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Strip for Semiconductor Packages the Wieland Group

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Strip for Semiconductor Packages the Wieland Group Strip for semiconductor packages The Wieland Group Europe Austria Greece Rolling mills and slitting centres Belarus Hungary North America Belgium Italy USA Croatia Poland Czech Republic Portugal Denmark Russia Finland Spain France Sweden Germany Switzerland Great Britain Turkey Wieland-Werke AG, Ulm, Germany Asia The Wieland Group, headquartered in Wieland supplies over 100 different China the southern German city of Ulm, is one copper alloys to customers in many India of the world’s leading manufacturers of different markets, first and foremost Japan semi-finished and special products in the electric and electronic sector, but Singapore copper and copper alloys: strip, sheet, other important consumers include the South Korea tube, rod, wire and sections as well as building trade, the automotive industry Taiwan slide bearings, finned tubes and heat and air-conditioning and refrigeration exchangers. engineering. The Company can trace its history right Wieland produces strip in all major back to the 19th century. Its founder, economic regions of the world: in Philipp Jakob Wieland, took over his Germany in the three rolling mills in uncle’s fine art and bell foundry in Ulm Vöhringen, Velbert-Langenberg and in 1820, and by 1828 he was already Villingen-Schwenningen. Further fabricating sheet and wire from brass. manufacturing companies are based South America Africa Australia in Great Britain, Singapore and the Brazil South Africa Today, Wieland’s output reaches about USA. A global network of slitting centres Colombia 500,000 tonnes a year in copper alloy ensures swift and flexible product products. The starting point of the deliveries worldwide. Wieland-Werke AG, Vöhringen, Germany production process is Europe’s biggest foundry for copper alloys at Wieland’s Vöhringen/Iller location. The Wieland Group has more than 6,500 employees in its manufacturing companies, slitting centres and trading firms in several European countries as well as the USA, South Africa, Singapore and China. Wieland-Werke AG, Velbert-Langenberg, Wieland-Werke AG, Villingen-Schwenningen, Germany Germany 2 Sites of the Wieland Group and its trading agencies Europe Austria Greece Rolling mills and slitting centres Belarus Hungary North America Belgium Italy USA Croatia Poland Czech Republic Portugal Denmark Russia Finland Spain France Sweden Germany Switzerland Great Britain Turkey Asia China India Japan Singapore South Korea Taiwan South America Africa Australia Brazil South Africa Colombia Wieland Metals, Inc. Wheeling, IL, USA Wieland Metals Shanghai Limited, Wieland Metals Singapore Pte Ltd., Shanghai, China Singapore 3 Leadframe strip for semiconductor packages Introduction • alloy and temper properties allowing to etch strips with high productivity The delivery program of the Wieland Group provides a broad • alloys with good solderability variety of alloys used for semiconductor packages, such as • tight dimensional tolerances strips for IC leadframes, strips for discrete packages as well • low internal tension allowing to stamp or etch high pin as for power transistors and heatspeaders. semiconductor frames with excellent lead co-planarity. Often high pin count IC leadframes are annealed after Requirements for leadframe strip used for stamping for better co-planarity of the leads requiring special IC’s & discrete packages softening resistant alloys & tempers. Further details on this are given in the data sheets for the various materials. Strips for IC leadframes and discrete semiconductor pack- ages call today for specially tailored copper alloys requiring the following properties: Requirements for copper strip used for heatspreader • special leadframe surface qualities to meet plating and wire bonding requirements • copper with very high electrical and thermal conductivity • material properties adjusted to today’s semiconductor • good surface properties to allow perfect plating and packaging assembly processes marking • high strength copper alloys allowing to produce matrix • good stamping and forming properties leadframes in large width • standardized alloys and tempers allowing high volume All of Wieland’s alloys offered for semiconductor packaging production and productivity applications meet the RoHS mandatory requirements. • softening resistant alloys suitable for high die bonding temperatures Material properties Wieland materials for semiconductor packages comply with and physical properties of Wieland alloys used in semi- established international standards such as EN, ASTM and JIS. conductor packaging. For further details kindly refer to the The following table provides an overview of the mechanical specific datasheets. Physical properties* Mechanical properties** Alloy EN UNS Chemical composition Electrical Thermal Tensile Yield Elon- Hard- (nominal) wt [%] conductivity conductivity strengh strengh gation ness [%] IACS [W/(mK)] [MPa] [MPa] A50 [%] HV 240–300 K09 Cu-OF C10100 Cu > 99.99 101 394 ≥ 180 ≥ 8 65–95 (Fullhard) 240–300 K32 Cu-ETP C11000 Cu > 99.99 100 390 ≥ 180 ≥ 8 65–95 (Fullhard) Ni 3 Si 0.65 Mg 0.15 608–725 K55 CuNi3SiMg C70250 40 190 550–650 ≥ 6 180–220 Cu balance (Halfhard) Sn 0.6 Ni 0.4 540–620 K62 – C18090 Cr 0.3 Ti 0.3 50 240 ≥ 450 ≥ 6 160–200 (Fullhard) Cu balance Fe 2.4 Zn 0.12 P 0.03 480–530 K65 CuFe2P C19400 60 280 ≥ 430 ≥ 4 140–160 Cu balance (Springhard) Cr 0.3 Si 0.02 Ti 0.1 530–610 K75 CuCrSiTi C18070 75 310 ≥ 460 ≥ 2 150–190 Cu balance (Springhard) Fe 0.1 P 0.03 360–440 K80 CuFeP C19210 90 350 ≥ 260 ≥ 3 100–130 Cu balance (Halfhard) * for reference only ** typical temper shown; for more details see alloy data sheets 4 Alloy performance table The following diagram shows typical Wieland leadframe alloys with information on temper range and electrical conductivity. 60 K09 / C10100 K32 / C11000 100 90 50 K80 / C19210 80 K75 / C18070 70 40 K65 / C19400 60 30 K62 / C18090 50 K55 / C70250 40 20 30 Electrical conductivity (MS/m) 20 Electrical conductivity (%/ACS) 10 10 0 0 200 400 600 800 Tensile strength / Rm (MPa) Typical applications The following table provides an overview of the usage of Wieland alloys within the semiconductor packaging industry. Application Heatspreader Integrated circuit (IC) Discrete BGA/LGA/PGA QFN QFP PLCC TSOP DIP SOT To-92 TO220 TO247 LED DPAK Package K09 • K32 • K55 • • • K62 • • K65 • • • • • • • K75 • • K80 • • • • • Pricing Besides the technical properties, price is of course an important criterion for the selection of a material. Here the value of the metal makes up a substantial part of the end price of the strip. Non-ferrous metals such as copper, nickel and tin are traded on commodity exchanges and are therefore subject to price fluctuations, which can be quite considerable. That’s why the price ratios among the various alloys are only valid for a specific date. 5 Your requirements – our solutions Leadframes Leadframes for IC or discrete semiconductors are either stamped or etched. Each process requires different strip properties. As such Wieland delivers optimized strip qualities for stamped and etched leadframes. While stamping qualities are typically delivered in a slightly oiled condition to enhance the stamping process, etched strips typically require dry surfaces. Both qualities require base materials with an optimized stress distribution in order to allow stamping and etching of high pin count leadframes with convincing results. Many new semiconductor packages like QFN require in their production half etching processes, meaning that the strip thickness is reduced by the etching medium. In order to achieve a proper solution even for such requirements special qualities have been developed to guarantee best half etching results. These qualities are limited to certain alloy/thickness combinations. Many of today’s discrete leadframes require a die bonding attachment process at temperatures exceeding 400 °C. In addition high pin IC leadframes are often annealed after stamping at temperatures exceeding 450 °C requiring special softening resistant alloys and tempers. For these applications Wieland developed special softening resistant alloys with convincing irreversible lengthening properties. Example: Softening resistance of Wieland-K75 K75 K75 160 180 150 170 140 160 Vickers Hardness after 130 150 heat treatment (typical values) 120 140 110 130 100 120 Temper R460 Temper R530 90 400 °C 110 400 °C 80 450 °C 100 450 °C ickers Hardness HV ickers Hardness 500 °C HV ickers Hardness 500 °C V 70 V 90 0 5 10 15 20 25 30 0 5 10 15 20 25 30 Time (min) Time (min) 6 Power transistors Surface of the milled strip Surface roughness Standard Tightend Power transistors combine typically a leadframe with an integrated heatspreader. As such contour milled materials Ra (of unmilled surface) < 0.20 μm < 0.16 μm are commonly used. In order to produce such profiles multiple Ra (of milled surface) < 0.40 μm < 0.20 μm processes are used within the industry, such as coining, milling, rolling and skiving. Sizes W Strip width 20–140 mm T1 Strip thickness 0.5–3.0 mm T2 Thickness of milled area ≥ 0.20 m Cw Width of milled channel 0.6–100 mm Angle of milling flanks ≥ 2° Micrograph section of a rolled profile strip: the deformation of the Tolerances structure is obvious Standard Tightend Cw ± 0.02 mm ± 0.01 mm R ± 0.05 mm ± 0.03 mm T1 ± 0.02 mm ± 0.01 mm T2 ± 0.012 mm ± 0.008 mm Micrograph section of ± 1º ± 1° a milled profile strip: the structure of the base material is the Guide values for dimensioning same R Cw α Milling shows the following benefits: Advantages for leadframe production • low stamping forces
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