Feasibility Study Gan Transistors Application in the Novel Split-Coils Inductive Power Transfer System with T-Type Inverter

Total Page:16

File Type:pdf, Size:1020Kb

Feasibility Study Gan Transistors Application in the Novel Split-Coils Inductive Power Transfer System with T-Type Inverter energies Article Feasibility Study GaN Transistors Application in the Novel Split-Coils Inductive Power Transfer System with T-Type Inverter Viktor Shevchenko 1,* , Bohdan Pakhaliuk 1,2, Oleksandr Husev 1,3,*, Oleksandr Veligorskyi 1, Deniss Stepins 4 and Ryszard Strzelecki 2,* 1 Chernihiv Power Electronics Laboratory, BRAS Department, Educational-Scientific Institute of Electronic and Information Technologies, Chernihiv National University of Technology, 14039 Chernihiv, Ukraine; [email protected] (B.P.); [email protected] (O.V.) 2 Faculty of Electrical and Control Engineering, Gdansk University of Technology, 80-233 Gdansk, Poland 3 Power Electronics Research Group, Tallinn University of Technology, 12616 Tallinn, Estonia 4 Institute of Industrial Electronics and Electrical Engineering, Riga Technical University, 12/K1 Azenes Street, LV-1658 Riga, Latvia; [email protected] * Correspondence: [email protected] (V.S.); [email protected] (O.H.); [email protected] (R.S.); Tel.: +380-93-957-4211 (V.S.); +380-96-985-5012 (O.H.) Received: 17 July 2020; Accepted: 28 August 2020; Published: 1 September 2020 Abstract: A promising solution for inductive power transfer and wireless charging is presented on the basis of a single-phase three-level T-type Neutral Point Clamped GaN-based inverter with two coupled transmitting coils. The article focuses on the feasibility study of GaN transistor application in the wireless power transfer system based on the T-type inverter on the primary side. An analysis of power losses in the main components of the system is performed: semiconductors and magnetic elements. System modeling was performed using Power Electronics Simulation Software (PSIM). It is shown that the main losses of the system are static losses in the filter inductor and rectifier diodes on the secondary side, while GaN transistors can be successfully used for the wireless power transfer system. The main features of the Printed Circuit Board (PCB) design of GaN transistors are considered in advance. Keywords: wireless power transfer; inductive power transmission; multilevel converter; AC-DC power converters; T-type inverter; GaN-transistors; electromagnetic coupling 1. Introduction Interest in inductive wireless power transmission is constantly growing due to the increasing interests of both low-power wireless chargers for mobile and wireless charging stations of medium and high power for electric bikes and electric vehicles. Such chargers transfer the electric energy wirelessly from primary to secondary inductor by means of inductive coupling [1]. Inductive wireless power transfer systems consist of a transmitting part (contains an inverter, compensation circuit and primary inductor) and a receiving part (receiving inductor, compensation circuit, rectifier) [1]. The researchers have already analyzed the main possible topologies of compensation schemes, their advantages and disadvantages, and described the general recommendations for their implementation. It is well known that Wireless Power Transfer (WPT) systems have some limitations, such as short transmission distance(centimeters or dozens of centimeters at acceptable levels of transmission efficiency) [2,3], sensitivity to the exact positioning of the receiving coil relative to the transmission coil [2,4], size and cost of the system. Energies 2020, 13, 4535; doi:10.3390/en13174535 www.mdpi.com/journal/energies Energies 2020, 13, x FOR PEER REVIEW 2 of 16 Among existing limitations, the issue of the size and cost of the WPT system is one of the most Energiesimportant.2020, 13Researchers, 4535 are still looking for the optimal system configurations and topologies2 of of 16 power converters that would best meet the above requirements. Different types of switches are utilized in the power electronics converters [5–8]. The conventionalAmong existingInsulated limitations, Gate Bipola ther Transistors issue of the (IGBTs) size and are cost gradually of the WPT going system out of is use one in of industrial the most important.circuits of ResearchersWPT systems are due still to looking their forlow the switching optimal systemcapability configurations [9]. The reverse and topologies blocking of voltage power converterscapability of that the would conventional best meet IGBT the is above very requirements.low; there are relatively large power losses [10]. It is well knownDi ffthaterent the types use of wideband switches are gap utilized semiconductors in the power (such electronics as GaN-transistors) converters [5 –instead8]. The of conventional classical Si Insulatedpower switches Gate Bipolarcan significantly Transistors reduce (IGBTs) the are power gradually losses goingthat lead out to of the use increasing in industrial of the circuits system of WPTefficiency systems or significantly due to their increase low switching switching capability frequency [9]. reducing The reverse size blockingof passive voltage elements capability [11–13]. ofIt theis advisable conventional to use IGBT GaN istransistors very low; for there T-type are topo relativelylogies large[5–8,14]. power The lossesGaN fe [10atures]. It isfast well switching, known thatlow parasitic the use of charges, wideband reverse gap semiconductorsconductivity with (such zero as recovery GaN-transistors) charge and instead low driving of classical power Si powerlosses switchesand dynamic can significantly losses; compared reduce theto Si-IGBTs power losses and that SiC-MOSFETs lead to the increasing [5,6,15–18], of thehigher system efficiency, efficiency low or significantlyparasitic output increase capacitance switching [16–18] frequency can be reducingachieved. sizeThe ofadvantage passiveelements of GaN over [11– Si13 is]. Itmostly is advisable visible toat higher use GaN frequencies transistors in for dynamic T-type losses topologies [15,19]. [5– However,8,14]. The the GaN conduction features fast losses switching, are comparable low parasitic with charges,the SIC semiconductors reverse conductivity [18,19]. with zero recovery charge and low driving power losses and dynamic losses;The compared main goal to Si-IGBTsof the article and SiC-MOSFETsis to study the [5 ,feasibility6,15–18], higherof GaN effi transistorciency, low application parasitic outputin the capacitanceproposed non-traditional [16–18] can be (non-classical) achieved. The WPT advantage system. This of GaN will be over based Si is on mostly the loss visible analysis at higherof the frequenciesmain components in dynamic of the lossescircuit. [15 ,19]. However, the conduction losses are comparable with the SIC semiconductorsThe paper, consisting [18,19]. of seven sections, proposes a new solution of the wireless power transfer systemThe based main on goal two of theparallel article single-phase is to study the T-type feasibility GaN-based of GaN invertors transistor (dual application T-type in inverter) the proposed with non-traditionaltwo transmitting (non-classical) coils on one ferrite WPT core system. (coupled This transmitting will be based inductances). on the loss The analysis case study of the system main componentsdescription and of the advantages circuit. of such solution are represented in Section 2 of the paper. According to previousThe paper,research consisting [20], more of than seven 70% sections, of the losse proposess in WPT a new systems solution for of various the wireless cases of power power, transfer loads systemand working based onfrequencies two parallel depend single-phase on semiconduc T-type GaN-basedtors and invertors inductors (dual [20,21]. T-type Therefore, inverter) withthe twocontribution transmitting of such coils parameters on one ferrite was coretaken (coupled into account transmitting in calculations inductances). in this paper. The case Confirmation study system of descriptionthe advantages and advantagesof the proposed of such solution, solution made are represented mainly by in power Section losses2 of the analysis, paper. Accordingdescribed toin previousSections 3–5. research Section [20 ],3 moreand 4 than proposes 70% of the the losses losses models in WPT of systems the GaN for transistors various cases and ofcoil power, inductors, loads andrespectively. working frequenciesSimulation dependand experimental on semiconductors verifica andtion inductors of the proposed [20,21]. Therefore, solution theis described contribution in ofSection such parameters5, with conclusions was taken and into list account of patents in calculations devoted to in the this proposed paper. Confirmation WPT system ofon the Section advantages 6 and of7, respectively. the proposed solution, made mainly by power losses analysis, described in Sections3–5. Sections3 and4 proposes the losses models of the GaN transistors and coil inductors, respectively. Simulation and2. Case experimental Study System verification Description of the proposed solution is described in Section5, with conclusions and list of patents devoted to the proposed WPT system on Sections6 and7, respectively. Figure 1 depicts the proposed circuit of a multi-level converter for WPT. The primary converter 2.consists Case Studyof a System full-bridge Description three-level T-type inverter connected to bidirectional auxiliary semiconductor switches. The GaN-based T-type inverter is first proposed for use in a WPT system togetherFigure with1 depicts two coupled the proposed inductors. circuit It provides of a multi-level a number converter of advantages for WPT. over The existing primary analogues. converter consistsThe of DC a full-bridgesource is applied three-level
Recommended publications
  • Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
    Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components.
    [Show full text]
  • Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
    micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical
    [Show full text]
  • Best Practices for Board Layout of Motor Drivers
    Application Report SLVA959A–November 2018–Revised January 2019 Best Practices for Board Layout of Motor Drivers .................................................................................................................. Motor Drive Business Unit ABSTRACT PCB design of motor drive systems is not trivial and requires special considerations and techniques to achieve the best performance. Power efficiency, high-speed switching frequency, low-noise jitter, and compact board design are few primary factors that designers must consider when laying out a motor drive system. Texas Instruments' DRV devices are ideal for such type of systems because they are highly integrated and well-equipped with protection circuitry. The goal of this application report is to highlight the primary factors of a motor drive layout when using a DRV device and provide a best practice guideline for a high performance solution that reduces thermal stress, optimizes efficiency, and minimizes noise in a motor drive application. Contents 1 Grounding Optimization ..................................................................................................... 3 2 Thermal Overview ........................................................................................................... 7 3 Vias........................................................................................................................... 11 4 General Routing Techniques ............................................................................................. 14 5 Bulk and Bypass
    [Show full text]
  • MAT 253 Operating Manual - Rev
    MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING
    [Show full text]
  • Series Catalog
    Conductive Polymer Aluminum Electrolytic Capacitors Surface Mount Type CY,SY series [Guaranteed at 85 ℃] Features ● Endurance 85 ℃ 2000 h ● Product height (3.0 mm max.) ● High ripple current (5100 mA rms to 6300 mA rms max.) ● RoHS compliance, Halogen free Specifications Series CY / SY Category temp. range –55 ℃ to +85 ℃ Rated voltage range 4.0 V, 6.3V Nominal cap. range 330 μF to 470 μF Capacitance tolerance ±20 % (120 Hz / +20 ℃) DC leakage current I ≦ 0.1 CV (μA) 2 minutes Dissipation factor (tan δ) ≦ 0.06 (120 Hz / + 20 ℃) Surge voltage (V) Rated voltage × 1.25 (15 ℃ to 35 ℃) +85 ℃ 2000 h, rated voltage applied Capacitance change Within ±20 % of the initial value Endurance Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current ≦ 3 times of the initial limit +60 ℃, 90 % RH, 500 h, No-applied voltage Capacitance change of 4.0 V 6.3 V Damp heat initial measurd value +60 %, –20 % +50 %, –20 % (Steady state) Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current Within the initial limit Marking Dimensions (not to scale) Capacitance (μF) Polarity bar (Positive) ⊖ ⊕ H P P L W1 W2 Lot No. W2 R. voltage code R. voltage code Unit:V 単位:mm g 4.0 Series L±0.2 W1±0.2 W2±0.1 H±0.2 P±0.3 j 6.3 CY / SY 7.3 4.3 2.4 2.8 1.3 ✽ Externals of figure are the reference. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
    [Show full text]
  • Session 2 ENVIRONMENTALLY SOUND MANAGEMENT of USED and SCRAP PERSONAL COMPUTERS (Pcs)
    Session 2 ENVIRONMENTALLY SOUND MANAGEMENT OF USED AND SCRAP PERSONAL COMPUTERS (PCs) Robert Tonetti US EPA, Office of Solid Waste Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations 28-29 September 2000 Vienna, Austria TABLE OF CONTENTS INTRODUCTION...........................................................................................................................................4 DEFINITION AND CHARACTERIZATION OF “USED AND SCRAP PCS” ...........................................5 PRINCIPAL ENVIRONMENTAL CONCERNS...........................................................................................7 Substances of Concern.................................................................................................................................7 Exposure to Substances of Concern.............................................................................................................8 OVERVIEW OF REUSE/RECYCLING PRACTICES..................................................................................9 Overview of Reuse.......................................................................................................................................9 Environmental Considerations of Reuse......................................................................................................9 Overview of Raw Material Recovery ........................................................................................................10 GUIDELINES FOR DOMESTIC PROGRAMS ..........................................................................................12
    [Show full text]
  • OPERATION ASSIGNMENT with BOARD SPLITTING and MULTIPLE MACHINES in PRINTED CIRCUIT BOARD ASSEMBLY by SAKCHAI RAKKARN Submitted
    OPERATION ASSIGNMENT WITH BOARD SPLITTING AND MULTIPLE MACHINES IN PRINTED CIRCUIT BOARD ASSEMBLY by SAKCHAI RAKKARN Submitted in partial fulfillment of the requirements For the degree of Doctor of Philosophy Dissertation Adviser: Dr. Vira Chankong Department of Electrical Engineering and Computer Science CASE WESTERN RESERVE UNIVERSITY May, 2008 CASE WESTERN RESERVE UNIVERSITY SCHOOL OF GRADUATE STUDIES We hereby approve the thesis/dissertation of ______________________________________________________ candidate for the ________________________________degree *. (signed)_______________________________________________ (chair of the committee) ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ (date) _______________________ *We also certify that written approval has been obtained for any proprietary material contained therein. i Table of Contents Table of Contents…………………………………………………………………………..i List of Figures……………………………………………………………………………..v List of Tables…………………………………………………………………………….vii Acknowledgements………………………………………………………………………..x Abstract…………………………………………………………………………………...xi 1 Introduction……………………………………………………………………………...1 1.1 The Overview of Printed Circuit Board Assembly…………………………....1 1.2 Planning and Process for PCB Assembly……………………………………..2 1.3 Problem Statement and Rationale...…………………………………………...6 1.4 Research Objective……………………………………………………………8
    [Show full text]
  • Field Programmable Gate Array (FPGA) Based Trigger System for the Klystron Department
    SLAC-TN-10-007 Field Programmable Gate Array (FPGA) Based Trigger System for the Klystron Department Darius Gray Office of Science, Science Undergraduate Laboratory Internship Program Texas A&M University, College Station SLAC National Accelerator Laboratory Menlo Park, California August 14, 2009 Prepared in partial fulfillment of the requirement of the Office of Science, Department of Energy’s Science Undergraduate Laboratory Internship under the direction of Michael G. Apte in the Environmental Energy and Technology division at Lawrence Berkeley National Laboratory. Participant: __________________________________ Signature Research Advisor: __________________________________ Signature Work supported in part by US Department of Energy contract DE-AC02-76SF00515. Table of Contents Abstract……….2 Introduction/Problem Description………….3 Materials and Methods…………..3 Literature Cited…………....…10 Acknowledgements…………..11 Figures and Tables…………12 1 Abstract Field Programmable Gate Array (FPGA) Based Trigger System for the Klystron Department. Darius Gray, Alternative Paper, Science Undergraduate Laboratory Internship, SLAC National Accelerator Laboratory, Summer 2009. The Klystron Department is in need of a new trigger system to update the laboratory capabilities. The objective of the research is to develop the trigger system using Field Programmable Gate Array (FPGA) technology with a user interface that will allow one to communicate with the FPGA via a Universal Serial Bus (USB). This trigger system will be used for the testing of klystrons. The key materials used consists of the Xilinx Integrated Software Environment (ISE) Foundation, a Programmable Read Only Memory (Prom) XCF04S, a Xilinx Spartan 3E 35S500E FPGA, Xilinx Platform Cable USB II, a Printed Circuit Board (PCB), a 100 MHz oscillator, and an oscilloscope. Key considerations include eight triggers, two of which have variable phase shifting capabilities.
    [Show full text]
  • MTD1N50E Power MOSFET 1 Amp, 500 Volts
    ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others.
    [Show full text]
  • Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development*
    IJEE 1830 Int. J. Engng Ed. Vol. 22, No. 1, pp. 000±000, 2006 0949-149X/91 $3.00+0.00 Printed in Great Britain. # 2006 TEMPUS Publications. Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development* PHILLIP A.M.SANDBORN AND PETER A.SANDBORN CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD, USA.E-mail: [email protected] Embedded resistors are planar resistors that are fabricated inside printed circuit boards and used as an alternative to discrete resistor components that are mounted on the surface of the boards.The successful use of embedded resistors in many applications requires that the resistors be trimmed to required design values prior to lamination into printed circuit boards.This paper describes a simple emulation approach utilizing conductive paper that can be used to characterize embedded resistor operation and experimentally optimize resistor trimming patterns.We also describe a hierarchy of simple modeling approaches appropriate to both college engineering students and pre-college students that can be verified with the experimental results, and used to extend the experimental trimming analysis.The methodology described in this paper is a simple and effective approach for demonstrating a combination of measurement methods, uncertainty analysis, and associated engineering model development. Keywords: embedded resistors; embedded passives; trimming INTRODUCTION process that starts with a layer pair that is pre- coated with resistive material that is selectively EMBEDDING PASSIVE components (capaci- removed to create the resistors.The layer contain- tors, resistors, and possibly inductors) within ing the resistor is laminated together with other printed circuit boards is one of a series of technol- layers to make the finished printed circuit board.
    [Show full text]
  • Design and Optimization of Printed Circuit Board Inductors for Wireless Power Transfer System
    University of Tennessee, Knoxville TRACE: Tennessee Research and Creative Exchange Engineering -- Faculty Publications and Other Faculty Publications and Other Works -- EECS Works 4-2013 Design and Optimization of Printed Circuit Board Inductors for Wireless Power Transfer System Ashraf B. Islam University of Tennessee - Knoxville Syed K. Islam University of Tennessee - Knoxville Fahmida S. Tulip Follow this and additional works at: https://trace.tennessee.edu/utk_elecpubs Part of the Electrical and Computer Engineering Commons Recommended Citation Islam, Ashraf B.; Islam, Syed K.; and Tulip, Fahmida S., "Design and Optimization of Printed Circuit Board Inductors for Wireless Power Transfer System" (2013). Faculty Publications and Other Works -- EECS. https://trace.tennessee.edu/utk_elecpubs/21 This Article is brought to you for free and open access by the Engineering -- Faculty Publications and Other Works at TRACE: Tennessee Research and Creative Exchange. It has been accepted for inclusion in Faculty Publications and Other Works -- EECS by an authorized administrator of TRACE: Tennessee Research and Creative Exchange. For more information, please contact [email protected]. Circuits and Systems, 2013, 4, 237-244 http://dx.doi.org/10.4236/cs.2013.42032 Published Online April 2013 (http://www.scirp.org/journal/cs) Design and Optimization of Printed Circuit Board Inductors for Wireless Power Transfer System Ashraf B. Islam, Syed K. Islam, Fahmida S. Tulip Department of Electrical Engineering and Computer Science, University of Tennessee, Knoxville, USA Email: [email protected] Received November 20, 2012; revised December 20, 2012; accepted December 27, 2012 Copyright © 2013 Ashraf B. Islam et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
    [Show full text]
  • Guidelines for Using ST's MOSFET Smd Packages
    AN1703 APPLICATION NOTE GUIDELINES FOR USING ST’S MOSFET SMD PACKAGES R.Gulino 1. ABSTRACT The trend from through-hole packages to low-cost SMD-applications is marked by the improvement of chip technologies. "Silicon instead of heatsink" is therefore possible in many cases. Many applications today use PCBs assembled with SMD-technologies, the emphasis being on Power ICs in SMD packages mounted on single-sided PCBs laminated on one side. The printed circuit board (PCB) itself becomes the heatsink. In early fabrications a solid heatsink was either screwed or clamped to the power package. It was easy to calculate the thermal resistance from the geometry of the heatsink. In SMD-technology, this calculation is much more difficult because the heat path must be evaluated: chip (junction) - lead frame - case or pin - footprint - PCB materials (basic material, thickness of the laminate) - PCB volume - surroundings. As the layout of the PCB is a main contributor to the result, a new technique must be applied. Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. The power dissipation for a SMD device is a function of the drain pad size, which can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. The measurements achieved on SMD packages for different drain pad size show that by increasing the area of the drain pad the power dissipation can be increased. Although one can achieve improvements in power dissipation with this method, the tradeoff is to use valuable board area.
    [Show full text]