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Package Outline Diagram Page Layout Used in This Data Book Package Outline Diagram Page Layout Used in This Data Book Header: Shows form and number of pins FINE PITCH BALL GRID ARRAY PACKAGE 176 PIN PLASTIC BGA-176P-M03 Package code 176-pin plastic FBGA Lead pitch 0.50 mm Package width × 8.00 × 8.00 mm package length Characteristics Lead shape Soldering ball Sealing method Plastic mold Mounting height 1.13 mm MAX BGA Illustration Weight 0.12g (BGA-176P-M03) PLASTIC Ta b : S h ow s fo r m 176-pin plastic FBGA (BGA-176P-M03) +0.20 8.00±0.10(.315±.004)SQ 0.93 Ð0.10 176-¯0.30±0.10 Mounting height 0.05(.002) M +.008 (176-¯.012±.004) .037 Ð.004 0.50(.020) TYP 15 Package outline 14 13 12 diagram 11 10 0.08(.003) 9 7.00(.276) 8 REF INDEX 7 6 5 4 3 2 1 DEFGHJKLMNPR ABC INDEX AREA 0.25±0.10 Stand off (.010±.004) Dimensions in mm (inches). C 2000 FUJITSU LIMITED B176003S-1c-1 1 Introduction to Packages 1.1 Overview...................................................................................................... 3 1.2 Package Lineup .......................................................................................... 4 1.3 Package Forms 1.3.1 Lead insertion types .......................................................................... 6 1.3.2 Surface mounted types...................................................................... 6 1.4 Package Structures 1.4.1 Structure diagrams ............................................................................ 8 1.4.2 Sample Assembly Process.............................................................. 11 1.4.3 Structural materials ......................................................................... 13 1.4.4 Lead-Free Packages........................................................................ 15 1.5 How Package Dimensions Are Indicated 1.5.1 SOP dimensions.............................................................................. 16 1.6 Package Codes 1.6.1 Fujitsu Code Labeling...................................................................... 18 1.7 Marking 1.7.1 Standard marking ............................................................................ 20 1.7.2 Customer-specified marking............................................................ 21 1.8 Future Trends in Packages 1.8.1 Diversification .................................................................................. 22 1.8.2 Future formats ................................................................................. 22 1.8.3 Custom packages............................................................................ 23 1.8.4 Modules........................................................................................... 23 Package Structures 1.1 Overview Fujitsu provides semiconductor packages as a kind of "interposers" for protecting semiconductor devices and getting the full benefit of them. Fujitsu has developed and released a diversi-fied series of "general-purpose package families" supporting a wide range of applications to suit customers’ needs. The packages include through-hole type packages such as DIPs and PGAs; QFPs and SOPs that contributed to setting the trend of surface mounting; and multi-pin QFPs, TCPs, and BGAs supporting high-tensity mounting. In addition, Fujitsu has developed and provided custom packages, cards, and modules for specific customers. This chapter begins with Fujitsu’s package lineup, followed by descriptions of package shapes and structures. Introduction to Packages This chapter also describes the package dimension display conventions based on the JEITA and JEDEC *1 standards to help you use this data book more efficiently as a source of information for you. Also, this chapter introduces Fujitsu’s basic concept of package development for future packages. The electronic device marketplace has been demanding more advanced and diversified high- density mounting technologies. Fujitsu has developed new packages (supporting CSP) to meet the needs of the industry. To support customers for easier use of these new packages, at the same time, Fujitsu has made a strong commitment to standardization of the packages by JEITA *2 . *1: Joint Electron Device Engineering Council *2: Japan Electronics & Information Technology Industries Association 11 Package Structures 1.2 Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages Lead inserted type Matrix type Standard PGA Surface mounted type Flat type Dual lead SOP TSOP I TSOP II LSSOP TSSOP Quad lead QFP LQFP TQFP UQFP HQFP Leadless chip carrier Quad lead QFN Matrix type BGA FBGA SPGA Tape carrier Dual lead DTP Quad lead QTP 12 Package Structures Name of package Description Lead pitch (mm) PGA Pin Grid Array Package 1.27/2.54 Small Outline Package (straight lead) SOP 1.27 Small Outline L-Leaded Package SSOP Shrink Small Outline L-Leaded Package 0.65/0.80/1.00 TSOP (1) Thin Small Outline L-Leaded Package (1) 0.50/0.55/0.60 TSOP (2) Thin Small Outline L-Leaded Package (2) 0.50/0.80/1.00/1.27 SON Small Outline Non-Leaded Package 0.50/1.00 Quad Flat Package (straight lead) QFP 0.40/0.50/0.65/0.80/1.00 Quad Flat L-Leaded Package Introduction to Packages LQFP* Low-Profile Quad Flat L-Leaded Package 0.40/0.50/0.65/0.80 TQFP Thin Quad Flat L-Leaded Package 0.40/0.50 HQFP QFP with Heat Sink 0.40/0.50/0.65 LCC* Leadless Chip Carrier 1.016/1.27 QFN Quad Flat Non-Leaded Package BGA Ball Grid Array 1.27/1.0 FBGA Fine pitch Ball Grid Array 0.8/0.75/0.65/0.5 DTP Dual Tape Carrier Package QTP Quad Tape Carrier Package *: Package name used by Fujitsu 11 Package Structures 1.3 Package Forms Packages can be broadly classified into two types according to the mounting method used: Lead inserted type: The leads on the package are inserted into through holes in a printed circuit board, etc., and then soldered in place. Surface mounted type: The device lays flat on surface of the circuit board and the leads are soldered directly to the wires. In addition, each of the various package forms has its own unique features. 1.3.1 Lead insertion types Name of Illustration Features Lead pitch package PGA The leads on this package extend straight down from Standard : 2.54mm the bottom of the package in a grid arrangement. This package is suited for high-density mounting of packages with 64 or more pins. A special surface- mount version of this package is available with a lead pitch of 1.27mm. 1.3.2 Surface mounted types Name of Illustration Features Lead pitch package SOP The leads on these packages extend out from two Standard : 1.27mm SOL * edges of the package; the leads are either gullwing (L-shaped) or straight. Packages that conform with JEDEC specifications are called "SOL". QFP The leads on this package extend out from four sides 1.00mm of the package; the leads are either gullwing (L- 0.80mm shaped) or straight. 0.65mm SSOP These packages are compact versions of the SOP SSOP : 0.65mm/0.80mm/ LQFP * and QFP. (The lead pitch and body size are smaller.) 1.00mm LQFP : 0.40mm/0.50mm (continued) * : Package name used by Fujitsu. 12 Package Structures (continued) Name of Illustration Features Lead pitch package TSOP These packages are thinner versions of the SOP and TSOP : 0.50mm/0.55mm/ TQFP QFP. (Mounted height: 1.27 mm max.) 0.60mm TQFP : 0.40mm/0.50mm LCC This package has no leads; instead, it has only Standard: 1.27mm Introduction to Packages QFN electrode pads for soldering. A ceramic leadless chip Among LCCs with many carrier is a compact, high-reliability representative of pads, 1.016mm, 0.635mm this type of package. and other fine-pitch packages are currently under development. DTP This type of package, generally called a "TAB 0.50 to 0.15mm QTP package," consists of an IC chip mounted by means of TAB technology on a tape on which the wiring JAPAN pattern is formed; the chip is then coated with resin. This package is suited for the increasing number of 160-01 pins required in chips and for high-density mounting. There are three tape widths: 35 mm, 48 mm, and 70 mm. BGA This package has a grid of equally spaced leads 1.00mm (solder ball) on the underside of the package. 1.27mm The BGA package is suitable for high density mounting and includes the following types: E-BGA: The package is die bonded directly to a heat sink for improved heat dissipation. T-BGA: A low-profile package with a metal-rich construction that provides excellent heat- withstanding and thermal resistance characteristics. FC-BGA: A high pin count package that uses flip chip bonding technology. FBGA Same as the BGA package but with a finer lead pitch. 0.5mm 0.65mm 0.75mm 0.8mm 11 Package Structures 1.4 Package Structures 1.4.1 Structure diagrams Structure diagrams for typical packages are shown below. Ceramic PGA (laminated) Cap (ceramic, metal) Seal (Low melting point braze metal) Metalize (tungusten) Laminated ceramic (alumina) Pin (Kovar) Lead finish Au plating or solder dip Plastic FBGA Resin Chip Au wires Polymide substrate Die attach Solder balls Plastic BGA (mold type) Chip Resin Au wires Solder balls Printed substrate 12 Package Structures Plastic BGA (cavity down type) Chip Resin Au wires Solder balls Introduction to Packages Multilayer printed substrate Stage Plastic LCC (BCC type) AU bump Chip AU wires Resin Pin Lead finish Pd/Ni/Pd plating Plastic QFP Chip Resin Au wiring Lead frame (Fe-Ni alloy or Cu alloy) Lead finish Solder plating 11 Package Structures Tape carrier package Resin Chip Inner lead (Cu) Outer lead(Cu) Test pad Lead finish Sn plating 12 Package Structures 1.4.2 Sample Assembly Process Sample assembly process for
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