Mini ATR, 3-Slot Openvpx™ Platform RUGGED, SMALL FORM FACTOR
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Congatec Product Guide
Product Guide 2020 NXP based Modules congatec A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. And who do it all for the customer and their needs. Embedded in your success. Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than 13 years. Technology Leader congatec has been driving industry standards since 2005 SMARC 2.0 Module Configurable Battery Thin 2.5” SBC 3.5” SBC BIOS Manager Mini-ITX Pico-ITX Type 2 Heat Pipe Type 6 First Type 10 Type 7 Acquisiton Module Cooling Module Module Module Real-Time Systems Founder Founding Design Guide Founding customizing IoT COM HPC Member Member Services Gateway Chairman 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 Technology Partnerships Executive Member Founding Member Board Member Associate member Specification editor Rev. -
PC Form Factors
PC Form Factors Computers come in different form factors. ATX is the most common. AT used to be the standard but is now obsolete. NLX and LPX are two others. These forms describe the shape and size of the motherboards, as well as the layout of the components on the board. The form factor will also determine the type of case you must buy, as the case is laid out differently and uses a different type of power supply. AT Form Factor Within the AT form, we have regular AT and Baby AT. They basically differ in size. An AT board is about 12" wide which means it can't fit in many of today's cases. AT boards generally are the older boards, 386 or earlier. Working inside the case was a lot more trouble with these because the size of the motherboard overlapped drive bays and such. Baby AT is the form used by many 486 and Pentium boards.. Many Socket 7 motherboards and a few Pentium II boards used this form factor. A Baby AT board is roughly 8.5" wide and 13" long. The size varies a little from board to board. This reduced size makes it easier to work inside the case simply because there is more room. There are three rows of mounting holes to hold the board in the case. AT form boards share common traits. They all have serial and parallel ports attached to the case in an expansion slot and connected to the board through cables. They also have a single keyboard connector soldered onto the board at the back of the board. -
Qseven MSC Q7-MB-RP3
Qseven MSC Q7-MB-RP3 Description Qseven™ 2.0 Evaluation Board The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify Qseven™ Rev. 2.0 modules for compatibility with the SGET specification. The board is shipped with a complete set of design files. An extensive design guide for the Qseven™ module technology is also provided to allow the motherboard designer to easily implement a custom version of a Qseven™ carrier. The Qseven™ Rev. 2.0 reference platform MSC Q7-MB-RP3 offers a large variety of interfaces commonly used in industrial applications such as Gigabit LAN, USB 3.0/2.0, RS232 and CAN as well as HDMI, DP and LVDS 435 x 170 for display attachment. In addition PCI Express is supported with one x16 and three PCIe x1 slots. This platform for N.A. rapid prototyping helps to assess the fitness of a specific CPU Technology. It is a key instrument to shorten design N.A.N.A. cycles and to improve time to market of new Qseven™ based systems. Highlights . One PCI Express™ x16 slot and 3 x1 slots . Two graphic card slots for HDMI / DP / eDP / LVDS . Mini PCI Express™ & mSATA slot . SD Card socket and SIM Card slot . Two SATA onboard connectors . Winbond W83627DHG Super I/O . EXAR X28V384 Super I/O . 7x COM, HW monitor . CAN Transceiver . HD audio codec . USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces avnet.com/embedded Qseven Technical Data - MSC Q7-MB-RP3 Formfactor Wide-ATX Storage Interfaces 2x SATA USB USB 3.0, 4x USB 2.0 Host, USB 2.0 Client Serial Interfaces 2x COM from Winbond Super I/O 4x COM from EXAR Super I/O 1x COM from Qseven module Bus Interfaces PCI express x16, 3x PCIe x1 Display Interfaces HDMI, DP, eDP, LVDS on add-on cards Network Interface GbE Audio Interface HD Audio on 6 connectors + S/PDIF Power Requirement 12V on standard connectors Certificates UL avnet.com/embedded Qseven Order Reference - MSC Q7-MB-RP3 Order Description Reference Cat Number 1135005 The MSC Q7-MB-RP3 is a reference platform designed for evaluation and MSC Q7-MB-RP3 PV test of Qseven Rev. -
SFF.2009.RG.Pdf
Only Print Single Only Print Single www.smallformfactors.com www.pc104online.com Volume 13 • Number 1 COLUMNS FEATURES 8 PC/104 Consortium THE BIG YET SMALL PICTURE: Embedded marketplace embraces PCI/104-Express By Dr. Paul Haris Small, smaller, smallest 12 The wireless toolbox 9 Small Form Factor SIG By John Schwartz, Digi International Separating interconnects from form factors By Paul Rosenfeld 15 Focus on Form Factors: Pico-ITXe 10 Euro Small Tech By Bob Burckle, WinSystems Compact board powers personal weather station By Hermann Strass TECH SMALL TALK: Insights from the experts 74 Editor’s Insight 16 COMIT hits the embedded computing world Rugged SFFs nail system designs By Bob Burckle, WinSystems By Chris A. Ciufo Only IT’S A SMALL (FORM FACTOR) WORLD: Unique applications DEPARTMENTS 19 PC/104 powers nanosatellite for space situational 24 Editor’s Choice Products awareness By Kristin Allen, Kristin Allen Marketing & Design By Don Dingee Print 22 Prototyping SoCs with customized PCI Express WEB RESOURCES development boards By Stephane Hauradou, PLDA Subscribe to the magazine or E-letter Live industry news • Submit new products RESOURCE GUIDE: http://submit.opensystemsmedia.com White papers: 27 2009 PC/104 and Small Form Factors Resource Guide Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.comSingle Communications and networking ...........27 Complete systems .....................29 ON THE COVER: In a progression from small to smallest, the ADLINK Technology Industrial automation ...................30 MilSystem 800, WinSystems Pico-I/O with VIA Pico-ITXe, and Digi XBee radio module show the latest trends in small form factor Interfaces ..........................32 systems and boards. -
P5V-VM Ultra Specifications Summary
P5V-VM Ultra User Guide Motherboard E2589 First Edition September 2006 Copyright © 2006 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT. -
COM Express® Basic, Compact, Mini • Qseven® • SMARC™
• • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™ -
SECO PRESENTS ITS FIRST PRODUCT BUILT UPON the LATEST INTEL ATOM X6000e SERIES and INTEL PENTIUM and CELERON N and J SERIES PROCESSORS
SECO S.p.A. Cap. Soc. € 767.054,00 Via A. Grandi 20 52100 Arezzo – Italy Reg. Imprese n. 4196 Arezzo Pag.1of 6 Ph: +39 0575 26979 REA n. 70645 Fax: +39 0575 350210 Meccanografico AR007079 P.IVA – VAT IT 00325250512 Iscr. Reg. Pile e Accumulatori n. IT20080P00006356 SECO PRESENTS ITS FIRST PRODUCT BUILT UPON THE LATEST INTEL ATOM x6000E SERIES AND INTEL PENTIUM AND CELERON N AND J SERIES PROCESSORS Arezzo, Italy - September 23rd 2020 - SECO's goal has always been to be at the forefront of innovation, providing its customers with the latest technologies available on the market. Today SECO is pleased to unveil its latest product: the SM-C93, a SMARC® Rel 2.1.1 compliant module with the Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors. Thanks to the close partnership with Intel and being part of the early access program for this platform, SECO was able to develop a solution that would encompass its great potential. The Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors are Intel ’s first enhanced for IoT platforms, with CPU and GPU performance to support IoT applications requirements: with up to 4 cores and excellent performance/watt ratio (4.5W - 12W TDP), it boosts up to 40% faster CPU and 2x 3D graphics performance when compared to Intel Apollo Lake. Additional improvements are Intel UHD Graphics and integrated Gigabit Ethernet: up to 3 Ethernet ports at 2.5 Gb with Time Sensitive Network (TSN) capabilities, a technology aiming at standardizing the transmission of time-sensitive data over Ethernet networks. -
Highrel PC/104 ISA, PCI & Pcie Modules and Systems
Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing -
ETX Driving Embedded
An ACCES I/O Products Whitepaper ETX Driving Embedded I/O ACCES I/O Products, Inc., 10623 Roselle Street, San Diego, CA 92121 (858) 550-9559 • Fax (858) 550-7322 • [email protected] • www.accesio.com One of the fastest-growing concepts in the embedded world is the “computer-on-module” or COM.The COM approach takes the traditional concept of a computer motherboard with plug- in I/O modules and turns it around so that the motherboard, now called a baseboard, con- tains all the I/O and the CPU with its core support chips and memory plug in as a module. The result of this reversal is an approach that blends the advantages of custom design with those of standard products. Products based on the COM approach maintain long-term viabil- ity while retaining access to the latest in computer technology. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron in early 2000. The ETX specification defines a module that is approximate- ly 100-mm square (see Figure 1) and contains the core of a personal computer (PC), including CPU, chipset, mem- aper ory, and core I/O capability. The core I/O includes Ethernet, graphics, USB, keyboard, mouse, and serial interfaces along with a PCI/ISA bus for connection to additional peripherals. Four surface-mount connectors route the mod- ule’s I/O to the baseboard, which can be designed to meet an application’s specific needs. P The original ETX specification was quickly adopted in the embedded industry and is now monitored by the ETX Industrial Group (ETXIG), which is dedicated to keeping the specification in line with advancing technology and market needs. -
MS-98F1 Datasheet
Mini-ITX with Intel® Atom™ Braswell Platform for Multi-Displays, Panel PC MS-98F1 Low-Power and DC/ATX Solution HMI SIM slot TPM Mini-PCIe Embedded DDR3 SO-DIMM System Specifications LPT ® PS2 Intel Pentium processor N3710, QC, 6W Intel® Celeron processor N3160, QC, 6W CPU ® System Fan Intel Celeron processor N3060, DC, 6W Intel® Celeron processor N3010, DC, 4W N3710, 1.6 GHz, up to 2.56 GHz Embedded N3160, 1.6 GHz, up to 2.24 GHz Board Frequency COM3-5 Processor N3060, 1.6 GHz, up to 2.48 GHz ATX N3010, 1.04 GHz, up to 2.24 GHz Front Panel L2 Cache 2MB Indicator CPU Type BGA eDP GPIO LVDS Chipset Integrated Semi-rugged Inverter Terminal BIOS AMI 4 x USB 2.0 Technology Dual-channel DDR3L 1333/1600 MHz SATA 3.0 LVDS Memory Max. Capacity Up to 8 GB Mini-PCIe SATA Power Socket 2 x 204-pin SO-DIMM Controller Intel® HD Graphics Shared system memory up to 1.7 GB Graphic Memory System SDRAM POS LVDS 2 x dual channel 18/24-bit Amplifier eDP 1 (colay with LVDS) Display DisplayPort 1 SPI debug port Multiple Display 3 independent displays COM Express LVDS up to 1920 x 1200 Full Board 2 x GbE LAN Display Interface DP up to 3840 x 2160 eDP up to 2560 x 1600 2 x Intel® i210-AT 1 x Intel® i210-AT Line-in Controller Ethernet GbE LAN GbE LAN Line-out Audio Controller Realtek® ALC887 co-lay ALC888S Super I/O Controller Fintek F81866AD-I Qseven Watchdog Timer 256-level Watchdog Timer Board H/W Monitor COM1 DP 4 x USB 3.0 Mic Smart Fan Yes Pin header (default) Low profile TPM Controller Infineon SLB9635TT 1.2 (by BOM option) Line-out Pin header 4 x USB3.0 -
LIPPERT Coreexpress-ECO
PC/104 and Small Form Factors Resource Guide COM/SOM Processor boards/SBCs LiPPERT Embedded Computers Inc. 5555 Glenridge Connector, Suite 200 • Atlanta, GA 30342 404-459-2870 www.lippertembedded.com CoreExpress®-ECO The CoreExpress-ECO is an advanced Computer on Module (COM) implementation in a tiny 58 mm x 65 mm format. CoreExpress modules are legacy-free. Should an applica- tion require analog signals, these can be implemented on the carrier board. The Intel Atom processor with its low TDP leads to minimum cooling efforts. The module comes with up to 1 GB of soldered SDDR2 RAM, graphics, LVDS and SDVO display ports, and HD Audio. Two PCI Express FEATURES lanes are available for I/O and graphics. There are 8 USB 2.0 › Intel Atom processor ports, IDE, SDIO/MMC interface, SMBus, and LPC bus avail- › 512 MB, 1 GB, (2 GB opt.) SDDR2 soldered RAM able. All signals are available on a 220-pin connector. › 2x PCI Express lanes › SDIO/MMC › SMBus, GMBus/DDC, LPC bus CoreExpress-ECO features LiPPERT Enhanced Manage- › 2x graphics ports (LVDS and SDVO) ment Technology. It handles power sequencing and other › HD Audio housekeeping tasks, and provides a secure write- and clear- › 8x USB 2.0 protected Flash area for miscellaneous user information. › IDE An evaluation kit is available. › 5 V only supply, 5 W › Optionally extended temperature range -40 °C to +85 °C For more information, contact: [email protected] RSC# 37871 @ www.smallformfactors.com/rsc PC/104 and Small Form Factors Resource Guide EBX Advantech 38 Tesla, Suite 100 • Irvine, CA 92618 800-866-6008 www.advantech.com PCM-9588 The PCM-9588 is targeted at system integrators who want a modular solution with the low-power fanless features of the Intel® Celeron® M processor. -
ATX Specification
ATX Specification Version 2.01 ATX Specification - Version 2.01 New features and additional requirements of Version 2.01 of the ATX specification Please Note Version 2.01 of the ATX Specification incorporates clarifications and some minor changes, as noted below. These changes take into account support for the next generation of ATX motherboards, while maintaining compatibility with the first generation. Readers should examine their combination of motherboard, power supply, and chassis needs to determine whether they require the additional features found in Version 2.01 of the ATX Specification. Changes from Version 2.0 to Version 2.01 of the ATX Specification • Section 2 - Updated Figure 1 to reflect recommendations implemented with Version 2.0. • Section 3.2 - Modified Figure 2 to clarify motherboard mount requirements. • Section 3.3 - Updated table of requirements to reflect changes in the section outlined below. • Section 3.3.5 - Rewrote text to clarify requirements. • Section 3.3.5 - Reduced keepout zone requirement to 0.1” (2.5 mm). This change was based on feedback from chassis manufacturers and is the most significant requirement change with respect to the chassis. • Section 3.3.5 - Added recommendation to avoid paint within the keepout zone. • Section 3.3.5 - Replaced Figure 4 to clarify chassis I/O aperture requirements. Tolerances were added to dimensions. • Section 3.3.5 - Changed Figure 5 to define connector placement limitations on the motherboard. This is a new recommendation for motherboard designers to ensure clearance between the chassis and motherboard connectors for the I/O shield. • Section 3.3.5 - Modified Figure 6 to remove redundant dimensions, and removed Figure 7 completely.