Fastboot BIOS Embedded and Communications Group an Investigation of BIOS Speed Enhancement Featuring the Intel® Atom™ Processor
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Computer on Module
Module COM Carte réceptrice Computer On Module Réduction du coût de votre développement Installation, maintenance et mise à jour simplifiées Diminution des risques inhérent à un développement Disponibilité sous 30 jours de votre produit Applications : • Terminaux de vente & Affichage Dynamique • Vidéosurveillance numérique • Médical • IP TV • Appareils de mesure & tests en ligne • M2M • Terminaux de jeux • Géolocalisation • Automatisation industrielle & contrôle de procédés • Serveurs informatiques • Militaire & Police Notre service ODM DTD Les règles générales du service ODM DTD : Le fabricant s'engage à gérer l'achat et le stockage des composants Le service ODM DTD n'est assuré que dans le cadre de l'utilisation courant qui permettent la fabrication d'un Computer On Module. Dans des modules AAEON aux formats : ETX, XTX and COM Express le cas où la fabrication de la carte réceptrice requière des composants modules. spécifiques ou sujet à des minima de quantité en commande (MOQ), Les frais d'études pour la réalisation de la carte réceptrice sont le client s'engage à acheter et à consigner ces composants chez basés sur les spécifications arrêtées avec le client à la signature de Equipements Scientifiques. la commande. Toute modifications de ces spécifications par la suite pourra emmener des frais supplémentaires à la charge du client. La Définitions 1 jour fourniture d'une carte réceptrice sous 30 jours ouvrés est incluse dans les frais d'études. Les corrections nécessaires après le test du prototype Etude du circuit 5 jours sont prises en charge par le service ODM DTD. Ces corrections seront Routage du PCB 9 jours vérifiées par le client avant le démarrage de la pré-série. -
Industrial Platform Service
latform P ndustrial I ervice S s stic ‧Manufa gi Ver. 211A ign cturing‧Lo es ‧D Consulting‧Product Portwell, Inc. was founded in 1993 and entered the Industrial Computing Platform Providers (IACPP), but also an associate PC market in 1995 by developing single-board computers. member of Intel® Embedded and Communications Alliance Today, our continuous development of leading-edge products (ECA), as well as Advanced Telecom Computing Architecture has resulted in strong growth in market share and revenue, a (ATCA) and an executive member of PCI Industrial Computer fi rm place on the Taipei stock exchange (TAISDAQ), and has Manufacturing group (PICMG). established Portwell a major worldwide supplier of specialty Portwell, Inc. has worldwide operation in the U.S.A., Taiwan, computing application platforms and services. Portwell, Inc. Japan, China, Netherland, United Kingdom, and India. is not only a member of the selected group of Intel® Applied Portwell Engine (PE) Building Whether you are working on a computer board or turnkey standards such as ISO 9001/14000/13485, OHSAS and system, Portwell is the perfect partner to help you deliver your RoHS, customers have taken advantage of our dedicated and products to market on time as well as maintain longevity of sophisticated engineering resource to satisfy their requirements product life cycle. With 18 years experience in the design and for the design, manufacturing and logistics of application- manufacture of specialty computer boards and systems, Portwell specifi c computer boards, customized computer chassis, and not only provides a one-stop resource for off-the-shelf products, specifi c computer system confi gurations. -
Download/Face- Modules/Documents/Face-Modules-Hw-Specifications.Pdf
I PC H “ CompuLab Ltd. Revision 1.2 December 2013 Legal Notice © 2013 CompuLab Ltd. All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written permission of CompuLab Ltd. No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by CompuLab Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document. CompuLab Ltd. reserves the right to change details in this publication without notice. Product and company names herein may be the trademarks of their respective owners. CompuLab Ltd. 17 HaYetsira St., Yokneam Elite 20692, P.O.B 687 ISRAEL Tel: +972-4-8290100 http://www.compulab.co.il http://fit-pc.com/web/ Fax: +972-4-8325251 CompuLab Ltd. Intense PC Hardware Specification Page 2 of 74 Revision History Revision Engineer Revision Changes 1.0 Maxim Birger Initial public release 1.1 Maxim Birger Memory Interface updated Super-IO Controller peripheral section added RS232 serial com port info added 1.2 Maxim Birger HDMI Block Diagram updated DP Block Diagram updated CompuLab Ltd. Intense PC Hardware Specification Page 3 of 74 Table of Contents Legal Notice .................................................................................................................................................. -
Dell Optiplex 7060 Desktop Setup
OptiPlex 7060 Small Form Factor Setup and specifications guide Regulatory Model: D11S Regulatory Type: D11S004 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 2018 - 06 Rev. A01 Contents 1 Set up your computer.....................................................................................................................................5 2 Chassis.......................................................................................................................................................... 8 Front view........................................................................................................................................................................... 8 Back view............................................................................................................................................................................9 3 System specifications.................................................................................................................................. 10 Chipset...............................................................................................................................................................................10 -
Focus on Your Core Competency the COM Express Standard
Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. -
Focus on Your Core Competency the COM Express Standard
Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. -
Uebayasi's Simple Template
eXecute In Place support in NetBSD Masao “uebs” Uebayashi <[email protected]> BSDCan 2010 2010.5.13 Who am I NetBSD developer Japanese Living in Yokohama Self-employed Since Dec. 15 2008 Tombi Inc. Agenda Demonstration Introduction Program execution VM Virtual memory management Physical memory management Fault handler, pager : Design of XIP Demonstration XIP on NetBSD/arm (i.MX35) Introduction What is XIP? Execute programs directly from devices No memory copy Only about userland programs (Kernel XIP is another story) Introduction Who needs XIP? Embedded devices Memory saving for less power consumption Boot time Mainframes (Linux) Memory saving for virtualized instances : “Nothing in between” Introduction How to achieve XIP? Don't copy programs to memory when executing it “Execute” == mmap() : : : : : What does that *actually* mean? Goals No hacks Keep code cleanliness Keep abstraction Including device handling : : Performance Latency Memory efficiency Program execution execve(2) → sys_execve() Prepare Read program header using I/O Map sections Set program entry point Execute Page fault is triggered Load pages using VM Execution is resumed Program execution I/O part needs no changes If block device interface (d_strategy()) is provided VM part needs changes!!! Virtual memory management http://en.wikipedia.org/wiki/Virtual_memory Virtual memory is a computer system technique which gives an application program the impression that it has contiguous working memory (an address space), while in fact it may be physically fragmented and may even overflow on to disk storage. Developed for multitasking kernels, virtual memory provides two primary functions: Each process has its own address space, thereby not required to be relocated nor required to use relative addressing mode. -
NOVA: a Log-Structured File System for Hybrid Volatile/Non
NOVA: A Log-structured File System for Hybrid Volatile/Non-volatile Main Memories Jian Xu and Steven Swanson, University of California, San Diego https://www.usenix.org/conference/fast16/technical-sessions/presentation/xu This paper is included in the Proceedings of the 14th USENIX Conference on File and Storage Technologies (FAST ’16). February 22–25, 2016 • Santa Clara, CA, USA ISBN 978-1-931971-28-7 Open access to the Proceedings of the 14th USENIX Conference on File and Storage Technologies is sponsored by USENIX NOVA: A Log-structured File System for Hybrid Volatile/Non-volatile Main Memories Jian Xu Steven Swanson University of California, San Diego Abstract Hybrid DRAM/NVMM storage systems present a host of opportunities and challenges for system designers. These sys- Fast non-volatile memories (NVMs) will soon appear on tems need to minimize software overhead if they are to fully the processor memory bus alongside DRAM. The result- exploit NVMM’s high performance and efficiently support ing hybrid memory systems will provide software with sub- more flexible access patterns, and at the same time they must microsecond, high-bandwidth access to persistent data, but provide the strong consistency guarantees that applications managing, accessing, and maintaining consistency for data require and respect the limitations of emerging memories stored in NVM raises a host of challenges. Existing file sys- (e.g., limited program cycles). tems built for spinning or solid-state disks introduce software Conventional file systems are not suitable for hybrid mem- overheads that would obscure the performance that NVMs ory systems because they are built for the performance char- should provide, but proposed file systems for NVMs either in- acteristics of disks (spinning or solid state) and rely on disks’ cur similar overheads or fail to provide the strong consistency consistency guarantees (e.g., that sector updates are atomic) guarantees that applications require. -
From Parallel to Serial
Computer-On-Modules 9 From Parallel to Serial COM Express™ modules are highly integrated off-the-shelf building blocks based on a PCI Express® bus architecture that plug into custom made, application-specific carrier boards. COM Express™ modules measure just 95 mm x 125 mm and include most generic functions such as video, audio, Ethernet, storage interfaces, and USB ports that are needed for most applications. A custom designed carrier board complements the COM Express™ core module with additional functionality required for a specific application. COM Express™ is a result of the convergence of the latest technology standards based on serial differential signalling such as PCI Express® USB 2.0, Serial ATA, LVDS, and Serial DVO implemented on an extremely compact Computer-on-Module. Moving from parallel busses such as PCI™ and IDE to serial busses such as PCI Express® is a change the scale of which has not been seen since PCI™ replaced ISA. 9-1 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA 2 6U cPCI Blades 3 Platforms 6U cPCI 4 3U cPCI Blades PCI Express® as a Central Bus Legacy Support At the core of the COM Express™ module lies the PCI Express® In an effort to protect existing investments, the initial COM 5 Platforms 3U cPCI bus. PCI Express® is a two-way serial connection that carries data in Express™ standard will maintain support for 32-bit PCI™, packets along two pairs of point-to-point data lanes. It can be used ISA through LPC and PATA IDE. At a later stage the COM as a peripheral device interconnect, a chip-to-chip interconnect, and Express™ formfactor will abandon both PCI™ and IDE a bridge to other interconnects such as IEEE 1394b, USB 2.0, SATA, legacy signals to make room for two additional Gigabit and Gigabit Ethernet. -
Container-Based Virtualization for Byte-Addressable NVM Data Storage
2016 IEEE International Conference on Big Data (Big Data) Container-Based Virtualization for Byte-Addressable NVM Data Storage Ellis R. Giles Rice University Houston, Texas [email protected] Abstract—Container based virtualization is rapidly growing Storage Class Memory, or SCM, is an exciting new in popularity for cloud deployments and applications as a memory technology with the potential of replacing hard virtualization alternative due to the ease of deployment cou- drives and SSDs as it offers high-speed, byte-addressable pled with high-performance. Emerging byte-addressable, non- volatile memories, commonly called Storage Class Memory or persistence on the main memory bus. Several technologies SCM, technologies are promising both byte-addressability and are currently under research and development, each with dif- persistence near DRAM speeds operating on the main memory ferent performance, durability, and capacity characteristics. bus. These new memory alternatives open up a new realm of These include a ReRAM by Micron and Sony, a slower, but applications that no longer have to rely on slow, block-based very large capacity Phase Change Memory or PCM by Mi- persistence, but can rather operate directly on persistent data using ordinary loads and stores through the cache hierarchy cron and others, and a fast, smaller spin-torque ST-MRAM coupled with transaction techniques. by Everspin. High-speed, byte-addressable persistence will However, SCM presents a new challenge for container-based give rise to new applications that no longer have to rely on applications, which typically access persistent data through slow, block based storage devices and to serialize data for layers of block based file isolation. -
Intel® System Controller Hub (Intel® SCH) Datasheet
Intel® System Controller Hub (Intel® SCH) Datasheet May 2010 Document Number: 319537-003US LINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The Intel® System Controller Hub (Intel® SCH) may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. -
Storage Solutions for Embedded Applications
White Paper Storage Solutions Brian Skerry Sr. Software Architect Intel Corporation for Embedded Applications December 2008 1 321054 Storage Solutions for Embedded Applications Executive Summary Any embedded system needs reliable access to storage. This may be provided by a hard disk drive or access to a remote storage device. Alternatively there are many flash solutions available on the market today. When considering flash, there are a number of important criteria to consider with capacity, cost, and reliability being foremost. This paper considers hardware, software, and other considerations in choosing a storage solution. Wear leveling is an important factor affecting the expected lifetime of any flash solution, and it can be implemented in a number of ways. Depending on the choices made, software changes may be necessary. Solid state drives offer the most straight forward replacement option for Hard disk drives, but may not be cost-effective for some applications. The Intel® X-25M Mainstream SATA Solid State Drive is one solution suitable for a high performance environment. For smaller storage requirements, CompactFlash* and USB flash are very attractive. Downward pressure continues to be applied to flash solutions, and there are a number of new technologies on the horizon. As a result of reading this paper, the reader will be able to take into consideration all the relevant factors in choosing a storage solution for an embedded system. Intel® architecture can benefit the embedded system designer as they can be assured of widespread