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Semiconductor Hardware & Thermal Management Farnell Page 649Date: 20-09-10 time:22:27 Technical portal and online community for Design Engineers - www.element14.com 649 Semiconductor Hardware & Thermal Management Page Page Crystal Oscillator Sockets .................. 659 Pin Grid Array (PGA) ..................... 654 DIL Headers ............................... 656 Plastic Leaded Chip Carrier (PLCC) ....... 654 DIMM Memory Sockets..................... 656 QTFP ................................... 655 Heatsinks ................................. Single-In-Line ........................... 653 Extruded ................................ 670 Small Outline ............................ 652 IC/Microprocessor ....................... 663 Ultra-Low Profile ......................... 654 Multi-Fin ................................ 679 IC Test Clips............................... 657 Pressed ................................. 667 Temperature Indicators..................... 682 IC Installation and Extraction Tools.......... 657 Thermal Interface Materials ................. 659 IC Socket Adaptors ........................ 656 Thermoelectric Modules.................... 681 IC Sockets Transistor/Diode Sockets and Dual-In-Line ............................. 649Fixing Hardware ........................... 658 IC Sockets - Dual-In-Line Mftrs. No. of Pitch, row Price Each List No. Ways mm Order Code DIPLOMATE™ Dual Wipe DIP Sockets 08-3518-10 8 7.62 167-4784● 14-3518-10 14 7.62 167-4785● Ì Open frame construction 16-3518-10 16 7.62 167-4786● Ì Inhibits solder wicking and flux contamination 18-3518-10 18 7.62 167-4787● Ì Tin plated phosphor bronze contacts Semiconductors ● Ì Stackable end-to-end or side-by-side 20-3518-10 20 7.62 167-4788 Ì Suitable for auto-insertion 24-3518-10 24 7.62 167-4789● Ì Body height above pcb 4.45mm 22-4518-10 22 10.16 167-4790● Ì UL recognised 24-4518-10 24 10.16 167-4792● 211532 24-6518-10 24 15.24 167-4793● No. of Mftrs Price Each 28-6518-10 28 15.24 167-4794● Ways List No. Order Code 32-6518-10 32 15.24 167-4795● 40-6518-10 40 15.24 167-4796● 0.3" (7.62mm) Row Spacing 48-6518-10 48 15.24 167-4797● 8 1-390261-2 110-1345● 50-9518-10 50 22.86 167-4798● 14 1-390261-3 110-1346● 64-9518-10 64 22.86 167-4799● 16 1-390261-4 110-1347● 18 1-390261-5 110-1348● 20 1-390261-6 110-1349● Premium Quality, Turned Pin DIP Sockets 3 0.6" (15.24mm) Row Spacing 800 Series, Thick 30μ" Gold Plated Contacts ● Semiconductor Hardware & Thermal Management 28 1-390262-2 110-1351 The 800 Series socket combines precision four- 40 1-390262-5 110-1352● fingered inner contacts with an open ladder in- sulator to produce the ultimate high-reliability sock- Sockets, Open Frame Collet Solder Pin Tails et. H (above PCB)=4.75, W=10.16 (0.3" row spacing), 12.7 Features: (0.4" row spacing), 17.78 (0.6" row spacing), L=1.27 (x Ì Open Frame allows Efficient Utilization No. ways) of Board Space with Optimized Cooling PCB clearance=4.32 min. Ì Choose from Several Pin Styles Ì Low insertion force, precision 4-fin- Ì Accepts IC leads: Ì Compatible with Automatic Insertion ger inner contacts Rectangular - 0.23mm x 0.38mm to 0.28mm Equipment Ì High quality turned pin contacts x 0.51mm Ì Side-to-Side and End-to-End Stackable Ì "X" and "Y" Stackable. Open ladder Round - 0.41mm to 0.53mm for cooling, cleaning and inspection 2.67mm min. length Ì Thermoplastic polyester body, UL recognised Pitch, lead = 2.54mm Contact rating 3A Insulator Thermoplastic polyester Specifications: Contact resistance 10mΩ Shell Brass, Tin / Lead plated Ì Body Material is black UL 94V-0 glass-filled 4/6 Nylon Insulation resistance 5000 x 106MΩ Contact Beryllium Copper, Gold plated Ì Pin Body is Brass Alloy 360 1/2-hard per UNS C36000 ASTM B16-00 Insertion force 134g typ. Operating temp. -55°C to +125°C Ì Pin Body Plating 10μ [0.25μm] min. Gold per MIL-G-45204 or 200μ [5.08μm] min. Dielectric withstand voltage 1kV rms 93/7 Tin/Lead per ASTM B545 or 200μ [5.08μm] min. Tin per ASTM B545 Type 1 Mftrs. List No. 8xx-AG11D where xx = No. of ways. over 100μ [2.54μm] min. Nickel per SAE AMS-QQ-N-290 241546 Ì 4-fingered Collet Contact is Beryllium-Copper Alloy per UNS C17200 ASTM B194-01 No. of Price Each Ì Contact Plating 200μ [5.08μm] min. 93/7 Tin/Lead per ASTM B545 or 200μ [5.08μm] Ways Order Code min. Tin per ASTM B545 Type 1 or 10μ [0.25μm] Gold per MIL-G-45204 over 50μ min. [1.27μm] Nickel per SAE AMS-QQ-N-290 0.3" (7.62mm) Row Spacing ● Ì Available Plating = Heavy Gold 30μ [0.76μm] 8 107-7303 Ì Contact Current Rating = 3 amps 14 107-7295● Ì Operating Temperature = 221°F [105°C] Tin and Tin/Lead plating = 257°F [125°C] 16 107-7298● Gold plating 18 107-7299● Ì Insertion Force = 180 grams/pin 20 107-7300● Ì Withdrawal Force = 90 grams/pin 24 107-7301● Ì Normal Force = 140 grams/pin Ì Midget Pin Insertion Force = 370 grams/pin 0.4" (10.16mm) Row Spacing Ì Midget Pin Withdrawal Force = 150 grams/pin 22 107-7304● Ì Midget Pin Normal Force = 240 grams/pin, based on a 0.018 [0.46] dia. test lead 0.6" (22.86mm) Row Spacing Ì Accepts Lead Lengths from 0.100 [2.54] min. and 0.015-0.025 [0.38-0.64] in dia. 24 107-7305● Ì Accepts Midget Pin Lead Lengths from 0.080 [2.03] and up to 0.022 [0.56] dia. 28 107-7306● Mounting Considerations: 32 107-7307● Ì Suggested PCB Hole Size for Solder Pin Tail and Extra Long Pin = 0.030 ±0.002 [0.76 40 107-7308● ±0.05] dia. Ì Suggested PCB Hole Size for Midget Pin = 0.040 ±0.002 [1.02 ±0.05] dia. 527584 Over 500 000 products available online For latest prices and stock information, please visit the website at www.element14.com 649 C = CYAN M = Magenta Y = Yellow B = Black/SINGINTBK1 Farnell Page 650Date: 20-09-10 time:22:30 650 Find it fast online at www.element14.com Over 500,000 products with real-time stock availability IC Sockets - Dual-In-Line - continued No. of Tube Price Each Ways Quantity Order Code Low Profile – Turned Pin Contacts 0.3" (7.62mm) Row Spacing ● Ì Available individually, or in convenience tubes 8 — 110-3844 ● Ì High precision, four-fingered inner contacts 14 — 110-3845 Ì X and Y stackable 16 — 110-3846● Ì Open frame design for cooling, cleaning and easy 18 — 110-3847● inspection 20 — 110-3848● Ì Non-wicking, closed base 24 — 110-3849● Ì Supplied in 630mm tubes 28 — 110-3850● Ì Beryllium copper inner contact, 10μ gold-on-nickel or tin plated 0.6" (15.24mm) Row Spacing Ì Thermoplastic polyester body, UL recognised 24 — 110-3851● ● Contact rating 3A Capacitance 1pF 28 — 110-3852 Contact resistance 10mΩ Dielectric withstand voltage 1kV rms 32 — 110-3853● 6 Insulation resistance 5000 x 10 MΩ Operating temperature -55°C to +105°C 40 — 110-3855● Mftrs. List No. 8XX-AG11DESL (gold plated), 8XX-AG12DES (tin plated) except 824-AG31DESL No. of Tube Price Per Tube = 107-7328. XX = No. of ways. 211506 Ways Quantity Order Code No. ofContact Tube Price Per Tube 0.3" (7.62mm) Row Spacing - Tubed Quantities Ways Material Qty. Order Code 860110-3831● 7.62mm (0.3") Row Spacing - Tubed Quantities 14 34 110-3832● 808-AG11D-ESL-LF 8 Gold 60 107-7345● 16 30 110-3833● 814-AG11D-ESL-LF 14 Gold 34 107-7312● 18 26 110-3834● 814-AG12D-ES-LF 14 Tin 34 107-7313● 20 24 110-3835● 816-AG11DESL-LF 16 Gold 30 107-7316● 24 20 110-3836● 816-AG12D-ES-LF 16 Tin 30 107-7317● 28 17 110-3837● 818-AG11D-ESL-LF 18 Gold 26 107-7319● 0.6" (15.24mm) Row Spacing - Tubed Quantities 818-AG12D-ES-LF 18 Tin 26 107-7320● 24 20 110-3838● 820-AG11D-ESL-LF 20 Gold 24 107-7322● 28 17 110-3839● Semiconductors 824-AG31D-ESL-LF 24 Gold 20 107-7328● 32 15 110-3840● 10.16mm (0.4") Row Spacing - Tubed Quantities 40 12 110-3841● 822-AG11DESL-LF 22 Gold 22 107-7323● 15.24mm (0.6") Row Spacing - Tubed Quantities Surface Mount – Collet Sockets 824-AG11D-ESL-LF 24 Gold 20 107-7329● 828-AG11D-ESL-LF 28 Gold 17 107-7331● Ì Open frame design 828-AG12D-ES-LF 28 Tin 17 107-7332● Ì High relibility machined collet con- 832-AG11D-ESL-LF 32 Gold 15 107-7334● tacts Ì Suitable for vapour phase soldering 832-AG12D-ES-LF 32 Tin 15 107-7335● Ì Beryllium copper contacts, gold-on-nickel plated ● 840-AG11D-ESL-LF 40 Gold 12 107-7337 Ì PET thermoplastic polyester bodies 840-AG12D-ES-LF 40 Tin 12 107-7339● Ì UL94V-0 rated Price Each Mftrs. List No. 0.3" (7.62mm) row spacing xx-3518-00 where xx=no. of ways 3 0.6" (15.24mm) row spacing xx-6518-00 211486 16.24mm (0.6") Row Spacing No. of Price Each Semiconductor Hardware & Thermal Management 824-AG11D-ESL-LF 24 Gold 107-7325● Ways Order Code 828-AG11D-ESL-LF 28 Gold 107-7330● 832-AG11D-ESL-LF 32 Gold 107-7333● 0.3" (7.62mm) Row Spacing 840-AG11D-ESL-LF 40 Gold 107-7336● 8 116-9119● 848-AG11DESL-LF 48 Gold 107-7341● 14 113-6588● 808-AG11D-LF 8 Gold 107-7303● 16 116-9120● 814-AG11D-LF 14 Gold 107-7295● 20 113-6589● 816-AG11D-LF 16 Gold 107-7298● 0.6" (15.24mm) Row Spacing 818-AG11D-LF 18 Gold 107-7299● 28 113-6590● 820-AG11D-LF 20 Gold 107-7300● 822-AG11D-LF 22 Gold 107-7304● Low Profile – Thick Gold, Turned Pin Contacts ● 824-AG31D-LF 24 Gold 107-7301 Ì Reliable four-leaf beryllium copper contacts ● 824-AG11D-LF 24 Gold 107-7305 Ì 0.25μ thick gold plated 828-AG11D-LF 28 Gold 107-7306● Ì Sold in complete tubes 832-AG11D-LF 32 Gold 107-7307● Ì 4.2mm body height 840-AG11D-LF 40 Gold 107-7308● Ì Auto insertable Ì Tin-lead plated brass pins Ì Glass filled polyester body UL recognised Low Profile – Turned Pin Contacts Contact rating 1A Mechanical life 100 cycles min.
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