INTERNAL COMPONENTS the Motherboard Is the Main Printed
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Ling Chia Wang (Student) and Masato R. Nakamura (Advisor) Background Objectives Comparison of PC Cooling Systems Summary Summer
Heat Transfer Analysis of Computer Components for Electronic Waste (e-waste) Reduction: Cardboard PC Case Design Project Ling Chia Wang (student) and Masato R. Nakamura (advisor) Department of Mechanical Engineering and Industrial Design Technology New York City College of Technology (City Tech), City University of New York (CUNY), Brooklyn, NY 11201 Background Comparison of PC Cooling Systems Cardboard PC Case Design Fans Low-noise CPU cooler GPU HDD and Reducing electric wastes (e-wastes) has been one of the main concerns DVD/Blu-ray Drive • A low-noise CPU cooler was proposed in 2012 that provides a more efficient heat in sustainable solid waste management since the development of dissipation capacity from the CPU to a finned heatsink without adding more heat pipes at Information Technology (IT) was started to accelerate. a lownoise level of a small fan under the confined space constraints of a computer chassis. Computational fluid dynamics (CFD) simulations were used to search for a • A short life cycle of computers demands an efficient recycling process, as 2 proper cooling design . Motherboard well as re-design of computer components. • E-waste of desktop PC in China and South Africa will rise by 500% in 2020 compared to their 2007 levels. Summary • One of the major components of desktop computers is a PC case: 49.8% by weight of wasted desktop computers. • During the e-waste recycling process, dismantling obsolete computers 2 Figure 5: Tentative design of cardboard PC (mainly liberating components from computer cases) takes a lot of Figure 2: schematic diagram of cooler (left), calculated temperature distribution (center), calculated velocity distribution (right) workload of skilled workers. -
Direct Memory Access Components Verification System
ТРУДЫ МФТИ. — 2012. — Том 4, № 1 Frolov P. V. et al. 1 УДК 004.052.42 P. V. Frolov, V. N. Kutsevol, A. N. Meshkov, N. Yu. Polyakov, M. P. Ryzhov AO «MCST» PAO «INEUM» Direct Memory Access components verification system A method of direct memory access subsystem verification used for Elbrus series micro- processors has been described. A peripheral controller imitator has been developed in order to reduce verification overhead. The model of imitator has been included into the functional machine simulator. A pseudorandom test generator for verification of the direct memory access subsystem has been based on the simulator. Ключевые слова: system verification, functional model, direct memory access, pseu- dorandom test generation. Direct Memory Access components verification system 1. Introduction Modern computer systems require very intensive data exchange between the peripheral de- vices and the random-access memory. In the most cases this exchange is performed by the direct memory access (DMA) subsystem. The increasing demands for the performance of the subsys- tem lead to an increase in its complexity, therefore requiring development of effective approaches to DMA subsystem verification [1,2]. This article is based on a result of a comprehensive project than combined implementation of a there co-designed verification techniques based on the consecutive investigation of theDMA subsystem employing one the three models: 1) a functional model written in C++ that corre- sponds to behaviour of the subsystem in the environment determined by a real computer system configuration, 2) RTL model in Verilog and 3) FPGA-based prototype. This article describesthe first method that enables verifying correctness of the design at an early stage of the verification and eliminate a large quantity of bugs using simple tests. -
VIA RAID Configurations
VIA RAID configurations The motherboard includes a high performance IDE RAID controller integrated in the VIA VT8237R southbridge chipset. It supports RAID 0, RAID 1 and JBOD with two independent Serial ATA channels. RAID 0 (called Data striping) optimizes two identical hard disk drives to read and write data in parallel, interleaved stacks. Two hard disks perform the same work as a single drive but at a sustained data transfer rate, double that of a single disk alone, thus improving data access and storage. Use of two new identical hard disk drives is required for this setup. RAID 1 (called Data mirroring) copies and maintains an identical image of data from one drive to a second drive. If one drive fails, the disk array management software directs all applications to the surviving drive as it contains a complete copy of the data in the other drive. This RAID configuration provides data protection and increases fault tolerance to the entire system. Use two new drives or use an existing drive and a new drive for this setup. The new drive must be of the same size or larger than the existing drive. JBOD (Spanning) stands for Just a Bunch of Disks and refers to hard disk drives that are not yet configured as a RAID set. This configuration stores the same data redundantly on multiple disks that appear as a single disk on the operating system. Spanning does not deliver any advantage over using separate disks independently and does not provide fault tolerance or other RAID performance benefits. If you use either Windows® XP or Windows® 2000 operating system (OS), copy first the RAID driver from the support CD to a floppy disk before creating RAID configurations. -
Creative Webcam Vf-0060 Driver Download Win7 DRIVER CREATIVE LABS VF-0060 USB for WINDOWS 8 X64
creative webcam vf-0060 driver download win7 DRIVER CREATIVE LABS VF-0060 USB FOR WINDOWS 8 X64. If you have creafive questions, please comment below. Host interfaces produced by a new & 2. Webcam Live is headphones for the Endpoints EP800 image controller chip. It worked on my old computer but I never had a disc for it, downloaded software at the time but I don't remember where from. Manufacturer, creative labs Model, vf-0060 Interface, USB. 3 External Sound Card & USB DAC Amp featuring Upgrade Motherboard Audio, 24-Bit/96 kHz Audio Output, 24-Bit/48 kHz Microphone Input, 93 dB Signal-to-Noise Ratio SNR , Drives a Wide Range of Headphones, Plug-and-Play via USB 3.0 & 2.0, Single or Split Stereo/Mic Connectors, Sound Blaster PLAY! Get technical help for your Creative products through Knowledgebase Solutions, firmware updates, driver downloads and more. Kernel 4 kernels, I cannot do much then. Cam Chat HD USB webcam for instant video chats. Support for such products is limited to online materials, such as Knowledgebase Solutions, drivers, application updates and product documentations available on the Creative Customer Support website. Support people indicated a conflict with Haupauge WinTV. This file can worked on WinXP, win7 creative vf 0060 xp driver EXE Looking for a windows xp driver for my creative labs vf-0060 usb pc 2. Fixed compatibility issues with Intel and AMD based USB 3.0 system It is highly recommended to always use the most recent driver version available. Here is a step by step written tutorial for those who. -
ATX-945G Industrial Motherboard in ATX Form Factor with Intel® 945G Chipset
ATX-945G Industrial Motherboard in ATX form factor with Intel® 945G chipset Supports Intel® Core™2 Duo, Pentium® D CPU on LGA775 socket 1066/800/533MHz Front Side Bus Intel® Graphics Media Accelerator 950 Dual Channel DDR2 DIMM, maximum 4GB Integrated PCI Express LAN, USB 2.0 and SATA 3Gb/s ATX-945G Product Overview The ATX-945G is an ATX form factor single-processor (x8) and SATA round out the package for a powerful industrial motherboard that is based on the Intel® 945G industrial PC. I/O features of the ATX-945G include a chipset with ICH7 I/O Controller Hub. It supports the Intel® 32-bit/33MHz PCI Bus, 16-bit/8MHz ISA bus, 1x PCI Express Core™2 Duo, Pentium® D, Pentium® 4 with Hyper-Threading x16 slot, 2x PCI Express x1 slots, 3x PCI slots, 1x ISA slot Technology, or Celeron® D Processor on the LGA775 socket, (shared w/ PCI), onboard Gigabit Ethernet, LPC, EIDE Ultra 1066/800/533MHz Front Side Bus, Dual Channel DDR2 DIMM ATA/100, 4 channels SATA 3Gb/s, Mini PCI card slot, UART 667/533/400MHz, up to 4 DIMMs and a maximum of 4GB. The compatible serial ports, parallel port, floppy drive port, HD Intel® Graphic Media Accelerator 950 technology with Audio, and PS/2 Keyboard and Mouse ports. 2048x1536x8bit at 75Hz resolution, PCI Express LAN, USB 2.0 Block Diagram CPU Core™2 Duo Pentium® D LGA775 package 533/800/1066MHz FSB Dual-Core Hyper-Threading 533/800/1066 MHz FSB D I M Northbridge DDR Channel A M ® x Intel 945G GMCH 2 DDRII 400/533/667 MHz D I CRT M M DB-15 DDR Channel B x 2 Discrete PCIe x16 Graphics DMI Interface 2 GB/s IDE Device -
In This Video We Are Going to See How a Personal Computer Hardware Is Organised the PC Was Designed with an Open Architecture
In this video we are going to see how a personal computer hardware is organised The PC was designed with an open architecture. This means that it uses standard modular components. We can add, replace, update or swap them easily and the computer will identify and handle the new devices automatically. The main component of a computer system is the motherboard or main board. It is a printed circuit board (PCB) that holds the main components of the computer and the electronics needed to communicate between them and to expand the system. We could say that it is the central nervous system of the computer. A motherboard provides the electrical connections by which the other components of the system communicate. Unlike a backplane, it also contains the central processing unit and hosts other subsystems and devices The form factor is the specification of a motherboard – the dimensions, power supply type, location of mounting holes, number of ports on the back panel, etc. In the IBM PC compatible industry, standard form factors ensure that parts are interchangeable across competing vendors and generations of technology, while in enterprise computing, form factors ensure that server modules fit into existing rack mount systems. Traditionally, the most significant specification is for that of the motherboard, which generally dictates the overall size of the case. The most used form factor for IBM PC compatible motherboards is ATX (Advanced Technology Extended) and its derivatives. For small form factor mainboards mini ITX is the de facto standard. A power supply unit (PSU) converts mains AC to low- voltage regulated DC power for the internal components of a computer. -
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for E-Function Module
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module Noboru Fujimaki Kiyoshi Koike Kazuhiro Takami Sigeyuki Ogata Hiroshi Iinaga Background shortening of signal wirings between circuits, reduction of damping resistors and elimination of characteristic Higher functionality of today’s portable devices impedance controls. Embedded component module demands smaller, lighter and thinner electronic boards have been adopted for higher functionality of components. Looking at the evolution of package video cameras and miniaturizing wireless communication miniaturization from the flat structure (System in Package: devices. It is expected the use will spread to a wider SiP) -> silicon chip stack structure (Chip on Chip: CoC) -> range of areas including automotive, consumer products, package stack structure (Package on Package: PoP) -> Si industrial equipment and infrastructure equipment. To through chip contact structure, the technology has gone meet these needs, a technology to package and embed from two-dimensional to three-dimensional packaging the various components and LSI will be required. This achieving high density packages. The trends in printed article discusses the method of embedding components, circuit boards and their packaging are shown in Figure 1. soldering technology, production method, reliability and Among the printed circuit boards, the three-dimensional case examples of the embedded component module integrated printed circuit board (hereafter referred to as board. “embedded component module board”) is attracting great attention. Integrating components into embedded component module boards Component embedding enables passive components (1) Embedding active components to be positioned directly beneath the LSI mounted There are two methods of embedding active on the surface providing electrical benefits such as components. -
Antec NSK 4482B-GB Owner's Manual
Antec NSK-4482B Computer Cases owner's manual Free Online Library This website has one of the largest libraries with thousands different manuals and ebooks that will help you to understand absolutely any device and how to use it. Many people are searching for Antec NSK-4482B owner's manual, so you should take a closer look into our library, because we have couple of them right here. Every day we are uploading more informative books and documents about different appliances, devices and software. You can even print these PDF files and have all the necessary papers with you, no matter where you are. Antec NSK-4482B owner's manual Click here to read (36 pages) Browse this massive electronic library for more information about all de This is the list with most popular files that will tell you more about Antec (NSK 4482B-GB) device: Antec Piano Black Quiet Super Mini Tower. EC version setup guide Status: Available Download link: manualstorrent.com/share/12828/setup_guide/Piano-Black-Quiet-Super-Mini-Tower.-EC-version.pdf Antec Piano Black Quiet Super Mini Tower. EC version user guide Status: Available Download link: manualstorrent.com/share/12828/user_guide/Piano-Black-Quiet-Super-Mini-Tower.-EC-version.pdf Antec Piano Black Quiet Super Mini Tower. EC version operating instruction Status: Available Download link: manualstorrent.com/share/12828/operating_instruction/Piano-Black-Quiet-Super-Mini-Tower.-EC- version.pdf Antec 3U20ATX300EC Rack 300W 4x3.5"2x5.25" ATX operating instruction Status: Available Download link: manualstorrent.com/share/12830/operating_instruction/3U20ATX300EC-Rack-300W-4x3.5% -
PC Form Factors
PC Form Factors Computers come in different form factors. ATX is the most common. AT used to be the standard but is now obsolete. NLX and LPX are two others. These forms describe the shape and size of the motherboards, as well as the layout of the components on the board. The form factor will also determine the type of case you must buy, as the case is laid out differently and uses a different type of power supply. AT Form Factor Within the AT form, we have regular AT and Baby AT. They basically differ in size. An AT board is about 12" wide which means it can't fit in many of today's cases. AT boards generally are the older boards, 386 or earlier. Working inside the case was a lot more trouble with these because the size of the motherboard overlapped drive bays and such. Baby AT is the form used by many 486 and Pentium boards.. Many Socket 7 motherboards and a few Pentium II boards used this form factor. A Baby AT board is roughly 8.5" wide and 13" long. The size varies a little from board to board. This reduced size makes it easier to work inside the case simply because there is more room. There are three rows of mounting holes to hold the board in the case. AT form boards share common traits. They all have serial and parallel ports attached to the case in an expansion slot and connected to the board through cables. They also have a single keyboard connector soldered onto the board at the back of the board. -
Utilising Commercially Fabricated Printed Circuit Boards As an Electrochemical Biosensing Platform
micromachines Article Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform Uroš Zupanˇciˇc,Joshua Rainbow , Pedro Estrela and Despina Moschou * Centre for Biosensors, Bioelectronics and Biodevices (C3Bio), Department of Electronic & Electrical Engineering, University of Bath, Claverton Down, Bath BA2 7AY, UK; [email protected] (U.Z.); [email protected] (J.R.); [email protected] (P.E.) * Correspondence: [email protected]; Tel.: +44-(0)-1225-383245 Abstract: Printed circuit boards (PCBs) offer a promising platform for the development of electronics- assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical -
SFF.2009.RG.Pdf
Only Print Single Only Print Single www.smallformfactors.com www.pc104online.com Volume 13 • Number 1 COLUMNS FEATURES 8 PC/104 Consortium THE BIG YET SMALL PICTURE: Embedded marketplace embraces PCI/104-Express By Dr. Paul Haris Small, smaller, smallest 12 The wireless toolbox 9 Small Form Factor SIG By John Schwartz, Digi International Separating interconnects from form factors By Paul Rosenfeld 15 Focus on Form Factors: Pico-ITXe 10 Euro Small Tech By Bob Burckle, WinSystems Compact board powers personal weather station By Hermann Strass TECH SMALL TALK: Insights from the experts 74 Editor’s Insight 16 COMIT hits the embedded computing world Rugged SFFs nail system designs By Bob Burckle, WinSystems By Chris A. Ciufo Only IT’S A SMALL (FORM FACTOR) WORLD: Unique applications DEPARTMENTS 19 PC/104 powers nanosatellite for space situational 24 Editor’s Choice Products awareness By Kristin Allen, Kristin Allen Marketing & Design By Don Dingee Print 22 Prototyping SoCs with customized PCI Express WEB RESOURCES development boards By Stephane Hauradou, PLDA Subscribe to the magazine or E-letter Live industry news • Submit new products RESOURCE GUIDE: http://submit.opensystemsmedia.com White papers: 27 2009 PC/104 and Small Form Factors Resource Guide Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.comSingle Communications and networking ...........27 Complete systems .....................29 ON THE COVER: In a progression from small to smallest, the ADLINK Technology Industrial automation ...................30 MilSystem 800, WinSystems Pico-I/O with VIA Pico-ITXe, and Digi XBee radio module show the latest trends in small form factor Interfaces ..........................32 systems and boards. -
P5V-VM Ultra Specifications Summary
P5V-VM Ultra User Guide Motherboard E2589 First Edition September 2006 Copyright © 2006 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.