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Product Guide 2020 Congatec Product Guide 2020 congatec congatec International partnerships A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. congatec Sales Partner Solution Partner This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. We simplify the use of embedded technology. And who do it all for the customer and their needs. Technology Leader Embedded in your success. congatec has been driving industry standards since 2005 SMARC 2.0 Module Configurable Battery Thin 2.5” SBC 3.5” SBC BIOS Manager Mini-ITX Pico-ITX Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Type 2 Heat Pipe Type 6 First Type 10 Type 7 Acquisiton Module Cooling Module Module Module Real-Time Systems Founder Founding Design Guide Founding customizing IoT COM HPC Member Member Services Gateway Chairman 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than 13 years. Technology Partnerships Executive Member Founding Member Board Member Associate member Specification editor Rev. 2.0, 2.1 New high performance module standard Chairman of the PICMG workgroup Design guide editor Rev. 1.0 Specification editor Rev. 2.0, 2.1, 3.0 Founding member Specification & design guide editor Key Technologies for the Industries. Real-Time congatec pays special attention to real-time capability during product development. The congatec BIOS/UEFI implementation is of particularly high quality, yielding significantly improved real-time results for OEM customers. By cooperating with OSADL, this real-time capability can be tested over an extremely long time. Real-Time Hypervisor Hypervisor support from Real-Time Systems makes the embedded computer technologies from congatec even more attractive. It allows multiple operating systems to be installed on a multicore x86 platform without impacting real-time capability. Each sub-application can be implemented with the appropriate operating system – e.g. real-time data acquisition with VxWorks, the user interface with Windows, and a firewall with Linux. Since Real-Time Systems is a wholly owned subsidiary of congatec, the distances between the two companies are very short, which gives OEMs a time advantage in support cases and promotes interdisciplinary solutions. Security By providing numerous BIOS/UEFI security options and Trusted Platform Module (TPM) support, congatec enables customers to implement a high level of security that is optimized for their specific solution requirements. Real Time Hypervisor Real Time Hypervisor harness the power of today’s harness the power of today’s multicore processors multicore processors The innovative Real-Time Systems Hypervisor permits multiple operating sys- tems - both real-time (RTOS) and general purpose operating systems (GPOS) like Microsoft™ Windows® or Linux - to run concurrently on multicore x86 proces- sors. By utilizing this powerful and cost-effective software solution, designers achieve increased flexibility in system design and remarkable enhance ments to functionality and performance - at the same time reducing overall system cost. Hard Real-Time Performance: Multiple Operating Systems in Perfect Harmony - Combine real-time operating systems like VxWorks®, QNX Neutrino or Real-Time Linux , with e.g. Microsoft™ Windows® - Operating systems reside simultaneously on an x86 computer while maintaining the hard real-time characteristics of an RTOS - User-definable boot sequence - Reboot any operating system anytime without disturbing the execution of other operating systems - Communication via high performance virtual TCP/IP network and flexible shared memory Advantages About the Hypervisor - Reduced system costs and physical size - All operating systems operate completely independent - Hardware consolidation - User defined startup sequence of operating systems - Hard real-time performance - Any operating system can reboot without affecting other - Maximum flexibility in system functionality operating systems - Increased reliability (MTBF) as no additional hardware is - All operating systems safely separated and protected required for additional operating system - Standard development tools can be used (supplied by - Works seamlessly with COTS and proprietary operating - the operating system vendors) systems - Standard drivers can be used - no special development - Proven in thousands of systems worldwide required - NUMA (Non-Uniform Memory Access) fully supported - OS independent drive sharing Single Board Computers Computer-On-Modules concept & advantages concept & advantages industrial Concept Benefits Concept Benefits Ready-to-use embedded platforms - -E xtended temperature range (up to -40° … +85°C) CPU module with standard PC core functions - -F aster time to market Reliable and rugged design - - 24/7 operation Carrier board with customer specific function&size - - Reduced development costs - Scalable product range Based on 15+ years of embedded experience - -L owest levels of power consumption Logical alternative to a chip-down design effort - -A llows customer focus on system features Long term availability (10+ years) - -R ich I/O feature set -F aster reaction to market trends Industrial design - - Hard- and software customization - Second source philosophy - Minimize inventory cost congatec SBCs Industrial SBCs are first choice Lower Costs Reduced Risk The congatec Single Board Computers offer industrial when desktop boards reach their limits. The use of COMs save money. The cost of the development and end COMs minimize risk. Basic changes during the design reliability, embedded features and affordable pricing. Single Board Computers is an easy and fast way for product are dramatically reduced when compared with a phase, or in the middle of a product‘s life cycle, are easily low power embedded mobile CPUs - creating industrial computing applications when there full custom design. This holds true for the product‘s entire managed. Simply plug in the next-generation COM are no or just smaller special functionalities required. life-cycle. COMs provide cost advantages from the start. module and continue. COMs allow for easy upgrades. Passive and active cooling options - Customer specific functions can be added by installing Lower engineering cost - -L ower design risk 24/7 operation - cards to the provided extension sockets. Designing with Lower product cost - - Lower transition risk Ceramic capacitors for extended lifetime - SBCs is faster because there’s no need to create Lower cost of life cycle management - Extended temperature options for harsh environment - customized carrier boards. Long term availibility 10+ years - Improved Flexibility Time-To-Market Advantage Customization of hardware and BIOS / UEFI possible - COMs are flexible and can meet all performance COMs put you in a leading position. The use of customized requirements. The modules support a wide range of carrier boards reduces necessary engineering effort by performance levels starting from NXP i.MX6 up to the separating your design work from the embedded PC Intel® Xeon® processor, as well as future architectures. technology. Focus on your own core competency. The COM standards are well established and are already -F aster time to market prepared for the future. - Faster engineering Scalability - -F aster reaction time to market changes Easy performance and technology upgrades - 12 13 Client Server Server Class Performance Class Low Power Class PIN H100 PIN H100 J2 J2 COM Express Basic COM Express Basic PIN H100 PIN H100 125x95mm2 125x95mm2 PIN E01 PIN E01 J2 J2 COM Express Compact PIN H100 95x95mm2 PIN E01 PIN E01 J2 Size D (160x160mm) PIN E01 Size E (200x160mm) COM Express Mini 84x55mm2 D D C C Size A (95x120mm) B D B B A C A PIN D100 A Size B (120x120mm) B J1 A PIN D100 Size C (160x120mm) PIN A01 J1 PIN D100 PIN A01 J1 PIN A01 PIN D100 J1 PIN D100 PIN A01 J1 PIN A01 COM HPC Client COM HPC Server COM Express Type 7 COM Express Type 6 Type 10 49x PCIe Gigabit Ethernet Gigabit Ethernet Gigabit Ethernet 65x PCIe 4x USB 3.0 4x USB 3.0 LPC / eSPI LPC LPC 4x USB 4.0 2x USB 4.0 8x PCIe 4x PCIe 4x USB 2.0 2x USB 3.1 HDA HDA 2x SATA 4x USB 2.0 32x PCIe LVDS / eDP PEG x16 LVDS 1x24 / eDP 12x GPIO, 2x UART 2x SATA eSPI, 2x SPI 12x GPIO ExpressCard DDI SMB, 2x I2C, IPMB 2x UART 2x SATA 4x SATA 2x SATA 2x SoundWire, I2S eSPI, 2x SPI 4x USB 2.0 8x USB 2.0 8x USB 2.0 / 2x USB 3.0 2x NBaseT (max. 10 Gb) SMB, 2x I2C, IPMB 8x GPIO / SDIO 4x 10GBaseKR 8x GPIO / SDIO 3x DDI 8x GPIO / SDIO 3x DDI 1x NBaseT (max. 10 Gb) 2x SER / CAN 2x SER / CAN 2x SER / CAN eDP 8x 25GBE KR SPI & I2C SPI & I2C SPI & I2C 2x 25GBE KR Power 8-20V DC Power 12V DC Power Power Power Power Power COM-HPC Sizes Interfaces Thermal Design COM-HPC is a new Computer-On-Module standard which The COM-HPC standard defines five different sizes. The COM Express defines 220/440 interconnect pins between As with Qseven and SMARC, the COM Express definition is currently unter development at the PICMG.
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