Guidelines ................................................................................................................. -
Call for Papers | 2022 MRS Spring Meeting
Symposium CH01: Frontiers of In Situ Materials Characterization—From New Instrumentation and Method to Imaging Aided Materials Design Advancement in synchrotron X-ray techniques, microscopy and spectroscopy has extended the characterization capability to study the structure, phonon, spin, and electromagnetic field of materials with improved temporal and spatial resolution. This symposium will cover recent advances of in situ imaging techniques and highlight progress in materials design, synthesis, and engineering in catalysts and devices aided by insights gained from the state-of-the-art real-time materials characterization. This program will bring together works with an emphasis on developing and applying new methods in X-ray or electron diffraction, scanning probe microscopy, and other techniques to in situ studies of the dynamics in materials, such as the structural and chemical evolution of energy materials and catalysts, and the electronic structure of semiconductor and functional oxides. Additionally, this symposium will focus on works in designing, synthesizing new materials and optimizing materials properties by utilizing the insights on mechanisms of materials processes at different length or time scales revealed by in situ techniques. Emerging big data analysis approaches and method development presenting opportunities to aid materials design are welcomed. Discussion on experimental strategies, data analysis, and conceptual works showcasing how new in situ tools can probe exotic and critical processes in materials, such as charge and heat transfer, bonding, transport of molecule and ions, are encouraged. The symposium will identify new directions of in situ research, facilitate the application of new techniques to in situ liquid and gas phase microscopy and spectroscopy, and bridge mechanistic study with practical synthesis and engineering for materials with a broad range of applications. -
Series Catalog
Conductive Polymer Aluminum Electrolytic Capacitors Surface Mount Type CY,SY series [Guaranteed at 85 ℃] Features ● Endurance 85 ℃ 2000 h ● Product height (3.0 mm max.) ● High ripple current (5100 mA rms to 6300 mA rms max.) ● RoHS compliance, Halogen free Specifications Series CY / SY Category temp. range –55 ℃ to +85 ℃ Rated voltage range 4.0 V, 6.3V Nominal cap. range 330 μF to 470 μF Capacitance tolerance ±20 % (120 Hz / +20 ℃) DC leakage current I ≦ 0.1 CV (μA) 2 minutes Dissipation factor (tan δ) ≦ 0.06 (120 Hz / + 20 ℃) Surge voltage (V) Rated voltage × 1.25 (15 ℃ to 35 ℃) +85 ℃ 2000 h, rated voltage applied Capacitance change Within ±20 % of the initial value Endurance Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current ≦ 3 times of the initial limit +60 ℃, 90 % RH, 500 h, No-applied voltage Capacitance change of 4.0 V 6.3 V Damp heat initial measurd value +60 %, –20 % +50 %, –20 % (Steady state) Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current Within the initial limit Marking Dimensions (not to scale) Capacitance (μF) Polarity bar (Positive) ⊖ ⊕ H P P L W1 W2 Lot No. W2 R. voltage code R. voltage code Unit:V 単位:mm g 4.0 Series L±0.2 W1±0.2 W2±0.1 H±0.2 P±0.3 j 6.3 CY / SY 7.3 4.3 2.4 2.8 1.3 ✽ Externals of figure are the reference. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. -
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT of USED and SCRAP PERSONAL COMPUTERS (Pcs)
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT OF USED AND SCRAP PERSONAL COMPUTERS (PCs) Robert Tonetti US EPA, Office of Solid Waste Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations 28-29 September 2000 Vienna, Austria TABLE OF CONTENTS INTRODUCTION...........................................................................................................................................4 DEFINITION AND CHARACTERIZATION OF “USED AND SCRAP PCS” ...........................................5 PRINCIPAL ENVIRONMENTAL CONCERNS...........................................................................................7 Substances of Concern.................................................................................................................................7 Exposure to Substances of Concern.............................................................................................................8 OVERVIEW OF REUSE/RECYCLING PRACTICES..................................................................................9 Overview of Reuse.......................................................................................................................................9 Environmental Considerations of Reuse......................................................................................................9 Overview of Raw Material Recovery ........................................................................................................10 GUIDELINES FOR DOMESTIC PROGRAMS ..........................................................................................12