Cpre 281 1 CMOS Realization of a NAND Gate CMOS Realization of a and Gate

Total Page:16

File Type:pdf, Size:1020Kb

Cpre 281 1 CMOS Realization of a NAND Gate CMOS Realization of a and Gate Voltage Representation NMOS Transistor as a Switch • MOSFET: Metal Oxide Semiconductor Field-Effect Transistor of Logic Values V DD • NMOS: n-channel MOSFET by Voltage Levels Logic value 1 x = "low" x = "high" (Positive logic V (a) A simple switch controlled by the input x system) 1,min Gate Undefined VG Source Drain V 0,max Substrate (Body) VS VD (c) Simplified symbol for Logic value 0 (b) NMOS transistor an NMOS transistor V SS (Gnd) 1 2 PMOS Transistor as a Switch Structure of a CMOS Circuit • PMOS: p-channel MOSFET •CMOS: V DD Complementary MOS Technology x = "high" x = "low" (a) A switch with the opposite behavior of previous slide Pull-up network PMOS (PUN) Gate V G V f Drain Source V V V S D x 1 V DD Substrate (Body) Pull-down network NMOS (c) Simplified symbol for (PDN) V (b) PMOS transistor an PMOS transistor x n 3 4 CMOS Realization of a NOT Gate CMOS Realization of a NOR Gate V DD VDD V x 1 T 1 T1 V V x Vf x 2 T 2 x T T f 1 2 x x T T T T f T2 1 2 1 2 3 4 V f 0 onoff 1 1 off on 0 0 0 on on off off 1 T 3 T 4 0 1 on off off on 0 off on on off (a) Circuit (b) Truth table and transistor states 1 0 0 1 1 off off on on 0 (a) Circuit (b) Truth table and transistor states 5 6 CprE 281 1 CMOS Realization of a NAND Gate CMOS Realization of a AND Gate V DD V DD V DD T 1 T 2 V f V f V x x x T T T T f 1 T 3 1 2 1 2 3 4 V x 1 0 0 on on off off 1 0 1 on off off on 1 V x 2 T 4 1 0 off on on off 1 V x 1 1 off off on on 0 2 (a) Circuit (b) Truth table and transistor states 7 8 Implement Compound Function Directly MOS (Metal-Oxide-Silicon) Transistor V • All variables need to DD appear in their complemented form. • PUN can be derived by looking at f directly. • PDN can be derived by looking at f’. V f V • Example: x 1 f = x1’+ x2’x3’ V x f’ = x1 (x2 + x3) 2 V x 3 9 10 MOS Transistor Operation Printed Circuit Board and Packaging • Printed Circuit Board (PCB) • Packaging Technology: – Dual Inline Package (DIP) – Quad Flat Package (QFP) – Pin Grid Array (PGA) Package NMOS 11 12 CprE 281 2 SEM Photo of Metal Layers Printed Circuit Board and Packaging • Printed Circuit Board (PCB) • Packaging Technology: – Dual Inline Package (DIP) – Quad Flat Package (QFP) – Pin Grid Array (PGA) Package 13 14 Types of Integrated Circuits (ICs) Standard Chips • Standard Chips • A collection of specific gates in a chip • Programmable Logic Devices (PLDs): • Popular until mid-80s – Programmable Logic Array (PLA) • 7400-Series Standard Chips – Programmable Array Logic (PAL) – 7404 : NOT gates – Complex Programmable Logic Device (CPLD) VDD – Field-Programmable Gate Array (FPGA) • Non-Programmable Devices: Gnd – Custom Design – Standard-Cell Design – 7408 : AND gates • Application Specific Integrated Circuit (ASIC) – 7432 : OR gates – Gate-Array Design – 74244 : Tri-State Buffers 15 16 Implementation of f = x1x2 + x2’x3 Programmable Logic Array (PLA) VDD x1 x2 xn 7404 Input buffers and inverters x1 x1 xn xn P1 7408 7432 AND plane OR plane Pk x1 x2 x3 f f f 17 1 m 18 CprE 281 3 Gate-Level Diagram of a PLA Customary Schematic for PLA x x x 1 2 3 x1 x2 x3 Programmable connections OR plane OR plane P1 P1 P P2 2 P3 P3 P4 P4 AND plane AND plane f f f1 f2 19 1 2 20 Programmable Array Logic (PAL) A PLD Programming Unit x1 x2 x3 P1 f1 P2 P3 f2 P4 AND plane 21 22 Complex Programmable Logic Device (CPLD) Field-Programmable Gate Array (FPGA) Logic block Interconnection switches I/O block I/O block PAL-like PAL-like block block I/O block I/O block I/O block Interconnection wires I/O block I/O block I/O block PAL-like PAL-like block block I/O block I/O block 23 24 CprE 281 4 x Lookup Table 1 Custom Design 0/1 (LUT) 0/1 x 1 x 2 f f 1 0/1 0 0 1 0 1 0 0/1 1 0 0 x 2 1 1 1 (a) Circuit for a two-input LUT (b) f 1 = x 1 x 2 + x 1 x 2 x 1 1 0 f 1 Intel 4004 Microprocessor 0 1971 1 x 2 Intel Pentium 4 Processor 2000 (c) Storage cell contents in the LUT 25 26 Standard-Cell Design Standard-Cell Design x 1 f 2 x 2 x 3 f 1 27 28 Gate Array Design 29 CprE 281 5.
Recommended publications
  • GS40 0.11-Μm CMOS Standard Cell/Gate Array
    GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.
    [Show full text]
  • Introduction to ASIC Design
    ’14EC770 : ASIC DESIGN’ An Introduction Application - Specific Integrated Circuit Dr.K.Kalyani AP, ECE, TCE. 1 VLSI COMPANIES IN INDIA • Motorola India – IC design center • Texas Instruments – IC design center in Bangalore • VLSI India – ASIC design and FPGA services • VLSI Software – Design of electronic design automation tools • Microchip Technology – Offers VLSI CMOS semiconductor components for embedded systems • Delsoft – Electronic design automation, digital video technology and VLSI design services • Horizon Semiconductors – ASIC, VLSI and IC design training • Bit Mapper – Design, development & training • Calorex Institute of Technology – Courses in VLSI chip design, DSP and Verilog HDL • ControlNet India – VLSI design, network monitoring products and services • E Infochips – ASIC chip design, embedded systems and software development • EDAIndia – Resource on VLSI design centres and tutorials • Cypress Semiconductor – US semiconductor major Cypress has set up a VLSI development center in Bangalore • VDAT 2000 – Info on VLSI design and test workshops 2 VLSI COMPANIES IN INDIA • Sandeepani – VLSI design training courses • Sanyo LSI Technology – Semiconductor design centre of Sanyo Electronics • Semiconductor Complex – Manufacturer of microelectronics equipment like VLSIs & VLSI based systems & sub systems • Sequence Design – Provider of electronic design automation tools • Trident Techlabs – Power systems analysis software and electrical machine design services • VEDA IIT – Offers courses & training in VLSI design & development • Zensonet Technologies – VLSI IC design firm eg3.com – Useful links for the design engineer • Analog Devices India Product Development Center – Designs DSPs in Bangalore • CG-CoreEl Programmable Solutions – Design services in telecommunications, networking and DSP 3 Physical Design, CAD Tools. • SiCore Systems Pvt. Ltd. 161, Greams Road, ... • Silicon Automation Systems (India) Pvt. Ltd. ( SASI) ... • Tata Elxsi Ltd.
    [Show full text]
  • ECE 274 - Digital Logic Lecture 22 Full-Custom Integrated Circuit
    ECE 274 - Digital Logic Lecture 22 Full-Custom Integrated Circuit Full-Custom Integrated Circuit Chip created specifically to implement the transistors of the desired chip Lecture 22 – Implementation Layout – detailed description how each transistor and wires should be Manufactured IC Technologies layed on a chips surface Typically use CAD tools to convert our circuit design to a custom layout Fabricating an IC is often referred to a silicon spin 1 2 Semicustom (Application Specific) Integrated Full-Custom Integrated Circuit Circuits - ASICs Full-Custom Integrated Circuit Gate Arrays Pros Utilize a chip whose transistors are pre-designed to forms rows (arrays) of logic gates on the chip Maximum performance Sometimes referred to as sea-of-gates Cons Pros High NRE (Non-Recurring Engineering) cost Much cheaper than full-custom IC Cost of setting of the fabrication of an IC Fabrications time is typically several weeks Often exceeds $1 million Cons May take months before first IC is available Less optimized compared to full-custom IC - Slower performance, bigger size, and more power consumption 3 4 Semicustom (Application Specific) Integrated Semicustom (Application Specific) Integrated Circuits - ASICs Circuits - ASICs Standard Cells Cell Array Utilize library of pre-layed-out gates and smaller pieces of logic (cells) Standard cells are replaced on the IC with only the wiring left to be that a designer must instantiate and connect with wires completed Pros Sometimes referred to as sea of cells Can be better optimized
    [Show full text]
  • INTEGRATED CIRCUITS Introduction
    INTEGRATED CIRCUITS Introduction Integrated circuits (ICs) are a keystone of modern electronics. They are the heart and brains of most circuits. They are the ubiquitous little black “chips” you find on just about every circuit board. Unless you’re some kind of crazy, analog electronics wizard, you’re likely to have at least one IC in every electronics project you build, so it’s important to understand them, inside and out. Integrated circuits are the little black “chips”, found all over embedded electronics. An IC is a collection of electronic components – resistors, transistors, capacitors, etc. – all stuffed into a tiny chip, and connected together to achieve a common goal. They come in all sorts of flavors: single-circuit logic gates, op amps, 555 timers, voltage regulators, motor controllers, microcontrollers, microprocessors, FPGAs…the list just goes on-and-on IC Packages The package is what encapsulates the integrated circuit die and splays it out into a device we can more easily connect to. Each outer connection on the die is connected via a tiny piece of gold wire to a pad or pin on the package. Pins are the silver, extruding terminals on an IC, which go on to connect to other parts of a circuit. These are of utmost importance to us, because they’re what will go on to connect to the rest of the components and wires in a circuit. There are many different types of packages, each of which has unique dimensions, mounting-types, and/or pin- counts. Polarity Marking and Pin Numbering All ICs are polarized, and every pin is unique in terms of both location and function.
    [Show full text]
  • Full-Custom Ics Standard-Cell-Based
    Full-Custom ICs Design a chip from scratch. Engineers design some or all of the logic cells, circuits, and the chip layout specifi- cally for a full-custom IC. Custom mask layers are created in order to fabricate a full-custom IC. Advantages: complete flexibility, high degree of optimization in performance and area. Disadvantages: large amount of design effort, expensive. 1 Standard-Cell-Based ICs Use predesigned, pretested and precharacterized logic cells from standard-cell li- brary as building blocks. The chip layout (defining the location of the building blocks and wiring between them) is customized. As in full-custom design, all mask layers need to be customized to fabricate a new chip. Advantages: save design time and money, reduce risk compared to full-custom design. Disadvantages: still incurs high non-recurring-engineering (NRE) cost and long manufacture time. 2 D A B C A B B D C D A A B B Cell A Cell B Cell C Cell D Feedthrough Cell Standard-cell-based IC design. 3 Gate-Array Parts of the chip are pre-fabricated, and other parts are custom fabricated for a particular customer’s circuit. Idential base cells are pre-fabricated in the form of a 2-D array on a gate-array (this partially finished chip is called gate-array template). The wires between the transistors inside the cells and between the cells are custom fabricated for each customer. Custom masks are made for the wiring only. Advantages: cost saving (fabrication cost of a large number of identical template wafers is amortized over different customers), shorter manufacture lead time.
    [Show full text]
  • Package Outline Diagram Page Layout Used in This Data Book
    Package Outline Diagram Page Layout Used in This Data Book Header: Shows form and number of pins FINE PITCH BALL GRID ARRAY PACKAGE 176 PIN PLASTIC BGA-176P-M03 Package code 176-pin plastic FBGA Lead pitch 0.50 mm Package width × 8.00 × 8.00 mm package length Characteristics Lead shape Soldering ball Sealing method Plastic mold Mounting height 1.13 mm MAX BGA Illustration Weight 0.12g (BGA-176P-M03) PLASTIC Ta b : S h ow s fo r m 176-pin plastic FBGA (BGA-176P-M03) +0.20 8.00±0.10(.315±.004)SQ 0.93 Ð0.10 176-¯0.30±0.10 Mounting height 0.05(.002) M +.008 (176-¯.012±.004) .037 Ð.004 0.50(.020) TYP 15 Package outline 14 13 12 diagram 11 10 0.08(.003) 9 7.00(.276) 8 REF INDEX 7 6 5 4 3 2 1 DEFGHJKLMNPR ABC INDEX AREA 0.25±0.10 Stand off (.010±.004) Dimensions in mm (inches). C 2000 FUJITSU LIMITED B176003S-1c-1 1 Introduction to Packages 1.1 Overview...................................................................................................... 3 1.2 Package Lineup .......................................................................................... 4 1.3 Package Forms 1.3.1 Lead insertion types .......................................................................... 6 1.3.2 Surface mounted types...................................................................... 6 1.4 Package Structures 1.4.1 Structure diagrams ............................................................................ 8 1.4.2 Sample Assembly Process.............................................................. 11 1.4.3 Structural materials ......................................................................... 13 1.4.4 Lead-Free Packages........................................................................ 15 1.5 How Package Dimensions Are Indicated 1.5.1 SOP dimensions.............................................................................. 16 1.6 Package Codes 1.6.1 Fujitsu Code Labeling...................................................................... 18 1.7 Marking 1.7.1 Standard marking ...........................................................................
    [Show full text]
  • EE Concierge Style Guide PCB Layout and Component Creation
    EE Concierge Style Guide PCB Layout and Component Creation For more information or component creation services visit EEConcierge.com Version 1.2 For more information or component creation services visit EEConcierge.com ​ Table of Contents Introduction Checklist: What a perfect part looks like Style Guide: Pins Number of Pins Pin Numbers Pin Names Pin Types Style Guide: Attributes Step by Step Walkthrough Style Guide: Symbols Step by Step Walkthrough Headers Pin Organization Style Guide: Footprints General Tips Component Origin Layers Top Component Top Package Outline Top Solder Mask Top Paste Mask Top Copper Top Courtyard Top Silkscreen Top Keepout Bottom Layers Mechanical Details, Rulers, Notes, Design Rules Hole Layer Hole Sizing Plated Through Holes TO-92 and Other Parts With Overlapping Holes/Pads Non Plated Through Holes (NPTH) Axial Components DIP Components Thermal Pads BGAs Additional Guidelines Common Mistakes Made Missing refdes (both symbol and footprint) For more information or component creation services visit EEConcierge.com ​ Holes not big enough (exact size of the hole) The datasheet is for a different part No part number on IC schematic No keepouts (this came up with antennas) Ground or power pins on the top or bottom of a symbol No pin one marker (footprint) Footprints not centered Missing mechanical details or holes on the wrong layers Wrong number of pins Bad pin names Missing overbars or # or n in the pin name Marking pin one improperly Specific Guidelines for Axial Components Specific Guidelines for Radial Components
    [Show full text]
  • PDF Package Information
    This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS 1.1 Packaging Trends In recent years, marked advances have been made in the electronics field. One such advance has been the progression from vacuum tubes to transistors and finally, to ICs. ICs themselves have been more highly integrated into LSIs, VLSIs, and now, ULSIs. With increased functions and pin counts, IC packages have had to change significantly in the last few years in order to keep-up with the advancement in semiconductor development. Functions required for conventional IC packages are as follows: 1) To protect IC chips from the external environment 2) To facilitate the packaging and handling of IC chips 3) To dissipate heat generated by IC chips 4) To protect the electrical characteristics of the IC Standard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage in the electronics industry for a number of years. With increasing integration and higher speed ICs, and with the miniaturization of electronic equipment, newer packages have been requested by the industry which incorporate the functions listed below: 1) Multi-pin I/O 2) Ultra-miniature packages 3) Packages suited to high density ICs 4) Improved heat resistance for use with reflow soldering techniques 5) High throughput speed 6) Improved heat dissipation 7) Lower cost per pin In response to these requests, OKI has developed a diversified family of packages to meet the myriad requirements of today’s burgeoning electronics industry.
    [Show full text]
  • Quad Flat No-Lead (QFN) Evauation Test
    National Aeronautics and Space Administration Quad Flat No-Lead (QFN) Evaluation Testing Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory Pasadena, California Jet Propulsion Laboratory California Institute of Technology Pasadena, California 6/17 National Aeronautics and Space Administration Quad Flat No-Lead (QFN) Evaluation Testing NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Success Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory Pasadena, California NASA WBS: 724297.40.43 JPL Project Number: 104593 Task Number: 40.49.02.35 Jet Propulsion Laboratory 4800 Oak Grove Drive Pasadena, CA 91109 http://nepp.nasa.gov 6/17 This research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, and was sponsored by the National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not constitute or imply its endorsement by the United States Government or the Jet Propulsion Laboratory, California Institute of Technology. Copyright 2017. California Institute of Technology. Government sponsorship acknowledged. Acknowledgments The author would like to acknowledge many people from industry and the Jet Propulsion Laboratory (JPL) who were critical to the progress of this activity including the Rochester Institute of Technology (RIT). The author extends his appreciation to program managers of the National Aeronautics and Space
    [Show full text]
  • AN1902: Assembly Guidelines for QFN and SON Packages
    AN1902 Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages Rev. 9 — 28 April 2021 Application note Document information Information Content Keywords QFN, SON, PCB, Assembly, Soldering Abstract This document provides guidelines for the handling and board mounting of QFN and SON packages including recommendations for printed-circuit board (PCB) design, soldering, and rework. NXP Semiconductors AN1902 Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages Revision history Rev Date Description v.9 20210428 Updated description in Section 7.1 and Section 7.2 v.8 20180206 Rewrote to combine Freescale AN1902 and NXP AN10365 application notes into a single document. AN1902 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Application note Rev. 9 — 28 April 2021 2 / 50 NXP Semiconductors AN1902 Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages 1 Introduction This application note provides guidelines for the handling and board mounting of NXP's QFN and SON packages including recommendations for printed-circuit board (PCB) design, board mounting, and rework. Generic information of package properties such as moisture sensitivity level (MSL) rating, board level reliability, mechanical and thermal resistance data are also provided. Semiconductor components are electrical (ESD) and mechanical sensitive devices. Proper precautions for handling, packing and processing are described. 2 Scope This application note contains generic information about various QFN and SON packages assembled at NXP and NXP's assembly and test vendors. Refer to Section 9 "Downloading package information from NXP website" of this application note for step by step instructions for retrieving package information.
    [Show full text]
  • (HSOP) and Power Quad Flat Package (PQFP) PCB Assembly Guidelines
    NXP Semiconductors Document Number: AN2388 Application Note Rev. 3.0, 7/2016 Heat sink small outline package (HSOP) and power quad flat package (PQFP) PCB assembly guidelines 1 Introduction Contents 1 Introduction . .1 This application note provides guidelines for the handling and assembly 2 Scope . .1 of NXP’S heat sink small outline package (HSOP) and power quad flat 3 HSOP and PQFP package information. .2 package (PQFP) during printed circuit board (PCB) assembly. 4 Printed circuit board guidelines . .4 Guidelines for PCB design, rework, and package performance 5 Board assembly . .10 information, such as Moisture Sensitivity Level (MSL) rating, board level reliability, mechanical, and thermal resistance data are included for 6 Repair and rework procedure . .14 reference. 7 Board level reliability . .17 8 Thermal characteristics . .18 9 Case outline drawing, MCDS and MSL rating. .20 2 Scope 10 Package handling . .21 11 References . .25 This document contains generic information encompassing various NXP HSOP and PQFP packages assembled internally or at external 12 Revision history. .26 subcontractors. Specific information about each device is not provided. To develop a specific solution, actual experience and development efforts are required to optimize the assembly process and application design per individual device requirements, industry standards (such as IPC and JEDEC), and prevalent practices in the assembly environment. For more details about the specific devices contained in this note, visit www.nxp.com, or contact the appropriate product application team. © 2016 NXP B.V. HSOP and PQFP package information 3 HSOP and PQFP package information Figure 1 shows the standard HSOP and PQFP offerings through NXP.
    [Show full text]
  • Building Your Prototype
    Building Your Prototype Prototype Construction Techniques Part Numbers Package Types Specification Sheets Schematic Diagrams Practical Advice T. Grotjohn, [email protected] Prototype Construction Techniques 1) Protoboard Use DIP components Keep your wires neat and color coded Prone to bad connections Maximum operating speed: ~ few MHz 2) Wire Wrap Often done using wire wrap sockets on a vector board Use DIP components Wire used is good for digital signals Be careful with high current lines because the wire is small. Typical wire: 30 gauge 0.34 Ω/m 28 gauge 0.21 Ω/m 3) Soldered Board Single solder points board Tied solder points board (Your mini project #1) PCB: printed circuit board PCB can be made for ECE 480 projects in the ECE Shop: See the shop’s web page. (Also see the next page) . Printed Circuit Board System General Information T-Tech Protyping Machine ECE 482 Student Project Design Department of Electrical and Computer Engineering, 1999 Michigan State University, East Lansing, Michigan, USA Part Numbers Typical Part Number: DM8095N Prefix: Indicates the manufacture of the part. See two pages in Attachment 1. Suffixes: Indicates temperature range: “military”, “industrial”, “commercial” Also the suffixes are used to indicate package types. The ECE shop deals most often with the following electronic part suppliers. Allied Electronics (www.alliedelec.com) Digi Key (www.digikey.com) Newark Electronics (www.newark.com) For other (non-electronic) supplies, suppliers often used are Grainger (www.grainger.com) McMaster Carr (www.mcmaster.com) Package Types DIP: Dual Inline Package Easiest to use. Works in protoboards, solder boards, wire wrapping, easiest to solder components to PCB This is your choice for ECE 480.
    [Show full text]