Avnet Embedded OFFICES

Total Page:16

File Type:pdf, Size:1020Kb

Avnet Embedded OFFICES Avnet Embedded. Support Around The Board™ Product Brief. congatec conga-QA www.avnet-embedded.eu www.congatec.com Qseven™ Module Ultra Mobil conga-QA Ultra compact Qseven™ module based on Intel® Atom™ Processor Z5xx Module for ultra mobile Formfactor Qseven Form Factor, 70x70 mm applications CPU Intel® Atom™ processor Z530 1.6 GHz, 533 MHz FSB and memory bus speed, 512k L2 cache, 45 nm, Lowest power consumption with Hyper-Threading Technology Intel® Atom™ processor Z510 1.1 GHz, 400 MHz FSB and memory bus speed, 512k L2 cache, 45 nm Fast serial differential interfaces DRAM Up to 1 GByte on-board DDR2 memory with 400/533 MT/s for high data bandwidth Chipset Intel® SCH US15W Ethernet Gigabit Ethernet Realtek RTL8111 I/O Interfaces 8x USB 2.0, 1x SATA, 1x SDIO, 1x PCIe, I²C Bus, 1x USB client, LPC bus Mass Storage On-board ATA Solid State Drive up to 4 GByte (optional) Sound Intel® High Definition Audio (Intel® HD Audio) Graphics Intel® Graphics Media Accelerator 500 (Intel® GMA 500), up to 256 MByte frame buffer supporting Direct X 9.0E and Open GL 2.0 Video Decode Acceleration Full hardware acceleration for MPEG2, H.264, WMV9 and VC1 Motion Video Support Single channel 112MHz LVDS transmitter, support for flat panels with 1x18 and 1x24 bit data mapping up to resolutions of 1366x768 pixel Single channel SDVO interface, supports resolutions up to 1280x1024 pixel Dual independent display support congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, based on AMIBIOS8® Power Management ACPI 3.0 compliant, Smart Battery Management Operating Systems Windows® XP, Windows® XP embedded, Windows® CE 6.0, LINUX, QNX Power Consumption Typ. application ~5 Watt @ 5V Intel and Atom are trademarks of Corporation in the US other countries. Temperature Operating: 0 to +60°C Storage: -20 to +80°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 70 x 70 mm (2¾" x 2¾") guarantee of correctness is implied or expressed. guarantee of correctness is implied or expressed. © 2010 congatec AG. All rights reserved. All data is for information purposes only. Although all the information contained within this document is carefully checkeno Although all the information contained within this document is carefully checkeno All rights reserved. All data is for information purposes only. © 2010 congatec AG. congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, [email protected] www.congatec.com Block Diagram conga-QA Order Information conga-QA Article PN CPU-Z510 CPU-Z530 2GB SSD* 4GB SSD* SATA SSD conga- QA/Z510-1G 015001 ü ü ü ü SSD NandDrive Processor (optional) conga-QA/Z510-1G SSD2 015021 ü ü ü Hardware Slave Device Intel® Atom™ Monitor Z5xx Series conga-QA/Z510-1G SATA 015011 ü ü Front Side Bus (400 or 533MHz) Memory Bus Watchdog (400 or 533MHz) conga-QA/Z530-1G 015002 ü ü ü BC SPI Board Controller Onboard DDR2 Atmel RTC Maximum 1GB conga-QA/Z530-1G SSD2 015022 ü ü ATmega165P GPIOs conga-QA/Z530-1G SATA 015012 ü ü 1x IDE Intel® System Controller Hub FWH (BIOS) conga-QA/Z530-1G SSD4/SATA 015005 ü ü ü ü Hardware Monitoring and Fan Control Circuitry US15W *commercial version PATA to SATA Bridge LPC Bus Article PN Description 2x x1 PCIe Links conga-QA-HSP-B 042745 Heatspreader, Standoff with 2.7mm bore hole (LVDS) Hosts Realtek conga-QA-HSP-T 042740 Heatspreader, Standoff with 2.5mm threat 8x USB 2.0 1x SDVO I/F Gigabit Ethernet OR OR 8111 conga-QA-CSP-B 042735 Standard passive cooling solution, surface orange anodized with 1.8mm fins, Fan bore hole bracket, threaded standoffs. Off-board 1x x1 PCIe Link I2C 1x Channel LCD I/F Power Management and Control Signals 1x SATA I/F HDA SM Bus 1x SDIO/MMC 7x USB Host 1x SDVO 1x DisplayPort Control 1x USB Client Gbit Ethernet Engineering Tools / Accessories for Qseven conga-QEVAL 007001 Evaluation platform for Qseven conga-QKIT 077455 Starterkit for Qseven including conga-QEVAL, conga-LDVI/EPI, conga-FPA1, Dual DVI-D ADD2 Card, ATX power supply... Qseven Mobility Kit 077460 Complete ready-to-use starter-kit for mobile applications conga-Mini Carrier Board 020710 Qseven mini carrier board for mobile applications. conga-Mini Carrier cable kit 400015 Cable Kit for Qseven mini carrier board. Consisting of: 4x USB adapter cable, 1x LVDS display cable, 1x Feature connector cable, 1x HDMI to DVI adapter cable. Qseven MXM carrier board connector 400012 Socket for Qseven Carrier Boards, Foxconn PN:AS0B321-S78N-7F, standard type, SMT, lead free, 230 positions, 0.50mm pitch, 7.8mm height. 1pcs conga-LDVI/EPI 011115 LVDS to DVI converter board for digital flat panels with onboard EEPROM Single DVI-D ADD2 Card 058500 ADD2 display adapter card with single DVI-D digital output. Suitable for all Intel based platforms that support Serial Digital Display Outputs (SDVO) on the standard x16 PCI Express Graphics (PEG) port. congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, [email protected] www.congatec.com Avnet Embedded. Support Around The Board™ Avnet EmbeddEd OFFICES. DenmArk Avnet Embedded nETHERLANDS (BElGIUm, lUXEmBOUrG) Avnet Embedded Avnet EMG France SA Avnet Embedded Avnet Nortec A/S Les Peupliers II Avnet B.V. Ellekær 9 35 avenue des Peupliers Takkebijsters 2 2730 Herlev 35510 Cesson-Sévigné 4817 BL Breda Phone: +45 3678 6250 Phone: + 33 2 99 77 37 02 Phone: +31 76 5722400 Fax: +31 76 5722404 Fax: +45 3678 6255 Fax: + 33 2 99 77 37 01 [email protected] [email protected] [email protected] SWEdEn (nOrWAY) FInlAnd GERMAnY (AUSTrIA, CZECH rEPUBlIC, Avnet Embedded Avnet Embedded HUnGArY, POlAND, SWITZERLAND) Avnet Embedded Avnet Nortec AB Avnet Nortec Oy Esplanaden 3 D Avnet EMG GmbH Pihatörmä 1 B 172 67 Sundbyberg Gruber Straße 60c 02240 Espoo Phone: +46 8 564 725 50 Phone: +358 20 749 9 260 85586 Poing Fax: +46 8 760 01 10 Fax: +358 20 749 9 280 Phone: +49 8121 775 500 [email protected] [email protected] Fax: +49 8121 775 550 [email protected] FrAnCE UnITEd kInGdOm (IrElAND) Avnet Embedded Avnet Embedded Avnet Embedded Avnet EMG GmbH Avnet EMG Ltd. Avnet EMG France SA Lötscher Weg 66 Pilgrims Court, 15/17 West Street Immeuble 154, Parc Chene 2 41334 Nettetal Reigate, Surrey, RH2 9BL 5, allée du General Benoist Phone: +49 8121 775 500 Phone: +44 1737 227800 69500 Bron Fax: +49 8121 775 550 Fax: +44 1737 244698 Phone: +33 4 72 81 02 30 [email protected] [email protected] Fax: +33 4 72 81 02 34 All trademarks and logos are the property of their respective owners. [email protected] This document provides a brief overview only and is not intended to be ITAlY (POrTUGAl, SPAIn) complete or binding offer. Product information, including information Avnet Embedded Avnet Embedded related to a product‘s specifications, uses or conformance with legal or other requirements, is obtained by Avnet from its suppliers or other Avnet EMG France SA Avnet EMG Italy SRL sources deemed reliable and is provided by Avnet on an „As Is“ basis. 14 avenue Carnot Via Manzoni, 44 Avnet makes no representation as to the accuracy or completeness of the F-91349 MASSY Cedex 20095 Cusano Milanino product information and Avnet disclaims all representations, warranties Tel: +33 (0)1 64 47 29 29 Phone: +39 02 660 92 1 and liabilities under any theory with respect to the product information, including any implied warranties of merchantability, fitness for a particular Fax: +33 (0)1 64 47 99 99 Fax: +39 02 660 92 498 purpose, title and/or non-refringement. All product information is subject [email protected] [email protected] to change without notice. www.avnet-embedded.eu 09/2011.
Recommended publications
  • Congatec Product Guide
    Product Guide 2020 NXP based Modules congatec A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. And who do it all for the customer and their needs. Embedded in your success. Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than 13 years. Technology Leader congatec has been driving industry standards since 2005 SMARC 2.0 Module Configurable Battery Thin 2.5” SBC 3.5” SBC BIOS Manager Mini-ITX Pico-ITX Type 2 Heat Pipe Type 6 First Type 10 Type 7 Acquisiton Module Cooling Module Module Module Real-Time Systems Founder Founding Design Guide Founding customizing IoT COM HPC Member Member Services Gateway Chairman 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 Technology Partnerships Executive Member Founding Member Board Member Associate member Specification editor Rev.
    [Show full text]
  • Qseven MSC Q7-MB-RP3
    Qseven MSC Q7-MB-RP3 Description Qseven™ 2.0 Evaluation Board The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify Qseven™ Rev. 2.0 modules for compatibility with the SGET specification. The board is shipped with a complete set of design files. An extensive design guide for the Qseven™ module technology is also provided to allow the motherboard designer to easily implement a custom version of a Qseven™ carrier. The Qseven™ Rev. 2.0 reference platform MSC Q7-MB-RP3 offers a large variety of interfaces commonly used in industrial applications such as Gigabit LAN, USB 3.0/2.0, RS232 and CAN as well as HDMI, DP and LVDS 435 x 170 for display attachment. In addition PCI Express is supported with one x16 and three PCIe x1 slots. This platform for N.A. rapid prototyping helps to assess the fitness of a specific CPU Technology. It is a key instrument to shorten design N.A.N.A. cycles and to improve time to market of new Qseven™ based systems. Highlights . One PCI Express™ x16 slot and 3 x1 slots . Two graphic card slots for HDMI / DP / eDP / LVDS . Mini PCI Express™ & mSATA slot . SD Card socket and SIM Card slot . Two SATA onboard connectors . Winbond W83627DHG Super I/O . EXAR X28V384 Super I/O . 7x COM, HW monitor . CAN Transceiver . HD audio codec . USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces avnet.com/embedded Qseven Technical Data - MSC Q7-MB-RP3 Formfactor Wide-ATX Storage Interfaces 2x SATA USB USB 3.0, 4x USB 2.0 Host, USB 2.0 Client Serial Interfaces 2x COM from Winbond Super I/O 4x COM from EXAR Super I/O 1x COM from Qseven module Bus Interfaces PCI express x16, 3x PCIe x1 Display Interfaces HDMI, DP, eDP, LVDS on add-on cards Network Interface GbE Audio Interface HD Audio on 6 connectors + S/PDIF Power Requirement 12V on standard connectors Certificates UL avnet.com/embedded Qseven Order Reference - MSC Q7-MB-RP3 Order Description Reference Cat Number 1135005 The MSC Q7-MB-RP3 is a reference platform designed for evaluation and MSC Q7-MB-RP3 PV test of Qseven Rev.
    [Show full text]
  • SFF.2009.RG.Pdf
    Only Print Single Only Print Single www.smallformfactors.com www.pc104online.com Volume 13 • Number 1 COLUMNS FEATURES 8 PC/104 Consortium THE BIG YET SMALL PICTURE: Embedded marketplace embraces PCI/104-Express By Dr. Paul Haris Small, smaller, smallest 12 The wireless toolbox 9 Small Form Factor SIG By John Schwartz, Digi International Separating interconnects from form factors By Paul Rosenfeld 15 Focus on Form Factors: Pico-ITXe 10 Euro Small Tech By Bob Burckle, WinSystems Compact board powers personal weather station By Hermann Strass TECH SMALL TALK: Insights from the experts 74 Editor’s Insight 16 COMIT hits the embedded computing world Rugged SFFs nail system designs By Bob Burckle, WinSystems By Chris A. Ciufo Only IT’S A SMALL (FORM FACTOR) WORLD: Unique applications DEPARTMENTS 19 PC/104 powers nanosatellite for space situational 24 Editor’s Choice Products awareness By Kristin Allen, Kristin Allen Marketing & Design By Don Dingee Print 22 Prototyping SoCs with customized PCI Express WEB RESOURCES development boards By Stephane Hauradou, PLDA Subscribe to the magazine or E-letter Live industry news • Submit new products RESOURCE GUIDE: http://submit.opensystemsmedia.com White papers: 27 2009 PC/104 and Small Form Factors Resource Guide Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.comSingle Communications and networking ...........27 Complete systems .....................29 ON THE COVER: In a progression from small to smallest, the ADLINK Technology Industrial automation ...................30 MilSystem 800, WinSystems Pico-I/O with VIA Pico-ITXe, and Digi XBee radio module show the latest trends in small form factor Interfaces ..........................32 systems and boards.
    [Show full text]
  • Mini ATR, 3-Slot Openvpx™ Platform RUGGED, SMALL FORM FACTOR
    DATA SHEET Mini ATR, 3-Slot OpenVPX™ Platform RUGGED, SMALL FORM FACTOR DESCRIPTION The modular design of this Mini ATR platform allows for various con- figurations. The chassis can easily be scaled up or down while using the same side walls. DC and AC power variations as well as custom front I/O configurations are available. Elma also offers a wide selec- tion of backplanes in various architectures and has different milled card cage sizes off-the-shelf. Functional Features Benefits ■■ Small form factor mini ATR-style chassis, natural convection- The all-aluminum Mini ATR incorporates military-grade cooled is low weight, ideal for weight critical applications components like MIL-DTL-38999L connector, on/off and reset switches, LEDs, breakers, etc. EMC shielding is compliant to (SWaP) MIL-STD-461E. Depending on specific applications, commercial, ■■ 3-slot backplane, 1in pitch to meet VITA 65 (OpenVPX) Back- industrial, or military-grade power supplies are available. The plane Profile BKP3-CEN03-15.2.9-n accepts 3U OpenVPX Mini ATR can also be configured with solid-state storage and boards on a 1in pitch, according to VITA 48.2 (REDI) and 250 W AC plug-in power supply module. VITA 65 (OpenVPX) ■■ Other backplanes can be accommodated: 3U CPCI, custom ■■ Two sizes available; other sizes custom: ■■ 1)133mm H x 175mm W x 311mm D (5.24in H x 6.89in W x 12.24in D) ■■ 2) 133mm H x 175mm W x 235mm D (5.24in H x 6.89in W x 9.25in D) ■■ Advanced airflow design distributes air across external fins in sidewalls ■■ Optional plug-in power supply provides up to 350 W VDC; AC versions also available ■■ Option to accommodate 2.5in storage with drive tray ■■ Custom I/O options including MIL-STD wiring and connectors OPTIONAL COMPUTING PRODUCTS ›■ 3U and 6U VPX compliant single board computers.
    [Show full text]
  • COM Express® Basic, Compact, Mini • Qseven® • SMARC™
    • • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™
    [Show full text]
  • SECO PRESENTS ITS FIRST PRODUCT BUILT UPON the LATEST INTEL ATOM X6000e SERIES and INTEL PENTIUM and CELERON N and J SERIES PROCESSORS
    SECO S.p.A. Cap. Soc. € 767.054,00 Via A. Grandi 20 52100 Arezzo – Italy Reg. Imprese n. 4196 Arezzo Pag.1of 6 Ph: +39 0575 26979 REA n. 70645 Fax: +39 0575 350210 Meccanografico AR007079 P.IVA – VAT IT 00325250512 Iscr. Reg. Pile e Accumulatori n. IT20080P00006356 SECO PRESENTS ITS FIRST PRODUCT BUILT UPON THE LATEST INTEL ATOM x6000E SERIES AND INTEL PENTIUM AND CELERON N AND J SERIES PROCESSORS Arezzo, Italy - September 23rd 2020 - SECO's goal has always been to be at the forefront of innovation, providing its customers with the latest technologies available on the market. Today SECO is pleased to unveil its latest product: the SM-C93, a SMARC® Rel 2.1.1 compliant module with the Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors. Thanks to the close partnership with Intel and being part of the early access program for this platform, SECO was able to develop a solution that would encompass its great potential. The Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors are Intel ’s first enhanced for IoT platforms, with CPU and GPU performance to support IoT applications requirements: with up to 4 cores and excellent performance/watt ratio (4.5W - 12W TDP), it boosts up to 40% faster CPU and 2x 3D graphics performance when compared to Intel Apollo Lake. Additional improvements are Intel UHD Graphics and integrated Gigabit Ethernet: up to 3 Ethernet ports at 2.5 Gb with Time Sensitive Network (TSN) capabilities, a technology aiming at standardizing the transmission of time-sensitive data over Ethernet networks.
    [Show full text]
  • Embedded Computing Highlights About Congatec 02|03
    Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies.
    [Show full text]
  • QSEVEN's SECRET FORMULA for LONGEVITY  Contents
    white paperpaper QSEVEN'S SECRET FORMULA FOR LONGEVITY contents EXECUTIVE SUMMARY: // 4 QSEVEN CONTINUES TO DEMONSTRATE VALUE INTRODUCTION: // 4 SMALL FORM FACTOR COMS IN BIG DEMAND WHICH SMALL COM FORMAT? // 4 THE CHOICE IS YOURS QSEVEN: GAME CHANGERS // 4 QSEVEN: LATEST PROCESSOR SOLUTIONS // 4 QSEVEN: DESIGN BENEFITS AND APPLICATIONS // 4 KONTRON: AT THE FOREFRONT OF QSEVEN COM // 4 SOLUTIONS MAXIMIZING SECURITY - APPROTECT // 4 KONTRON AND QSEVEN: VALUE ADDED // 4 SUMMARY // 4 WHITE PAPER www.kontron.com // // 2 A decade since its inception, the popularity of SGET’s Qseven small form factor architecture for Computer-on-Module shows no sign of fading. With new Intel and ARM processor Qseven modules on the market there are more good reasons why devel- opers and users should stick to an architecture they know and trust. processors supported. At the same time, availability of the latest Qseven modules from large global embedded manufacturers such as Kontron allows those completely new to this form factor to enjoy a seamless experience. Ratifi ed by SGET (Standardization Group for Embedded Technologies) in 2008, Qseven’s extensive and long- established ecosystem has been the key to its longevity. It off ers designers and users considerable fl exibility on development time and cost savings when it comes to design options, avoiding the need for architectural redesigns and replacement of existing specialized Qseven boards. //// Qseven-Q7APL,Qs SMARC-sXAL (E2) In this arena, where reliability and technology familiarity are perhaps the most important factors, Qseven continues to survive and thrive as a trusted platform. Based on market reports, Qseven technology is predicted EXEXECUTIVEEECUTIVE SUMMARY: QSEQSEVENVE CONTINUES TO to be in signifi cant demand for many years to come, DEMONSTRATE VALUE ensuring it remains one of the most popular industry Qseven is well-proven as one of the embedded standard ‘credit card size’ formats on the market.
    [Show full text]
  • Pcie/104 Qseven Carrier Board
    PCIe/104 Qseven CARRIER BOARD PCIe/104 Qseven Carrier Board Connect Tech’s PCIe/104 Qseven Carrier Board is a small embedded Product Name: PCIe/104 Qseven Carrier Board carrier board that allows complete integration with any industry Part Number: QCG001 standard Qseven module. This carrier board utilizes the PC/104 form factor with 4 x1 PCIe lanes, and the PCIe/104 bus. The on-board connectors enable connection to SATA, USB, Ethernet, LVDS Video, VGA Video, and RS-232 & RS-422/485. Easily upgrade to the latest processor and memory technology while maintaining the I/O interfaces. What is Qseven? Qseven is a Computer-on-Module standard for mobile and embedded Note: Qseven CPU applications. To learn more about Connect Tech’s PCIe/104 Qseven module mounted on bottom side. Carrier Board, visit http://www.connecttech.com/Qseven. Qseven module sold separately. FEATURES PCIe/104 form factor Uses any off-the-shelf Qseven module Ideal for applications with low power requirements Connectors and cables included for easy connection to Qseven features Custom Design Services Can’t find the feature you need or Specifications require a different form factor? Form Factor PCIe/104, 4 x1 PCIe lanes The PCIe/104 Qseven Carrier Board Display VGA, LVDS flat panel Storage 2x SATA allows you to prototype your application, Serial Interface 2x RS-232, 2x RS-485 while Connect Tech’s design services USB 4x USB 2.0 creates a custom solution. Ethernet 1x Gigabit Ethernet Dimensions PC/104 compliant Temperature -20ºC to 70ºC (-4ºF to 158ºF) Connect Tech Inc. Power ATX supply input 42 Arrow Road, Guelph ON Canada Power Consumption To be determined Tel: 519.836.1291 Fax: 519.836.4878 Additional I/O PS/2 keyboard and mouse Toll: 800.426.8979 (North America) Accessories Optional Cable Kit Email: [email protected] Warranty and Support Lifetime warranty and free technical support www.connecttech.com Specifications subject to change without notice.
    [Show full text]
  • FA143 Modulstandards
    Modulstandards im Vergleich Möglichkeiten und technische Limits der verschiedenen Aufsteck-Boards 1 Seit knapp 2 Jahrzehnten sind Aufsteckmodule verfügbar, die über standardisierte Schnittstellen an ein Doch was bedeuten diese Abkürzungen, Base-Board kontaktiert werden können. Die eindeu- welche Schnittstellen verbergen sich tigen Vorteile bescheren diesen Modulen eine immer dahinter und wo haben diese Konzepte stärker wachsende Nachfrage: Geringere Entwick- Ihre Vorteile im Vergleich zu anderen? lungszeit und -kosten, Verfügbarkeit, Skalierbarkeit von Performance und Preis, die Austauschbarkeit zwischen unterschiedlichen Anbietern und die Reduzierung von Risiken durch das Verwenden von zertifizierten Modulen Nachfolgend werden die geläufigen Abkürzungen rund sind Gründe, sich für Plug-On Boards zu entscheiden. um das Thema Plug-On Modul-Lösungen und Begriffe inkl. deren Schnittstellen und deren Möglichkeiten Die Anforderungen hinsichtlich Größe, Preis, Verfüg- näher erklärt. barkeit und die rasch voranschreitenden Chip-Tech- nologien stellen die Anbieter von Systemlösungen vor Package on a Package (PoP) Herausforderungen, die jedoch durch die Verwendung von Aufsteck-Modulen sehr gut managebar sind. Sind Ein „Package on a Package“ stapelt Einzel-Packages während der Designphase Anforderungen an Perfor- in Form von kleinen bestückten Platinen vertikal über- mance, Schnittstellen, Abmessungen, aber auch z.B. einander, welche durch Ball-Grid-Arrays miteinander Temperaturbereich und Störaussendung definiert, kann verbunden werden. Sozusagen
    [Show full text]
  • Product Guide 2020 Congatec International Partnerships
    Product Guide 2020 congatec International partnerships congatec Sales Partner Solution Partner We simplify the use of embedded technology. congatec A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. And who do it all for the customer and their needs. Embedded in your success. Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than
    [Show full text]
  • PQ7-C201 Module with Multiple Displays and One Gbe
    Mini-ITX Form Factor Carrier Board For Qseven® PQ7-C201 Module with Multiple Displays and One GbE GbE + 2x USB 2.0 COM1 (RS-232) Display Port VGA Audio HDMI USB 3.0 COM2 (RS-232/422/485) Selectable PCIe x4 Expansion Slot Audio COM1 (RS-232) Display Port USB 3.0 VGA HDMI GbE USB 2.0 ports PQ7 module Two SATA Ports LVDS Rear I/O SDIO GENERAL Portwell’s PQ7-C201 is designed with Qseven® 230 pin card ® edge MXM connecter, and it supports Portwell's Qseven® Qseven module Portwell Qseven module PQ7-M10X Series modules for initial evaluation testing on PCIe x4, LVDS, DP, Dimension Mini-ITX: 170(L) x 170(W) mm; 6.69"(L) x 6.69" (W) HDMI, VGA, SATA, USB, LAN, AUDIO, SDIO, LPC function, etc. Storage Devices 2x SATA PQ7-C201 offers rich I/O ports for expansion demand, also simultaneously supports SATA and SD card functions. SDIO 1x SD socket Furthermore, Portwell can provide carrier board design guides Programmable via software from 0.5 sec. to 254.5 min. for your own carrier board development reference to shorten Watchdog Timer developing stage. Expansion Interface - 2x COM ports (1x RS-232/422/485 header, with 1x RS-232 port) - 1x PCIE x4 slot - SMBus header FEATURES -I2C header - LPC header ® Qseven 2.0 carrier board is compatible with - SPI header Portwell Qseven® modules - TPM header Mini-ITX form factor for embedded applications Environment Operating Temperature: 0 to 60oC o 1x Gigabit Ethernet port Storage Temperature: -40 to 70 C Relative Humidity: 5% to 90%, non-condensing 2x SATA ports and 1x SD socket Power - 12VDC input 1x PCIe x4 expansion
    [Show full text]