Using Stencils to Simplify the Printed Circuit Board Assembly Process
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Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components. -
Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical -
Best Practices for Board Layout of Motor Drivers
Application Report SLVA959A–November 2018–Revised January 2019 Best Practices for Board Layout of Motor Drivers .................................................................................................................. Motor Drive Business Unit ABSTRACT PCB design of motor drive systems is not trivial and requires special considerations and techniques to achieve the best performance. Power efficiency, high-speed switching frequency, low-noise jitter, and compact board design are few primary factors that designers must consider when laying out a motor drive system. Texas Instruments' DRV devices are ideal for such type of systems because they are highly integrated and well-equipped with protection circuitry. The goal of this application report is to highlight the primary factors of a motor drive layout when using a DRV device and provide a best practice guideline for a high performance solution that reduces thermal stress, optimizes efficiency, and minimizes noise in a motor drive application. Contents 1 Grounding Optimization ..................................................................................................... 3 2 Thermal Overview ........................................................................................................... 7 3 Vias........................................................................................................................... 11 4 General Routing Techniques ............................................................................................. 14 5 Bulk and Bypass -
MAT 253 Operating Manual - Rev
MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING -
Case Study on the Validation of SAC305 and Sncu-Based Solders in SMT, Wave and Hand Soldering at the Contract Assembler Level
Case Study on the Validation of SAC305 and SnCu-based Solders in SMT, Wave and Hand Soldering at the Contract Assembler Level Peter Biocca, ITW Kester Itasca, Illinois Carlos Rivas, SMT Dynamics Anaheim, California Abstract: At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a 63/37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes. The selection of soldering materials and fluxes are important as to insure high quality solder joints with lead-free solders which tend to wet slower than leaded solders but also the process equipment must be lead-free process compatible. Components must be lead-free and able to meet the thermal requirements of the process but also the MSL (moisture sensitivity limits) must be observed. Board finish must be lead- free and the PCB must be able to sustain higher process temperature cycles with no physical damage but also good solderability to enable subsequent soldering at the wave or hand assembly. Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council as the preferred option for SMT assembly and most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many contract manufacturers and PCBA assemblers are opting for less costly options such as tin-copper based solders for wave, selective, hand soldering, dip tinning operations. -
'Pin in Paste' Reflow Process with Combination of Solder Preforms To
As originally published in the IPC Printed Circuit Expo, APEX & Designer Summit Proceedings. Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering Guhan Subbarayan, Scott Priore Assembly Sciences and Technology, Cisco Systems, Inc. San Jose, California [email protected] Paul Koep, Scott Lewin*, Rahul Raut Cookson Electronics - Assembly Materials South Plainfield, NJ; *Elgin, IL Sundar Sethuraman Jabil Circuits San Jose, California ABSTRACT The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several advantages compared to the traditional wave soldering process. One of the primary advantages is lowering of cost due to the elimination of the wave soldering process and its associated tooling cost and potential handling damage. Another advantage is that with the wave soldering process, it is extremely difficult to achieve adequate holefill on thermally challenging thick Printed Circuit Boards (PCBs). However, by using PiP process with combination of solder preforms, it is possible to achieve adequate holefill and reliable solder joints for soldering PTH components. The objective of this study is to investigate the use and limitations of machine-placed solid solder preforms during the top- side SMT reflow process for PTH components. An experiment was designed to investigate the following problems: 1) How much additional volume is provided by the combination -
Series Catalog
Conductive Polymer Aluminum Electrolytic Capacitors Surface Mount Type CY,SY series [Guaranteed at 85 ℃] Features ● Endurance 85 ℃ 2000 h ● Product height (3.0 mm max.) ● High ripple current (5100 mA rms to 6300 mA rms max.) ● RoHS compliance, Halogen free Specifications Series CY / SY Category temp. range –55 ℃ to +85 ℃ Rated voltage range 4.0 V, 6.3V Nominal cap. range 330 μF to 470 μF Capacitance tolerance ±20 % (120 Hz / +20 ℃) DC leakage current I ≦ 0.1 CV (μA) 2 minutes Dissipation factor (tan δ) ≦ 0.06 (120 Hz / + 20 ℃) Surge voltage (V) Rated voltage × 1.25 (15 ℃ to 35 ℃) +85 ℃ 2000 h, rated voltage applied Capacitance change Within ±20 % of the initial value Endurance Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current ≦ 3 times of the initial limit +60 ℃, 90 % RH, 500 h, No-applied voltage Capacitance change of 4.0 V 6.3 V Damp heat initial measurd value +60 %, –20 % +50 %, –20 % (Steady state) Dissipation factor (tan δ) ≦ 2 times of the initial limit DC leakage current Within the initial limit Marking Dimensions (not to scale) Capacitance (μF) Polarity bar (Positive) ⊖ ⊕ H P P L W1 W2 Lot No. W2 R. voltage code R. voltage code Unit:V 単位:mm g 4.0 Series L±0.2 W1±0.2 W2±0.1 H±0.2 P±0.3 j 6.3 CY / SY 7.3 4.3 2.4 2.8 1.3 ✽ Externals of figure are the reference. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. -
1.5 Repair and Re-Balling Stencils for SMD Components
Repair and Re-balling stencils 1.5 for SMD components Application Manufacturing in the laser cut and laser Stencil post-processing welding process With the introduction of SMD-technology All laser cut stencils from LaserJob are subjected and the constant drive toward miniaturization LaserJob stencils are produced in temperature- to an automated post-cut brushing process. of components, new procedures and repair controlled production rooms with a fiber laser. The CNC-controlled brushing system removes all processes are constantly being developed in Our custom fiber laser platform produces a exposed burrs on the laser exit side. The brush order to provide reliable repair materials and significantly better beam quality then commonly head travels across the entire stencil surface in safe repair procedures. Despite the low failure used laser systems. The distinct lower cutting horizontal and vertical directions. rates of many of the new integrated circuits, opening (20 µm instead of the commonplace the high cost of these devices, and the subse- 40 µm), with equal depth of focus sharpness, Advantages of this process quent cost of the populated PCB require a allows for reduced heat input into the material. – no enlargement of pad openings reliable repair solution. The high precision of the moderately conical – lowest material removal < 2 µm It is very rare for a new product to achieve a first- apertures increases the process window in the – consistent thickness of stainless steel pass yield of 100 %. Increased component pick and place operation and allows for more material geometries and component leads, particularly efficient solder paste release. with area array components, create the need As a standard feature, the repair stencils are for tighter tolerances and accuracy from rework offered in sizes from 10 mm x 10 mm to systems and rework stencils. -
Soldering Guidelines for Land Grid Array Packages Application Note 61
Soldering Guidelines for Land Grid Array Packages Application Note 61 Summary The objective of this application note is to provide Peregrine Semiconductor customers with general guidelines for the soldering and assembly of land grid array (LGA) packages. Precise process development and designed experimentation are needed to optimize specific appli- cation/performance. Introduction LGAs are grid array packages with terminal pads on the bottom surface. These are leadless packages with electrical connections made via lands on the bottom side of the component to the surface of the connecting substrate (PCB, ceramic, LTCC, etc.). The LGA is typically made with organic laminate or PC board as substrate with nickel-gold (NiAu)-plated termina- tions. Other component termination plating or substrate might be used based on application. The LGA solder interconnect is formed solely by solder paste applied at board assembly because there are no spheres attached to the LGA. This results in a lower standoff height of approximately 0.06 mm to 0.10 mm, which is favored for portable product applications. The lower standoff height also allows more space above the package for heatsink solution or for thin form factor application. LGA eliminates the risk that customers receive packages with damaged or missing solder spheres due to shipping and handling. Reflow soldering of LGA assemblies provides mechanical, thermal and electrical connections between the component leads or terminations and the substrate surface mount land pattern. Solder paste may be applied to the surface mount lands by various methods, such as screen printing and stencil printing. Peregrine Semiconductor LGA packages are categorized as surface mount components (SMCs). -
Medalist Bead Probe Technology
Keysight Technologies Medalist Bead Probe Technology Technical Overview An Ingenious, Yet Simple Method for Dramatically Improving Test Access The Keysight Technologies, Inc. Medalist Bead Probe Technology is the industry’s first, fully researched, documented and proven technology for placing test targets directly on printed circuit board (PCB) signal traces. These beads then serve as highly reliable test points for use during in-circuit testing. This new technique dramatically improves in-circuit test access on high density and gigabit-speed boards, resulting in excellent fault coverage. And best of all, plac- ing bead probes on a PCB requires no changes to your existing SMT process. Today’s Test Challenge: Smaller, Faster As PCB’s get increasingly smaller, the ability to provide test points for “Over 1.5 million in-circuit test becomes more difficult. Designs with high-speed buses also data points lead limit where test targets can be placed us to believe that on board layouts. Workarounds for these issues can often be time solder-bead consuming and costly, and sometimes simply not possible. probing is not only feasible in a high Unprecedented Access No access? No problem. Keysight volume production Bead probes are easily placed on has the solution. Test engineers can parallel traces with no re-routing environment, but now get the access they need for superior test coverage, even on the can be successfully most densely populated boards. In Use your current fact, numerous bead probes can be SMT processes implemented placed on multiple traces. Sit back and let your Keysight ICT tester select You can get started immediately without any the optimal bead locations for probing. -
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT of USED and SCRAP PERSONAL COMPUTERS (Pcs)
Session 2 ENVIRONMENTALLY SOUND MANAGEMENT OF USED AND SCRAP PERSONAL COMPUTERS (PCs) Robert Tonetti US EPA, Office of Solid Waste Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations 28-29 September 2000 Vienna, Austria TABLE OF CONTENTS INTRODUCTION...........................................................................................................................................4 DEFINITION AND CHARACTERIZATION OF “USED AND SCRAP PCS” ...........................................5 PRINCIPAL ENVIRONMENTAL CONCERNS...........................................................................................7 Substances of Concern.................................................................................................................................7 Exposure to Substances of Concern.............................................................................................................8 OVERVIEW OF REUSE/RECYCLING PRACTICES..................................................................................9 Overview of Reuse.......................................................................................................................................9 Environmental Considerations of Reuse......................................................................................................9 Overview of Raw Material Recovery ........................................................................................................10 GUIDELINES FOR DOMESTIC PROGRAMS ..........................................................................................12 -
OPERATION ASSIGNMENT with BOARD SPLITTING and MULTIPLE MACHINES in PRINTED CIRCUIT BOARD ASSEMBLY by SAKCHAI RAKKARN Submitted
OPERATION ASSIGNMENT WITH BOARD SPLITTING AND MULTIPLE MACHINES IN PRINTED CIRCUIT BOARD ASSEMBLY by SAKCHAI RAKKARN Submitted in partial fulfillment of the requirements For the degree of Doctor of Philosophy Dissertation Adviser: Dr. Vira Chankong Department of Electrical Engineering and Computer Science CASE WESTERN RESERVE UNIVERSITY May, 2008 CASE WESTERN RESERVE UNIVERSITY SCHOOL OF GRADUATE STUDIES We hereby approve the thesis/dissertation of ______________________________________________________ candidate for the ________________________________degree *. (signed)_______________________________________________ (chair of the committee) ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ ________________________________________________ (date) _______________________ *We also certify that written approval has been obtained for any proprietary material contained therein. i Table of Contents Table of Contents…………………………………………………………………………..i List of Figures……………………………………………………………………………..v List of Tables…………………………………………………………………………….vii Acknowledgements………………………………………………………………………..x Abstract…………………………………………………………………………………...xi 1 Introduction……………………………………………………………………………...1 1.1 The Overview of Printed Circuit Board Assembly…………………………....1 1.2 Planning and Process for PCB Assembly……………………………………..2 1.3 Problem Statement and Rationale...…………………………………………...6 1.4 Research Objective……………………………………………………………8