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The Worldwide Merchant Embedded Computing Market 2018 Edition
THE WORLDWIDE MERCHANT EMBEDDED COMPUTING MARKET 2018 EDITION A Comprehensive Report on the Latest Embedded Computing Technologies Plus Forecasts of Key Markets Report Highlights Technical Trends PCI C ompactPCI AdvancedTCA PC/104 AdvancedMC MicroTCA COM Express PMC VMEbus OCP Market Trends Total Available Market Competitive Strategies Corporate Relations Industry Analysis and Forecast, 2015-2022 MEC Market Total A vailable MEC Market By Segment (Communications, Industrial, Medical, Aerospace/Military, Other Applications) Company Profiles (89) New Venture Research Corp. A Technology Market Research Company 337 Clay St., Suite 101 [email protected] Nevada City, CA 95959 www.newventureresearch.com Tel: (530) 265-2004 Fax: (530) 265-1998 The Worldwide Merchant Embedded Computing Market - 2018 Edition Synopsis The Worldwide Merchant Embedded The Industrial market segment also holds strong Computing Market - 2018 Edition report potential for the process control industries (oil & gas, analyzes the performance of the standards-based mining, agriculture, paper/pulp and textiles) as the and non-standards-based industry from 2015 - Industrial Internet of Things begins to impact 2022. Although there are several hundred manufacturing and engage Big Data solutions for companies in the standards-based MEC market, increased productivity and output. Related industries most are fairly small in revenue and highly like robotics will require high performance designs specialized, focusing on specific application that utilize advanced artificial intelligence and virtual segments with unique product requirements. reality solutions. Clean energy is also examined for However, the report also examines the world’s optimizing efficiency in solar, wind and tidal technical leading contract manufacturers that participate in solutions. the non-standards-based product assemblies in the same market segments. -
SFF.2009.RG.Pdf
Only Print Single Only Print Single www.smallformfactors.com www.pc104online.com Volume 13 • Number 1 COLUMNS FEATURES 8 PC/104 Consortium THE BIG YET SMALL PICTURE: Embedded marketplace embraces PCI/104-Express By Dr. Paul Haris Small, smaller, smallest 12 The wireless toolbox 9 Small Form Factor SIG By John Schwartz, Digi International Separating interconnects from form factors By Paul Rosenfeld 15 Focus on Form Factors: Pico-ITXe 10 Euro Small Tech By Bob Burckle, WinSystems Compact board powers personal weather station By Hermann Strass TECH SMALL TALK: Insights from the experts 74 Editor’s Insight 16 COMIT hits the embedded computing world Rugged SFFs nail system designs By Bob Burckle, WinSystems By Chris A. Ciufo Only IT’S A SMALL (FORM FACTOR) WORLD: Unique applications DEPARTMENTS 19 PC/104 powers nanosatellite for space situational 24 Editor’s Choice Products awareness By Kristin Allen, Kristin Allen Marketing & Design By Don Dingee Print 22 Prototyping SoCs with customized PCI Express WEB RESOURCES development boards By Stephane Hauradou, PLDA Subscribe to the magazine or E-letter Live industry news • Submit new products RESOURCE GUIDE: http://submit.opensystemsmedia.com White papers: 27 2009 PC/104 and Small Form Factors Resource Guide Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.comSingle Communications and networking ...........27 Complete systems .....................29 ON THE COVER: In a progression from small to smallest, the ADLINK Technology Industrial automation ...................30 MilSystem 800, WinSystems Pico-I/O with VIA Pico-ITXe, and Digi XBee radio module show the latest trends in small form factor Interfaces ..........................32 systems and boards. -
P5V-VM Ultra Specifications Summary
P5V-VM Ultra User Guide Motherboard E2589 First Edition September 2006 Copyright © 2006 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT. -
Focus on Your Core Competency the COM Express Standard
Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. -
S-915 and S-917 Mini-ITX Cases Ready to Maximize Your Storage Space
S-915 and S-917 Mini-ITX Cases Ready to Maximize Your Storage Space The more we work and play, the more we find ourselves racking These Mini-ITX cases are easy to install and maintain, and up gigabytes of music, movies, photos, and documents. Then are suitable for every environment from home to office to comes the challenge of managing these precious but hefty store. They’re also equipped with a security lock to prevent digital goods. That’s when your system is crying out for a NAS unauthorized HDD access, and aluminum front bezels that system to help wash down the plug. adorn a solid-steel chassis, making for great looks and a powerhouse data manager. Network-attached storage (NAS) is what can make wrangling data a piece of cake. Imagine a single machine on your network slinging files to every PC in your home, managing backups, and safeguarding all of your important memories or sensitive data. iStarUSA’s new S-915, S-917, and S-919 Mini-ITX cases are ideal for those wanting to build their own NAS storage server. They’re designed to house high performing systems in a compact form factor and at high storage capacity. 727 Phillips Drive, City of Industry, CA 91748 Tel: 1-888-989-1189 Fax: 1-626-301-0588 www.istarusa.com S-915 and S-917 Mini-ITX Cases Ready to Maximize Your Storage Space Products S-915 S-917 S-919 Compact Stylish 5x 5.25” Bay mini- Compact Stylish 7x 5.25” Bay mini- Build-to-Order - Compact Stylish 9x ITX Tower ITX Tower 5.25” Bay microATX Tower Standard Drive 2.5” Drive (internal): 1 2.5” Drive (internal): 1 3.5” Drive (internal): -
Mini ATR, 3-Slot Openvpx™ Platform RUGGED, SMALL FORM FACTOR
DATA SHEET Mini ATR, 3-Slot OpenVPX™ Platform RUGGED, SMALL FORM FACTOR DESCRIPTION The modular design of this Mini ATR platform allows for various con- figurations. The chassis can easily be scaled up or down while using the same side walls. DC and AC power variations as well as custom front I/O configurations are available. Elma also offers a wide selec- tion of backplanes in various architectures and has different milled card cage sizes off-the-shelf. Functional Features Benefits ■■ Small form factor mini ATR-style chassis, natural convection- The all-aluminum Mini ATR incorporates military-grade cooled is low weight, ideal for weight critical applications components like MIL-DTL-38999L connector, on/off and reset switches, LEDs, breakers, etc. EMC shielding is compliant to (SWaP) MIL-STD-461E. Depending on specific applications, commercial, ■■ 3-slot backplane, 1in pitch to meet VITA 65 (OpenVPX) Back- industrial, or military-grade power supplies are available. The plane Profile BKP3-CEN03-15.2.9-n accepts 3U OpenVPX Mini ATR can also be configured with solid-state storage and boards on a 1in pitch, according to VITA 48.2 (REDI) and 250 W AC plug-in power supply module. VITA 65 (OpenVPX) ■■ Other backplanes can be accommodated: 3U CPCI, custom ■■ Two sizes available; other sizes custom: ■■ 1)133mm H x 175mm W x 311mm D (5.24in H x 6.89in W x 12.24in D) ■■ 2) 133mm H x 175mm W x 235mm D (5.24in H x 6.89in W x 9.25in D) ■■ Advanced airflow design distributes air across external fins in sidewalls ■■ Optional plug-in power supply provides up to 350 W VDC; AC versions also available ■■ Option to accommodate 2.5in storage with drive tray ■■ Custom I/O options including MIL-STD wiring and connectors OPTIONAL COMPUTING PRODUCTS ›■ 3U and 6U VPX compliant single board computers. -
COM Express® Basic, Compact, Mini • Qseven® • SMARC™
• • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™ -
Highrel PC/104 ISA, PCI & Pcie Modules and Systems
Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing -
Embedded Computing Highlights About Congatec 02|03
Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies. -
ETX Driving Embedded
An ACCES I/O Products Whitepaper ETX Driving Embedded I/O ACCES I/O Products, Inc., 10623 Roselle Street, San Diego, CA 92121 (858) 550-9559 • Fax (858) 550-7322 • [email protected] • www.accesio.com One of the fastest-growing concepts in the embedded world is the “computer-on-module” or COM.The COM approach takes the traditional concept of a computer motherboard with plug- in I/O modules and turns it around so that the motherboard, now called a baseboard, con- tains all the I/O and the CPU with its core support chips and memory plug in as a module. The result of this reversal is an approach that blends the advantages of custom design with those of standard products. Products based on the COM approach maintain long-term viabil- ity while retaining access to the latest in computer technology. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron in early 2000. The ETX specification defines a module that is approximate- ly 100-mm square (see Figure 1) and contains the core of a personal computer (PC), including CPU, chipset, mem- aper ory, and core I/O capability. The core I/O includes Ethernet, graphics, USB, keyboard, mouse, and serial interfaces along with a PCI/ISA bus for connection to additional peripherals. Four surface-mount connectors route the mod- ule’s I/O to the baseboard, which can be designed to meet an application’s specific needs. P The original ETX specification was quickly adopted in the embedded industry and is now monitored by the ETX Industrial Group (ETXIG), which is dedicated to keeping the specification in line with advancing technology and market needs. -
MS-98F1 Datasheet
Mini-ITX with Intel® Atom™ Braswell Platform for Multi-Displays, Panel PC MS-98F1 Low-Power and DC/ATX Solution HMI SIM slot TPM Mini-PCIe Embedded DDR3 SO-DIMM System Specifications LPT ® PS2 Intel Pentium processor N3710, QC, 6W Intel® Celeron processor N3160, QC, 6W CPU ® System Fan Intel Celeron processor N3060, DC, 6W Intel® Celeron processor N3010, DC, 4W N3710, 1.6 GHz, up to 2.56 GHz Embedded N3160, 1.6 GHz, up to 2.24 GHz Board Frequency COM3-5 Processor N3060, 1.6 GHz, up to 2.48 GHz ATX N3010, 1.04 GHz, up to 2.24 GHz Front Panel L2 Cache 2MB Indicator CPU Type BGA eDP GPIO LVDS Chipset Integrated Semi-rugged Inverter Terminal BIOS AMI 4 x USB 2.0 Technology Dual-channel DDR3L 1333/1600 MHz SATA 3.0 LVDS Memory Max. Capacity Up to 8 GB Mini-PCIe SATA Power Socket 2 x 204-pin SO-DIMM Controller Intel® HD Graphics Shared system memory up to 1.7 GB Graphic Memory System SDRAM POS LVDS 2 x dual channel 18/24-bit Amplifier eDP 1 (colay with LVDS) Display DisplayPort 1 SPI debug port Multiple Display 3 independent displays COM Express LVDS up to 1920 x 1200 Full Board 2 x GbE LAN Display Interface DP up to 3840 x 2160 eDP up to 2560 x 1600 2 x Intel® i210-AT 1 x Intel® i210-AT Line-in Controller Ethernet GbE LAN GbE LAN Line-out Audio Controller Realtek® ALC887 co-lay ALC888S Super I/O Controller Fintek F81866AD-I Qseven Watchdog Timer 256-level Watchdog Timer Board H/W Monitor COM1 DP 4 x USB 3.0 Mic Smart Fan Yes Pin header (default) Low profile TPM Controller Infineon SLB9635TT 1.2 (by BOM option) Line-out Pin header 4 x USB3.0 -
Operating Guide
Operating Guide EPIA-P700 Mainboard EPIA-P700 Operating Guide Table of Contents Table of Contents .......................................................................................................................................................................................... i VIA EPIA-P700 Overview............................................................................................................................................................................1 VIA EPIA-P700 Layout .................................................................................................................................................................................2 VIA EPIA-P700 Specifications...................................................................................................................................................................3 VIA EPIA-P700 Processor SKUs................................................................................................................................................................4 VIA VX700 Chipset Overview ...................................................................................................................................................................5 VIA EPIA-P700 Companion I/O Boards................................................................................................................................................6 VIA EPIA-P700 Dimensions.......................................................................................................................................................................7