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PCB Layout Recommendations for Leaded Packages

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PCB Layout Recommendations for Leaded Packages PCB Layout Recommendations for Leaded Packages Technical Note FPGA-TN-02160-1.5 July 2021 PCB Layout Recommendations for Leaded Packages Technical Note Disclaimers Lattice makes no warranty, representation, or guarantee regarding the accuracy of information contained in this document or the suitability of its products for any particular purpose. All information herein is provided AS IS and with all faults, and all risk associated with such information is entirely with Buyer. Buyer shall not rely on any data and performance specifications or parameters provided herein. Products sold by Lattice have been subject to limited testing and it is the Buyer's responsibility to independently determine the suitability of any products and to test and verify the same. No Lattice products should be used in conjunction with mission- or safety-critical or any other application in which the failure of Lattice’s product could create a situation where personal injury, death, severe property or environmental damage may occur. The information provided in this document is proprietary to Lattice Semiconductor, and Lattice reserves the right to make any changes to the information in this document or to any products at any time without notice. © 2013-2021 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. FPGA-TN-02160-1.5 3 PCB Layout Recommendations for Leaded Packages Technical Note Contents 1. Introduction .................................................................................................................................................................. 6 2. Perimeter Land Pad and Trace Design .......................................................................................................................... 6 3. Stencil Design for Perimeter Land Pads ........................................................................................................................ 7 4. Reflow Profile................................................................................................................................................................ 7 5. QFP and QFN Board Layout Recommendations ........................................................................................................... 8 6. QN84 Quad-Flat No Lead Package ................................................................................................................................ 8 7. VQ100 Quad-Flat Package .......................................................................................................................................... 12 8. TQ144 Quad-Flat Package ........................................................................................................................................... 14 9. PCB Solder Land Patterns............................................................................................................................................ 16 10. Thermal Pad ................................................................................................................................................................ 17 11. Lead Finger Details ...................................................................................................................................................... 18 12. Advantages and Disadvantages of QFP and QFN Packaging ....................................................................................... 19 Reference ............................................................................................................................................................................ 20 Use at Your Own Risk .......................................................................................................................................................... 21 PCB Design Support ............................................................................................................................................................ 22 Technical Support Assistance ............................................................................................................................................. 23 Revision History .................................................................................................................................................................. 24 Figures Figure 2.1. Wider Trace Under Solder Mask Edge to Avoid Trace ........................................................................................ 6 Figure 4.1. Typical Pb-Free Solder Flow ................................................................................................................................ 7 Figure 6.1. QN84 Layout ....................................................................................................................................................... 9 Figure 6.2. Top-Layer Layout ................................................................................................................................................ 9 Figure 6.3. Inner-layer Layout ............................................................................................................................................... 9 Figure 6.4. Top Layer........................................................................................................................................................... 10 Figure 6.5. Ground Layer .................................................................................................................................................... 10 Figure 6.6. Power Layer ...................................................................................................................................................... 11 Figure 6.7. Bottom Layer .................................................................................................................................................... 11 Figure 7.1. Top Layer........................................................................................................................................................... 12 Figure 7.2. Inner Layer ........................................................................................................................................................ 12 Figure 7.3. Power Layer ...................................................................................................................................................... 13 Figure 7.4. Ground Layer .................................................................................................................................................... 13 Figure 8.1. Top Layer........................................................................................................................................................... 14 Figure 8.2. Bottom Layer .................................................................................................................................................... 14 Figure 8.3. Power Layer ...................................................................................................................................................... 15 Figure 8.4. Ground Layer .................................................................................................................................................... 15 Figure 9.1. QFN Footprints .................................................................................................................................................. 16 Figure 9.2. QFP Footprints .................................................................................................................................................. 16 Figure 10.1. Thermal Pad .................................................................................................................................................... 17 Figure 11.1. Lead Finger Details .......................................................................................................................................... 18 Figure 12.1. Misalignment of BGA Balls vs. QFP Leads ....................................................................................................... 19 © 2013-2021 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 4 FPGA-TN-02160-1.5 PCB Layout Recommendations for Leaded Packages Technical Note Tables Table 1.1. Leaded Package Types ......................................................................................................................................... 6 Table 5.1. Package Layout Example Summary...................................................................................................................... 8 Table 6.1. Solder Stencil Patterns for Thermal Pad .............................................................................................................. 8 Table 6.2. QN84, Single-Layer Layout Dimensions ............................................................................................................... 9 Table 6.3. QN84, Multi-Layer Layout Dimensions .............................................................................................................
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