Focus on Your Core Competency the COM Express Standard

Computer-On-Modules

Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. The table on the several advantages: following page shows the features for modules defined in • The carrier can contain more rugged types of connectors for revision 1 of the COM Express specification. external I/O. It is not limited to traditional connectors such as USB, Ethernet, and video. COM.0 Rev. 2.0 – Future Proof • The carrier can contain value added silicon such as FPGAs or other In 2009, PICMG formed a subcommittee to update the COM types of peripherals. Placing these devices on the carrier Express specification based on the changes in peripherals eliminates the need for traditional PCI Express or PCI expansion used in modern systems. This included support for Super cards and the mechanics associated with them. Speed USB 3.0, PCI Express Gen 2 signaling, as well as • The CPU function is decoupled from the I/O so that different additional video interfaces such as DVI, HDMI and processors can be used for different applications, ranging from low DisplayPort. The spec update created two new types to power and cost Atom™ based compute modules to Core™ i7 or support the I/O changes: type 6 and 10. Backwards other high performance multicore processor modules. compatibility with existing type 2 and 1 modules was a main • The design and maintenance of the compute module no longer objective of the specification update. becomes a task for the OEM. • The use of industry standard modules brings with it availability from multiple vendors which provides alternative solutions.

1-1 http://www.adlinktech.com/Computer-on-Module COM Express pinout types and supported features New with COM.0 Rev. 2.0 –

PCI Type 6 and Type 10 Pinouts PEG/ IDE SATA LAN USB 2.0 / Display Types Express PCI SDVO Ports Ports Ports USB 3.0 Interfaces Lanes The release of COM Express COM.0 Revision 2.0 brings

Type 1 Computer-on-Modules in line with current and future AB Up to 6 – – – 4 1 8 / 0 VGA, LVDS technology trends by providing for the latest graphics connector interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, Type 2 VGA, LVDS, AB/CD Up to 22 1/2 32-bit 1 4 1 8 / 0 and SuperSpeed USB 3.0. The new Type 6 pinout is based PEG/SDVO connectors on the popular Type 2 pinout, but with legacy functions Type 3 replaced by Digital Display Interfaces (DDI), additional PCI VGA, LVDS, AB/CD Up to 22 1/2 32-bit – 4 3 8 / 0 PEG/SDVO Express lanes, and reserved pins for future technologies. connectors The new Type 10 pinout is based on the Type 1 pinout Type 6 VGA, AB/CD Up to 24 1/NA – – 4 1 8 / 4 LVDS,PEG, with only the A-B connector that is used in the “Mini” form connectors 3x DDI factor. The Type 10 pinout provides additional flexibility for Type 10 developers by freeing up pins reserved for SATA and PCIe AB Up to 4 –/1 – – 2 1 8 / 0 1x DDI connector for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both of the □ Rev. 1 Pinouts ■ Rev. 2 Pinouts new Type 6 and Type 10 pinouts support the SPI Interface, The Right Size for the Right Job which was unavailable in COM.0 Rev. 1.0. The COM Express specification also defines three module sizes: the COM Express Type 1 vs. Type 10 comparison Compact Module, Basic Module and the Extended Module. A fourth “Mini” size module supporting only type 1 and type 10 pinouts has COM Express been presented to PICMG for inclusion in a future release of the COM.0 rev 1.0 specification. AB 125 mm Type 1

Control LVDS & B LPC Bus VGA TV Miscella 5Vsb 12V Basic 125 x 95 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Type 2/6 compatible pinout A Channel A Miscellaneous Basic 95 mm COM Express COM.0 rev 2.0

Type 10 AB 95 mm

FAN & Control SDVO SPI & 5Vsb 12V B LPC Bus select Miscella 2x RS 8x 4x RS Sing Channel neous Compact 95 x 95 Audio total SATA VD VD SPI amount USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Type 2/6 compatible pinout Channel A Miscellaneous Type ID Compact 95 mm COM Express Type 2 vs. Type 6 comparison

COM Express 84 mm COM.0 rev 1.0 Mini 84 x 55

Mini Type 1/10 compatible pinout Type 2 CD

55 mm AB

D PATA IDE PCI Bus PCIe x16 (or SDVO) 12V C

Control ADLINK – We Know COM Express LVDS & B LPC Bus VGA TV Miscella 5Vsb 12V 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Although many companies develop COM Express modules, A Channel A Miscellaneous most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in COM Express the development and maintenance of the PICMG COM Express COM.0 rev 2.0 specification over the years. ADLINK recently chaired the PICMG

subcommittee that was tasked with defining the specification Type 6 CD update known as COM Express COM.0 Revision 2.0. As a AB

leading participant in the creation of the specification, ADLINK is D USB 3.0 DDI 1 extended 2x DP, HDMI DDI 2 DDI 3 DP, HDMI DP, HDMI PCIe x16 12V signaling to PCIe x1 or upgrade four SDVO in a unique position to influence its direction. By doing so, ADLINK C USB 2.0 ports

has a deep understanding of the meaning and intention of the FAN & Control LVDS SPI & LPC Bus VGA select Miscella 5Vsb 12V B Channel B neous 4x 8x 6x total Audio amount specification and applies this knowledge in the design of our COM SATA SPI USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Express products. Channel A Miscellaneous Type ID

1-2 7 ® Processor Core™ ®

- - Yes Yes Yes Yes TBD TBD 1-11 HD Audio ® Preliminary AMI EFI Type 2 Type C, SMBus BGA1023 2 1600/1333 I 7-Series Chipset Yes, Ver. 1.2 Ver. Yes, Windows VGA (QXGA) 0°C ~ +60°C ® Express-IB2 Intel S0 S1 S3 S4 S5 Linux, AIDI library 16 Mbit Flash SPI Max 829 MB UMA HD Graphics 4000 3MB, 4MB or 6MB Intel OpenGL 3.1, DirectX 11 OpenGL 3.1, DirectX one channel, one device EEPROM CMOS backup, Serial Console redirection Serial Console redirection 16 GB (max), dual channel 6x PCI-Express x1 (or 1 x4) 6x PCI-Express PICMG COM.0 R2.1, Type 2 PICMG COM.0 R2.1, Type optional SATA SSD 4~16 GB optional SATA DDR3 non ECC at 1600/1333 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. L3 depends on processor type L3 depends on processor USB boot/legacy, PXE support USB boot/legacy, PCIe two x8, x4 or x1 (on PEG) up 2.7 GHz with 6 MB L3 cache Basic Form Factor (95x125 mm) 4 ports USB 3.0, 4 ports USB 2.0 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), integrated Intel GbE (10/100/1000) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS two SATA 3 Gb/s, two SATA 6 Gb/s 3 Gb/s, two SATA two SATA Max 16 GB on two 200-pin SODIMM 3rd Generation Intel 3rd PCIe x16 Graphics port or switch for SDVO port

® 7 ® : B810E, 847E ® - - - 1-9 Yes Yes Yes Yes Yes TBD TBD HD Audio PCH QM67 ® AMI EFI C, SMBus ® BGA1288 2 1333/1066 XP/Xpe, Windows I Yes, Ver. 1.2 Ver. Yes, VGA (QXGA) 0°C ~ +60°C ® Express-HR Intel S0 S1 S3 S4 S5 8 ports USB 2.0 Intel 16 Mbit Flash SPI Max 829 MB UMA HD Graphics 3000 3MB, 4MB or 6MB Linux 2.6.x, AIDI library PCIe x16 Graphics port DDR3 non ECC at 1333 EEPROM CMOS backup, COM Express COM OpenGL 3.0, DirectX 10.1 OpenGL 3.0, DirectX Serial Console redirection Serial Console redirection Core™ i7/i5/i3 (Sandy Bridge) Core™ 16 GB (max), dual channel 6x PCI-Express x1 (or 1 x4) 6x PCI-Express ® PICMG COM.0 R2.0, Type 6 PICMG COM.0 R2.0, Type optional SATA SSD 4~16 GB optional SATA Basic (125 x 95 mm) Basic (125 x L3 depends on processor type L3 depends on processor USB boot/legacy, PXE support USB boot/legacy, PCIe two x8, x4 or x1 (on PEG) Windows Basic Form Factor (95x125 mm) up 2.53 GHz with 6 MB L3 cache Core™ i7 (quad core): i7-2715QE; i7 (quad core): Core™ 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), integrated Intel GbE (10/100/1000) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS two SATA 3 Gb/s, two SATA 6 Gb/s 3 Gb/s, two SATA two SATA Intel Max 16 GB on two 200-pin SODIMM 3 DDI ports for HDMI/DVI/DP & SDVO Core™ i7/i5/i3 (dual core): i7-2655LE, i7-2610UE, i7/i5/i3 (dual core): Core™ i5-2515E, 2310E, 2340UE; Celeron Type 6 Type 7 ® Processor Core™ ®

- - - - 1-7 Yes Yes Yes Yes Yes TBD TBD HD Audio ® AMI EFI C, SMBus BGA1023 2 1600/1333 Preliminary I 7-Series Chipset Yes, Ver. 1.2 Ver. Yes, Windows VGA (QXGA) 0°C ~ +60°C Express-IB ® Intel S0 S1 S3 S4 S5 Linux, AIDI library 16 Mbit Flash SPI Max 829 MB UMA HD Graphics 4000 3MB, 4MB or 6MB Intel PCIe x16 Graphics port OpenGL 3.1, DirectX 11 OpenGL 3.1, DirectX EEPROM CMOS backup, Serial Console redirection Serial Console redirection 16 GB (max), dual channel 6x PCI-Express x1 (or 1 x4) 6x PCI-Express PICMG COM.0 R2.1, Type 6 PICMG COM.0 R2.1, Type optional SATA SSD 4~16 GB optional SATA DDR3 non ECC at 1600/1333 L3 depends on processor type L3 depends on processor USB boot/legacy, PXE support USB boot/legacy, PCIe two x8, x4 or x1 (on PEG) up 2.7 GHz with 6 MB L3 cache Basic Form Factor (95x125 mm) 4 ports USB 3.0, 4 ports USB 2.0 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), integrated Intel GbE (10/100/1000) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS two SATA 3 Gb/s, two SATA 6 Gb/s 3 Gb/s, two SATA two SATA Max 16 GB on two 200-pin SODIMM 3 DDI ports for HDMI/DVI/DP & SDVO http://www.adlinktech.com/Computer-on-Module 3rd Generation Intel 3rd

Extended Temperature Power States Power Consumption Compatibillity Matrix Storage Support External Graphics Bus BIOS Flash Graphics Memory Integrated Display Support BIOS Features FSB Speed Memory Type Memory Soldered Socket Memory CPU Package CPU Models / Speeds Page Number Operating Temperature Compatibillity Dimensions Solid State Disk on Module Support BSP & Software PCI Suport LPC Support Management Bus Power Parallel ATA (IDE) Parallel ATA Serial ATA Ethernet USB Audio Watchdog TPM Support PCI Express Graphics Controller BIOS Type Main Chipset System Memory Cache (L3) CPU Type Selection Guide Selection

Computer-On-Modules Basic (125 x 95 mm) Type 2

Express-CB/CBE Express-MV Express-MG CPU Type Intel® Core™ i7/i5/i3 (Arrandale) Intel® Core™2 Duo (Penryn) Intel® Core™2 Duo (Penryn) up 2.53 GHz with 4 MB L2 cache up 2.26 GHz with 6 MB L2 cache up 2.53 GHz with 6 MB L2 cache CPU Package BGA1288 BGA956 PGA478 CPU Models / Speeds Core™ i3/i5/i7 (Arrandale) i7-610E 620LE 620UE Celeron® M 722, 723 Celeron® M 575, T3100 (dual core) i5-520E i3-330E Core™2 Duo (Penryn) Core™2 Duo (Penryn) Celeron® M P4505, U3405 SP9300, SL9400, SL9380, SU9300 T9400, P8400 FSB Speed 1066/800 1066/800 1066/800 Main Chipset Intel® PCH QM57 Intel® GS45 with ICH9M (SFF) Intel® GM45 with ICH9M System Memory 8 GB (max), dual channel 8 GB (max), dual channel 8 GB (max), dual channel Memory Type DDR3 non ECC (CB) or ECC (CBE) DDR3 at 1066/800/667 DDR3 at 1066/800/667 Soldered Memory - - - Socket Memory Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Cache (L2) L2 depends on processor type L2 depends on processor type L2 depends on processor type 2MB, 3MB or 4MB 1MB, 3MB or 6MB 1MB, 3MB or 6MB BIOS Type AMI EFI AMIBIOS®8 AMIBIOS®8 BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Graphics Controller GMA HD with 12 execution units Intel® GMA X4500 at 533/320 MHz Intel® GMA X4500 at 533 MHz Graphics Memory Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Integrated Display Support VGA (QXGA) VGA (QXGA) VGA (QXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) TV-out (PAL/NTSC/HDTV) External Graphics Bus PCIe x16 Graphics port PCIe x16 Graphics port PCIe x16 Graphics port or SDVO port or SDVO port Compatibillity OpenGL 2.1, DirectX 10 OpenGL 2.0, DirectX 10 OpenGL 2.0, DirectX 10 Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device Serial ATA four SATA 3 Gb/s three SATA 3 Gb/s three SATA 3 Gb/s Matrix Storage Support Yes optional optional Ethernet integrated Intel GbE (10/100/1000) integrated Intel® GbE (10/100/1000) integrated Intel® GbE (10/100/1000) USB 8 ports USB 2.0 8 ports USB 2.0 8 ports USB 2.0 Audio Intel® HD Audio Intel® HD Audio Intel® HD Audio Watchdog Yes Yes Yes TPM Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 PCI Express Support 6x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) PCI-Express x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz LPC Support Yes Yes Yes Management Bus I2C, SMBus I2C, SMBus I2C, SMBus Power 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) Power States S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 Power Consumption 21 W with Core™ i7-620UE at 1.2 GHz 18 W with Core™ 2 Duo SU9300 at 1.2 GHz 23 W with Core™ 2 Duo P8400 at 2.26 GHz and 2 GB memory typical and 2 GB memory typical and 2 GB memory typical Operating Temperature 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C Extended Temperature selected modules: -20°C ~ +70°C selected modules: -20°C ~ +70°C - Compatibillity PICMG COM.0 R2.0, Type 2 PICMG COM.0 R1.0, Type 2 PICMG COM.0 R1.0, Type 2 Dimensions Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Solid State Disk on Module optional SATA SSD 4~16 GB - - BSP & Software Support Windows® XP/Xpe, Vista, Windows® XP/Xpe, Windows® Vista, Windows® XP/Xpe, Windows® Vista, Windows® 7 Windows® 7, Windows® CE, Windows® 7, Windows® CE, Linux® 2.6.x, AIDI library Linux® 2.6.x, AIDI library Linux® 2.6.x, AIDI library Page Number 1-13 1-15 1-17

1-4 7 ® 2.6.x, ® ------Yes Yes Yes Yes TBD TBD 1-25 CE, Linux Type 6 Type C, SMBus ® BGA-413 2 1066/1333 AIDI library XP/Xpe, Windows I Yes, Ver. 1.2 Ver. Yes, VGA (QXGA) 0°C ~ +70°C ® 512KB or 1MB 2x PCI-Express x1 2x PCI-Express Express-GFC HD Audio and AC’97 AMI APTIO UEFI G-T52R, G-T44R four SATA 6 Gb/s four SATA 16 Mbit Flash SPI ® Available Q2 2012 Available S0, S1, S3, S4, S5 DDR3 at 1066/1333 DirectX 11 and UVD3 DirectX EEPROM CMOS backup, Serial Console redirection Intel 8 GB (max), single channel Windows PICMG COM.0 R2.0, Type 6 PICMG COM.0 R2.0, Type 1.65GHz with 1MB L2 cache AMD Fusion™ up to dual-core AMD Fusion™ up to dual-core L2 depends on processor type L2 depends on processor single/dual 24-bit LVDS (UXGA) single/dual 24-bit LVDS USB boot/legacy, PXE support USB boot/legacy, Compact (95 x 95 mm) Compact (95 Windows 2 ports USB 3.0, 8 ports USB 2.0 AMD Fusion™ G-T56N, G-T40N, AMD Fusion™ G-T56N, G-T40N, 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), Compact Form Factor (95x95 mm) Max 8GB on two 200-pin SODIMM AMD Fusion™ Controller Hub A50M AMD Fusion™ Controller UVD and 3D Engine integrated on G-series processor Realtek RTL8111E GbE (10/100/1000) Realtek RTL8111E 4x PCI-Express x1 or PCIe one x4 (on APU) 4x PCI-Express Two DDI ports for DP/HDMI/DVI/SDVO for ports DDI Two Vista ® 2.6.x, ® N270 8 ® ® - - Atom™ Yes Yes Yes Yes 533 1-23 GMA 950 ® ® CE, Linux C, SMBus ® µFC-BGA 2 ® AIDI library I AMIBIOS Yes, Ver. 1.2 Ver. Yes, VGA (QXGA) 0°C ~ +60°C DDR2 at 533 Intel Express-AT XP/Xpe, Windows Intel 945GSE with ICH7M 8 ports USB 2.0 HD Audio and AC’97 8 Mbit Flash SPI ® L2 cache 512 KB Single SDVO port ® ® Max 256 MB UMA S0, S1, S3, S4, S5 3x PCI-Express x1 3x PCI-Express two SATA 1.5 Gb/s two SATA Atom™ N270 at 1.6 GHz ® 9 W with Atom one channel, two devices EEPROM CMOS backup, Serial Console redirection Serial Console redirection TV-out (PAL/NTSC/HDTV) (PAL/NTSC/HDTV) TV-out OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* Intel 2 GB (max), single channel Intel (optional 5 PCI Express x1) (optional 5 PCI Express Windows PICMG COM.0 R1.0, Type 2 PICMG COM.0 R1.0, Type 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI Ver. Intel USB boot/legacy, PXE support USB boot/legacy, Basic Form Factor (95x125 mm) selected modules: -20°C ~ +70°C at 1.6GHz and 1 GB DDR2 typical 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS Windows up to 1.6 GHz with 512 KB L2 cache up to 1.6 GHz with 512 KB L2 cache Max 2 GB on single 200-pin SODIMM Realtek RTL8111C GbE (10/100/1000) Realtek RTL8111C optional PATA SSD 512 MB up to 4 GB 4 to up MB 512 SSD PATA optional

Vista ® COM Express COM 2.6.x, ® 8 ® - - Yes Yes Yes Yes 1-21 GMA 950 ® CE, Linux M 423, 440/530 667/533 C, SMBus ® Type 2 Type ® 2 AIDI library I AMIBIOS Yes, Ver. 1.2 Ver. Yes, VGA (QXGA) 0°C ~ +60°C Express-NR XP/Xpe, Windows Intel 8 ports USB 2.0 HD Audio and AC’97 8 Mbit Flash SPI 945GME with ICH7M ® DDR2 at 667/533 ® Max 256 MB UMA S0, S1, S3, S4, S5 ® 1MB, 2MB or 4MB two SATA 1.5 Gb/s two SATA or dual SDVO ports optional (ICH7MDH) Duo (Merom/Yonah) Core™2 PCIe x16 Graphics Port, PCI-Express x1 (on PEG) PCI-Express 4 GB (max), dual channel Celeron one channel, two devices EEPROM CMOS backup, Serial Console redirection Serial Console redirection TV-out (PAL/NTSC/HDTV) (PAL/NTSC/HDTV) TV-out ® OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* Intel Intel 5x PCI-Express x1 (or 1 x4) 5x PCI-Express Windows PICMG COM.0 R1.0, Type 2 PICMG COM.0 R1.0, Type Core™2 Duo T7400 (socket) Core™2 82573 GbE EthernetGbE 82573 (10/100/1000) Basic (125 x 95 mm) Basic (125 x 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI Ver. ® L2 depends on processor type type L2 depends on processor USB boot/legacy, PXE support USB boot/legacy, 16 W with Core™2 Duo U7500 16 W with Core™2 Basic Form Factor (95x125 mm) selected modules: -20°C ~ +70°C up to 2.2 GHz with 4MB L2 cache µFC-PGA (socket-M) or µFC-BGA µFC-PGA (socket-M) or µFC-BGA 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS Intel Windows Core™2 Duo L7400, U7500, U2500 Core™2 Max 4 GB on two 200-pin SODIMM at 1.06 GHz and 1 GB memory typical Intel

Vista ® 8 ® - - - GbE (10/100/1000) Yes Yes Yes Yes 1-19 HD Audio ® M 550 (socket) ® GMA X3100 ® C, SMBus ® 2 2.6.x, AIDI library I AMIBIOS Yes, Ver. 1.2 Ver. Yes, VGA (QXGA) 0°C ~ +60°C 800/667/533 2MB or 4MB ® XP/Xpe, Windows Intel 8 ports USB 2.0 8 Mbit Flash SPI GME965 with ICH8M ® DDR2 at 667/533 Duo (Merom) Core™2 Intel optional (ICH8EM) three SATA 3 Gb/s SATA three Max 384 MB UMA S0, S1, S3, S4, S5 ® Express-MC800 or dual SDVO ports ® OpenGL 2.0, DirectX 10 OpenGL 2.0, DirectX Linux Celeron PCIe x16 Graphics Port, 4 GB (max), dual channel one channel, two devices EEPROM CMOS backup, Serial Console redirection Serial Console redirection TV-out (PAL/NTSC/HDTV) (PAL/NTSC/HDTV) TV-out http://www.adlinktech.com/Computer-on-Module Intel 5x PCI-Express x1 (or 1 x4) 5x PCI-Express PICMG COM.0 R1.0, Type 2 PICMG COM.0 R1.0, Type Core™2 Duo T7500 (socket) Core™2 Intel 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 19 W with Core™2 Duo U7500 19 W with Core™2 L2 depends on processor type type L2 depends on processor USB boot/legacy, PXE support USB boot/legacy, up 2.2 GHz with 4 MB L2 cache Basic Form Factor (95x125 mm) PPGA478 (socket-P) or PBGA479 PCI-Express x8, x4 or x1 (on PEG) PCI-Express 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS Windows integrated Intel Max 4 GB on two 200-pin SODIMM Core™2 Duo (Meron) U7500, L7500 Duo (Meron) Core™2 at 1.06 GHz and 2 GB memory typical

1-5

Computer-On-Modules Compact (95 x 95 mm) Mini (84 x 55 mm) Type 2 Type 10 Type 1

Express-LPC Express-ATC nanoX-TC nanoX-ML CPU Type Single / Dual Intel® Atom™ Intel® Atom™ Intel® Atom™ Processor E6xx from Intel® Atom™ Processor Z5xx up to 1.8 GHz with 1 MB L2 cache up to 1.6 GHz with 512 KB L2 cache 600 MHz up to 1.6 GHz from 1.1 GHz up to 1.6 GHz CPU Package FCBGA559 PBGA437 FC-BGA 676 BGA 441 CPU Models / Speeds Atom™ N455 at 1.66 GHz Intel® Atom™ N270 at 1.6 GHz E680 at 1.6 GHz, E660 at 1.3 GHz, Intel® Atom™ Z530 at 1.6 GHz Atom™ D425 at 1.8 GHz E640 at 1.1 GHz, E620 at 600 MHz Intel® Atom™ Z510 at 1.1 GHz Atom™ D525 at 1.8 GHz (dual core) FSB Speed - 533 - 533/400 Main Chipset ICH8M Intel® 945GSE with ICH7M Intel® PCH EG20T Intel® SCH US15W System Memory 4 GB (max), single channel 2 GB (max), single channel 2 GB (max), single channel 1 GB (max), single channel Memory Type DDR3 at 667/800 DDR2 533 DDR2 800 DDR2 400/533 Soldered Memory - - 512 MB up 2 GB DDR2 at 800 MHz 512 MB or 1 GB DDR2 466/533 MHz Socket Memory Max 4 GB on two 200-pin SODIMMs Max 2 GB on single 200-pin SODIMM - - Cache (L2) L2 cache 512 KB (N455/D425) L2 cache 512 KB L2 cache 512 KB L2 cache 512 KB L2 cache 1 MB (D525) BIOS Type AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend AMI EFI, American Megatrend AMIBIOS®8, American Megatrend BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI FWH, 8 Mbit Flash Graphics Controller Intel® GMA 3150 Intel® GMA 950 Intel® GMA 600 Intel® GMA 500 Graphics Memory Max 384 MB UMA Max 256 MB UMA Max 64 MB UMA Max 256 MB UMA Integrated Display Support VGA (QXGA) 2048x1536 VGA (QXGA) 18/24-bit LVDS max 1280x768@60Hz single channel 18/24-bit LVDS (WXGA) single 18 LVDS (WXGA) 1366x768 single/dual 18/24-bit LVDS (UXGA) Encode : MPEG4, H.263, H.264; supports HDTV/DHD decode and TV-out (PAL/NTSC/HDTV) Decode : MPEG2/4, VC1, WMV9, H.264 MPEG, H.264, hardware decoding External Graphics Bus - Single SDVO port Single SDVO max 1920x1080@50Hz Single SDVO port

Compatibillity OpenGL 1.5, DirectX 9.0c OpenGL 1.4, DirectX* 9.0c OpenGL 2.1, DirectX 9.0c OpenGL 2.0, DirectX 9.0c Parallel ATA (IDE) one channel, two devices one channel, two devices - one channel, one device Serial ATA two SATA 1.5 Gb/s two SATA 1.5 Gb/s two SATA 1.5 Gb/s one SATA 1.5 Gb/s Matrix Storage Support - - - - Ethernet Intel® 82583V GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) integrated Intel GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) USB 6 ports USB 2.0 6 ports USB 2.0 6 ports USB 2.0, 1 client port 8 ports USB 2.0 Audio Intel® HD Audio Intel® HD Audio and AC’97 Intel® HD Audio Intel® HD Audio Watchdog Yes Yes Yes Yes TPM Yes Yes Yes Yes PCI Express Support 5x PCI-Express x1 3x PCI-Express x1 3x PCIe x1 1x PCIe x1 (optional 5 PCI Express x1) (optional 4x PCIe without PCH EG20T) (optional 2x PCIe without LAN function) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz - - LPC Support Yes Yes Yes Yes Management Bus I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus Power 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 4.75V – 14V wide range (5Vsb 4.75V – 14V wide range (5Vsb optional for ATX function) optional for ATX function) Power States S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 Power Consumption 8 W with Atom® N455 9 W with Atom® N270 4.5 W with E620 at 600 MHz and 5 W with Atom®Z510 at 1.1 GHz and at 1.66 GHz and 1 GB DDR3 typical at 1.6GHz and 1 GB DDR2 typical 512 MB DDR2 typical 512 MB DDR2 typical Operating Temperature 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C Extended Temperature selected modules : -20°C ~ +70°C selected modules: -20°C ~ +70°C selected modules: -20°C ~ +70°C selected modules: -20°C ~ +70°C Compatibillity PICMG COM.0 R2.0, Type 2 PICMG COM.0 R1.0, Type 2 PICMG COM.0 R2.0, Type 10 PICMG COM.0 R1.0, Type 1 Dimensions Compact Form Factor (95x95 mm) Compact Form Factor (95x95 mm) Mini Form Factor (84x55 mm) Mini Form Factor (84x55 mm) Solid State Disk on Module optional SSD 4 GB up to 8 GB optional SSD 4 GB up to 8 GB - optional SSD 1 GB up to 8 GB BSP & Software Support Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® CE, Windows® XP/Xpe, Windows® CE, Windows® CE, Linux® 2.6.x, AIDI library Windows® CE, Linux® 2.6.x, AIDI library Win7 Embedded, Linux®, AIDI library Linux®, AIDI library

Page Number 1-27 1-29 1-37 1-39

1-6 ® and Linux ® 7-Series Chipset ® Core™ Processor ® 7 ® BSP ® ® Type 6 Module with 3rd Generation Generation 3rd with 6 Module Type ® VxWorks 6.x VxWorks AIDI Library for Windows Linux 4 ports USB 3.0 (USB0~3) and 4 ports USB 2.0 (USB4~7) ports at 6 Gb/s and two ports at 3 Gb/s Supports two SATA with support for RAID 0,1,5,10 based Solid State Disk 8/16/32 GB Optional SATA Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 TBD Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88Grms, 5-500Hz, each axis Operating: 0.5Grms, 5-500Hz, each axis 6, Basic form factor 125mm x 95mm Type COM Express CE, FCC, HALT Windows Embedded XP support package Linux Integrated on Intel 7-Series Chipset 7-Series ® Core™ Processor-based Mobile Platform Mobile Processor-based Core™ ® 1333MHz DisplayPort /HDMI/DVI/SDVO purpose x8/4/1) graphics (or general four USB 2.0 LAN, four USB 3.0, 3rd Generation Intel 3rd Generation Intel DDR3 SDRAM at Up to 16GB Dual Channel InterfacesThree Digital Display for (DDI) PCIe x16 (Gen3) for Seven PCIe x1, one 6 Gb/s, Gigabit SATA 3 Gb/s, two SATA Two

Features Intel COM Express COM

USB SATA SSD Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification Systems Operating Support Standard Extended Support (BSP) Multi I/O Chipset C (user) 2

Core™ Processor Core™ ® 7-Series Chipset http://www.adlinktech.com/Computer-on-Module ® Preliminary

Gigabit LAN PHY WG82579LM HD Graphics 4000 at 650–1200 MHz (depending on 7-Series Chipset ® ® ® Intel 10/100/1000 Mbps Ethernet processor) OpenGL 3.1, OpenCL 1.1 11, DirectX Intel Clear Video HD Technology Advanced Scheduler 2.0, 1.0, XPDM support support for full AVC/VC1/ Video Acceleration (DXVA) DirectX decode MPEG2 hardware Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug Dual channel 18/24-bit LVDS DDI ports supporting HDMI/DVI/DisplayPort or SDVO Three On Express-BASE6 carrier (ALC888) On Express-BASE6 Intel Integrated on Intel 22nm process, BGA type 22nm process, 3rd Generation Intel Generation 3rd - AMI EFI with CMOS backup in 16 Mbit SPI flash Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug timer range to generate RESET Programmable graphics solution or x16 (Gen3) bus for discrete PCI Express (2 x8 or 1 x8 with 2 x4) general purpose PCI Express lane 7 is free, x1: Lanes 0/1/2/3/4/5/6 are 8 PCI Express occupied by GbE LPC bus, SMBus (system) , I Dual channel 1333/1600 MHz DDR3 non-ECC memory up to Dual channel 1333/1600 MHz DDR3 non-ECC memory up 16GB in dual stacked SODIMM socket Intel

Express-IB Interface Integrated Video Support Feature VGA Interface Interface LVDS Digital Display Interface Audio Codec LAN Chipset Audio Chipset Integrated in Processor Video Specifications System Core CPU

L3 Cache BIOS Monitor Hardware Debug Interface Timer Watchdog Expansion Busses Memory Chipset

Computer-On-Modules Functional Diagram

SODIMM 2 XDP 1333/1600 MHz SFF26 1~8 GB DDR3 Processor

PCI Express x16 (Gen3) SODIMM 2 3rd Generation 2 x8 or 1x8 + 2x4 1333/1600 MHz Intel® Core™ 1~8 GB DDR3 Quad & Dual Core I F D DMI

VGA 4x USB 3.0 (port 0/1/2/3) Dual channel 18/24-bit LVDS

6x PCIe x1 (port 0~5) DDI 1 DP / HDMI / DVI / SDVO GbE PCIe x1 DDI 2 82579 (port 7) PCH DP / HDMI / DVI HD Audio DDI 3 DP / HDMI / DVI / eDP 2x SATA 6 Gb/s (channel 0/1) ® 2x SATA 3 Gb/s (channel 2/3) Intel 7-Series

4x USB 2.0 (port 4/5/6/7) PCIe x1 (port 6)

TPM Debug SLB9635 Header LPC bus

4x GPI GPIO Monitor SPI 1 4x GP0 PCA9535 ATD BIOS

SMBus SPI 2

2 BIOS I C BC

SPI

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-IB-i7-3615QE COM Express® Type 6 module with 4C 3rd Generation Passive Heatsinks ® Intel Core™ Processor with 7-Series Chipset THSH-IB-B High Profile Heatsink for Express-IB with threaded Express-IB-i7-3612QE COM Express® Type 6 module with 4C 3rd Generation standoffs ® Intel Core™ Processor with 7-Series Chipset Heat Spreaders ® Express-IB-i7-3555LE COM Express Type 6 module with 2C 3rd Generation HTS-IB-B Heatspreader for Express-IB with threaded standoffs Intel® Core™ Processor with 7-Series Chipset Heatsink with Active Cooling Express-IB-i7-3517UE COM Express® Type 6 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset THSF-IB-B High Performance Heatsink with Fan for Express-IB 2C with threaded standoffs Express-IB-i5-3610ME COM Express® Type 6 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset THSF-IB-B-4C High Performance Heatsink with Fan for Express-IB 4C with threaded standoffs Express-IB-i3-3120ME COM Express® Type 6 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset Express-IB-i3-3217UE COM Express® Type 6 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset ® 7 ® and Linux ® XP(e) / Windows ® 2.6.x BSP ® ® Gigabit LAN PHY WG82579LM Type 6 Module with with 6 Module Type ® ® Linux VxWorks 6.x VxWorks AIDI Library for Windows 10/100/1000 Mbps Ethernet Windows Embedded XP support package Linux Integrated on QM67 Supports up to eight ports USB 2.0 ports at 6 Gb/s and two ports at 3 Gb/s Supports two SATA with support for RAID 0,1,5,10 based Solid State Disk 8/16/32 GB Optional SATA Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 i7-2610UE at 1.5 GHz and 2 GB memory 22 W with Core™ typical Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88Grms, 5-500Hz, each axis Operating: 0.5Grms, 5-500Hz, each axis 6, Basic form factor 125mm x 95mm Type COM Express CE, FCC, HALT Intel Quad or Dual Core™ i7/i5/i3 Processor Dual Core™ i7/i5/i3 Quad or QM67 Chipset ® ® Core™ i7/i5/i3 Processor and QM67 Chipset and Processor i7/i5/i3 Core™ ® 1333MHz DisplayPort /HDMI/DVI/SDVO purpose x8/4/1) graphics (or general LAN, eight USB 2.0 Intel Intel DDR3 SDRAM at Up to 16GB Dual Channel InterfacesThree Digital Display for (DDI) PCIe x16 (Gen2) for Seven PCIe x1, one 6 Gb/s, Gigabit SATA 3 Gb/s, two SATA Two

Intel COM Express COM Features

Interface Operating Systems Operating Support Standard Extended Support (BSP) Multi I/O Chipset USB SATA SSD Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification LAN Chipset C (user) 2 PCH QM67 http://www.adlinktech.com/Computer-on-Module ® B810E 1.6 GHz, 2MB L3 Cache, 35W (2C) 847E 1.1 GHz, 2MB L3 Cache, 17W (2C)

® ®

Celeron Celeron Chipset Mobile QM67 Express Core™ i7-2715QE 2.1 GHz (3.0 GHz Turbo), 2.1 GHz (3.0 GHz Turbo), i7-2715QE Core™ 2.2 GHz (2.9 GHz Turbo), i7-2655LE Core 1.5 GHz (2.4 GHz Turbo), i7-2610UE Core™ 2.5 GHz (3.2 GHz Turbo), i5-2515E Core™ 2.1 GHz, 3MB L3 Cache, 35W (2C) i3-2310E Core™ 1.3 GHz, 3MB L3 Cache, 17W (2C) i3-2340UE Core™ ® ® ® ® ® ® ® ® ® HD Graphics 3000 at 650–1300 MHz 10.1 and OpenGL 3.0 DirectX Intel Clear Video HD Technology Advanced Scheduler 2.0, 1.0, XPDM support support for full AVC/VC1/ Video Acceleration (DXVA) DirectX decode MPEG2 hardware Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug Dual channel 18/24-bit LVDS DDI ports supporting HDMI / DVT / DisplayPort or Three SDVO 6MB L3 cache, 45W (4C) Intel 4MB L3 cache, 25W (2C) Intel 4MB L3 cache, 17W (2C) Intel 3MB L3 cache, 35W (2C) Intel On Express-BASE6 carrier (ALC888) On Express-BASE6 Integrated on Intel Sandy Bridge 32 nm process, BGA type Sandy Bridge 32 nm process, Intel Intel to Dual channel non-ECC 1066/1333 MHz DDR3 memory up 16 GB in dual SODIMM socket Intel 6MB (i7-2715QE), 4MB(i7-2655LE and i7-2610UE), 3MB (i5-2515E) AMI EFI with CMOS backup in 16 Mbit SPI flash Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug timer range to generate RESET Programmable graphics solution or x16 (Gen2) bus for discrete PCI Express (2 x8 or 1 x8 with 2 x4) general purpose PCI Express lane 7 is free, x1: Lanes 0/1/2/3/4/5/6 are 8 PCI Express occupied by GbE LPC bus, SMBus (system) , I Intel Intel

1-9 Express-HR

Integrated Video Support Feature VGA Interface Interface LVDS Digital Display Interface Memory Chipset Audio Codec Audio Chipset Video Integrated in Processor Specifications System Core CPU

L3 Cache BIOS Monitor Hardware Debug Interface Timer Watchdog Expansion Busses

Computer-On-Modules Functional Diagram

SODIMM 2 1066/1333 MHz 1~8 GB DDR3 CPU SODIMM 2 XDP Core 1066/1333 MHz SFF26 i7/i5/i3 1~8 GB DDR3

PCI Express x16 (Gen2) 2 x8 or 1 x8 + 2 x4 I F D DMI

VGA

Dual channel 24-bit LVDS DDI 1 DP / HDMI / DVI / SDVO 6x PCIe x1 (port 0~5) DDI 2 DP / HDMI / DVI GbE LAN PCIe x1 82579 (port 7) PCH DDI 3 HDA Audio DP / HDMI / DVI / eDP 2x SATA 6 Gb/s (channel 0/1) QM67 2x SATA 3 Gb/s (channel 2/3) PCIe x1 8x USB 2.0 (channel 0/7) (port 6)

TPM Debug SLB9635 Header LPC bus

4x GPI GPIO Monitor SPI 1 4x GP0 PCA9535 ADT7490 BIOS

SMBus SPI 2

2 BIOS I C BC

SPI

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-HR-i7-2715QE COM Express® Type 6 module with 4C Intel® Core Passive Heatsinks i7-2715QE SV processor at 2.1GHz with QM67 chipset THSH-HR-BL High Profile Heatsink for Express-HR with threaded Express-HR-i7-2655LE COM Express® Type 6 module with 2C Intel® Core standoffs i7-2655LE LV processor at 2.2GHz with QM67 chipset Heat Spreaders ® ® Express-HR-i7-2610UE COM Express Type 6 module with 2C Intel Core HTS-HR-B Heatspreader for Express-HR with threaded standoffs i7-2610UE ULV processor at 1.5 GHz with QM67 Chipset Heatsink with Active Cooling Express-HR-i5-2515E COM Express® Type 6 module with 2C Intel® Core i5-2515E SV processor at 2.5 GHz with QM67 Chipset THSF-HR-BL High Performance Heatsink with Fan for Express-HR with threaded standoffs Express-HR-i3-2310E COM Express® Type 6 module with 2C Intel® Core i3-2310E SV processor at 2.1 GHz with QM67 Chipset THSF-HR-BL-QC High Performance Heatsink with Fan for Express-HR Quad-Core CPU with threaded standoffs Express-HR-i3-2340UE COM Express® Type 6 module with 2C Intel® Core i3-2340UE ULV processor at 1.3 GHz with QM67 Chipset Express-HR-B810E COM Express® Type 6 module with 2C Intel® Celeron® B810E SV processor at 1.6 GHz with QM67 Chipset Express-HR-B-847E COM Express® Type 6 module with 2C Intel® Celeron® B847E ULV processor at 1.1 GHz with QM67 Chipset

1-10 ® and Linux ® Core™ Processor ® 7 ® BSP ® ® Type 2 Module with 3rd Generation Generation 3rd with 2 Module Type ® VxWorks 6.x VxWorks AIDI Library for Windows Linux Infineon SLB9635TT1.2 (optional) TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 TBD Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88Grms, 5-500Hz, each axis Operating: 0.5Grms, 5-500Hz, each axis 2, Basic form factor 125mm x 95mm Type COM Express CE, FCC, HALT Windows Embedded XP support package Linux Connected to LPC bus on carrier if needed 7-Series Chipset 7-Series ® Core™ Processor-based Mobile Platform Mobile Processor-based Core™ ® 1333MHz purpose x8/4/1) graphics (or general LAN, eight USB 2.0 3rd Generation Intel 3rd Generation Intel DDR3 SDRAM at Up to 16GB Dual Channel and SDVO 18/24-bit LVDS x16 (Gen3) for Five PCIe x1, one PCIe 6 Gb/s, Gigabit SATA 3 Gb/s, two SATA Two

Features Intel COM Express COM

Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification Systems Operating Support Standard Extended Support (BSP) Super I/O TPM C (user) 2

Core™ Processor Core™ ® 7-Series Chipset 7-Series Chipset http://www.adlinktech.com/Computer-on-Module ® ® Preliminary

Gigabit LAN PHY WG82579LM HD Graphics 4000 at 650–1200 MHz (depending on 7-Series Chipset ® ® ® Intel 10/100/1000 Mbps Ethernet processor) OpenGL 3.1, OpenCL 1.1 11, DirectX Intel Clear Video HD Technology Advanced Scheduler 2.0, 1.0, XPDM support support for full AVC/VC1/ Video Acceleration (DXVA) DirectX decode MPEG2 hardware Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug Dual channel 18/24-bit LVDS SDVO multiplexed with PCIe x16 lane 0-7 On Express-BASE carrier (ALC888) On Express-BASE 8 ports USB 2.0 (USB0~7) ports at 6 Gb/s and two ports at 3 Gb/s Supports two SATA with support for RAID 0,1,5,10 based Solid State Disk 8/16/32 GB Optional SATA Integrated on Intel Intel Integrated on Intel 22nm process, BGA type 22nm process, 3rd Generation Intel Generation 3rd - AMI EFI with CMOS backup in 16 Mbit SPI flash Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug timer range to generate RESET Programmable graphics solution or x16 (Gen3) bus for discrete PCI Express (2 x8 or 1 x8 with 2 x4) general purpose PCI Express lane 5 is occupied free, x1: Lanes 0/1/2/3/4 are 5 PCI Express by PCI bus and lane 7 is lane 6 is occupied by PATA, occupied by GbE LPC bus, SMBus (system) , I Dual channel 1333/1600 MHz DDR3 non-ECC memory up to Dual channel 1333/1600 MHz DDR3 non-ECC memory up 16GB in dual stacked SODIMM socket Intel

Express-IB2 Interface Integrated Video Support Feature VGA Interface Interface LVDS SDVO Interface Audio Codec USB SATA SSD Multi I/O Chipset LAN Chipset Audio Chipset Integrated in Processor Video Specifications System Core CPU

L3 Cache BIOS Monitor Hardware Debug Interface Timer Watchdog Expansion Busses Memory Chipset

Computer-On-Modules Functional Diagram

SODIMM 2 XDP 1333/1600 MHz SFF26 1~8 GB DDR3 Processor

SODIMM 2 3rd Generation PCIe x16 [lane 8-15] 1333/1600 MHz Intel® Core™ 1~8 GB DDR3 Quad & Dual Core PCIe x16 lane [0-7] h I c t i F D DMI Sw

CRT SDVO Dual channel 24-bit LVDS

5x PCIe x1 (port 0~4)

GbE PCIe x1 PCIe to 82579 (port 7) PCIe x1 PATA PATA PCH (port 5) JMB368 HD Audio

2x SATA 6 Gb/s (channel 0/1) ® 2x SATA 3 Gb/s (channel 2/3) Intel 7-Series PCIe to PCIe x1 PCI 8x USB 2.0 PCI (channel 0 ~7) (port 6) TI XIO2001

TPM Debug SLB9635 Header LPC bus

4x GPI SPI 1 GPIO Monitor 4x GP0 BIOS PCA9535 ATD

SMBus SPI 2

2 BIOS I C BC

SPI

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-IB2-i7-3615QE COM Express® Type 2 module with 4C 3rd Generation Passive Heatsinks ® Intel Core™ Processor with 7-Series Chipset THSH-IB2-B High Profile Heatsink for Express-IB2 with threaded Express-IB2-i7-3612QE COM Express® Type 2 module with 4C 3rd Generation standoffs ® Intel Core™ Processor with 7-Series Chipset Heat Spreaders ® Express-IB2-i7-3555LE COM Express Type 2 module with 2C 3rd Generation HTS-IB2-B Heatspreader for Express-IB2 with threaded standoffs Intel® Core™ Processor with 7-Series Chipset Heatsink with Active Cooling Express-IB2-i7-3517UE COM Express® Type 2 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset THSF-IB2-B High Performance Heatsink with Fan for Express-IB2 2C with threaded standoffs Express-IB2-i5-3610ME COM Express® Type 2 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset THSF-IB2-B-4C High Performance Heatsink with Fan for Express-IB2 4C with threaded standoffs Express-IB2-i3-3120ME COM Express® Type 2 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset Express-IB2-i3-3217UE COM Express® Type 2 module with 2C 3rd Generation Intel® Core™ Processor with 7-Series Chipset

Core i7/i5/i3 i7/i5/i3 Core ® ® 7 ® and Linux ® PCH QM57 PCH QM57 ® ® Type 2, Basic form factor 125 mm x 95 mm Type ® XP(e) / Vista / Windows ® 2.6.x BSP ® ® Module with Intel with Module ® Linux Embedded XP support package Linux 6.x BSP VxWorks AIDI Library for Windows Supports up to eight ports USB v. 2.0 Supports up to eight ports USB v. 3 Gb/s with optional support for RAID Four ports SATA 0,1,5,10 based Solid State Disk 8/16/32 GB Optional SATA channel 1, Master only bridge on SATA to PATA SATA On Express-BASE carrier (ALC888) On Express-BASE CE, FCC Windows Integrated on Intel Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis Integrated on Intel Integrated on QM57 with 82577LM PHY 10/100/1000 Mbps Ethernet COM Express AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) mode (12 V +/- 5%) and ATX AT Supports S0, S1, S3, S4, S5 i7-620UE at 1.2 GHz and 2 GB memory 21 W with Core™ typical Yes Core™ i7/i5/i3 Processor Core™ i7/i5/i3 QM57 chipset ® ® 1066 MHz (optional ECC) 1066 MHz (optional x8/4/1) (or general purpose Intel Intel DDR3 SDRAM at Up to 8 GB Dual Channel x16 for graphics Six PCIe x1, one PCIe DisplayPort and Embedded 18/24-bit LVDS Gigabit LAN, USB 2.0 IDE (PATA), 3 Gb/s SATA

Features COM Express COM Processor and QM57 Chipset QM57 and Processor

Extended Support (BSP) USB SATA SSD PATA Audio Codec Certification Systems Operating Support Standard Multi I/O Chipset Super I/O TPM Chipset Type Specifications Power Input Power and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Audio Chipset LAN Chipset Interface Power States Power Consumption Smart Battery Support DVMT 5.0) ® Core™ i7 / i5) i7 Core™ ® C (user) 2 http://www.adlinktech.com/Computer-on-Module

M), 4/3 MB (Intel Processor P4505 (2M Cache, 1.86 GHz) 35 W Processor U3405 (2M Cache, 1.06GHz) 18W Processor ® ® ®

Dynamic Video Memory Technology (Intel Dynamic Video Memory Technology Mobile QM57 Core™ i7-610E Processor (4M Cache, 2.53 GHz) 35 W Processor i7-610E Core™ (3M Cache, 2.40 GHz) 35 W Processor i5-520E Core™ (4M Cache, 2.00 GHz) 25 W Processor i7-620LE Core™ (4M Cache, 1.06 GHz) 18 W Processor i7-620UE Core™ (3M Cache, 2.13 GHz) 35W Processor i3-330E Core™ Celeron Celeron ® ® ® ® ® ® ® ® ® AMI EFI with CMOS backup in 16 Mbit SPI flash Supply voltages and CPU temperature timer ranges to generate RESET Programmable graphics solution or x16 bus for discrete PCI Express (2 x8 or 2 x4 or 2 x1) or general purpose PCI Express Embedded Display Port (eDP) lane 6 is free, x1: Lanes 0/1/2/3/4/5 are 7 PCI Express as 1 x4 (on occupied by GbE; can be optionally configured 0/1/2/3) and 2 x1 (4/5) 2.3 at 33MHz, supporting 4 bus masters 32-bit PCI: PCI Rev. LPC bus, SMBus (system) , I Video capture via x1 concurrent PCI Express port PCI Express via x1 concurrent Video capture Audio-Video Path) support for Protected (Protected PAVP Intel HD Audio Playback High performance MPEG-2 decoding support WMV9 (VC-1) and H.264 (AVC) for MPEG2 VLD/iDCT acceleration Hardware support 10 DirectX Microsoft OpenGL 2.1 support Blu-ray support @ 40 Mb/s motion compensation Hardware Intermediate Z in classic rendering Analog VGA support by 300 MHz DAC Analog monitor support up to QXGA ( 2048 X 1536) Single / Dual channel 18- or 24-bit panels 2 MB (Celeron Arrandale BGA type Gen 5.75 with 12 execution units 10 and OpenGL 2.1 DirectX Intel Dual channel 800/1066 MHz DDR3 memory up to 8 GB in Dual channel 800/1066 MHz DDR3 memory up to 8 GB dual stacked SODIMM socket; ECC memory for CBE series only Intel Intel Intel Intel Intel Intel Intel Intel 1-13 Express-CB/CBE BIOS Monitor Hardware Timer Watchdog Expansion Busses VGA Interface Interface LVDS L2 Cache

Specifications System Core CPU

Video Integrated in Processor Integrated Video Support Feature Chipset Memory

Computer-On-Modules Functional Diagram

DDR3 SODIMM

DDR3 Channel A with or without ECC CPU Memory 800/1066 MHz Controller Core with DDR3 SODIMM ECC i7 / i5 / i3 Channel B with or without ECC 800/1066 MHz PCIe x16 Gfx 2 PCIe x8 Embedded DisplayPort (eDP) Embedded Graphics Core

VGA

LVDS

Audio DMI FDI

VGA SDVO LVDS HDMI (3x) B dual 18/24-bit DVI (3x) D HD Audio DisplayPort (3x) A C Intel GbE LAN PHY LAN (occupies PCIe x1 port 6) 82577LM MAC PCH PCIe x1 (port 0/1/2/3/4/5) PCIe x1 QM57

SATA (1 port) JM330 PATA IDE SATA to PATA PCI SATA (4 ports) 6x 33 MHz PCI SATA 2 8x s u O v2.3 I B

SATA USB P SATA (1 port) G SPI LPC SSD 2.0 SM

USB

Test SMBus Header BIOS MAX6621 LM87 I2C to GPIO GPIO Mon(T) Mon(T/V) TPM

I2C BC

LPC

Ordering Information Modules Accessories Non-ECC ECC Description/Configuration Model Number Description/Configuration Model Number Model Number Heat Spreaders ® ® Express-CB-i7-610E Express-CBE-i7-610E COM Express module with Intel HTS-CB-B Heatspreader with threaded standoffs for Express-CB/CBE Core i7-610E SV processor at Heatsink with Active Cooling 2.53 GHz with QM57 chipset THSF-CB-B Heatsink with fan and threaded standoffs for Express-CB/ Express-CB-i5-520E Express-CBE-i5-520E COM Express® module with Intel® CBE Core i5-520 SV processor at 2.4 GHz with QM57 chipset Express-CB-i7-620LE Express-CBE-i7-620LE COM Express® module with Intel® Core i7-620LE LV processor at 2.0 GHz with QM57 chipset Express-CB-i7-620UE Express-CBE-i7-620UE COM Express® module with Intel® Core i7-620UE ULV processor at 1.07 GHz with QM57 chipset Express-CB-i3-330E Express-CBE-i3-330E COM Express® module with Intel® Core i3-330E SV processor at 2.13 GHz with QM57 chipset Express-CB-P4505 Express-CBE-P4505 COM Express® module with Intel® Celeron® P4505 SV processor at 1.86 GHz with QM57 chipset Express-CB-U3405 Express-CBE-U3405 COM Express® module with Intel® Celeron® U3405 ULV processor at 1.06 GHz with QM57 chipset

1-14 ® Core™2 Duo Core™2 82567LM PHY ® ® ICH9M ICH9M with Intel ® ® Type 2, Basic form factor, 2, Basic form factor, Type ® XP 32/64-bit Vista 32/64-bit Server 2003/2008 ® ® ® 2.6.x 2.6.x BSP ® ® Module with Intel with Module ® 10/100/1000 Mbps Ethernet Embedded XP BSP Linux WinCE 6.0 BSP AIDI Library for Win32, WinCE and Linux Windows Windows Linux 95 mm x 125 mm CE, FCC Supports up to eight ports USB v. 2.0 Supports up to eight ports USB v. Windows Integrated on Intel channel 3, on SATA JM20330 controller to PATA SATA Master only Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 Duo SU9300 at 1.2 GHz and 2 GB 18 W (with Core™2 memory typical) 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM Express Integrated on Intel Four ports SATA 3 Gb/s with (optional) support for RAID Four ports SATA 0,1,5,10 Duo processor (up to 2.26 GHz) (up to 2.26 Duo processor Core™2 ICH9M-SFF chipset GS45 and ® ® at 1066 MHz x8, x4 or x1) (or general purpose (SDTV and HDTV) Intel Intel up to 8 GB DDR3 Dual SODIMM for x16 for graphics Five PCIe x1, one PCIe and TV-out 18/24-bit LVDS Single/dual channel 2.0 Gigabit LAN, USB IDE (PATA), 3 Gb/s, SATA

COM Express COM Processor and GS45 / ICH9M-SFF Chipset Chipset / ICH9M-SFF GS45 and Processor Features Interface Extended Support

Certifications USB SATA Operating Systems Operating Support Standard Multi I/O Chipset PATA Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption and Environmental Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor LAN Chipset DVMT 5.0) ® Graphics Media ® I/O Controller Hub ICH9M-SFF I/O Controller ® ICH9M http://www.adlinktech.com/Computer-on-Module ®

C M 722, FSB 800, ULV 1.2GHz M 722, FSB 800, ULV 2 ® 8 with CMOS backup in 16 Mbit SPI flash ®

HD Audio Playback Dynamic Video Memory Technology (Intel Dynamic Video Memory Technology Core™2 Duo SP9300, FSB 1066, 2.26 GHz Core™2 1.86 GHz Duo SL9400, FSB 1066, LV Core™2 1.2 GHz Duo SU9300, FSB 800, ULV Core™2 Celeron Hub SFF Graphics Memory Controller GS45 Express ® ® ® ® ® ® ® Video capture via x1 concurrent PCI Express port PCI Express via x1 concurrent Video capture Audio-Video Path) support for Protected (Protected PAVP Intel High performance MPEG-2 decoding support WMV9 (VC-1) and H.264 (AVC) for MPEG2 VLD/iDCT acceleration Hardware support 10 DirectX Microsoft Blu-ray support @ 40 Mb/s motion compensation Hardware Intermediate Z in classic rendering Analog VGA support by 300MHz DAC Analog monitor support up to QXGA, supports VGA hot plug Single / Dual channel 18/24-bit at 25~112 MHz supported up to 1024x768 resolution NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) with 6MB L2 cache, 25 Watt Intel with 6MB L2 cache, 17 Watt Intel with 3MB L2 cache, 10 Watt Intel (Small Form Factor) and Intel Supply voltages and CPU temperature timer ranges to generate RESET Programmable x16 bus for SDVO/HDMI/DisplayPort Graphics PCI Express (x8 / x4 / x1) or general purpose PCI Express 5 is occupied by GbE; free, x1: 0/1/2/3/4 are 6 PCI Express as 1 x4 0/1/2/3 x1 can be optionally configured 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I HDA codec on carrier to HDMI interface Audio routed Integrated on Intel GS45 GMCH integrated Mobile Intel Penryn SFF BGA type Intel AMIBIOS Accelerator 4500MHD with core render clock 533 MHz render Accelerator 4500MHD with core Mode voltage or 266 MHz @ 1.025 L.P. @ 1.05-V core Intel with 1MB L2 cache, 5.5 Watt with 1MB L2 cache, 5.5 Watt Dual stacked SODIMM sockets supporting dual channel up to 8 GB of non-ECC, 800/1066 MHz DDR3 memory, Intel 1-15 Express-MV Feature Support Feature VGA Interface Interface LVDS TV-out Monitor Hardware Timer Watchdog Expansion Busses Audio Codec HDMI Chipset Audio Video Chipset Specifications System Core CPU

BIOS Integrated Video Memory Chipset

Computer-On-Modules Functional Diagram

CPU Celeron® M Core™2 Duo

Small Form Factor: 22 x 22 mm BGA

FSB 800/1066 MHz

GMCH DDR3 800/1066 ® Channel A SODIMM socket Intel GS45 DDR-3 Small Form Factor Memory Controller Analog Graphics Core DDR3 800/1066 VGA Channel B VGA 4500MHD SODIMM socket PCIe x16 Gfx TV-out SDTV HDTV PCIe x8/x4/x1 SDVO (2) DisplayPort (3) LVDS LVDS dual 18/24-bit HDMI (2)

DMI PCIe x16 (multiplexed) Audio Audio

Intel LAN ICH Gbe PHY PCIe x1, lane 5 ® 82567LM MAC Intel ICH9M Small Form Factor AB Six CD PCIe x1, lane 0/1/2/3/4 or PCIe x4 JM30220 PCIe x1 1x SATA2 SATA / PATA IDE lanes RTC PCI SATA_0/1/2/3 3x SATA PCI 33 MHz v2.3 Bus

USB_0/1/2/3/4/5/6/7 8x USB 2.0 M S SPI LPC

Test SMBus header BIOS GPIO F75111R LM95245 LM87 TPM I2C BC

LPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MV-SP9300 COM Express® Module with Intel® Core™2 Duo Heat Spreaders processor SP9300 at 2.26 GHz HTS-MV-B Heatspreader for Express-MV (BGA CPU) with threaded Express-MV-SL9400 COM Express® Module with LV Intel® Core™2 Duo standoffs processor SL9400 at 1.86 GHz Passive Heatsinks ® Express-MV-SU9300 COM Express Module with ULV Intel® Core™2 Duo THS-MV-BL Low Profile Heatsink for Express-MV (BGA CPU) with processor SU9300 at 1.20 GHz threaded standoffs for bottom mounting with long cooling Express-MV-722 COM Express® Module with ULV Intel® Celeron® M fins (incl screws for 5 and 8 mm btb) processor 722 at 1.20 GHz Heatsink with Active Cooling THSF-MV-B High Performance Heatsink with Fan for Express-MV (BGA CPU) with threaded standoffs

1-16 Core™2 Duo Core™2 ® ® 7 ® and Linux ® I/O Controller Hub 9 Mobile (ICH9M) I/O Controller I/O Controller Hub 9 Mobile (ICH9M) I/O Controller ® ®

Type 2, Basic form factor 125 mm x 95 mm Type ® XP(e) / Vista / Windows ® OpenGL setup instructions) 2.6.x BSP (with Xorg ® ® Module with Intel with Module ® Yes Linux Embedded XP support package Linux 6.x BSP (on request) VxWorks AIDI Library for Windows Supports up to eight ports USB v. 2.0 Supports up to eight ports USB v. 3 Gb/s with optional support for RAID Four ports SATA 0,1,5,10 channel 3, Master on SATA JM330 controller to PATA SATA channel) up fourth SATA to free only (can be removed On Express-BASE carrier (ALC888) On Express-BASE to HDMI interface Audio routed CE, FCC Windows Integrated on ICH9M with Intel 82567LM PHY 10/100/1000 Mbps Ethernet Integrated on Intel Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 Supports S0, S1, S3, S4, S5 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis Integrated on Intel COM Express AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) mode (12 V and 5 Vsb +/- 5%) mode (12 V +/- 5%) and ATX AT Duo P8400 at 2.26 GHz and 2 GB 23 W (with Core™2 typical) memory, Core™2 Duo processor (up to 2.53 GHz) processor (up Core™2 Duo ICH9M chipset GM45 and ® ® at 1066 MHz x8, x4 or x1) (or general purpose (SDTV and HDTV) Intel Intel up to 8 GB DDR3 Dual SODIMM for x16 for graphics Five PCIe x1, one PCIe and TV-out 18/24-bit LVDS Single/dual channel 2.0 Gigabit LAN, USB IDE (PATA), 3 Gb/s, SATA

COM Express COM Processor and GM45 / ICH9M Chipset / ICH9M GM45 and Processor Features Smart Battery Support

Extended Support (BSP) USB SATA PATA Audio Codec HDMI Certification Systems Operating Support Standard Chipset Interface Multi I/O Chipset Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Audio Chipset LAN DVMT 5.0) ® Graphics Media ® C (user) 2 M T3100, FSB 800, 1.90 GHz with ® http://www.adlinktech.com/Computer-on-Module

M), 6/3 MB (Core™2 Duo) M), 6/3 MB (Core™2 M 575, FSB 667, 2.00 GHz with 1-MByte L2 ® ® 8 with CMOS backup in 16 Mbit SPI flash ®

Dynamic Video Memory Technology (Intel Dynamic Video Memory Technology HD Audio Playback GM45 Express Graphics Memory Controller Hub and Graphics Memory Controller GM45 Express Hub 82801IEM (ICH9M-E) I/O Controller Core™2 Duo T9400, FSB 1067, 2.53 GHz with Core™2 Duo P8400, FSB 1067, 2.26 GHz with Core™2 Dual Celeron Celeron ® ® ® ® ® ® ® ® Video capture via x1 concurrent PCI Express port PCI Express via x1 concurrent Video capture Audio-Video Path) support for Protected (Protected PAVP Intel High performance MPEG-2 decoding support WMV9 (VC-1) and H.264 (AVC) for MPEG2 VLD/iDCT acceleration Hardware support 10 DirectX Microsoft OpenGL 2.1 support Blu-ray support @ 40 Mb/s motion compensation Hardware Intermediate Z in classic rendering Analog VGA support by 300-MHz DAC Analog monitor support up to QXGA and support for VGA hot plug Single / Dual channel 18- or 24-bit panels supported up to 1024x768 resolution NSTC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Intel 1 MB (Celeron 6-MByte L2 cache, 35 Watt Intel 3-MByte L2 cache, 25 Watt Intel Supply voltages and CPU temperature timer ranges to generate RESET Programmable x16 bus or SDVO/HDMI/DisplayPort or Graphics PCI Express (x8/x4/x1) general purpose PCI Express lane 5 is free, x1: Lanes 0/1/2/3/4 are 6 PCI Express occupied by GbE LAN; lanes 0/1/2/3 x1 can be optionally as 1 x4 configure 2.3 at 33MHz, supporting 4 bus masters 32-bit PCI: PCI Rev. LPC bus, SMBus (system), I AMIBIOS GM45 GMCH integrated Mobile Intel Socket P Intel Accelerator X4500 with core render clock 533-MHz @ render Accelerator X4500 with core 1.05 Vcore Intel cache, 31 Watt cache, 31 Watt top, one on bottom) SODIMM sockets (one on Two up to 8 GB of non-ECC, supporting dual channel memory, 800/1067 MHz DDR3 Intel 1-MByte L2 cache, 35 Watt Intel 1-17 Express-MG Feature Support Feature VGA Interface Interface LVDS TV-out L2 Cache Monitor Hardware Timer Watchdog Expansion Busses BIOS Video Chipset Specifications System Core CPU

Integrated Video Memory Chipset

Computer-On-Modules Functional Diagram

CPU Core™2 Duo Celeron® M

Socket P

FSB 800/1066 MHz

GMCH DDR3 800/1066 ® Channel A SODIMM socket Intel GM45 DDR3 Memory Controller

Analog Channel B DDR3 800/1066 VGA SODIMM socket

SDTV PCIe x16 Gfx HDTV PCIe x8/x4/x1 SDVO (2) LVDS DisplayPort (3) dual 18/24-bit HDMI (2)

HDA only

DMI

Intel Audio PHY 82567LM GbE port 5 N/A (Multifunction with LAN) ICH MAC ®

Intel ICH9M D PCI-E ports 0 / 1 / 2 / 3 / 4 six ports PCI-E x1 Small Form Factor AB C JM330 SATA (port 3) SATA / PATA PATA IDPAE (mTaAster only)

SATA ports 0/1/2 (0/1/2/3 if no PATA support) 4x SATA 2 RTC PCI PCI 33 MHz v2.3 u s O I P G USB_0/1/2/3/4/5/6/7 8x USB 2.0 SMB SPI LPC

Test SMBus Header BIOS

2 LM95235 LM87 I C to GPIO GPIO Mon(T) Mon(T/V) TPM

I2C BC

LPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MG-S COM Express® Module with socket type for Intel® Heat Spreaders Core™2 Duo processor with GM45 and ICH9M chipset HTS-MG-S Heatspreader for Express-MG (socket CPU) with threaded Express-MG-S/T9400 COM Express® Module with socket type Intel® Core™2 Duo standoffs processor T9400 at 2.53 GHz Passive Heatsinks ® ® Express-MG-S/P8400 COM Express Module with socket type Intel Core™2 Duo THS-MG-S Low Profile Heatsink for Express-MG (socket CPU) with processor P8400 at 2.26 GHz threaded standoffs ® ® Express-MG-S/T3100 COM Express Module with socket type Intel Heatsink with Active Cooling Dual Core Celeron® processor T3100 at 1.90 GHz THSF-MG-S High Performance Heatsink with FAN for Express-MG ® ® Express-MG-S / 575 COM Express Module with socket type Intel (socket CPU) with threaded standoffs Celeron® processor 575 at 2.00 GHz

1-18

® Core™2 Duo Core™2 ® Type 2, Basic form factor, 95 mm x 125 mm 2, Basic form factor, Type ® Server 2003 XP 32/64-bit Vista 32/64-bit ® ® ® 2.6.x 2.6.x BSP ® ® ICH8-M Module with Intel with Module ® ® Embedded XP BSP Linux AIDI Library for Win32, WinCE and Linux Linux Windows Windows Single channel IDE with Ultra ATA 100/66/33 support Single channel IDE with Ultra ATA 3 Gb/s SATA ports Three Up to eight ports USB 2.0 CE, FCC Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 Duo U7500 at 1.06 GHz and 2 GB 19 W (with Core™2 typical) memory, 0°C to 60°C 20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM Express Windows Intel ystems ™2 Duo processor (up to 2.2 GHz) (up to 2.2 Core™2 Duo processor chipset GME965 / ICH8M ® ® Intel Intel up to 4 GB DDR2 at 800MHz Dual SODIMM for x16 graphic (or x8) Five PCIe x1, one PCIe TV-out LVDS, Dual-channel 24-bit Gigabit LAN, USB 2.0 PATA, 3 Gb/s, SATA

COM Express COM Processor and GME965 / ICH8-M Chipset Chipset / ICH8-M GME965 and Processor Features Extended Support

IDE (PATA) SATA USB Certifications Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption and Environmental Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor S Operating Support Standard Multi I/O Chipset 82566 PHY ® GMA X3100 ® ICH8-M ® http://www.adlinktech.com/Computer-on-Module C M 550, FSB 533, 2.0 GHz, with 2 ® 8 with CMOS backup in 8 Mbit SPI flash ® GME965 GMCH and ICH8-M Core™2 Duo T7500, FSB 800, 2.2 GHz with Core™2 Celeron Duo T7500, FSB 800, 2.2 GHz with Core™2 1.5 GHz with Duo L7500, FSB 800, LV Core™2 1.06 GHz with Duo U7500, FSB 533, ULV Core™2 ® ® ® ® ® ® AMIBIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable 5 occupied by GbE), optional x1 (0 – 4 free, 6 PCI Express configurable as x4 x8/x4/x1, or SDVO x16 or PCI Express Graphics PCI Express digital video bus 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters LPC, SMBus, I 4MB L2 cache, 34 W Intel 4MB L2 cache, 34 W Intel 4MB L2 cache, 17 W Intel 2MB L2 cache, 10 W Dual stacked SODIMM sockets supporting dual channel up to 4 GB of non-ECC, 533/667 MHz DDR2 memory, Intel HDA codec on carrier Integrated on Intel ICH8-M integrated GbE MAC with Intel GME965 integrated Mobile Intel Socket P type Intel Analog VGA support up to 2048 x1536 at 60 Hz, 32-bpp Single / Dual channel 18/24-bit at 25~112 MHz up to 1024x768 resolution, NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN 10/100/1000 Mbps with Wake-on-LAN support 1MB L2 cache 27 W BGA type Intel

1-19

dio BIOS Monitor Hardware Timer Watchdog Expansion Busses Memory Chipset Audio Codec LAN Chipset Chipset Au Chipset Video

Specifications System Core CPU Express-MC800 VGA Interface Interface LVDS TV-out Interface

Computer-On-Modules Functional Diagram

CPU Celeron® M Core™2 Duo

SMT µFCBGA2 or µFCPGA2

FSB 533/800 MHz

GMCH Channel A DDR2 533/667 Intel® GME965 SODIMM socket DDR-2 Memory Analog Controller VGA VGA Graphic Core Channel B DDR2 533/667 X3100 SODIMM socket SDTV TV-out HDTV Gfx PCIe x16 LVDS LVDS PCIe x8/x4/x2/x1 dual 18/24-bit or 2x SDVO

DMI PCIe x16 (multiplexed) HDA Audio Audio ICH GbE ® GbE PHY PCIe x1, lane 5 Intel 82566 MAC Intel ICH8M

PCI Express PATA 1x PCIe x1, lane 0/1/2/3/4 or PCIe x4 lanes IDE0 RTC PCI SATA_0/1/3 3x SATA2 PCI 33 MHz, v2.3

USB 2.0 0/1/2/3/4/5/6/7 8x USB 2.0 SMBus SPI LPC

I2C BC

SMBus TPM GPIO GPIO Monitor Monitor F75111R LM95235 LM87 BIOS

LPC header LPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MC800-S COM Express® Module with socket for Celeron® M or Heat Spreaders Core™2 Duo processor HTS-MC800-B Heatspreader for Express-MC800 (BGA CPU) with ® (for Intel Core™2 Duo T7500 processor at 2.2 GHz or threaded standoffs Intel® Celeron® M 550 processor at 2.0 GHz) Passive Heatsinks Express-MC800-L7500 COM Express® Module with LV Intel® Core™2 Duo L7500 THS-MC800-B Low Profile Heatsink for Express-MC800 (BGA CPU) with processor at 1.6 GHz threaded standoffs Express-MC800-U7500 COM Express® Module with ULV Intel® Core™2 Duo THSH-MC800-B High Heatsink for Express-MC800 (BGA CPU) with U7500 processor at 1.06 GHz threaded standoffs Heatsink with Active Cooling THSF-MC800-S High Performance Heatsink with Fan for Express-MC800 (socket CPU) with threaded standoffs

1-20

® Core™2 Duo Core™2 ® x1 (or one x4) ® Type 2, Basic form factor, 95 mm x 125 mm 2, Basic form factor, Type ® XP 32/64-bit Vista 32/64-bit Server 2003 ® ® ® 2.6.x BSP 2.6.x ® ® ICH7-M Module with Intel with Module ® ® AIDI Library for Win32, WinCE and Linux Embedded XP BSP WinCE BSP Linux Windows Windows Linux Single channel IDE with UDMA 100 support 1.5 Gb/s ports SATA Three Up to eight USB 2.0 ports CE, FCC Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 Duo U7500 and 1 GB memory) 16 W typical (with Core™2 0°C to 60°C -20°C to 80°C Up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM Express Windows Intel x16, five PCIe ® e™2 Duo processor (up to 2.1 GHz) processor (up to Core™2 Duo chipset 945GME / ICH7-M ® ® ating Systems Intel Intel up to 4 GB DDR2 at 667 MHz Dual SODIMM for One PCIe TV-out LVDS, Single/dual 18/24-bit Gigabit LAN, USB 2.0 PATA, SATA,

COM Express COM Processor and 945GME / ICH7-M Chipset Chipset / ICH7-M 945GME and Processor Features

Extended Support

ICH7-M DH http://www.adlinktech.com/Computer-on-Module ® 82573L C 2 ® M 530, 1.73GHz with 1MB L2 cache, 27 W M 440, 1.86 GHz with 1MB L2 cache, 27 W M 423, 1.06GHz with 1MB L2 cache, 5.5 W ® ® ® 8 with CMOS backup in 8 Mbit SPI flash ® 945GME Express Graphics Memory Controller Hub Graphics Memory Controller 945GME Express Hub 7 Mobile (ICH7-M DH) I/O Controller Celeron T2500, 2.0 GHz with 2MB L2 cache, 31 W Duo Core™ Celeron Core™2 Duo T7400, 2.16GHz with 4MB L2 cache, 34 W Core™2 Core™ Duo L2400, 1.66GHz with 2MB L2 cache, 15 W Duo Core™ U2500, 1.2 GHz with 2MB L2 cache, 9 W Duo Core™ Celeron Core™2 Duo L7400, 1.5 GHz with 4MB L2 cache, 17 W Duo Core™2 U7500, 1.06 GHz with 2MB L2 cache, 10 W Duo Core™2 ® ® ® ® ® ® ® ® ® ® ® Merom Core BGA type Core Merom BGA type Core Yonah Intel AMIBIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable 5 occupied by GbE LAN), x1 (0 – 4 free, 6 PCI Express optional configurable as x4 x16, or SDVO digital video bus Graphics PCI Express 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters LPC, SMBus, I 10/100/1000 Mbps HDA (Azalia) or AC’97 codec on carrier PCIe type Intel Integrated on Intel 945GME GMCH integrated graphics supports dual independent displays Analog VGA support up to 2048 x1536 resolution Single / Dual channel 18/24-bit up to 1024x768 resolution, NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Yonah Core socket type socket Core Yonah Intel Dual SODIMM sockets supporting dual channel memory, up to 4 GB of non-ECC, 533/667 MHz DDR2 Intel Merom Core socket type Core Merom Intel Intel Intel Intel Intel Intel Intel Intel

1-21

BIOS Hardware Monitor Hardware Timer Watchdog Expansion Busses Interface Audio Codec Chipset LAN Audio Chipset Video Chipset VGA Interface Interface LVDS TV-out Memory Chipset

Specifications System Core CPU

Express-NR

Computer-On-Modules Functional Diagram CPU Celeron® M Core™ Duo Core™2 Duo

SMT µFCBGA2 or µFCPGA2

FSB 533/667 MHz

GMCH Channel A DDR2 533/667 Intel® 945GME SODIMM socket DDR-2 Memory Analog Controller Graphic Core VGA VGA DDR2 533/667 250 MHz Channel B SODIMM socket SDTV TV-out HDTV PCIe x16 Gfx PCIe x1 or LVDS LVDS 2x SDVO Dual 18/24-bit

DMI PCIe x16 (multiplexed) AC97 Audio or HDA Audio ICH GbE LAN PCIe x1, lane 5 ® Intel 82573L Intel ICH7-M DH Six PCIe x1 PCIe x1, lane 0/1/2/3/4 or PCIe x4 lanes PATA 1x IDE RTC PCI SATA_0/1 2x SATA PCI 33 MHz, v2.3 Bus

USB_0/1/2/3/4/5/6/7 M 8x USB 2.0 S SPI LPC

I2C BC

SMBus TPM GPIO GPIO LM95235 LM87 BIOS

LPC header LPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-NR-S COM Express® Module with socket for Celeron® M / Core™ Heat Spreaders Duo / Core™2 Duo processor (for Intel® Core™2 Duo T7400 processor at 2.16 GHz or HTS-NR-B Heatspreader for Express-NR (BGA CPU) with threaded Intel® Celeron® M 440 processor at 1.86 GHz) standoffs Express-NR-L7400 COM Express® Module with LV Intel® Core™2 Duo L7400 Passive Heatsinks processor at 1.5 GHz THS-NR-B Low Profile Heatsink for Express-NR (BGA CPU) with Express-NR-L2400 COM Express® Module with LV Intel® Core™ Duo L2400 threaded standoffs processor at 1.66 GHz THSH-NR-B High Heatsink for Express-NR (BGA CPU) with threaded Express-NR-U7500 COM Express® Module with ULV Intel® Core™2 Duo U7500 standoffs processor at 1.06 GHz Heatsink with Active Cooling Express-NR-423 COM Express® Module with ULV Intel® Celeron® M 423 THSF-NR-S High Performance Heatsink with Fan for Express-NR processor at 1.06 GHz (socket CPU) with threaded standoffs

1-22 ® Atom™ Atom™ ® Type 2, Basic form factor, 2, Basic form factor, Type ® XP 32-bit Vista 32-bit ® ® 2.6.x BSP 2.6.x ® ® ICH7-M Module with Intel with Module ® ® AIDI Library for Win32, WinCE and Linux Embedded XP BSP WinCE BSP Linux Windows Linux Single IDE channel with UDMA100 with optional 512MB - 8GB IDE-based Solid State Disk 1.5 Gb/s port SATA Two Up to eight ports USB 2.0 95 mm x 125 mm CE, FCC Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 9 W typical (with Atom™ N270 and 1 GB memory) 0°C to 60°C -20°C to 80°C Up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM Express Windows Intel ems yst processor N270 at 1.6 GHz Atom™ processor / ICH7-M chipset 945GSE ® ® and TV-out (SDTV and HDTV) and TV-out Disk Intel Intel 2 GB DDR2 at 533 MHz SODIMM for up to 4 x1 or 1 x4) Three PCIe x1 (optional single/dual 18-bit LVDS High resolution VGA, Gigabit LAN, USB 2.0 (PATA), IDE SATA, IDE-based Solid State Optional 512MB~8GB

Features COM Express COM Processor N270 and 945GSE / ICH7-M Chipset / ICH7-M 945GSE and N270 Processor

Extended Support

IDE (PATA) SATA USB Certifications Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption nmental and Enviro Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor S Operating Support Standard Multi I/O Chipset Technology ® I/O Controller Hub 7 Mobile (ICH7-M) I/O Controller http://www.adlinktech.com/Computer-on-Module ®

SpeedStep C ® 2 8 with CMOS backup in 8 Mbit SPI flash ®

945GSE Express Graphic Memory Controller Hub and Graphic Memory Controller 945GSE Express Hub 7 Mobile (ICH7-M) I/O Controller Graphics Media Accelerator 950 integrated into Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2 ® ® ® ® Source synchronous double-pumped (2x) Address synchronous Source quad-pumped (4x) Data synchronous Source C0 - C4 low power states supported up to 2 GB of non-ECC, Single SODIMM socket memory, 400/533 MHz DDR2 Intel Intel AMIBIOS 945GSE GMCH supporting dual independent displays Analog VGA support up to 1600 x 1200 Single / Dual channel 18-bit (optional 24-bit on carrier SDVO) through supported, up to 1024x768 resolution NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) cache, 2.5 W, on-die primary 32-kB instruction cache cache, 2.5 W, and 24 KB write-back data cache support (2-threads) Hyper-Threading Advanced gunning transceiver logic (AGTL+) bus driver technology Enhanced Intel Supply voltages and CPU temperature timer ranges to generate RESET Programmable 3 is occupied by GbE LAN) free, x1 (0/1/2 are 4 PCI Express as x4 optionally configured Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I HDA (Azalia) or AC’97 codec on carrier PCIe x1 Realtek RTL8111C 10/100/1000 Mbps Integrated on Intel Intel BGA type Intel 1-23 Express-AT Memory Chipset BIOS VGA Interface Interface LVDS TV-out Monitor Hardware Timer Watchdog Expansion Busses Audio Codec Interface LAN Chipset io Aud Chipset Chipset Video Specifications System Core CPU

Computer-On-Modules Functional Diagram CPU

Atom™ N270

FSB 533 MHz

DDR2 533 GMCH Channel A ® SODIMM socket Intel 945GSE up to 2 GB DDR-2 Analog Memory VGA VGA Controller Graphic Core SDTV 250 MHz TV-out HDTV

LVDS LVDS Single channel dual 18-bit SDVO

DMI SDVO HDA Audio Au dio ICH GbE LAN Solid State PCIe x1 port 3 Realtek Intel® ICH7-M Drive RTL8111C Four 512MB up to 8 GB AB PCIe x1 CD lanes PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) PATA 1x IDE RTC

2x SATA PCI PCI 33 MHz, v2.3 SATA_0/1 s

8x USB Bu USB_0/1/2/3/4/5/6/7 M 2.0 S SPI LPC

I2C BC

SMBus TPM GPIO GPIO LM87 BIOS

LPC header LPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-AT-N270 COM Express® module with Intel® Atom™ N270 processor Heat Spreaders at 1.6 GHz HTS-CAT-B Heatspreader for Express-AT (BGA CPU) with threaded Express-AT-N270-4G COM Express® module with Intel® Atom™ N270 processor standoffs at 1.6 GHz 4GB SSD Solid State Disk Passive Heatsinks THS-CAT-B Low Profile Heatsink for Express-AT (BGA CPU) with threaded standoffs

1-24 Type 6 Module with AMD with 6 Module Type ® nmental Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 TBD Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis CE, FCC Windows XP(e) / Windows 7 Linux Embedded XP/2009, WES7 support package OpenGL setup instruction) Linux 2.6.x BSP (with Xorg 6.x (on request) VxWorks AIDI I²C Library for Windows and Linux Integrated on AMD A55M ports USB 2.0 ports USB 3.0 and eight Two 6 Gb/s with support for RAID 0,1,5,10 Four ports SATA COM Express Type 2, COM.0 R2.0 Type COM Express Compact form factor 95 mm x 95 mm stems 1333MHz DP/HDMI/DVI/SDVO Fusion™ G-Series Processor AMD Fusion™ Hub AMD A55M Controller DDR3 SDRAM at Up to 8GB Dual Channel DDI (Digital Display Interface) for Two (optional PCIe x4) Six free PCIe x1 lanes 6 Gb/s, Gigabit Ethernet Four SATA USB 3.0, eight USB 2.0 Two

Fusion™ G-Series Processor and A55M Controller Hub Controller A55M and Processor G-Series Fusion™ Compact COM Express COM Compact Features

Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support ro and Envi Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification Sy Operating Support Standard Extended Support (BSP) Multi I/O and Storage Chipset USB SATA C (user) 2 http://www.adlinktech.com/Computer-on-Module Available Q2 2012 Available Realtek RTL8111E 10/100/1000 Mbps Ethernet Integrated on AMD A55M carrier (ALC888) On Express-BASE6 UVD and 3D Engine integrated with G-series processor and UVD3 11 DirectX support for full Acceleration (DXVA) Video DirectX Decode Hardware AVC/VC1/MPEG2 UVD3 includes support for DivX and Xvid via MPEG-4 Part 2 3D support decoding, Blu-ray 3D via MVC and 120Hz stereo Analog VGA support by 300 MHz DAC Analog monitor support up to 2560x1600 resolution Dual channel 24-bit LVDS eDP interface supports link-speeds of 1.62 Gbps and 2.7 Gbps on 1, 2 or 4 data lanes; eDP supports -0.5% SSC and non-SSC clock settings BGA Type 1.65 GHz (1MB L2 cache, 18W) AMD G-T56N dual-core 1.0 GHz (1MB L2 cache, 9W) AMD G-T40N dual-core AMD G-T52R 1.5 GHz (512KB L2 cache, 18W) AMD G-T44R 1.2 GHz (512KB L2 cache, 9W) up Single channel non-ECC 1066/1333 MHz DDR3 memory to 8 GB in dual stacked SODIMM socket Hub AMD A55M Control 1MB for G-T56N and G-T40N 512KB for G-T52R and G-T44R AMI APTIO UEFI in 16 Mbit SPI flash and supply voltages only Temperature timer range to generate RESET Programmable lane 0 is free, x1: Lanes 0/1/2/3/4/5/6 are 6 PCI Express occupied by GbE; lane 1 is occupied by USB 3.0 LPC bus, SMBus (system) , I

1-25

udio Express-GFC Interface Chipset Chipset Audio Codec LAN A Video Integrated in Processor Integrated Video Support Feature VGA Interface Interface LVDS Embedded Display Port Specifications System Core CPU Memory Chipset L2 Cache BIOS Monitor Hardware Timer Watchdog Expansion Busses

Computer-On-Modules Functional Diagram

SODIMM 1 Analog VGA 1066/1333 MHz 1~4 GB DDR3

24-bit LVDS Chrontel CH7511 AMD APU SODIMM 2 1066/1333 MHz 1~4 GB DDR3 2 PCIe x1 (or 1 x2) Gen2 AMD G-T56N (port 4,5) AMD G-T40N DDI 1 AMD G-T52R DP/HDMI B LAN PCIe x1 AMD G-T44R RT8111E (port 7) DDI 2 DP/HDMI C

2 USB 3.0 Renesas PCIe x1 uPD720200A (port 7) USB 3.0 upgrade UMI

6 USB 2.0

4 PCIe x1 (or 1 x4) Gen2 (port 0,1,2,3) 4x SATA 6 Gb/s (port 0,1,2,3) AMD FCH

HD Audio TPM A50M SLB9635 LPC bus

4x GPI SPI SPI BIOS 4x GP0

Fan Control Monitor ADT7490 SMBus 2 I C BC SPI

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-GFC-T56N Compact COM Express Type 6 module with AMD Fusion Passive Heatsinks G-T56N dual-core processor at 1.65 GHz and A55M THSH-GFC-BL High Profile Heatsink for Express-GFC with threaded Controller Hub standoffs Express-GFC-T40N Compact COM Express Type 6 module with AMD Fusion Heat Spreaders G-T40N dual-core processor at 1.0 GHz and A55M Controller Hub HTS-GFC-BL Low Profile Heatsink for Express-LPC with threaded standoffs Express-GFC-T52R Compact COM Express Type 6 module with AMD Fusion G-T52R processor at 1.5 GHz and A55M Controller Hub Heatsink with Active Cooling Express-GFC-T44R Compact COM Express Type 6 module with AMD Fusion THSF-GFC-BL High Performance Heatsink with Fan for Express-GFC with G-T44R processor at 1.2 GHz and A55M Controller Hub threaded standoffs

1-26

® 7 ® and Linux ® Module with Single/Dual Single/Dual with Module ® Type 2, COM.0 R2.0 Type ® nmental XP(e) / Vista, Windows ® 2.6.x BSP ® ® I/O Controller Hub 8 Mobile (ICH8M) I/O Controller ® Linux VxWorks 6.x BSP VxWorks AIDI Library for Windows Supports up to eight ports USB 2.0 3 Gb/s SATA ports Three Single IDE channel (UDMA100) with optional 4GB ~ 8GB IDE-based Solid State Drive Windows Embedded XP / 2009 support package Linux BIOS support for legacy free or legacy with two types of BIOS support for legacy free Super I/O (Winbond W83627HG and W83627DHG) Infineon SLB9635TT1.2 (optional) TPM 1.2 Supports S0, S1, S3, S4, S5 10 W (with N455 CPU and 2 GB memory typical) Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis CE, FCC Intel AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) mode (12 V +/- 5%) and ATX AT COM Express Compact form factor 95 mm x 95 mm Atom™ Processor and ICH8M Chipset ICH8M and Processor Atom™ ® stems I/O Controller Hub 8 Mobile I/O Controller Hub ® Dual Core Atom™ processor at 1.8 GHz Atom™ processor Single/Dual Core Intel SDRAM at 800 MHz Up to 4 GB DDR3 (optional PCIe x4) Five free PCIe x1 lanes support VGA and LVDS 2.0 Gigabit LAN, USB IDE (PATA), 3 Gb/s, SATA

Core Intel Core Compact COM Express COM Compact Features

USB SATA IDE (PATA)

Standard Support Standard Extended Support (BSP) Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support ro and Envi Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification Sy Operating Multi I/O and Storage Chipset C (user) 2 Atom™ processor 1.80 GHz at 10 W Atom™ processor Atom™ processor 1.66 GHz at 6.5 W Atom™ processor ® ® Atom™ processor 1.80 GHz at 13 W Atom™ processor ® I/O Controller Hub 8 Mobile (ICH8M) I/O Controller http://www.adlinktech.com/Computer-on-Module ® 8 with CMOS backup in 16 Mbit SPI flash ® Atom™ Processor Clear Video Technology 82583V Gigabit Ethernet Controller Dynamic Video Memory Technology 4.0 support Dynamic Video Memory Technology I/O Controller Hub 8 Mobile (ICH8-M) I/O Controller ® ® ® ® ® MPEG2 Hardware Acceleration, ProcAmp Acceleration, ProcAmp MPEG2 Hardware up to 2048x1536@ 60 Hz resolution Analog RGB display, up to 1366x768, 18bpp Single 18-bit channel, resolution 10/100/1000 Mbps Ethernet DirectX 9 compliant Pixel Shader v2.0 DirectX clock frequency 400 MHz render and RGB 2 display ports: LVDS Intel 1 MB for D525, 512KB for N455 & D425 AMIBIOS supports SPI BIOS on carrier (COM.0 R2.0) Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Instant on with Intel Bootloader support, OEM BIOS settings, & Statistics, ACPI 3.0, Smart Battery Management Info Board timer ranges with programmable support, Watchdog 5 is occupied by GbE; free, x1: 0/1/2/3/4 are 6 PCI Express as 1 x4 0/1/2/3 x1 can be optionally configured 2.3 at 33MHz, supporting 4 bus masters 32-bit PCI: PCI rev. LPC bus, SMBus (system), I Dual SODIMM sockets support up to 4 GB of non-ECC Dual SODIMM sockets support up to 4 GB of non-ECC 667/800 MHz DDR3 memory (N455 supports max. 2 GB) Intel D525: Dual Core Intel D525: Dual Core On carrier (ALC888) Intel Integrated in Intel Integrated in CPU with Gen3.5+ GFX Core and render core core and render Integrated in CPU with Gen3.5+ GFX Core at 200 MHz (N455) and 400 MHz (D425/D525) frequency Intel D425: Single Core Intel D425: Single Core Intel N455: Single Core Intel N455: Single Core

1-27

udio

VGA Interface Interface LVDS Interface Feature Support Feature L2 Cache BIOS Hardware Monitor Hardware Debug Interface Embedded Features Expansion Busses Memory Chipset

Audio Codec LAN Chipset A Chipset Integrated Video GPU Core Video

Specifications System Core CPU Express-LPC

Computer-On-Modules Functional Diagram

SODIMM 1 VGA Atom 512MB ~ 2GB DDR3

18-bit LVDS N455 SODIMM 2 D425 512MB ~ 2GB DDR3 D525 XDP SFF-26

5x PCIe x1 (port 0~4)

PCI Bus D GbE LAN PCIe x1 AB 82583V (port 5) C

HDA Audio ICH8M 3x SATA (port 0~2) PATA IDE

8x USB

LPC bus

4x GPI GPIO SPI SPI BIOS 4x GP0 PCA9535

SMBus

2 I C BC

SPI

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-LPC-N455 Compact COM Express® Module with Intel® Atom™ Single Heat Spreaders Core Low Voltage Processor N455 at 1.66 GHz HTS-LPC-B Heatspreader for Express-LPC with threaded standoffs ® ® Express-LPC-D425 Compact COM Express Module with Intel Atom™ Single Passive Heatsinks Core Processor D425 at 1.80 GHz THS-LPC-B Low Profile Heatsink for Express-LPC with threaded ® ® Express-LPC-D525 Compact COM Express Module with Intel Atom™ Dual standoffs Core Processor D525 at 1.80 GHz Active Heatsinks THSF-LPC-B Heatsink with Fan for Express-LPC with threaded standoffs

1-28 Atom™ Atom™ ® ® Module with Intel with Module ® Type 2, Compact form factor, 2, Compact form factor, Type ® XP 32-bit Vista 32-bit ® ® 2.6.x BSP 2.6.x ® ® ICH7-M ® AIDI Library for Win32, WinCE and Linux Embedded XP BSP WinCE BSP Linux Windows Linux Single IDE channel with UDMA100 with optional 1GB ~ 8GB IDE-based Solid State Drive 1.5 Gb/s ports SATA Two Up to eight ports USB 2.0 95 mm x 95 mm CE, FCC Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 (optional) TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 9 W typical (with Atom™ N270 and 1 GB memory) 0°C to 60°C -20°C to 80°C Up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM Express Windows Intel ems yst processor N270 at 1.6 GHz Atom™ processor chipset 945GSE/ICH7-M ® ® and TV-out (SDTV and HDTV) and TV-out Drive Intel Intel 2 GB DDR2 at 533 MHz SODIMM for up to 4 x1 or 1 x4) Three PCIe x1 (optional single/dual 18-bit LVDS High resolution VGA, Gigabit LAN, USB 2.0 (PATA), IDE SATA, IDE-based Solid State Optional 1GB ~ 8GB

Features Processor N270 and 945GSE / ICH7-M Chipset / and 945GSE N270 Processor Compact COM Express COM Compact

Extended Support

C 2 8 with CMOS backup in 8 Mbit SPI flash ®

Graphics Media Accelerator 950 integrated into 945GSE Express Graphic Memory Controller Hub and Graphic Memory Controller 945GSE Express Hub 7 Mobile (ICH7-M) I/O Controller Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2 ® ® ® ® 945GSE GMCH supporting dual independent displays Analog VGA support up to 1600 x 1200 Single / Dual channel 18-bit (optional 24-bit on carrier SDVO) through supported, up to 1024x768 resolution NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Supply voltages and CPU temperature timer ranges to generate RESET Programmable 3 is occupied by GbE LAN) free, x1 (0/1/2 are 4 PCI Express as one PCIe x4 optionally configured Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I Intel AMIBIOS cache, 2.5 W, on-die primary 32-kB instruction cache cache, 2.5 W, and 24 KB write-back data cache support (2-threads) Hyper-Threading Advanced gunning transceiver logic (AGTL+) bus driver technology Enhanced Intel SpeedStep HDA (Azalia) or AC’97 codec on carrier PCIe x1 Realtek RTL8111C 10/100/1000 Mbps Intel Integrated on Intel BGA type Intel Source synchronous double-pumped (2x) Address synchronous Source quad-pumped (4x) Data synchronous Source C0 - C4 low power states supported Single SODIMM socket up to 2 GB of non-ECC, 400/533 MHz DDR2 memory Intel 1-29 Express-ATC VGA Interface Interface LVDS TV-out Hardware Monitor Hardware Timer Watchdog Expansion Busses BIOS

Audio Codec LAN Chipset Interface io Aud Chipset Chipset Video Specifications System Core CPU Memory Chipset

Computer-On-Modules Functional Diagram CPU

Atom™ N270

FSB 533 MHz

DDR2 533 GMCH Channel A ® SODIMM socket Intel 945GSE up to 2 GB DDR-2 Analog Memory VGA VGA Controller Graphic Core SDTV 250 MHz TV-out HDTV

LVDS LVDS Single channel dual 18-bit SDVO

2x SATA PCI PCI 33 MHz, v2.3 SATA_0/1 s

8x USB Bu USB_0/1/2/3/4/5/6/7 M 2.0 S SPI LPC

I2C BC

SMBus TPM GPIO GPIO LM87 BIOS

LPC header LPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-ATC-N270 Compact COM Express® module with Intel® Atom™ N270 Heat Spreaders processor at 1.6 GHz HTS-ATC-B Heatspreader for Express-ATC (BGA CPU) with threaded Express-ATC-N270-4G Compact COM Express® module with Intel® Atom™ N270 standoffs processor at 1.6 GHz with 4GB SSD Solid State Disk Passive Heatsinks Express-ATC-N270-8G Compact COM Express® module with Intel® Atom™ N270 processor at 1.6 GHz with 8GB SSD Solid State Disk THS-ATC-B Low Profile Heatsink for Express-ATC (BGA CPU) with threaded standoffs

1-30

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ress nn ard xp Features Co in ATX Form Factor ATX in COM Express COM E

nbo o CI IDE P Functional Diagram COM Express Carrier Design Guide Provides detailed information on designing your own custom carrier board for COM Express modules. Download from the Express-BASE product webpage at www.adlinktech.com Ordering Information Ordering Carrier Model Number Express-BASE Revision 2.0 ® http://www.adlinktech.com/Computer-on-Module x1 slots ®

C, module control signals, flat panel control signals signals, flat panel control C, module control 2 COM Express

® Supports Type 2 modules in Basic or Compact form factor 2 modules in Basic Supports Type 305 mm x 244 mm (AT/ATX) 32-bit PCI™ v2.3 slots Two Five PCI Express One PCI Express x16 / SDVO slot One PCI Express LPC bus header Two x 220-pin (Type 2) x 220-pin (Type Two DB15 on Rear I/O panel for VGA displays headers supporting dual channel LVDS onboard Two I/O panel, Mic/Line-in on Mic/Line-in/Speakers on rear S/PDIF on header header, One 40-pin header connectors Four SATA One socket onboard I/O panel 10/100/1000BASE-T compatible RJ45 on rear I/O panel, two on header and one through Four + two on rear Card Mini Express I/O panel, one header onboard One DB-9 on rear I/O panel One DB-25 on rear 34-pin header One header for Smart Battery management communications (connects to ADLINK BattMan board) I/O panel) 6-pin mini DIN (on rear Two 8-pin header SMBus, I Onboard diagnostics for BIOS POST code data and address diagnostics for BIOS POST code data and address Onboard on LPC bus Allows single step BIOS execution sockets for secondary LPC & SPI flash Onboard ALC880 High Definition Audio Codec Winbond WF83627HG on LPC PICMG Reset, Power LED, HDD LED, Buzzer connector ATX Standard mini switch RESET button and ATX Onboard 1-31 Express-BASE Dimensions Expansion Busses

Connectors COM Express™ VGA LVDS Audio IDE PATA IDE SATA PCIe Mini Card LAN USB 2.0 Serial Port Parallel Port FDD Smart Battery KB/Mouse Digital I/O Connectors Feature Active Components Active Audio BIOS / Debug POST LEDs Secondary BIOS Super I/O Specifications tor Fac Form Interface Module Core Miscellaneous Power Switches

Computer-On-Modules COM Express® Type 6 Reference Carrier Board Express-BASE6 in ATX Form Factor

Features Seven PCI Express x 1 slots PCI Express x16 / SDVO slot Supports three Digital Display Interfaces (DDI) with HDMI/DVI/DisplayPort output LPC based Super I/O Dual BIOS (SPI and LPC) Conforms to COM Express® Carrier Design Guide

Specifications Functional Diagram

Analog VGA USB0 Form Factor DB15 USB 2.0/3.0 ® ® USB1 Core Module Interface PICMG COM Express Revision 2.0 34-pin Header Dual Channel LVDS USB 2.0/3.0 USB2 USB 2.0/3.0 Supports Type 6 modules in Basic or Compact form factor Flat Panel Control signals 8-pin Header Dimensions 305 mm x 244 mm (ATX) USB3 USB 2.0/3.0 LAN Expansion Busses Seven PCI Express x1 slots RJ45 Transformer USB4 One PCI Express Mini Card slot USB5 4x SATA0 One PCI Express x16 / SDVO slot SATA USB6 USB 2.0 SATA SATA1 USB7 BIOS / Debug SATA SATA2 PCIe lane 0 POST LEDs Onboard diagnostics for BIOS POST code data and address SATA SATA3 PCIe x1 PCIe lane 1 on LPC bus PCIe x1 Audio 7.1 PCIe lane 2 Secondary BIOS Onboard socket for secondary SPI flash Audio PCIe x1 Channel HDA PCIe lane 3 Codec PCIe x1 ALC888 S/PDIF out PCIe lane 4 Active Components PCIe x1 PCIe lane 5 Audio Realtek ALC888 High Definition Audio Codec PS/2 KB/MS PCIe x1 Super I/O LPC Super I/O Winbond WF83627DHG on LPC bus COM1 Winbond PCIe lane 6 W83627DHG PCIe x1 Digital I/O I2C to GPIO bridge PCA9535 COM2 Express PCIe lane 7 Card LPC Connectors Header COM Express™ Two x 220-pin (Type 6) DDI1 4GPI – 4GPO Header DDI VGA DB15 on Rear I/O panel for VGA display Adapter DDI2 SMBus Card slot LVDS Onboard 34-pin header Header (PCI x16 w/ proprietary pinout) DDI3 Digital Display Interface Supports three DDI ports to HDMI/DVI/DIsplayPort output by GPIO Header adapter card (PCIe x16 slot with proprietary pinout) PCA9535 I2C Flat Panel Control Onboard 8-pin header Header Audio Mic/Line-in/Line-out on I/O panel EEPROM SATA Four SATA connectors PCIe x16 PCIe x16 slot PCIe Mini Card One socket onboard Feature / Control Signals Header LAN 10/100/1000BASE-T compatible RJ45 on I/O panel nd SPI USB 2.0 Four USB 2.0 on I/O panel, 2 SPI BIOS Four USB 2.0/3.0 on I/O panel Serial Port One DB-9 on I/O panel One onboard 10-pin header Ordering Information Smart Battery One 10-pin header for Smart Battery management Modules communications (connects to ADLINK BattMan board) LPC Debug Onboard 20-pin header Model Number Description/Configuration KB/Mouse Two 6-pin mini DIN (on rear I/O panel) Express-BASE6 COM Express® Type 6 Reference Carrier Board in ATX Feature Connectors SMBus, I2C, module control signals form factor Miscellaneous Reset, Power LED, HDD LED, Buzzer

COM Express Carrier Design Guide Provides detailed information on designing your own custom carrier board for COM Express modules. Download from the Express-BASE6 product webpage at www.adlinktech.com

1-32 ThisThis TypeType 66 Computer-on-ModuleComputer-on-Module Starter Starter Kit Kit gets gets you you going going TypeType 66 StarterStarter Kit Kit - -COM COM Express Express withwith CarrierCarrier Board Board Design Design and and Software Software Veriﬁcation Verification in inno notime time

Features Includes COM Express Type 6 Module COM CPU,Express Memory Type 6 Module

Computer-On-Modules CPU, Express-BASE6Memory Reference Carrier Board Express-BASE6 Thermal Solution Reference (heatspreader Carrier Board and heatsink) Thermal Schematics, Solution (heatspreaderDesign Guide, andand heatsink)User Manuals Schematics, ADLINK Design USB stick Guide, with and Documentation, User Manuals ADLINKDrivers, USB stickBSPs, with Libraries Documentation, Drivers, BSPs, Libraries

The Starter Kit consists of a COM Express Type 6 core module with ATX size reference carrier board that offers one PCIe x16 Express slot with proprietary pinout for DDI Adapter card, one PCI Express graphics slot x16, seven PCI Express x1 slot, Serial ATA, VGA, LVDS, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.

Contents

Standard Items Optional Items

• Express-BASE6 reference carrier board • COM Express Type 6 module with CPU of your choice • Accessory kit: • Memory of your choice - DisplayPort to DVI adapter cable • Thermal solution of your choice (heatspreader, heatsink) - SATA cable - T6-DDI Video Adapter Card - PCIe x16-to-two-x8 Adapter card - LPC POST Debug Board - USB Stick with documentation, drivers, libraries, and BSPs for Linux, Windows CE, XPe and WES7 - Carrier Design Guide and product manuals

COM Express Memory Thermal T6-DDI LPC Post Type 6 Module Solution Debug Board

Carrier Board PCIe x16-to-two-x8 PSU Includes manuals, schematics, with cabling Adapter Card layout les, drivers and BSP les

1-33 http://www.adlinktech.com/Computer-on-Module

C122-3-Type 6 Starter Kit - COM Express.indd 29 2012/1/31 下午 05:37:32 This Type 6 Computer-on-Module Starter Kit gets you going Type 6 Starter Kit - COM Express with Carrier Board Design and Software Veriﬁcation in no time

Includes How to order Starter Kit – COM Express COM Express Type 6 Module ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core CPU, Memory module and thermal solution to suit your speci c application development needs. Express-BASE6 Reference Carrier Board Thermal Solution (heatspreader and heatsink) Schematics, Design Guide, and User Manuals ADLINK USB stick with Documentation, Drivers, BSPs, Libraries Select a core module, memory, thermal solution, according to your needs

Standard Items Optional Items

• COM Express Type 6 module with CPU of your choice • Express-BASE6 reference carrier board Get the speci c part number for your • Memory of your choice • Accessory kit: starter kit - DisplayPort to DVI adapter cable • Thermal solution of your choice (heatspreader, heatsink) - SATA cable - T6-DDI Video Adapter Card - PCIe x16-to-two-x8 Adapter card - LPC POST Debug Board ADLINK also provides a set of Engineering Test Tools to save you time and expedite - USB Stick with documentation, drivers, libraries, and your application development BSPs for Linux, Windows CE, XPe and WES7 - Carrier Design Guide and product manuals BattMan Smart Battery Management Flat Panel Transfer Board Reference System

COM Express Memory Thermal T6-DDI LPC Post Type 6 Module Solution Debug Board

Please refer to page 1-45 Please refer to page 1-45 for detailed information for detailed information

Carrier Board PCIe x16-to-two-x8 PSU Includes manuals, schematics, with cabling Adapter Card layout les, drivers and BSP les

1-34

C122-3-Type 6 Starter Kit - COM Express.indd 29 2012/1/31 下午 05:37:32 C122-3-Type 6 Starter Kit - COM Express.indd 30 2012/1/31 下午 05:37:35 ThisThis Computer-on-ModuleComputer-on-Module Starter Starter Kit Kit gets gets you you going going with with TypeType 22 StarterStarter Kit Kit - -COM COM Express Express CarrierCarrier Board Board Design Design and and Software Software Veriﬁcation Verification in no in timeno time

Features Includes COM Express Type 2 Module COM CPU,Express Memory Type 2 Module

Computer-On-Modules CPU, Express-BASEMemory Reference Carrier Board Express-BASE Thermal Solution Reference (heatspreader Carrier Board and heatsink) Thermal Schematics, Solution (heatspreaderDesign Guide, andand heatsink)User Manuals Schematics, ADLINK Design USB stick Guide, with and Documentation, User Manuals ADLINKDrivers, USB stickBSPs, with Libraries Documentation, Drivers, BSPs, Libraries

The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.

Contents

Standard Items Optional Items

• Express-BASE reference carrier board • COM Express Type 2 module with CPU of your choice • Accessory kit: • Memory of your choice - IDE cable • Thermal solution of your choice (heatspreader, heatsink) - SATA cable - TV out cable - CF adapter - PCI 2-slot riser card - USB Stick with documentation, drivers, libraries, and BSPs for Linux, Windows CE, XPe - Carrier Design Guide and product manuals

Includes manuals, COM Express Carrier Board Memory Heatsink PSU schematics, layout les, Module with cabling drivers and BSP les

1-35 http://www.adlinktech.com/Computer-on-Module

C122-03-Type2 Starter Kit.indd 29 2012/1/31 下午 05:42:01 This Computer-on-Module Starter Kit gets you going with Type 2 Starter Kit - COM Express Carrier Board Design and Software Veriﬁcation in no time

Includes How to order Starter Kit – COM Express COM Express Type 2 Module ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core CPU, Memory module and thermal solution to suit your speci c application development needs. Express-BASE Reference Carrier Board Thermal Solution (heatspreader and heatsink) Schematics, Design Guide, and User Manuals ADLINK USB stick with Documentation, Drivers, BSPs, Libraries Select a core module, memory, thermal solution, and CPU (for socket type) according to your needs

Standard Items Optional Items

• COM Express Type 2 module with CPU of your choice • Express-BASE reference carrier board Get the speci c part number for your • Accessory kit: • Memory of your choice starter kit - IDE cable • Thermal solution of your choice (heatspreader, heatsink) - SATA cable - TV out cable - CF adapter ADLINK also provides a set of Engineering Test Tools to save you time and expedite - PCI 2-slot riser card your application development - USB Stick with documentation, drivers, libraries, and BSPs for Linux, Windows CE, XPe BattMan Smart Battery Management Flat Panel Transfer Board - Carrier Design Guide and product manuals Reference System

Please refer to page 1-45 Please refer to page 1-45 Includes manuals, for detailed information for detailed information COM Express Carrier Board Memory Heatsink PSU schematics, layout les, Module with cabling drivers and BSP les

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C122-03-Type2 Starter Kit.indd 29 2012/1/31 下午 05:42:01 C122-03-Type2 Starter Kit.indd 30 2012/1/31 下午 05:42:05 7 ® COM.0 R2.0 Type 10 COM.0 R2.0 Type ® EG20T PCH PCH EG20T ® ® Type 10 Pinout Compatible Compatible 10 Pinout Type ® XP / Windows ® / Moblin COM.0 R2.0 Type 10 Pinout COM.0 R2.0 Type Platform Controller Hub EG20T Platform Controller Atom™ Processor E6xx and EG20T PCH EG20T E6xx and Processor Atom™ ® ® ® ® ® Linux Embedded XP WinCE 6.0 Linux 6.x VxWorks QNX AIDI Library Mini size 84 mm x 55 mm (3.3” x 2.17”) CE, FCC, HALT Realtek RTL8211CL 10/100/1000 Mbps Six USB 1.1/2.0 host ports and one USB 1.1/2.0 client port 1.5 Gb/s and 3 Gb/s ports supporting SATA Two with SDIO/MMC supporting SDHC speed class 6 (shared GPIO, selectable in the BIOS setup) 2x One RS-232 (RX/TX) and one CAN (AX/RX) port (optional RS-232 w/o CAN) Windows Integrated in Intel mode mode and ATX 4.75 V – 21 V wide range, supports AT (with additional 5 Vsb) Supports S0, S1, S3, S4, S5 5W at 5V typical, 3W idle Yes 0°C to 70°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis PICMG COM Express Integrated in Intel Atom™ Processor E6xx from 600 MHz E6xx from Atom™ Processor ® up to 1.6 GHz for USB, LAN, SDIO, Serial & CAN bus and for USB, LAN, SDIO, SATA Up to 2 GB soldered DDR2 SDRAM at 800 MHz Up to 2 GB soldered and SDVO support 24-bit LVDS lanes 4x PCI Express x1 Optional Intel COM Express mm x 55 mm Mini form factor 84 Intel ating Systems

Features Mini size COM Express size COM Mini with Intel Module

Extended Support (BSP) Mechanical Certification PHY Speed USB SATA SDIO port Serial and CAN Oper Support Standard LAN GbE MAC Specifications Power Input Power Power States Power Consumption Smart Battery Support ental ironm and Env Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Multi I/O and Storage Chipset

® C (user) 2 Hyper-Threading and Intel Hyper-Threading ® Atom™ Processor E6xx Atom™ Processor Atom™ Processor E6xx Atom™ Processor http://www.adlinktech.com/Computer-on-Module ® ® Atom™ E680, 1.6 GHz, 3.9 W TDP Atom™ E660, 1.3 GHz, 3.3W TDP Atom™ E640, 1.0 GHz, 3.3W TDP Atom™ E620, 600 MHz, 2.7W TDP ® ® ® ® Intel Intel Intel support Intel All processors Virtualization Technology 512 KB on all processors 512 MB, 1 or 2 GB DDR2 at 800 MHz Soldered bootloader or AMI UEFI flash License-free Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Instant on with Intel Bootloader support, OEM BIOS settings, & Statistics, ACPI 3.0, Smart Battery Management Info Board timer ranges with programmable support, Watchdog x1 (0/1/2/3, port 3 is optionally used for 4 PCI Express EG20T PCH; no PCIe x4 support) LPC Bus, SMBus (system) , I Multi-channel audio stream, 32-bit sample depth, sample Multi-channel audio stream, rate up to 192 kHz support for ALC888) On carrier (standard MPEG2, MPEG4, VC1, WMV9, H.264 and DivX MPEG4, H.264 (baseline at L3) maximum with depths color pixel 24-bit or 18- channel Single of up to 1280x768 @ 60 Hz. Pixel clock rate resolution between 19.75 MHz (minimum) and 80 MHz (maximum). Serial digital video output supporting devices for DVI, TV-out, of up to 1280x1024 analog VGA. Maximum resolution @ 85 Hz and pixel clock rate up to 160 MHz. Integrated in Intel Integrated in Intel Intel 4 GPI and 4 GPO (shared with SDIO on optional EG20T) 4 GPI and 4 GPO (shared SPI (supports BIOS only)

1-37

dio nanoX-TC

L2 cache Memory BIOS Monitor Hardware Debug Interface Embedded Features Expansion Busses Characteristics Audio Codec Decoding Encoding Interface LVDS SDVO Au High Definition Audio Video 2D/3D Graphic Engine Specifications System Core CPU

Computer-On-Modules Functional Diagram

Soldered Memory BIOS 512 MB ~ 2 GB DDR2

SPI

LPC bus

® XDP Intel Atom™ SFF-26 18/24-bit LVDS Processor SDVO HDA Audio E6xx 3x PCIe x1 (port 1~3)

PCIe x1 (port 0)

CAN bus (Ax/Rx) UART (Tx/Rx)

2x SATA (port 0,1)

6x USB Host ® 1x USB Client Intel Platform Controller Hub LAN PHY RTL8211CL EG20T

SDIO/MMC port 0 h c t 4x GPI GPIO Swi 4x GP0 PCA9535

SMBus

2 I C BC

Ordering Information Modules Accessories Model Number Description Model Number Description nanoX-TC-E680-1G Mini size COM Express Type 10 Module with Intel® Atom™ E680 Heat Spreaders processor at 1.6GHz, PCH EG20T and 1 GB soldered DDR2 SDRAM HTS-nXTC-B Heatspreader for nanoX-TC with threaded standoffs for nanoX-TC-E660-1G Mini size COM Express Type 10 Module with Intel® Atom™ E660 bottom mounting processor at 1.3GHz, PCH EG20T, and 1 GB soldered DDR2 SDRAM HTS-nXTC-BT Heatspreader for nanoX-TC with throughole standoffs for nanoX-TC-E640-1G Mini size COM Express Type 10 Module with Intel® Atom™ E640 top mounting processor at 1.0GHz, PCH EG20T, and 1 GB soldered DDR2 SDRAM Passive Heatsinks nanoX-TC-E620-1G Mini size COM Express Type 10 Module with Intel® Atom™ E620 processor at 600 MHz, PCH EG20T, and 1 GB soldered DDR2 SDRAM THS-nXTC-B Multidirectional Heatsink for nanoX-TC with threaded standoffs for bottom mounting THS-nXTC-BT Multidirectional Heatsink for nanoX-TC with threaded standoffs for top mounting

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® COM.0 Type 1 COM.0 Type ® Type 1 Pinout Compatible Module Module Compatible 1 Pinout Type ® XP 32-bit Vista 32-bit ® ® 2.6.26 and up 2.6.x BSP C Library for Win32, WinCE and Linux ® ® 2 Embedded XP BSP WinCE BSP Linux AIDI I Windows Linux Mini size 84 mm x 55 mm (3.3” x 2.17”) CE, FCC 4.75V ~ 14V wide range input support, with optional 5Vsb for 4.75V ~ 14V wide range input support, with optional 5Vsb support ATX Supports S0, S1, S3, S4, S5 typical) 5 W (with Atom Z510 and 512 MB memory, 0°C to 60°C -20°C to 80°C 10% to 90%, storage: 5% to 95% (non condensing) 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis PICMG COM Express Windows Single channel IDE with UDMA (33/66/100) connects to Single channel IDE with UDMA (33/66/100) connects to State Disk of 1 GB up to 8 GB Solid onboard bridge to SATA PATA port One SATA one MB/s; 480 to up transfers of capable ports 2.0 USB Eight port optionally configurable as USB client 8 BIOS ® Atom™ Processor Z5xx and US15W Chipset US15W Z5xx and Processor Atom™ ® Atom™ Processor Z530/Z510 Atom™ Processor Hub US15W System Controller ® ® Intel Intel 2 without LAN) One PCIe x1 (opt. and SDVO 18/24-bit LVDS USB 2.0, SDIO, LPC GbE LAN, SATA, AMIBIOS GB up to 8 GB Solid State Disk: 1 x 55 mm footprint Mini Compact 84 mm ating Systems

Features with Intel with Mini size COM Express size COM Mini Extended Support

Mechanical Certifications Power Specifications Power Input Power Power States Power Consumption ental ironm and Env Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Compatibility Oper Support Standard Multi I/O IDE (PATA) SATA USB on System Controller Hub on System Controller ® System Controller Hub US15W System Controller http://www.adlinktech.com/Computer-on-Module ® High Definition Audio codec on carrier board High Definition Audio codec on carrier board ® C 8 with CMOS backup in 8 Mbit LPC flash 2 ® Atom™ processor Z530 at 1.6 GHz with 533 MHz FSB, Atom™ processor Z510 at 1.1 GHz with 400 MHz FSB, Atom™ processor Hub US15W System Controller ® ® ® 2.3 watts TDP, supports Hyper-Threading 2.3 watts TDP, Intel 2.0 watts TDP 400/533 MHz 512/1024 MB non-ECC, unbuffered Soldered DDR2 Intel AMIBIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable x1 PCI Express Two LPC bus SMBus / I Supports Intel Integrated on Intel GMA 500 integrated on Intel Intel US15W with full HD HW Ultra low power integrated 3D graphics core video decode engine and dual independent display support Analog VGA not supported Single channel 18/24-bit at 25~112 MHz May be used for any external display device (HDMI/DVI, includes EDID and VGA and LVDS); analog TV, EDID-less support, and a 160 MHz pixel clock Gigabit Ethernet PCI Express Controller Realtek RTL8111C and Alert on LAN 10/100/1000 Mbps with Wake-on-LAN support

1-39

dio nanoX-ML Memory Chipset BIOS Hardware Monitor Hardware Timer Watchdog Expansion Busses Type Au Chipset Video Chipset Specifications System Core CPU Features VGA Interface Interface LVDS SDVO Chipset Interface LAN

Computer-On-Modules Functional Diagram

Intel® Atom™ Z510/Z530

FSB 400/533 MHz

® Intel US15W DDR-2 DDR2 400/533 Memory soldered Controller

LAN

SDVO VO GbE RT8111C S D two Graphics Core PCIe x1 200 MHz EIDE PATA 1x PATA Slave SSD Solid State Drive r

e 1 GB up to 8 GB t s a 0

LVDS LPC HDA SDIO/ 8x M N

n e 18/24-bit A Audio MMC USB 2.0 PATA to L la

, SATA Bridge x1 BC e I C P C P C T A L 2 I A SMBus S

Ordering Information Modules Accessories Model Number Description Model Number Description nanoX-ML-51/512-0 Mini COM Express® Type 1 compatible module with Intel® Heat Spreaders Atom™ processor Z510 at 1.1 GHz and 512 MB DDR2 HTS-nML-B Heatspreader for nanoX-ML (BGA CPU) with threaded nanoX-ML-53/512-0 Mini COM Express® Type 1 compatible module with Intel® standoffs Atom™ processor Z530 at 1.6 GHz and 512 MB DDR2 Passive Heatsinks nanoX-ML-51-512/4G Mini COM Express® Type 1 compatible module with Intel® Atom™ Processor Z510 at 1.1 GHz, 512 MB memory and THS-nML-B Low profile Heatsink for nanoX-ML (BGA CPU) with 4 GB SSD storage threaded standoffs nanoX-ML-53-512/4G Mini COM Express® Type 1 compatible module with Intel® Atom™ Processor Z530 at 1.6 GHz, 512 MB memory and 4 GB SSD storage nanoX-ML-51-1024/4G Mini COM Express® Type 1 compatible module with Intel® Atom™ Processor Z510 at 1.1 GHz, 1GB memory and 4 GB SSD storage nanoX-ML-53-1024/4G Mini COM Express® Type 1 compatible module with Intel® Atom™ Processor Z530 at 1.6 GHz, 1GB memory and 4 GB SSD storage

1-40

® COM Express ® C, module control signals, flat panel control signals signals, flat panel control C, module control 2 x1 (5 slots, 1 PCIe Mini Card 1 PCIe Mini Card x1 (5 slots, ® Type 1 Reference Carrier Board Board Carrier 1 Reference Type ® Connector AB only, one 220-pin (Type 1) one 220-pin (Type Connector AB only, 34-pin header Onboard Mic/Line-in/Line-out on I/O panel connectors SATA Two (USB + PCIe x1) One socket onboard 10/100/1000BASE-T compatible RJ45 on I/O panel Five on I/O panel, one Mini-USB (client only) and one through PCIe Mini Card DB-9 on I/O panel Two One header onboard One header for Smart Battery management communications (connects to ADLINK BattMan board) I/O panel) 6-pin mini DIN (on rear Two SD socket for bootable storage or function extension SMBus, I Reset, Power LED, HDD LED, Buzzer connector ATX Standard mini switch RESET button and ATX Onboard Carrier Design Guide slot) ress Six PCI Exp two PCI™ slots PCIe-to-PCI bridge, slot SDVO ADD2 card (enable/disable) LPC based Super I/O multiplexed on GPIO SDIO/MMC support, and SPI) Dual BIOS (both LPC Compatible with PICMG

with onboard PCIe-to-PCI Bridge PCIe-to-PCI onboard with COM Express COM Features Connectors COM Express LVDS Audio SATA PCIe Mini Card LAN USB 2.0 Serial Port Parallel Port Smart Battery KB/Mouse SDIO/MMC Connectors Feature Miscellaneous Power Switches Revision 1.0 ® http://www.adlinktech.com/Computer-on-Module Mini Card slot Mini Card x1 slots ® ®

COM Express

® C to GPIO bridge PCA9535 2 Supports Type 1 and Type 10 pinouts 1 and Type Supports Type 305 mm x 240 mm (AT/ATX) Five PCI Express One SDVO ADD2 slot LPC bus header Two 32-bit PCI™ v2.3 slots Two One PCI Express PLX PEX8505 switch with PCIE0 input from module PLX PEX8505 switch with PCIE0 input from PEX8505 PLX PEX8112 bridge with PCIe x1 input from switch Winbond WF83627DHG on LPC bus Realtek ALC888 High Definition Audio Codec I Onboard diagnostics for BIOS POST code data and address diagnostics for BIOS POST code data and address Onboard on LPC bus sockets for secondary LPC & SPI flash Onboard PICMG 1-41 nanoX-BASE Dimensions Expansion Busses

PCI Express Switch PCI Express to PCI Express PCI Bridge Super I/O Audio Codec Digital I/O Active Components Active BIOS / Debug POST LEDs Secondary BIOS Specifications Factor Form Interface Module Core

Computer-On-Modules Functional Diagram

USB0 USB1 4-port Single Channel LVDS Header NC USB Flat Panel Control Signals USB3 Header

USB4 PCIe x16 Slot SDVO Flat cable in RJ-45 USB5 & LAN 2-port USB USB2 Mini USB

SATA SATA0 USB6 s

PCIe (x1) s SATA1 Card SATA CI pre P x E Mini

PCIe (x1) PCIE0 (x1) PCIe PCIe x16 Slot Switch PCIe (x1) PEX 8505 PCIe x1 Slot PCI Audio

Audio 7.1 HDA / AC’97 e Codec Channel (x ALC888 1 ) AB PCI PCIe to PCI Slot PCI bridge GPIO / SDIO PCI SDIO / MMC PEX 8112 PCI Slot

PCIE1 (x1) Header PCIe x1 Slot PCIE2 (x1) PCIe x1 Slot SMBus Header PCIE3 (x1) PCIe x1 Slot

Header GPIO PCA9535 LPT1 I2C Header COM1

COM2 EEPROM Super I/O LPC Winbond IrDA Feature / Control Signals W83627DHG Header PS/2 KB/MS

LPC nd 2 LPC BIOS

Ordering Information Carrier Model Number Description nanoX-BASE COM Express® Type 1 Reference Carrier Board with onboard PCIe to PCI bridge

1-42 ThisThis Computer-on-ModuleComputer-on-Module Starter Starter Kit Kit gets gets you you going going with with StarterStarter KitKit -- nanoXnanoX CarrierCarrier Board Board Design Design and and Software Software Veriﬁcation Verification in no in timeno time

Includes Includes COM Express® Type 1/10 core module COM Express® Type 1 core module Thermal solution (heatspreader or heatsink) Thermal solution (heatspreader or heatsink) Computer-On-Modules nanoX-BASE Reference Carrier Board nanoX-BASE Reference Carrier Board LVDS flat panel evaluation kit LVDS ﬂat panel evaluation kit Schematics, Design Guide, and User Manuals Schematics, Design Guide, and User Manuals ADLINK USB stick with Documentation, ADLINKDrivers, USB stickBSPs, with Libraries Documentation, Drivers, BSPs, Libraries

The nanoX Starter Kit consists of a COM Express® Type 1/10 core module with ATX size reference carrier board that provides four PCI Express x1 slots, one PCI Express x16 slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini Card slot, one SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also provides additional development tools including a veri ed 10.1” LVDS panel, LVDS-to-TTL conversion board, ADD2 DVI card, power supply, thermal solution and cabling accessories.

Contents

Standard Items • nanoX-BASE reference carrier board • Accessory kit: • 10.1” (1024 x 600) LVDS flat panel - LVDS flat panel cabling • SDVO to DVI adapter - SATA, SDVO, USB cables • Flat panel transfer board - Power cord • ATX power supply - USB stick with documentation, drivers, libraries, and BSP for Linux, Embedded XP - Carrier Design Guide and product manuals

Optional Items • COM Express Type 1/10 core module of your choice • Thermal solution of your choice (heatspreader or heatsink)

COM Express Type 1/10 Module Heatsink ADD2 PSU

Includes manuals, Carrier Board LVDS Panel FPTB schematics, layout les, with cabling drivers and BSP les

1-43 http://www.adlinktech.com/Computer-on-Module

C122-3-01-nanoX.indd 37 2012/1/31 下午 05:45:14 This Computer-on-Module Starter Kit gets you going with Starter Kit - nanoX Carrier Board Design and Software Veriﬁcation in no time

Includes How to order Starter Kit – nanoX COM Express® Type 1 core module ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core Thermal solution (heatspreader or heatsink) module and thermal solution to suit your speci c application development needs. nanoX-BASE Reference Carrier Board LVDS ﬂat panel evaluation kit Schematics, Design Guide, and User Manuals ADLINK USB stick with Documentation, Drivers, BSPs, Libraries Select a core module and thermal solution according to your needs

The nanoX Starter Kit consists of a COM Express® Type 1/10 core module with ATX size reference carrier board that provides four PCI Express x1 slots, one PCI Express x16 slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini Card slot, one SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also provides additional development tools including a veri ed Contact an ADLINK sales 10.1” LVDS panel, LVDS-to-TTL conversion board, ADD2 DVI card, power supply, thermal solution and cabling accessories. representative in your region

Contents

Standard Items • nanoX-BASE reference carrier board • Accessory kit: Get the speci c part number for your • 10.1” (1024 x 600) LVDS flat panel - LVDS flat panel cabling nanoX Starter Kit • SDVO to DVI adapter - SATA, SDVO, USB cables • Flat panel transfer board - Power cord • ATX power supply - USB stick with documentation, drivers, libraries, and BSP for Linux, Embedded XP - Carrier Design Guide and product manuals

Optional Items ADLINK also provides a set of Engineering Test Tools to save you time and expedite your application development • COM Express Type 1/10 core module of your choice • Thermal solution of your choice (heatspreader or heatsink) BattMan Smart Battery Management LPC POST Debug Board Reference System

COM Express Type 1/10 Module Heatsink ADD2 PSU

Please refer to page 1-45 Please refer to page 1-46 for detailed information for detailed information Includes manuals, Carrier Board LVDS Panel FPTB schematics, layout les, with cabling drivers and BSP les

1-44

C122-3-01-nanoX.indd 37 2012/1/31 下午 05:45:14 C122-3-01-nanoX.indd 38 2012/1/31 下午 05:45:18 Useful time saving tools to expedite expedite tools to time saving Useful development application your modules (includes two Smart Batteries, 19V ® Flat Panel Transfer Board for LVDS-to-TTL signal for LVDS-to-TTL Board Flat Panel Transfer conversion input output to FPTB LVDS carrier LVDS Reference and Express-BASE6 cable (supports Express-BASE, nanoX-BASE) Description/Configuration adapter and USB key) Description/Configuration Smart Battery Management Reference Platform for COM Smart Battery Management Reference Express ADD2 DVI-D Adapter Description/Configuration The BattMan Smart Battery Management Reference Platform allows implement easily then and level system a on verify first to developers the same type of battery power design into their own carrier board. BattMan supports single battery unloading using two batteries. mode or balanced loading and Contents module • Smart Battery management 5200 mAh each batteries at 14.V, Li-ion smart • Two (110/220Vac) • 19V notebook type adapter BOM and manual • USB key with schematics, Ordering Information Ordering Model Number FPTB cable for FPTB LVDS Note: Included in the Starter Kit - nanoX. Ordering Information Ordering Model Number StarterKit-Battman The Flat includes Panel module . The displays panel flat TTL and LVDS Transfer of verification Board (FPTB) supports prototyping an converter LVDS-to-TTL to allow users to and implement TTL displays with COM modules that support Onboard only. LVDS PWM circuitry and TTL displays. for LVDS supports backlight control The ADD2 DVI-D Adapter Card provides DVI-D display output (digital provides The ADD2 DVI-D Adapter Card only) for modules that support into the SDVO PEG x16 connector on output. Express-BASE, SDVO connector on This adapter nanoX-BASE, and DDI connector on Express-BASE6. plugs FI-7307(N16D)-F Ordering Information Ordering Model Number http://www.adlinktech.com/Computer-on-Module

1-45

ADD2 DVI-D Adapter Card Flat Panel Transfer Board Flat Panel Transfer

BattMan Management Smart Battery Platform Reference Engineering Test Tools Test Engineering

Computer-On-Modules PCIe x16-to-two-x8 Adapter Card The ADLINK PCIe x16-to-two-x8 adapter card can be used with modules that support bifurbication on the PEG x16 interface. The card reroutes the PCIe x16 to two x8 and allows testing of two independent PCIe add-on cards with x8/x4/x2/x1 width.

Ordering Information Model Number Description/Configuration P16TO28 PCIe x16-to-two-x8 adapter card

LPC POST Debug Board All ADLINK COM modules include an LPC debug connector. The LPC POST Debug Board connects to this connector and can provide monitoring of BIOS POST status. The LPC POST Debug Board connects directly to the module and can be used regardless of the carrier board being used.

Ordering Information Model Number Description/Configuration LPC_DEBUG_2 LPC POST debug board with secondary LPC BIOS

COM-T6T2 Adapter Board The COM-T6T2 Adapter Board allows COM Express Type 6 modules to be tested on existing COM Express Type 2 carriers. The adapter COM Express Type 6 to Type 2 Conversion board adds PATA IDE (via a SATA to PATA bridge) and PCI bus (via a PCIe-to-PCI bridge) to the signals on the CD connector. The SDVO port is rerouted to correspond to the Type 2 pin definition. PCIe x16 is not supported.

Ordering Information Model Number Description/Configuration COM-T6T2 COM Express Type 6 to Type 2 adapter card (w/ SDVO)

T6-DDI Video Adapter Card The T6-DDI Video Adapter Card provides connector access to COM Express Type 6 module Digital Display Interface (DDI) outputs. The COM Express Type 6 DDI to HDMI/DVI/DisplayPort card must be installed on the Express-BASE6 Type 6 carrier board using the second PCIe x16 slot with proprietary pinout. Jumper settings on the card configure output to either HDMI or DisplayPort. DVI can be tested by using a passive dongle connected to a DisplayPort output. Ordering Information Model Number Description/Configuration T6-DDI COM Express Type 6 DDI-to-HDMI/DVI/DisplayPort adapter card (includes DVI dongle)

1-46