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An Introduction to Plastic Pin Grid Array (PPGA) Packaging

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An Introduction to Plastic Pin Grid Array (PPGA) Packaging E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array (PPGA) Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel retains the right to make changes to specifications and product descriptions at any time, without notice. The Pentium® processor may contain design defects or errors known as errata. Current characterized errata are available on request. *Third-party brands and names are the property of their respective owners. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 7641 Mt. Prospect, IL 60056-7641 or call 1-800-879-4683 COPYRIGHT © INTEL CORPORATION 1996 7/1/96 9:08 AM 243103_1.doc AP-577 CONTENTS PAGE PAGE 1.0. INTRODUCTION................................................5 4.0. SYSTEM LEVEL CHARACTERIZATION....... 16 4.1. System Level Assembly and 2.0. PPGA OVERVIEW.............................................6 Manufacturing 16 2.1. PPGA Package Physical Dimensions 6 4.2. Quality and Reliability 17 2.2. Physical Structure of a PPGA Package 7 2.3. PPGA Package Shipping Media 9 5.0. PERFORMANCE COMPARISON BETWEEN PPGA AND CPGA....................... 18 3.0. PPGA PERFORMANCE 5.1. Package Level Comparison 18 CHARACTERISTICS.........................................9 5.2. System Level Comparison 18 3.1. Thermal Characteristics 10 3.2. Electrical Characteristics 11 6.0. CONCLUSION................................................. 18 3.2.1. I/O Buffer................................................11 APPENDIX A. THERMAL RESISTANCE 3.2.2. Signal Quality.........................................12 VALUES FOR PENTIUMÒ PROCESSOR 3.2.3. EMI.........................................................12 CB1 IN CPGA (WITHOUT HEAT SPREADER) AND IN PPGA .......................... 19 3.3. Mechanical Characteristics 12 3.3.1. Mechanical Fit........................................12 APPENDIX B. FREQUENTLY ASKED 3.3.2. Heat Sink Attachment ............................13 QUESTIONS ................................................... 22 3.3.2.1. Thermal Interface Material ..............13 APPENDIX C. SINK AND SOCKET 3.3.2.2. Clip Design and Attach....................14 SUPPLIERS .................................................... 24 3.3.2.3. Thermal Test Results......................14 3.4. Quality and Reliability 16 3 7/1/96 9:08 AM 243103_1.doc AP-577 4 7/1/96 9:08 AM 243103_1.doc AP-577 1.0. INTRODUCTION develop advanced packaging technology. The Pentium® As Intel microprocessors become faster, more complex microprocessor family has been available in either and more powerful, the demand on high-performance ceramic pin grid array (CPGA) package or tape carrier packaging technology increases. For instance, higher package (TCP) format to date. However as the core clock rates imply faster internal signals, which may cause frequency of microprocessors steps up with rapid pace, more switching noise. Thus packaging technology needs from 166 MHz today to higher frequencies in the near to tackle power supply decoupling issues. For each new future, power dissipation will be increasing accordingly. generation of microprocessors, a greater number of transistors are packed onto each chip, generating more In 1993, Intel engineers began the development of plastic heat. The package thermal resistance becomes critical. pin grid array (PPGA) packages to alleviate potential Furthermore the shrinking die size causes higher power performance-limiting package problems. Compared to density, which tests the effectiveness of the package to the existing CPGA package technology, the PPGA dissipate the heat. The improvements in microprocessor package has a better power distribution and improved speed and functionality drive the package design thermal and electrical performance. Intel also ensures improvements in electrical, thermal and mechanical that the processors in PPGA and CPGA packages meet performance. the same product specifications in Input/Output (I/O) timings, mechanical fit and quality and reliability. Over the years, Intel has introduced a variety of innovative package designs, such as surface mount, small Table 1 summarizes the key differences between the out-line, very thin package, and multilayer molded PPGA package and the CPGA package. The following plastic quad flatpacks (PQFP). Keeping form, fit and sections will detail the physical structure, electrical function in mind, Intel continues to research and modeling and performance of PPGA. Table 1. Differences Between CPGA and PPGA Packages ATTRIBUTE CPGA PPGA Physical Appearance Tile, flat ceramic top Circuit board, exposed pins Package Body Material Ceramic body, Al bond wires BT laminate, Ni/Cu slug, encap, Au bondwires Body Thickness 2.8 mm 3.0 mm (with heat slug) Weight 29 gms 18 gms Package Trace Metal Tungsten Copper External Heat Slug No Yes External Capacitors No Yes Performance Thermal (qjc) with Heat Sink 1.25° C/W 0.50° C/W Power Distribution Good Better Package Trace Propagation Delay Good Better Others Thermal Grease Used for Electrically conductive or Electrically non-conductive Heat Sink Attachment non-conductive Board Mount Socket or thru-hole insertion Socket only Shipping Tray Blue color ,see Figure 6 Brown color, pocket size reduced Conclusion: While comparable mechanically, the PPGA package has superior electrical and thermal characteristics. It is compatible with CPGA board manufacturing and maintains high quality and reliability standards. PPGA packages are “drop-in” replacements for CPGA packages. 5 7/1/96 9:08 AM 243103_1.doc AP-577 2.0. PPGA OVERVIEW grams, as compared to an average of 29 grams for a CPGA package. 2.1. PPGA Package Physical Figure 2 and Table 2 show the dimensions of a Dimensions 296-pin staggered PPGA package with a heatslug. Compared to the existing CPGA package, the PPGA Figure 1 is the top view of a PPGA package. Note the height is increased by 0.2 mm (0.009 inches). nickel plated copper heatslug and the eight discrete capacitors. The weight of the package is around 18 Figure 1. Top View of a PPGA Package 2 Figure 2. Plastic Pin Grid Array (PPGA) Package Dimensions 6 7/1/96 9:08 AM 243103_1.doc AP-577 Table 2. Physical Dimensions of a 296-Pin Staggered PPGA Package Family: Plastic Pin Grid Array Package Symbol Millimeters Inches Minimum Maximum Minimum Maximum A 2.72 3.33 0.107 0.131 A1 1.83 2.23 0.072 0.088 A2 1.00 0.039 B 0.40 0.51 0.016 0.020 D 49.43 49.63 1.946 1.954 D1 45.59 45.85 1.795 1.805 D2 23.44 23.95 0.923 0.943 e1 2.29 2.79 0.090 0.110 F1 17.56 0.692 F2 23.04 0.907 L 3.05 3.30 0.120 0.130 N 296 296 S1 1.52 2.54 0.060 0.100 2.2. Physical Structure of a PPGA Package The PPGA package body is a pinned laminated printed temperature (Tg) Bismaleimide Triazine (BT) with a Tg circuit board (PCB) structure. Figure 3 illustrates the ranging from 170° C to 190° C. Conductors are copper cross section schematic1. The dielectric material, which traces. For bondability, the copper (Cu) bond fingers are is chosen for its high temperature stability and industry plated with gold (Au) over nickel (Ni). The heat slug is history, is a glass-reinforced high glass transition Ni plated copper, which gives high thermal dissipation. The Kovar pins are plated with Au over Ni. 1 The cross section is a schematic only. It does not depict the exact stackup model of the PPGA production units. 7 7/1/96 9:08 AM 243103_1.doc AP-577 Figure 3. A PPGA Schematic Cross Section In manufacturing the PPGA piece part, standard Printed Figure 4 lists the basic manufacturing and lamination Circuit Board (PCB) processing and equipment are used. process. Prepare BT Core Material Drill Through-Holes Drill Pilot Holes Cu Plate Vias Form Cavities Pattern Definition: Pin, Chip Capacitor, Slug Lands Plate Cavity Walls Solder Resist Application Pattern Definition Ni/Au Plate Lamination Singulation Note: This process is performed at the piece part supplier. Figure 4. Piece Part Substrate Manufacturing and Lamination Process 8 7/1/96 9:08 AM 243103_1.doc AP-577 Following lamination, the piece part manufacturer 2.3. PPGA Package Shipping press-fits pins into plated through holes. The heat slug Media and chip capacitors are then solder attached with 90 percent Sn and 10 percent Pb, using standard Surface PPGA shipping trays meet the JEDEC standards. All Mount Technology (SMT) processes. external dimensions of the PPGA tray are the same as the CPGA tray. For easy identification, the PPGA tray Intel’s PPGA component assembly process is very has a brown color while the CPGA tray is blue. In similar to CPGA in both equipment and process steps. addition, to reduce package free-play, the PPGA tray This is summarized in Figure 5. has slightly smaller pocket dimensions. Refer to Figure 6 for the dimensions of the PPGA shipping tray. Die Preparation Die Attachment Wire Bonding: PPGA utilizes Au rather than Al wir Encapsulation: Analogous to CPGA lid sealing Testing Backside Marking: 100% laser marking Figure 5. Intel PPGA Assembly Process Seating Plane .180” Below Top of the Tray Seating Plane .140” Below top of the Tray 1.889” 1.970” 1.986” CPGA Shipping Tray (Blue) PPGA Shipping Tray (Brown) Figure 6.
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