Classification of Semiconductor Package

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www.connect.co.jp www.jccherry.com Technical Data Classification of semiconductor package SIP ZIP Single In-line Package Zigzag In-line Package A package having leads on a single side of the body. A package having Zig-zag formed leads on a single side of the body. DIP PGA Dual In-line Package Pin Grid Array A package having leads in parallel rows A package having pins on top or bottom on two opposite sides of the body for face in a matrix layout of at least three through-hole insertion. rows and three columns. SDIP Shrink DIP A package which reduced the lead pitch of DIP. SOP SON Small Outline Package Small Outline Non-leaded Package A package having gull-wing-shaped leads A package having single-inline terminal on two opposite sides of the body. pads along two opposite edges of the bottom face. The terminal pads may or may not be exposed on the package sides. TSOP Thin SOP SOJ A package height of SOP exceeds 1.0 mm, Small Outline J-leaded Package and 1.2 mm or less. A package having J-shaped leads on two opposite sides of the body. SSOP Shrink SOP A package which reduced the lead pitch of SOP. 50-01 www.connect.co.jp www.jccherry.com Classification of semiconductor package QFP LGA Quad Flat Package Land Grid Array A package having gull-wing-shaped leads A package having lands on top or bottom on four sides of the body. face in a matrix of at least three rows and three columns. BGA QFN Ball Grid Array Quad Flat Non-leaded Package A package having single-inline terminal A package having balls or bumps on top pads along four edges of the bottom or bottom face in a matrix of at three face. The terminal pads may or may not rows and three columns or more. be exposed on the package sides. CQFN FBGA(CSP) Ceramic QFN Fine pitch BGA A name in U.S. is LCC/CLCC. A package of BGA having less or equal QFN package having ceramic body. 0.8mm pitch terminals. TFBGA QFJ Thin FBGA Quad Flat J-leaded Package A package height of FBGA exceeds 1.0 mm, and 1.2 mm or less. A package having J-shaped leads on four sides of the body. VFBGA PQFJ Very thin FBGA Plastic QFJ A name in U.S. is PLCC. A package height of FBGA exceeds 0.8 mm, QFJ package having plastic body. and 1.0 mm or less. TCP TO Tape Carrier Package Transister Outline A semiconductor package that has the TAB connection and is coated by resin. A package that is widely used for transistor, sensors and passive component. CAN type ,Metal package And its materials are metal, ceramics and plastics. 50-02.

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