DOCSLIB.ORG

Focus on Your Core Competency the COM Express Standard

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Focus on Your Core Competency the COM Express Standard Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. The table on the several advantages: following page shows the features for modules defined in • The carrier can contain more rugged types of connectors for revision 1 of the COM Express specification. external I/O. It is not limited to traditional connectors such as USB, Ethernet, and video. COM.0 Rev. 2.0 – Future Proof • The carrier can contain value added silicon such as FPGAs or other In 2009, PICMG formed a subcommittee to update the COM types of peripherals. Placing these devices on the carrier Express specification based on the changes in peripherals eliminates the need for traditional PCI Express or PCI expansion used in modern systems. This included support for Super cards and the mechanics associated with them. Speed USB 3.0, PCI Express Gen 2 signaling, as well as • The CPU function is decoupled from the I/O so that different additional video interfaces such as DVI, HDMI and processors can be used for different applications, ranging from low DisplayPort. The spec update created two new types to power and cost Atom™ based compute modules to Core™ i7 or support the I/O changes: type 6 and 10. Backwards other high performance multicore processor modules. compatibility with existing type 2 and 1 modules was a main • The design and maintenance of the compute module no longer objective of the specification update. becomes a task for the OEM. • The use of industry standard modules brings with it availability from multiple vendors which provides alternative solutions. 1-1 http://www.adlinktech.com/Computer-on-Module COM Express pinout types and supported features New with COM.0 Rev. 2.0 – PCI Type 6 and Type 10 Pinouts PEG/ IDE SATA LAN USB 2.0 / Display Types Express PCI SDVO Ports Ports Ports USB 3.0 Interfaces Lanes The release of COM Express COM.0 Revision 2.0 brings Type 1 Computer-on-Modules in line with current and future AB Up to 6 – – – 4 1 8 / 0 VGA, LVDS technology trends by providing for the latest graphics connector interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, Type 2 VGA, LVDS, AB/CD Up to 22 1/2 32-bit 1 4 1 8 / 0 and SuperSpeed USB 3.0. The new Type 6 pinout is based PEG/SDVO connectors on the popular Type 2 pinout, but with legacy functions Type 3 replaced by Digital Display Interfaces (DDI), additional PCI VGA, LVDS, AB/CD Up to 22 1/2 32-bit – 4 3 8 / 0 PEG/SDVO Express lanes, and reserved pins for future technologies. connectors The new Type 10 pinout is based on the Type 1 pinout Type 6 VGA, AB/CD Up to 24 1/NA – – 4 1 8 / 4 LVDS,PEG, with only the A-B connector that is used in the “Mini” form connectors 3x DDI factor. The Type 10 pinout provides additional flexibility for Type 10 developers by freeing up pins reserved for SATA and PCIe AB Up to 4 –/1 – – 2 1 8 / 0 1x DDI connector for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both of the □ Rev. 1 Pinouts ■ Rev. 2 Pinouts new Type 6 and Type 10 pinouts support the SPI Interface, The Right Size for the Right Job which was unavailable in COM.0 Rev. 1.0. The COM Express specification also defines three module sizes: the COM Express Type 1 vs. Type 10 comparison Compact Module, Basic Module and the Extended Module. A fourth “Mini” size module supporting only type 1 and type 10 pinouts has COM Express been presented to PICMG for inclusion in a future release of the COM.0 rev 1.0 specification. AB 125 mm Type 1 Control LVDS & B LPC Bus VGA TV Miscella 5Vsb 12V Basic 125 x 95 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Type 2/6 compatible pinout A Channel A Miscellaneous Basic 95 mm COM Express COM.0 rev 2.0 Type 10 AB 95 mm FAN & Control SDVO SPI & 5Vsb 12V B LPC Bus select Miscella 2x RS 8x 4x RS Sing Channel neous Compact 95 x 95 Audio total SATA VD VD SPI amount USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Type 2/6 compatible pinout Channel A Miscellaneous Type ID Compact 95 mm COM Express Type 2 vs. Type 6 comparison COM Express 84 mm COM.0 rev 1.0 Mini 84 x 55 Mini Type 1/10 compatible pinout Type 2 CD 55 mm AB D PATA IDE PCI Bus PCIe x16 (or SDVO) 12V C Control ADLINK – We Know COM Express LVDS & B LPC Bus VGA TV Miscella 5Vsb 12V 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Although many companies develop COM Express modules, A Channel A Miscellaneous most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in COM Express the development and maintenance of the PICMG COM Express COM.0 rev 2.0 specification over the years. ADLINK recently chaired the PICMG subcommittee that was tasked with defining the specification Type 6 CD update known as COM Express COM.0 Revision 2.0. As a AB leading participant in the creation of the specification, ADLINK is D USB 3.0 DDI 1 extended 2x DP, HDMI DDI 2 DDI 3 DP, HDMI DP, HDMI PCIe x16 12V signaling to PCIe x1 or upgrade four SDVO in a unique position to influence its direction. By doing so, ADLINK C USB 2.0 ports has a deep understanding of the meaning and intention of the FAN & Control LVDS SPI & LPC Bus VGA select Miscella 5Vsb 12V B Channel B neous 4x 8x 6x total Audio amount specification and applies this knowledge in the design of our COM SATA SPI USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Express products. Channel A Miscellaneous Type ID 1-2 Selection Guide COM Express® Basic (125 x 95 mm) Type 6 Type 2 Computer-On-Modules Preliminary Preliminary Express-IB Express-HR Express-IB2 CPU Type 3rd Generation Intel® Core™ Processor Intel® Core™ i7/i5/i3 (Sandy Bridge) 3rd Generation Intel® Core™ Processor up 2.7 GHz with 6 MB L3 cache up 2.53 GHz with 6 MB L3 cache up 2.7 GHz with 6 MB L3 cache CPU Package BGA1023 BGA1288 BGA1023 CPU Models / Speeds - Core™ i7 (quad core): i7-2715QE; - Core™ i7/i5/i3 (dual core): i7-2655LE, i7-2610UE, i5-2515E, 2310E, 2340UE; Celeron®: B810E, 847E FSB Speed 1600/1333 1333/1066 1600/1333 Main Chipset Intel® 7-Series Chipset Intel® PCH QM67 Intel® 7-Series Chipset System Memory 16 GB (max), dual channel 16 GB (max), dual channel 16 GB (max), dual channel Memory Type DDR3 non ECC at 1600/1333 DDR3 non ECC at 1333 DDR3 non ECC at 1600/1333 Soldered Memory - - - Socket Memory Max 16 GB on two 200-pin SODIMM Max 16 GB on two 200-pin SODIMM Max 16 GB on two 200-pin SODIMM Cache (L3) L3 depends on processor type L3 depends on processor type L3 depends on processor type 3MB, 4MB or 6MB 3MB, 4MB or 6MB 3MB, 4MB or 6MB BIOS Type AMI EFI AMI EFI AMI EFI BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 16 Mbit Flash SPI 16 Mbit Flash SPI 16 Mbit Flash SPI Graphics Controller HD Graphics 4000 HD Graphics 3000 HD Graphics 4000 Graphics Memory Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Integrated Display Support VGA (QXGA) VGA (QXGA) VGA (QXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) 3 DDI ports for HDMI/DVI/DP & SDVO 3 DDI ports for HDMI/DVI/DP & SDVO External Graphics Bus PCIe x16 Graphics port PCIe x16 Graphics port PCIe x16 Graphics port or switch for SDVO port Compatibillity OpenGL 3.1, DirectX 11 OpenGL 3.0, DirectX 10.1 OpenGL 3.1, DirectX 11 Parallel ATA (IDE) - - one channel, one device Serial ATA two SATA 3 Gb/s, two SATA 6 Gb/s two SATA 3 Gb/s, two SATA 6 Gb/s two SATA 3 Gb/s, two SATA 6 Gb/s Matrix Storage Support Yes Yes Yes Ethernet integrated Intel GbE (10/100/1000) integrated Intel GbE (10/100/1000) integrated Intel GbE (10/100/1000) USB 4 ports USB 3.0, 4 ports USB 2.0 8 ports USB 2.0 4 ports USB 3.0, 4 ports USB 2.0 Audio Intel® HD Audio Intel® HD Audio Intel® HD Audio Watchdog Yes Yes Yes TPM Yes, Ver.
Load more

Recommended publications
  • Computer on Module
    Module COM Carte réceptrice Computer On Module Réduction du coût de votre développement Installation, maintenance et mise à jour simplifiées Diminution des risques inhérent à un développement Disponibilité sous 30 jours de votre produit Applications : • Terminaux de vente & Affichage Dynamique • Vidéosurveillance numérique • Médical • IP TV • Appareils de mesure & tests en ligne • M2M • Terminaux de jeux • Géolocalisation • Automatisation industrielle & contrôle de procédés • Serveurs informatiques • Militaire & Police Notre service ODM DTD Les règles générales du service ODM DTD : Le fabricant s'engage à gérer l'achat et le stockage des composants Le service ODM DTD n'est assuré que dans le cadre de l'utilisation courant qui permettent la fabrication d'un Computer On Module. Dans des modules AAEON aux formats : ETX, XTX and COM Express le cas où la fabrication de la carte réceptrice requière des composants modules. spécifiques ou sujet à des minima de quantité en commande (MOQ), Les frais d'études pour la réalisation de la carte réceptrice sont le client s'engage à acheter et à consigner ces composants chez basés sur les spécifications arrêtées avec le client à la signature de Equipements Scientifiques. la commande. Toute modifications de ces spécifications par la suite pourra emmener des frais supplémentaires à la charge du client. La Définitions 1 jour fourniture d'une carte réceptrice sous 30 jours ouvrés est incluse dans les frais d'études. Les corrections nécessaires après le test du prototype Etude du circuit 5 jours sont prises en charge par le service ODM DTD. Ces corrections seront Routage du PCB 9 jours vérifiées par le client avant le démarrage de la pré-série.
    [Show full text]
  • Industrial Platform Service
    latform P ndustrial I ervice S s stic ‧Manufa gi Ver. 211A ign cturing‧Lo es ‧D Consulting‧Product Portwell, Inc. was founded in 1993 and entered the Industrial Computing Platform Providers (IACPP), but also an associate PC market in 1995 by developing single-board computers. member of Intel® Embedded and Communications Alliance Today, our continuous development of leading-edge products (ECA), as well as Advanced Telecom Computing Architecture has resulted in strong growth in market share and revenue, a (ATCA) and an executive member of PCI Industrial Computer fi rm place on the Taipei stock exchange (TAISDAQ), and has Manufacturing group (PICMG). established Portwell a major worldwide supplier of specialty Portwell, Inc. has worldwide operation in the U.S.A., Taiwan, computing application platforms and services. Portwell, Inc. Japan, China, Netherland, United Kingdom, and India. is not only a member of the selected group of Intel® Applied Portwell Engine (PE) Building Whether you are working on a computer board or turnkey standards such as ISO 9001/14000/13485, OHSAS and system, Portwell is the perfect partner to help you deliver your RoHS, customers have taken advantage of our dedicated and products to market on time as well as maintain longevity of sophisticated engineering resource to satisfy their requirements product life cycle. With 18 years experience in the design and for the design, manufacturing and logistics of application- manufacture of specialty computer boards and systems, Portwell specifi c computer boards, customized computer chassis, and not only provides a one-stop resource for off-the-shelf products, specifi c computer system confi gurations.
    [Show full text]
  • Download/Face- Modules/Documents/Face-Modules-Hw-Specifications.Pdf
    I PC H “ CompuLab Ltd. Revision 1.2 December 2013 Legal Notice © 2013 CompuLab Ltd. All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written permission of CompuLab Ltd. No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by CompuLab Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document. CompuLab Ltd. reserves the right to change details in this publication without notice. Product and company names herein may be the trademarks of their respective owners. CompuLab Ltd. 17 HaYetsira St., Yokneam Elite 20692, P.O.B 687 ISRAEL Tel: +972-4-8290100 http://www.compulab.co.il http://fit-pc.com/web/ Fax: +972-4-8325251 CompuLab Ltd. Intense PC Hardware Specification Page 2 of 74 Revision History Revision Engineer Revision Changes 1.0 Maxim Birger Initial public release 1.1 Maxim Birger Memory Interface updated Super-IO Controller peripheral section added RS232 serial com port info added 1.2 Maxim Birger HDMI Block Diagram updated DP Block Diagram updated CompuLab Ltd. Intense PC Hardware Specification Page 3 of 74 Table of Contents Legal Notice ..................................................................................................................................................
    [Show full text]
  • Dell Optiplex 7060 Desktop Setup
    OptiPlex 7060 Small Form Factor Setup and specifications guide Regulatory Model: D11S Regulatory Type: D11S004 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 2018 - 06 Rev. A01 Contents 1 Set up your computer.....................................................................................................................................5 2 Chassis.......................................................................................................................................................... 8 Front view........................................................................................................................................................................... 8 Back view............................................................................................................................................................................9 3 System specifications.................................................................................................................................. 10 Chipset...............................................................................................................................................................................10
    [Show full text]
  • Focus on Your Core Competency the COM Express Standard
    Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1.
    [Show full text]
  • Intel® 915GME Express Chipset Development Platform For
    Product Brief Intel® 915GME Express Chipset Intel® 915GME Express Chipset Consumer Electronics Development Platform for Connected Consumer Electronics Devices The Intel 915GME Express chipset is a key building block for connected consumer electronics (CE) platforms, including modular digital TV sub- systems, IP digital set top boxes, “set back” boxes for Internet-based services and connected digital media recorders (DMRs) designed to support a variety of emerging connected usage models. Connected applications, services and media are The chipset includes a 400 MHz system bus to coming to consumer electronics devices. The support the Intel® Celeron® M 900MHz and 1.5MHz Intel® 915GME Express Chipset Development processors, an internal 2D/3D graphics controller Platform provides the components you need to and a memory controller that supports up to 2GB add Intel® architecture processing performance of DDR2 SDRAM. The controller supports dual- and IP networking capability to CE devices. channel, single-channel and asymmetric modes. Intel® CE 951GME Express Chipset Platform Features Benefits Intel® Celeron® M 900MHz processor and • High performance to support next-generation Intel® Celeron® M 1.5GHz processor with connected applications and services 400MHz processor bus SVDO port • Supports third-party SDVO compliant devices including DVI, TV-Encoder, LVDS, and HDMI 1.2 Internal graphics controller • 2D/3D graphics support for advanced user interfaces Direct Media Interface (DMI) • High-bandwidth chip-to-chip interconnect for optimum system-level performance Multiple I/O subsystem interfaces • Flexible platform configurations Support for up to 2GB of 400MHz DDR2 memory • Memory bandwidth for optimum system-level performance Product Brief Intel® 915GME Express Chipset Block Diagram Intel® Celeron® M n IMVP 4 CK410 (SC451, SC2608), Clock Gen (900/1.5GHz 1.8V, 3.3Vstby, (IC954103) 353/370) XDP Co 5Vaud, 2.5V Dual-Channel ATX FS8 Pwr Con 512 MB-1GB 400MHz 400MT/s DDR2 x 16 0 SDVO_C 512 MB/1DDR2GB x 16 HDMI Xmtr HDMI 1.
    [Show full text]
  • Toucan-QM57 COM Express Computer-On-Module Technical
    Toucan-QM57 COM Express Computer-On-Module Technical Manual TME-TOUCANQM-R0V3.docx Revision 0.3 / June 11 © LIPPERT Embedded Computers GmbH Hans-Thoma-Str. 11 D-68163 Mannheim http://www.lippertembedded.com/ Technical Manual Toucan-QM57 LiPPERT Document: TME-TOUCANQM-R0V3.docx Revision 0.3 Copyright ©2011 LiPPERT Embedded Computers GmbH, All rights reserved Trademarks MS-DOS, Windows, Windows 95, Windows 98, Windows NT and Windows XP are trademarks of Microsoft Corporation. PS/2 is a trademark of International Business Machines, Inc. Intel and Solid State Drive are trademarks of Intel Corporation. Geode is a trademark of Advanced Micro Devices. PC/104 is a registered trademark of PC/104 Consortium. All other trademarks appearing in this document are the property of their respective owners. Disclaimer Contents and specifications within this technical manual are subject of change without notice. LiPPERT Embedded Computers GmbH provides no warranty with regard to this technical manual or any other information contained herein and hereby expressly disclaims any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. LiPPERT Embedded Computers GmbH assumes no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies between the product and the technical manual. In no event shall LiPPERT Embedded Computers GmbH be liable for any incidental, consequential, special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information contained herein or the use thereof.
    [Show full text]
  • User's Guide Conga-MCB
    COM Express™ conga-MCB Short description of the congatec COM Express™ mini carrier board Short Description Revision 1.0 Revision History Revision Date (dd.mm.yy) Author Changes 1.0 21.04.11 GDA Official release Preface This short description provides information about the components, features and connectors available on the conga-MCB COM Express™ mini carrier board. Disclaimer The information contained within this short description, including but not limited to any product specification, is subject to change without notice. congatec AG provides no warranty with regard to this short description or any other information contained herein and hereby expressly disclaims any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies between the product and the short description. In no event shall congatec AG be liable for any incidental, consequential, special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this short description or any other information contained herein or the use thereof. Intended Audience This short description is intended for technically qualified personnel. It is not intended for general audiences. Lead-Free Designs (RoHS) All congatec AG products are created from lead-free components and are completely RoHS compliant. Copyright © 2011 congatec AG CMCBm10 2/31 Symbols The following symbols are used in this short description: Warning Warnings indicate conditions that, if not observed, can cause personal injury.
    [Show full text]
  • SOM-5898 Come TYPE6
    SOM-5898 COMe TYPE6 R120 2018’09’25 ０ Contents 1. Introduction ................................................................................................ ７ 1.1. About This Document ............................................................................. ７ 1.2. Signal Table Terminology ....................................................................... ７ 1.3. Terminology ............................................................................................ ８ 1.4. Reference Documents ............................................................................ １２ 1.5. Revision History ...................................................................................... １２ 1.6. SOM-5898 Block Diagram ...................................................................... １３ 2. COM Express Type 6 Interfaces ............................................................... １４ 2.1. COM Express Type 6 Connector Layout ................................................ １４ 2.2. COM Express Type 6 Connector Pin-out ............................................... １５ 2.3. PCI Express ............................................................................................ ２３ 2.3.1. COM Express A-B Connector and C-D Connector PCIe Groups ...................... ２３ 2.3.2. General Purpose PCIe Signal Definitions .......................................................... ２３ 2.3.3. PCI Express Lane Configurations – Per COM Express Spec ........................... ２８ 2.3.4. PCI Express* General Routing Guidelines .......................................................
    [Show full text]
  • COM Express® Basic, Compact, Mini • Qseven® • SMARC™
    • • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™
    [Show full text]
  • Highrel PC/104 ISA, PCI & Pcie Modules and Systems
    Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing
    [Show full text]
  • HP Z2 Tower G4 Workstation
    QuickSpecs HP Z2 Tower G4 Workstation Overview HP Z2 Tower G4 Workstation 1. Power Button 6. Optional SD Card Reader 2. Headphone/Microphone 7. External 5.25’’ bay 3. 1 USB 3.0 port 4. 1 USB 3.0 Battery Charging Port 5. (Optional) 1 USB 3.1 Gen2 Type-C™ Battery Charging Port c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 1 QuickSpecs HP Z2 Tower G4 Workstation Overview 1. 1 Audio Line In, 1 Audio Line Out, 2. 2 DisplayPortTM (DP 1.2) output from Intel® UHD graphics (available on selected processors only) 3. Optional Serial Port 4. 1 flex IO module for 2nd LAN/VGA/HDMI/DP/ USB-C 3.1 Gen2 Charging Port with Alt mode /Thunderbolt™ 3.0 (Thunderbolt™ requires x4 PCIe Add in card) 5. RJ-45 to integrated GBe 6. 2 USB 2.0 7. 4 USB 3.0 8. Optional WLAN/BT Antenna c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 2 QuickSpecs HP Z2 Tower G4 Workstation Overview Form Factor Minitower Operating Systems Preinstalled: • Windows 10 Home* • Windows 10 Pro* • Windows 10 Pro (National Academic License)* • Windows 10 Pro for Workstations – HP recommends Windows 10 Pro * • HP Linux®-ready Supported: • Red Hat® Enterprise Linux® Workstation (1 year paper license available; Preinstall not available) * Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates.
    [Show full text]