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Status of the Advanced Packaging Industry 2020 July 2020 Sample From Technologies to Markets Status of the Advanced Packaging Industry 2020 Market and Technology Report 2020 Sample © 2020 GLOSSARIES AI Artificial Intelligence HD High Density (Fan-Out) OR High Definition (TV) PWB Printed Wiring Board ASIC Application Specific Integrated Circuit HPC High Performance Computing QFN Quad Flat No-Leads AR Augmented Reality HVM High Volume Manufacturing QFP Quad Flat Package BE Back-End I/O Input/Output RDL Redistribution layer BGA Ball Grid Array IDM Integrated Device Manufacturer RF Radio Frequency CIS CMOS Image Sensor IC Integrated Circuit SAP Semi-Additive Process CSP Chip Scaled Package IIoT Industrial Internet of Things SiM System in Module CPU Central Processing Unit IoT Internet of Things SiP System in Package DSP Digital Signal Processor L/S Line/Space SMT Surface Mount Technology DMS Design Manufacturing Services STB Set-Top Box LED Light Emitting Diode DTV Digital TV TSV Through Si Via M&A Merger & Acquisition ED Embedded Die (in laminate substrate) TXVR Transceiver mSAP modified Semi-Additive Process EMS Electronics Manufacturing Services VR Virtual Reality ODM Original Design Manufacturer FE Front-End WB Wirebond OEM Original Equipment Manufacturer FI Fan-In WE Wearables OSAT Outsourced Semiconductor Assembly and Test FC Flip Chip WiFi Wireless Fidelity PC Personal Computer FO Fan-Out WLP Wafer Level Package PCB Printed Circuit Board FPGA Field Programmable Gate Array PCBA Printed Circuit Board Assembly GPU Graphics Processing Unit PLP Panel Level Packaging HBM High Bandwidth Memory PMIC Power Management IC Status of ©2020the Advanced | www.yole.fr Packaging | Status Industry of the 2020 Advanced | Sample Packaging | ©2020 Industry| www.yole.fr 2020 2 TABLE OF CONTENTS o Introduction 3 o Advanced Packaging Market Trend 139 o Conclusions 254 o Forecasts per adv. packaging platforms o Methodology o Unit count o Appendix 257 o Report Synergies o Wafer count o Revenue o Yole Développement presentation 265 o Objectives, Scope, Glossary o Forecast of adv. Packaging platforms by applications o What we get right & what we get wrong ? o Different Advanced Packaging Platform Summary 159 o Advanced Packaging platforms o Analysis per platform and future development : Flip-chip, Fan-out, Fan-in, 3D Stacking, Embedded-die & Advanced o Noteworthy news on advanced packaging 16 Substrates o 3 Page Summary 18 o Players and Supply Chain 175 o Player landscape and positioning o Executive Summary 22 o Business model shifts o What happened in 2018 and what to expect in o Overview of production per manufacturer next 2 years? o Advanced packaging wafer breakdown by manufacturers o Key slides from the report by different technology: flip-chip, fan-out, fan-in, 3D/2.5D IC o Semiconductor Business Trends & Outlook 78 o Advanced packaging wafer breakdown by business model: o Semiconductor industry trends and market OSATs, IDMs & Foundries drivers o Player financials 199 o Effect of US-China trade dispute on o TOP 25 OSAT financial analysis semiconductor business & supply chain o Rankings by different parameters: revenues, Gross profit, net-income, R&D etc. o Advanced Packaging Technology Trend 100 o Recent development of key OSATs o What is driving AP business ? o Impact of FEOL on packaging o Mergers/Acquisitions and recent development 239 o Packaging & Technology roadmaps o List of M&As in semiconductor since 2013 o Focus on TSMC, Intel & Samsung Electronics AP o Analysis of M&As trend in OSATs sector and various scenarios for 2019-2024 o M&As scenarios for OSATs Status of the Advanced Packaging Industry 2020 | Sample | ©2020 | www.yole.fr 3 METHODOLOGIES & DEFINITIONS Yole’s market forecast model is based on the matching of several sources: Preexisting information Market Volume (in Munits) ASP (in $) Revenue (in $M) Information Aggregation Status of the Advanced Packaging Industry 2020 | Sample | ©2020 | www.yole.fr 4 ABOUT THE AUTHORS Biographies & contacts Santosh KUMAR Santosh Kumar is currently working as Director & Principal Analyst in the Semiconductor & Software division at Yole Développement, part of Yole Group of Companies. His main interest areas are advanced electronic packaging materials and technology including TSV and 3D packaging, modeling and simulation, reliability and material characterization, wire bonding and novel solder materials and process etc. He received bachelor and master degrees in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul, respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging. [email protected] Favier SHOO Favier Shoo is a Technology and Market Analyst in the Semiconductor & Software division at Yole Développement (Yole), part of Yole Group of Companies. Based in Singapore, he is engaged in the development of reports as well as the production of custom consulting projects. With prior experience at Applied Materials and REC Solar, Favier has developed a deep understanding of the supply chain and core business values. Being knowledgeable in this field, Favier has conducted professional training for industry players and obtained two patents. He also co-founded a startup company. Favier holds a bachelor’s in Materials Engineering (Hons) and a minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore). [email protected] Vaibhav TRIVEDI Vaibhav Trivedi is a Sr. Technology and Market Analyst in the Semiconductor & Software division at Yole Développement, part of Yole Group of Companies. Based in the US, he is a member of Yole’s advanced packaging team and contributes to analysis of ever-changing advanced packaging technologies. Vaibhav has 17+ years of field experience in semiconductor processing and semiconductor supply chain, specifically on memory and thermal component sourcing and advanced packaging such as SiP and WLP. Vaibhav has held multiple technical and commercial lead roles at various semiconductor corporations prior to joining Yole. Vaibhav holds a Bachelor of Science in Chemical Engineering, and Master of Science of Material Science from University of Florida in addition to an MBA from Arizona State [email protected] Status of the Advanced Packaging Industry 2020 | Sample | ©2020 | www.yole.fr 5 COMPANIES CITED IN THIS REPORT Altera, Amkor, Analog Devices, Ardentec, Atmel, AOI Electronics, Apple, ARM, ASE, Avago, Bitmain, Broadcom, Carsem, China WLCSP, Chipbond, ChipMOS, Cisco, Cypress Semiconductor, Deca Technologies, Greatek, IC Interconnect, Fairchild, Facebook, Flip Chip International, Formosa, Freescale, Fujitsu, GlobalFoundries, Google, Hana Micron, Huawei, Inari Berhad, Intel, Intersil, J-Devices, JCET, King Yuan, Linear Technology, LB Semicon, Lingsen Precision, Maxim, MaxLinear, MediaTek, Microchip, Microsemi, Movidius, Nantong-Fujitsu, Nanium, Nepes, Nvidia, NXP, ON Semiconductor, OptoPAC, Orient Semiconductor, Powertech Technology, Renesas, Qualcomm, Rohm, Samsung, SilTech, Sigurd, SK Hynix, Softbank, SPIL, ST Microelectronics, STATS ChipPAC, STS Semiconductor, Teraprobe, Texas Instruments, Tianshui Huatian, Tong Hsing, Toshiba, TSMC, Unisem, UTAC, Walton Advanced Engineering, and many more… > 100 companies cited in the report Status of the Advanced Packaging Industry 2020 | Sample | ©2020 | www.yole.fr 6 WHAT’S NEW IN THE STATUS OF ADVANCED PACKAGING 2020? o Updated forecast of the semiconductor market including memory & non-memory components o Included key system level demand forecast: mobile & consumer, automotive, telecom & infrastructure o Update of Advanced Packaging market data (2019-2025): o By revenue, wafer, and unit forecasts o By advanced packaging platforms: flip-chip, fan-out, fan-in, 3D stacked, embedded die o Included COVID-19 impact on all forecasts o Analysis of US-China effect on semiconductor business & supply chain o Update 2019 - 2025 revenue, wafer, and unit forecasts, by various application segments: consumer & mobile, automotive & transportation, telecom & infrastructure, medical, industrial, defense & aerospace o Updated supply chain analysis with focus on impact of foundry entry into advanced packaging business o Wafer starts share by manufacturers from different business model (IDM, OSAT, foundry) by different advanced packaging platform and its evolution o Updated financial analysis of the top 25 OSATs (2019-2013) by different parameters: Revenue, YoY growth, R&D, Capex, Gross profit, Gross Margin, Net Income etc. o M&As data update and different scenarios for OSATs for 2019-2025 Status of the Advanced Packaging Industry 2020 | Sample | ©2020 | www.yole.fr 7 KEY FEATURES OF THIS REPORT The “Status of the Advanced Packaging Industry” is a yearly overview report. The objectives of the report are as follows: • Advanced packaging market overview • Drivers and dynamics • Future applications • Disruptions and opportunities • Technology trends and forecasts • Revenue, wafer and unit forecasts by platform • Future development by platform • Impact of front-end scaling • Scaling and functional roadmaps • Supply chain analysis • Overview of production by player (IDM, OSAT, foundry) • Shifting business models • Financial analysis of TOP 25 OSATs Status of the Advanced Packaging Industry 2020 | Sample | ©2020 | www.yole.fr 8 WHAT’S NEW FROM THE ADVANCED PACKAGING TEAM? Advanced Packaging Monitors In 2019, the advanced packaging team of Semiconductor, Memory and Computing Division
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