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PDF Package Information This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS 1.1 Packaging Trends In recent years, marked advances have been made in the electronics field. One such advance has been the progression from vacuum tubes to transistors and finally, to ICs. ICs themselves have been more highly integrated into LSIs, VLSIs, and now, ULSIs. With increased functions and pin counts, IC packages have had to change significantly in the last few years in order to keep-up with the advancement in semiconductor development. Functions required for conventional IC packages are as follows: 1) To protect IC chips from the external environment 2) To facilitate the packaging and handling of IC chips 3) To dissipate heat generated by IC chips 4) To protect the electrical characteristics of the IC Standard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage in the electronics industry for a number of years. With increasing integration and higher speed ICs, and with the miniaturization of electronic equipment, newer packages have been requested by the industry which incorporate the functions listed below: 1) Multi-pin I/O 2) Ultra-miniature packages 3) Packages suited to high density ICs 4) Improved heat resistance for use with reflow soldering techniques 5) High throughput speed 6) Improved heat dissipation 7) Lower cost per pin In response to these requests, OKI has developed a diversified family of packages to meet the myriad requirements of today’s burgeoning electronics industry. 1 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS Smaller size SURFACE MOUNTING TYPE DIP SOP SOJ SSOP TSOP QFJ ZIP TQFP/LQFP QFP SKINNY DIP Higher Pin Count TCP SHRINK-DIP PGA BGA/LGA CSP Figure 1.1.1 Packaging Trend 2 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 100 Through-hole mounting type package (DIP, ZIP, SIP, PGA, etc.) 80 60 Surface mounting type package (SOP, QFP, SOJ, QFJ, BGA) 40 Usage rate (%) 20 Tape carrier (TCP) COB, TCP, etc. 1995 2000 2005 Figure 1.1.2 IC Package Demand Trend Forecast 3 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1.2 Packaging Classification [Classification by the mounting method] 1) Through-hole mount packages Through-hole packages have a structure in which the lead pins are inserted and soldered into holes (0.8 to 1.0 mm in diameter) drilled through the printed circuit (PC) board, and find wide applications in electronic equipment where board space is not at a premium or where costs are a constraint. DIPs, and PGAs are typical packages in this group. ZIPs, skinny DIPs, and shrink DIPs are high-pin- density IC packages which can be used in these applications. 2) Surface mount packages Surface mount packages have a flat structure in which the lead pins are soldered directly to the soldered pattern (called the mount pad) provided on the PC board, and are used in high-pin-density IC package situations because devices can be mounted on both sides of the PC board. QFPs and QFJs (PLCC) are typical packages in this group. 3) Custom packages Memory modules are packages which have several memory ICs mounted on a PC board, Tape carrier packages (TCP) using Tape Automated Bonding (TAB) techniques, Chip On Board (COB) packages, or IC card packages. TCP and COB packages are custom designs conforming to the customer’s specifications. [Classification by package materials] Packages are broadly classified into ceramic and plastic packages. Package materials can be selected according to their application or operating environment. Ceramic packages are known for their high reliability, but plastic packages are becoming more popular due to their low cost (when compared to ceramic packages). Reliability has improved considerably in the last few years making plastic a very attractive alternative to ceramic. 4 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS IC packages are classified as indicated below according to shape, material, and mounting methods. QFP Quad Lead Rows TQFP/LQFP Flat SOP Dual Lead Rows SSOP TSOP Surface Mounting Type Dual Lead Rows SOJ Chip Carrier Quad Lead Rows QFJ (PLCC) Matrix BGA/FBGA Plastic FLGA W-CSP Standard DIP Dual Lead Rows Skinny DIP Through- Miniature hole Mounting Shrink DIP Type Single Lead ZIP Rows Surface Package Mounting Flat Quad Lead Rows QFP Type Ceramic Type & CER-DIP Through- Matrix PGA hole Mounting Dual Lead Standard DIP Type Rows TCP (TAB) COB COT SIMM Custom Memory Socket Type Module Type DIMM Figure 1.2.1 Package Classification 5 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1.3 Package Type and Characteristics 1) Through-hole mounting type package Package Symbol Type Package Types Pin Count Old New 8, 14, 16, 18, 20, 22, Standard RS RA 24, 28, 32, 36, 40, 42, 48 DlP Skinny RS RC 20, 22 Plastic Shrink SS RB 30, 42, 64 Through-hole Mounting Type Mounting Through-hole ZIP ZS RD 20, 24, 28, 40 6 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS Package Name Characteristics Standard DIP packages are most widely used. The lead pitch is 2.54 mm Dual In-line Package (100 mil), and the spacing between terminal rows is 300, 400, or 600 mil. Skinny DIP packages are standard DIPs with spacing between terminal Skinny Dual In-line Package rows of 7.62 mm (300 mil) and with 20 or more pins. Shrink DIP packages are standard DIPs with a lead pitch reduced to 1.778 Shrink Dual In-line Package mm (70 mil). They are smaller in external size than standard DIPs and suited to compact electronic equipment using high-pin-density IC packages. ZIP packages are featured by the leads which are drawn out from each package body into a single row to allow vertical mounting with a lead pitch of Zigzag In-line Package 1.27 mm (50 mil). The leads of each package are Zigzag folded, within the package surface thickness, into two rows. The Zigzag folding increases the lead pitch in each row to 2.54 mm (100 mil). 7 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS Package Symbol Type Package Types Pin Count Old New 14, 16, 18, 20, 22, 24, Standard DIP AS AA 28, 40, 42, 48 8, 14, 16, 18, 22, 24, CER-DIP AS AB 28, 32, 40, 42 Ceramic 73*2, 88, 133*2, 177*2, 2 2 2 Through-hole Mounting Type Mounting Through-hole PGA AS BA 209* , 257* , 301* , *1 240, 365*2, 400 *1 Under development *2 The PGA pin count includes a pin for preventing incorrect insertion. 8 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS Package Name Characteristics DIP packages are hermetic ceramic package. The lead pitch is 2.54 mm Dual In-line Package (100 mil) and the package body is made of ceramics. Metal or glass may be used as a sealing material. Dual In-line packages are called “CER-DIP” package. Dual In-line Package The lead pitch is 2.54 mm (100 mil), and the package body is molded with (Glass Sealed) powder ceramics. The sealing material is glass. PGA packages are featured by the leads which are drawn out vertically from each package body and arranged on the specified grid. The package body Pin Grid Array is made of ceramics, and the standard lead pitch is 2.54 mm (100 mil). PGA packages are suited to multipin packaging. 9 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 2) Surface mounting type package Package Symbol Type Package Types Pin Count Old New MS MA 8, 16 SOP GS MA 24, 28, 32, 40, 44 MS MB 20 SSOP GS MB 30, 32, 60, 64, 70 GS-B MB 60 TSOP(1) 32, 40*1 TS TA 26/20, 26/24, 28/24, 28, 32, TSOP(2) 44/40, 44, 48, 50/44, 50, 54, 66*1, 70/64, 70, 86*1 44, 56, 64, 80, 100, 128, GS GA 160, 208, 240, 272, 304 QFP GS-2 GA 44, 56 GS-B GA 64, 80, 100 High Heat GS-C GA 208 Dissipation QFP*2 Plastic TQFP TS TB 44, 48, 64, 80, 100, 120 Surface Mounting Type Mounting Surface LQFP GS TC 144, 176, 208 26/20, 26/24, 28/24, 28, SOJ JS (SJ) JA 32, 36, 40, 42, 50 QFJ 18, 20, 22, 28, 32, 44, 68, JS JB (PLCC) 84 48, 84, 104, 144, 176, 224, BGA/FBGA LS LA 256, 352, 420, 560 FLGA ― LB 49, 56, 84 Wafer Level ― HA, HB Custom design CSP (W-CSP) *1 Under development *2 Built-in Heat Spreader 10 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS Package Name Characteristics SOP packages are characterized by gull-wing type leads which are drawn Small Out-line out from each package body in two directions, and can be mounted flat. L-Leaded Package The standard lead pitch is 1.27 mm (50 mil). Shrink Small Out-line SOP packages with a lead pitch of less than 1.27 mm (50 mil) are called L-Leaded Package SSOP. TSOP packages are ultra thin SOPs with a package L-Leaded mounting Thin Small Out-line height of less than 1.27 mm, and are suited to ultra-thin electronic L-Leaded Package equipment such as smart cards. QFP packages are characterized by gull-wing type leads which are drawn out from each package body in four directions, and can be mounted flat. Quad Flat L-Leaded Package There are various QFPs available because the lead pitch is variable and the dimensions of the package body fixed. Quad Flat L-Leaded QFP packages with a heat sink. (for high power device) Package with Heat Sink Quad Flat L-Leaded QFP packages with built-in heat spreader.
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