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Focus on Your Core Competency the COM Express Standard

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Focus on Your Core Competency the COM Express Standard Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. The table on the several advantages: following page shows the features for modules defined in • The carrier can contain more rugged types of connectors for revision 1 of the COM Express specification. external I/O. It is not limited to traditional connectors such as USB, Ethernet, and video. COM.0 Rev. 2.0 – Future Proof • The carrier can contain value added silicon such as FPGAs or other In 2009, PICMG formed a subcommittee to update the COM types of peripherals. Placing these devices on the carrier Express specification based on the changes in peripherals eliminates the need for traditional PCI Express or PCI expansion used in modern systems. This included support for Super cards and the mechanics associated with them. Speed USB 3.0, PCI Express Gen 2 signaling, as well as • The CPU function is decoupled from the I/O so that different additional video interfaces such as DVI, HDMI and processors can be used for different applications, ranging from low DisplayPort. The spec update created two new types to power and cost Atom™ based compute modules to Core™ i7 or support the I/O changes: type 6 and 10. Backwards other high performance multicore processor modules. compatibility with existing type 2 and 1 modules was a main • The design and maintenance of the compute module no longer objective of the specification update. becomes a task for the OEM. • The use of industry standard modules brings with it availability from multiple vendors which provides alternative solutions. 1-1 http://www.adlinktech.com/Computer-on-Module COM Express pinout types and supported features New with COM.0 Rev. 2.0 – PCI Type 6 and Type 10 Pinouts PEG/ IDE SATA LAN USB 2.0 / Display Types Express PCI SDVO Ports Ports Ports USB 3.0 Interfaces Lanes The release of COM Express COM.0 Revision 2.0 brings Type 1 Computer-on-Modules in line with current and future AB Up to 6 – – – 4 1 8 / 0 VGA, LVDS technology trends by providing for the latest graphics connector interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, Type 2 VGA, LVDS, AB/CD Up to 22 1/2 32-bit 1 4 1 8 / 0 and SuperSpeed USB 3.0. The new Type 6 pinout is based PEG/SDVO connectors on the popular Type 2 pinout, but with legacy functions Type 3 replaced by Digital Display Interfaces (DDI), additional PCI VGA, LVDS, AB/CD Up to 22 1/2 32-bit – 4 3 8 / 0 PEG/SDVO Express lanes, and reserved pins for future technologies. connectors The new Type 10 pinout is based on the Type 1 pinout Type 6 VGA, AB/CD Up to 24 1/NA – – 4 1 8 / 4 LVDS,PEG, with only the A-B connector that is used in the “Mini” form connectors 3x DDI factor. The Type 10 pinout provides additional flexibility for Type 10 developers by freeing up pins reserved for SATA and PCIe AB Up to 4 –/1 – – 2 1 8 / 0 1x DDI connector for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both of the □ Rev. 1 Pinouts ■ Rev. 2 Pinouts new Type 6 and Type 10 pinouts support the SPI Interface, The Right Size for the Right Job which was unavailable in COM.0 Rev. 1.0. The COM Express specification also defines three module sizes: the COM Express Type 1 vs. Type 10 comparison Compact Module, Basic Module and the Extended Module. A fourth “Mini” size module supporting only type 1 and type 10 pinouts has COM Express been presented to PICMG for inclusion in a future release of the COM.0 rev 1.0 specification. AB 125 mm Type 1 Control LVDS & B LPC Bus VGA TV Miscella 5Vsb 12V Basic 125 x 95 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Type 2/6 compatible pinout A Channel A Miscellaneous Basic 95 mm COM Express COM.0 rev 2.0 Type 10 AB 95 mm FAN & Control SDVO SPI & 5Vsb 12V B LPC Bus select Miscella 2x RS 8x 4x RS Sing Channel neous Compact 95 x 95 Audio total SATA VD VD SPI amount USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Type 2/6 compatible pinout Channel A Miscellaneous Type ID Compact 95 mm COM Express Type 2 vs. Type 6 comparison COM Express 84 mm COM.0 rev 1.0 Mini 84 x 55 Mini Type 1/10 compatible pinout Type 2 CD 55 mm AB D PATA IDE PCI Bus PCIe x16 (or SDVO) 12V C Control ADLINK – We Know COM Express LVDS & B LPC Bus VGA TV Miscella 5Vsb 12V 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Although many companies develop COM Express modules, A Channel A Miscellaneous most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in COM Express the development and maintenance of the PICMG COM Express COM.0 rev 2.0 specification over the years. ADLINK recently chaired the PICMG subcommittee that was tasked with defining the specification Type 6 CD update known as COM Express COM.0 Revision 2.0. As a AB leading participant in the creation of the specification, ADLINK is D USB 3.0 DDI 1 extended 2x DP, HDMI DDI 2 DDI 3 DP, HDMI DP, HDMI PCIe x16 12V signaling to PCIe x1 or upgrade four SDVO in a unique position to influence its direction. By doing so, ADLINK C USB 2.0 ports has a deep understanding of the meaning and intention of the FAN & Control LVDS SPI & LPC Bus VGA select Miscella 5Vsb 12V B Channel B neous 4x 8x 6x total Audio amount specification and applies this knowledge in the design of our COM SATA SPI USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Express products. Channel A Miscellaneous Type ID 1-2 Selection Guide COM Express® Basic (125 x 95 mm) Type 6 Type 2 Computer-On-Modules Preliminary Preliminary Express-IB Express-HR Express-IB2 CPU Type 3rd Generation Intel® Core™ Processor Intel® Core™ i7/i5/i3 (Sandy Bridge) 3rd Generation Intel® Core™ Processor up 2.7 GHz with 6 MB L3 cache up 2.53 GHz with 6 MB L3 cache up 2.7 GHz with 6 MB L3 cache CPU Package BGA1023 BGA1288 BGA1023 CPU Models / Speeds - Core™ i7 (quad core): i7-2715QE; - Core™ i7/i5/i3 (dual core): i7-2655LE, i7-2610UE, i5-2515E, 2310E, 2340UE; Celeron®: B810E, 847E FSB Speed 1600/1333 1333/1066 1600/1333 Main Chipset Intel® 7-Series Chipset Intel® PCH QM67 Intel® 7-Series Chipset System Memory 16 GB (max), dual channel 16 GB (max), dual channel 16 GB (max), dual channel Memory Type DDR3 non ECC at 1600/1333 DDR3 non ECC at 1333 DDR3 non ECC at 1600/1333 Soldered Memory - - - Socket Memory Max 16 GB on two 200-pin SODIMM Max 16 GB on two 200-pin SODIMM Max 16 GB on two 200-pin SODIMM Cache (L3) L3 depends on processor type L3 depends on processor type L3 depends on processor type 3MB, 4MB or 6MB 3MB, 4MB or 6MB 3MB, 4MB or 6MB BIOS Type AMI EFI AMI EFI AMI EFI BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 16 Mbit Flash SPI 16 Mbit Flash SPI 16 Mbit Flash SPI Graphics Controller HD Graphics 4000 HD Graphics 3000 HD Graphics 4000 Graphics Memory Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Integrated Display Support VGA (QXGA) VGA (QXGA) VGA (QXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) 3 DDI ports for HDMI/DVI/DP & SDVO 3 DDI ports for HDMI/DVI/DP & SDVO External Graphics Bus PCIe x16 Graphics port PCIe x16 Graphics port PCIe x16 Graphics port or switch for SDVO port Compatibillity OpenGL 3.1, DirectX 11 OpenGL 3.0, DirectX 10.1 OpenGL 3.1, DirectX 11 Parallel ATA (IDE) - - one channel, one device Serial ATA two SATA 3 Gb/s, two SATA 6 Gb/s two SATA 3 Gb/s, two SATA 6 Gb/s two SATA 3 Gb/s, two SATA 6 Gb/s Matrix Storage Support Yes Yes Yes Ethernet integrated Intel GbE (10/100/1000) integrated Intel GbE (10/100/1000) integrated Intel GbE (10/100/1000) USB 4 ports USB 3.0, 4 ports USB 2.0 8 ports USB 2.0 4 ports USB 3.0, 4 ports USB 2.0 Audio Intel® HD Audio Intel® HD Audio Intel® HD Audio Watchdog Yes Yes Yes TPM Yes, Ver.
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