Ampro XTX 830 Core™ Duo Computer-On-Module
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
The Worldwide Merchant Embedded Computing Market 2018 Edition
THE WORLDWIDE MERCHANT EMBEDDED COMPUTING MARKET 2018 EDITION A Comprehensive Report on the Latest Embedded Computing Technologies Plus Forecasts of Key Markets Report Highlights Technical Trends PCI C ompactPCI AdvancedTCA PC/104 AdvancedMC MicroTCA COM Express PMC VMEbus OCP Market Trends Total Available Market Competitive Strategies Corporate Relations Industry Analysis and Forecast, 2015-2022 MEC Market Total A vailable MEC Market By Segment (Communications, Industrial, Medical, Aerospace/Military, Other Applications) Company Profiles (89) New Venture Research Corp. A Technology Market Research Company 337 Clay St., Suite 101 [email protected] Nevada City, CA 95959 www.newventureresearch.com Tel: (530) 265-2004 Fax: (530) 265-1998 The Worldwide Merchant Embedded Computing Market - 2018 Edition Synopsis The Worldwide Merchant Embedded The Industrial market segment also holds strong Computing Market - 2018 Edition report potential for the process control industries (oil & gas, analyzes the performance of the standards-based mining, agriculture, paper/pulp and textiles) as the and non-standards-based industry from 2015 - Industrial Internet of Things begins to impact 2022. Although there are several hundred manufacturing and engage Big Data solutions for companies in the standards-based MEC market, increased productivity and output. Related industries most are fairly small in revenue and highly like robotics will require high performance designs specialized, focusing on specific application that utilize advanced artificial intelligence and virtual segments with unique product requirements. reality solutions. Clean energy is also examined for However, the report also examines the world’s optimizing efficiency in solar, wind and tidal technical leading contract manufacturers that participate in solutions. the non-standards-based product assemblies in the same market segments. -
Embedded Computing Highlights About Congatec 02|03
Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies. -
ETX Driving Embedded
An ACCES I/O Products Whitepaper ETX Driving Embedded I/O ACCES I/O Products, Inc., 10623 Roselle Street, San Diego, CA 92121 (858) 550-9559 • Fax (858) 550-7322 • [email protected] • www.accesio.com One of the fastest-growing concepts in the embedded world is the “computer-on-module” or COM.The COM approach takes the traditional concept of a computer motherboard with plug- in I/O modules and turns it around so that the motherboard, now called a baseboard, con- tains all the I/O and the CPU with its core support chips and memory plug in as a module. The result of this reversal is an approach that blends the advantages of custom design with those of standard products. Products based on the COM approach maintain long-term viabil- ity while retaining access to the latest in computer technology. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron in early 2000. The ETX specification defines a module that is approximate- ly 100-mm square (see Figure 1) and contains the core of a personal computer (PC), including CPU, chipset, mem- aper ory, and core I/O capability. The core I/O includes Ethernet, graphics, USB, keyboard, mouse, and serial interfaces along with a PCI/ISA bus for connection to additional peripherals. Four surface-mount connectors route the mod- ule’s I/O to the baseboard, which can be designed to meet an application’s specific needs. P The original ETX specification was quickly adopted in the embedded industry and is now monitored by the ETX Industrial Group (ETXIG), which is dedicated to keeping the specification in line with advancing technology and market needs. -
FA143 Modulstandards
Modulstandards im Vergleich Möglichkeiten und technische Limits der verschiedenen Aufsteck-Boards 1 Seit knapp 2 Jahrzehnten sind Aufsteckmodule verfügbar, die über standardisierte Schnittstellen an ein Doch was bedeuten diese Abkürzungen, Base-Board kontaktiert werden können. Die eindeu- welche Schnittstellen verbergen sich tigen Vorteile bescheren diesen Modulen eine immer dahinter und wo haben diese Konzepte stärker wachsende Nachfrage: Geringere Entwick- Ihre Vorteile im Vergleich zu anderen? lungszeit und -kosten, Verfügbarkeit, Skalierbarkeit von Performance und Preis, die Austauschbarkeit zwischen unterschiedlichen Anbietern und die Reduzierung von Risiken durch das Verwenden von zertifizierten Modulen Nachfolgend werden die geläufigen Abkürzungen rund sind Gründe, sich für Plug-On Boards zu entscheiden. um das Thema Plug-On Modul-Lösungen und Begriffe inkl. deren Schnittstellen und deren Möglichkeiten Die Anforderungen hinsichtlich Größe, Preis, Verfüg- näher erklärt. barkeit und die rasch voranschreitenden Chip-Tech- nologien stellen die Anbieter von Systemlösungen vor Package on a Package (PoP) Herausforderungen, die jedoch durch die Verwendung von Aufsteck-Modulen sehr gut managebar sind. Sind Ein „Package on a Package“ stapelt Einzel-Packages während der Designphase Anforderungen an Perfor- in Form von kleinen bestückten Platinen vertikal über- mance, Schnittstellen, Abmessungen, aber auch z.B. einander, welche durch Ball-Grid-Arrays miteinander Temperaturbereich und Störaussendung definiert, kann verbunden werden. Sozusagen -
Product Guide 2020 Congatec International Partnerships
Product Guide 2020 congatec International partnerships congatec Sales Partner Solution Partner We simplify the use of embedded technology. congatec A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. And who do it all for the customer and their needs. Embedded in your success. Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than -
XTX Specification Rev
XTX™ Specification Revision 1.2 XTXTM Pinout, signal description and implementation guidelines XTX™ Specification Revision 1.2 XTX™ Specification Revision 1.2 Revision History Revision Date Author Revision History 1.0 July 13, 05 congatec AG/MAREKMICRO GmbH Initial release 1.0a June 8, 06 XTX™ Consortium Added information from XTX-Spec-Errata10. Changed format of document. 1.1 July 11, 06 XTX™ Consortium Added additional information about connectors X1, X3, and X4. 1.2 Dec. 5, 06 XTX™ Consortium Added pin 60 PP_TPM to table 2 and X2 connector schematic. Added description for PP_TPM to table 16. Added Hirose connector location peg hole tolerances note to section 1.3.1. Copyright © 2005 XTX™ Consortium XTX-Spec12 2/42 XTX™ Specification Revision 1.2 Preface ETX® Concept and XTXTM Extension The ETX® concept is an off the shelf, multi vendor, Single-Board-Computer that integrates all the core components of a common PC and is mounted onto an application specific carrier board. ETX® modules have a standardized form factor of 95mm x 114mm and have specified pinouts on the four system connectors that remain the same regardless of the vendor. The ETX® module provides most of the functional requirements for any application. These functions include, but are not limited to, graphics, sound, keyboard/mouse, IDE, Ethernet, parallel, serial and USB ports. Four ruggedized connectors provide the carrier board interface and carry all the I/O signals to and from the ETX® module. Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. -
AAEON's Computer on Module Service
www.aaeon.com AAEON’s Computer On Module Service (COMS) Reduce Business Investment Less Design Effort and Less Risk Time-to-Market Solution within 30 Days AAEON’s COM Module Custom Carrier Board Applications: • Retail & Advertising • Medical • Test & Measurement • Gaming & Entertainment • Industrial Automation • Military & Government • Security AAEON’s Computer On Module Service COMS (COMS) Overview Computer On Module Service What is COM (Computer On Module)? What is COMS (Computer On Module Service)? COM (Computer On Module) is a compact CPU board COMS (Computer On Module Service) is a service to that integrates primary functions into a small form customer’s who use AAEON’s COM modules. There are factor module. Simply design your carrier board with three phases for COMS: I/O ports and enjoy the following benefits: Phase 1: Document Support (1) Easy installation, maintenance and upgrade AAEON provides: (2) Faster time to market (3) Cost savings (1) Reference Schematics (4) Lower design risks (2) Design Rules (5) Long-term support (3) Layout Guidelines (4) Check List Phase 2: Technical Support AAEON provides: (1) Professional consultation for carrier board or system design (2) Schematics review of carrier board (upon customer request) Phase 3: DTD (ODM Service) DTD (Design to Delivery) for custom carrier boards: The web-enabled DTD services allow you to list all of the requirements you need for your carrier board. AAEON’s DTD team will review the information you provide and offer consultation. (1) DTD is designed to shorten time to market and minimize loading on your resources. (2) AAEON will work closely with you to determine detailed specifications of your custom carrier board. -
An I/O View of Small Form Factor Choices
Technology General-purpose I/O options An I/O view of small form factor choices By Eric Rossi With all the small form factor choices available, the process of selecting an SBC takes more than a little time and consideration. Evaluating each option based on a handful of significant factors including I/O requirements helps designers make informed decisions. Designers looking for small form factor PC/104 connector. Although this form SBCs have many choices, including the factor has x86 roots, new PC/104 SBCs more widely fielded PC/104, EBX, and based on RISC (primarily ARM) archi- System-On-Module (SOM). With so tecture recently have been introduced. Figure 1 many options, how do designers deter- This allows RISC-based SBCs to make ly mine which one to use? use of the various PC/104 peripheral n modules. EBX The right choice depends on three key EBXO is a larger (5.75" x 8.0") format usu- issues plus several other considerations One of the definite advantages of thet ally utilized with higher-end processors, listed in Table 1: PC/104 format is the number of SBC and although low-end processor EBX boards peripheral options and enclosuresi navail- are available. EBX allows both PC/104 n What are the I/O requirements? able. The PC/104 standard allowsr these and PCI expansion. A standard PCI card n How much processing is required? peripheral modules toP be stacked one on slot provides for PCI bus connection (see n What are the constraints (power top of another so that almost any applica- Figure 2). -
Products Guide
PRODUCT GUIDE Type 6 INDEX COMe-C55-CT6 p. 24 COMe-C08-BT6 p. 25 COMe-C89-CT6 p. 25 COMe-B75-CT6 p. 26 COMe-C24-CT6 p. 26 COMe-B09-BT6 p. 27 COMe-A98-CT6 p. 27 COMe-A41-CT6 p. 28 Qseven® COMe-953-BT6 p. 28 Q7-C58 p. 10 Carrier Board Q7-B03 p. 11 CCOMe-C30 p. 29 Q7-C26 p. 11 Development Kit Q7-C25 p. 12 Q7-A36 p. 12 COM EXP T6 DEV KIT p. 29 Q7-974 p. 13 Q7-928 p. 13 ® μQseven® ETX ETX-A61 p. 30 μQ7-C72 p. 14 μQ7-A76-J p. 14 μQ7-962 p. 15 Single Board Computer μQ7-A75-J p. 15 SBC-C90 p. 31 Carrier Board SBC-C43 p. 32 CQ7-A42 p. 16 SBC-C20 p. 32 Development Kit SBC-C41-pITX p. 33 SBC-C57 p. 33 Q7 DEV KIT 2.0 p. 16 SBC-C31 p. 34 Q7 STARTER KIT 2.0 p. 17 SBC-C66 p. 34 SBC-C23 p. 35 SMARC SBC-B08 p. 35 SBC-A62-J p. 36 SM-C93 p. 18 SBC-A44-pITX p. 36 SM-B69 p. 19 SBC-B68-eNUC p. 37 SM-D18 p. 19 SBC-A80-eNUC p. 37 SM-D16 p. 20 SM-C12 p. 20 SM-B71 p. 21 Modular HMI & Boxed Solutions Development Kit SYS-A62-10 p. 38 SMARC DEV KIT p. 21 SYS-B08-7 p. 39 SYS-C90-DS p. 39 SYS-B68-IPC p. 40 COM-HPC® CHPC-C77-CSA p. -
Embedded Platforms
AAEON Technology Inc. LITERATURE ORDERING 5F, No. 135, Lane 235, Pao Chiao Rd., Hsin-Tien Dist, New Taipei City, 231, Taiwan, R.O.C. Contact local office for literature requests. Tel: +886-2-8919-1234 Fax: +886-2-8919-1056 E-mail: [email protected] URL: http://www.aaeon.com 2018 Embedded Platforms Embedded Platforms 2018 AAEON Premier Source For Embedded Computing Products Product Catalog www.aaeon.com MKT-2201800 www.aaeon.com Focus • Agility • Competitiveness (ES) Equipements Scientifiques SA - Département Modules & Systèmes Informatiques - 127 rue de Buzenval BP 26 - 92380 Garches Tél. 01 47 95 99 80 - Fax. 01 47 01 16 22 - e-mail: [email protected] - Site Web: www.es-france.com 00 About AAEON About AAEON About A Leader and Partner in Embedded Computing Platforms We have a relentless drive for excellence and passion for unsurpassed service. Established in 1992, AAEON is one of the leading designers and AAEON Core Values manufacturers of professional intelligent IoT solutions and advanced industrial computing platforms today. Committed to innovative Reliability: engineering, AAEON provides integrated solutions including industrial Delivering dependable products in a timely manner motherboards and systems, industrial displays, rugged tablets, embedded controllers, network appliances and related accessories. Integrity: We also work with premier OEM/ODMs and system integrators Valuing business integrity and ethics around the world. Offering x86-based platforms from Intel® Atom™ all the way to Intel® Xeon processors, and in desktop, 1U and 2U Innovation: form factors, AAEON’s team of experienced engineers has helped Turning cutting-edge concepts into reality dozens of companies around the globe deploy reliable appliances with faster times to market and lower development costs based on state-of-the-art hardware platforms, unmatched service quality and long-term support. -
Embedded Computing Highlights About Congatec 02|03
Product Guide Autumn 2013 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies. -
CONGATEC Computer-On-Modules CONGATEC User Data Storage OEM Splash Screen Flat Panel Auto Detection Multistage Watchdog Manufacturing Data and Board Information
Single Board Computers CONGATEC Computer-On-Modules This product is RoHS compliant. CONGA-CA COM EXPRESS COMPACT MODULE BASED ON INTEL® ATOM™ PROCESSOR Z5XX SERIES The Industry’s First COM Express Module Based on Intel’s Menlow Platform The conga-CA is a COM Express™ Type 2 pinout module that features Intel® Atom™ ZX5xx series processors with an Intel® System Controller Hub US15W in a compact 95x95mm size form factor. All congatec boards are equipped with the company’s embedded BIOS, including a board controller that enhances embedded features such as system monitoring, watchdog timer and the I2C bus. With the ability to isolate itself from the main x86 processor, these features are also available in stand-by mode, hence promoting further power saving functionality The conga-CA is equipped with the congatec Embedded BIOS and supports the following features: • ACPI 3.0 Power Management • Multistage Watchdog • OEM Splash Screen • Fast Mode I²C Bus • ACPI Battery Support • User Data Storage • Flat Panel Auto Detection • Real Headless Operation • Supports Customer Specific CMOS Defaults • Manufacturing Data and Board Information • BIOS Setup Data Backup conga-CA Congatec MOUSER congatec Price Each Article Description Description STOCK NO. Part No. 1 5 787-87477 87477 conga-CA/Z510-512 Intel® Atom™ Z510 processor 1.1GHz, 512kB L2-Cache, 400MHz FSB and 512MB DDR2 328.02 318.78 787-61125 61125 conga-CA/Z530-1G Intel® Atom™ Z530 processor 1.6GHz, 512kB L2-Cache, 533MHz FSB and 1GB DDR2 452.98 440.22 787-99881 99881 conga-CA/Z510-512 PCIe Intel®