From Parallel to Serial

Computer-On-Modules

From Parallel to Serial COM Express™ modules are highly integrated off-the-shelf building blocks based on a PCI Express® bus architecture that plug into custom made, application-specific carrier boards. COM Express™ modules measure just 95 mm x 125 mm and include most generic functions such as video, audio, Ethernet, storage interfaces, and USB ports that are needed for most applications. A custom designed carrier board complements the COM Express™ core module with additional functionality required for a specific application.

COM Express™ is a result of the convergence of the latest technology standards based on serial differential signalling such as PCI Express® USB 2.0, Serial ATA, LVDS, and Serial DVO implemented on an extremely compact Computer-on-Module. Moving from parallel busses such as PCI™ and IDE to serial busses such as PCI Express® is a change the scale of which has not been seen since PCI™ replaced ISA.

9-1 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA

2 6U cPCI Blades

3 Platforms 6U cPCI

4 3U cPCI Blades

PCI Express® as a Central Bus Legacy Support At the core of the COM Express™ module lies the PCI Express® In an effort to protect existing investments, the initial COM 5 Platforms 3U cPCI bus. PCI Express® is a two-way serial connection that carries data in Express™ standard will maintain support for 32-bit PCI™, packets along two pairs of point-to-point data lanes. It can be used ISA through LPC and PATA IDE. At a later stage the COM as a peripheral device interconnect, a chip-to-chip interconnect, and Express™ formfactor will abandon both PCI™ and IDE a bridge to other interconnects such as IEEE 1394b, USB 2.0, SATA, legacy signals to make room for two additional Gigabit and Gigabit Ethernet. Ethernet ports and 10 addtional PCI Express® lanes. 6 PCI Express® constitutes the most significant PC bus architecture & MBs Industrial SBCs change in over a decade, delivering a huge increase in I/O bandwidth while maintaining software compatibility with the existing PCI™ infrastructure. 7 Chassis Industrial 125 mm AB Connector CD Connector One Gigabit Ethernet port Parallel ATA, IDE port LPC interface Alternatedefinition assigns this to two 8 Accessories IPC Four Serial ATA channels additional Gigabit Ethernet ports High Definition Audio 32-bit PCI™ v2.3 bus Eight USB 2.0 ports Alternate definition assigns this to ten additional PCI Express® x1 lanes Six PCI Express® Lanes x1 Dual 24-bit LVDS channels PCI Express® x16 for Graphics

95 mm 9 Analog VGA These pins can also be assigned to On-Modules Computer- TV-out ports (SDTV/HDTV) two SDVO extensions (multiplexed) Eight GPIO pins SMB and I2C bus Keyboard +12 V primary power input Power / Thermal control 10 +5 V standby and 3.3 V RTC +12 V primary power input Extreme Rugged Ampro by ADLINK

Above connector assignments comply with PICMG® COM.0 COM Express™ Module, Basic Formfactor

9-2 http://www.adlinktech.com/Computer-on-Module 8-3

Computer-On-Modules ETX Selection Guide COM Express™ 1 Procucts AdvancedTCA

Basic (125 x 95 mm)

NEW NEW NEW 2 6U cPCI Blades

Express-CB Express-MV Express-MG 3 CPU Type Intel® Core™ i7/i5 (Arrandale) Intel® Core™2 Duo (Penryn) Intel® Core™2 Duo (Penryn) Platforms 6U cPCI up 2.4 GHz with 4 MB L2 cache up 2.26 GHz with 6 MB L2 cache up 2.53 GHz with 6 MB L2 cache CPU Package µFC-BGA only µFC-BGA only µFC-BGA only CPU Speeds / Numbers Celeron® M TBD Celeron® M 722, 723 Celeron® M 575, T3100 (dual core) Core™ i7 (Arrandale) Core™2 Duo (Penryn) Core™2 Duo (Penryn) i7-620E/M, 620LE, 620UE, i5-520E/M SP9300, SL9400, SL9380, SU9300 T9400, P8400 FSB Speed - 1066/800 1066/800 4 3U cPCI Blades Main Chipset Intel® PCH QM57 Intel® GS45 with ICH9M (SFF) Intel® GM45 with ICH9M System Memory 8 GB (max), dual channel 8 GB (max), dual channel 8 GB (max), dual channel Memory Type Dual channel DDR3 Dual channel DDR3 Dual channel DDR3 Soldered Memory - - - Socket Memory Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Cache (L2) L2 depends on processor type L2 depends on processor type L2 depends on processor type 5 1MB, 3MB or 4MB 1M, 3MB or 6MB 1M, 3MB or 6MB Platforms 3U cPCI BIOS Type AMI EFI, American Megatrend AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Graphics Controller Gen 5.75 with 12 execution units ® ® 6 Intel GMA X4500 at 533/320 MHz Intel GMA X4500 at 533 MHz & MBs Industrial SBCs Graphics Memory Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Integrated Display Support CRT (QXGA) CRT (QXGA) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) TV-out (PAL/NTSC/HDTV) External Graphics Bus PCIe x16 Graphics port, PCIe x16 PEG port, DisplayPort PCIe x16 Graphics port, DisplayPort Embedded DisplayPort dual SDVO ports, HDMI dual SDVO ports, HDMI 7 Compatibillity OpenGL 2.1, DirectX 10 OpenGL 2.0, DirectX 10 OpenGL 2.0, DirectX 10 Chassis Industrial Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device Serial ATA four SATA-300 ports three SATA-300 ports (optional 4) three SATA-300 ports (optional 4) Matrix Storage Support optional optional optional Ethernet integrated Intel® GbE (10/100/1000) integrated Intel® GbE (10/100/1000) integrated Intel® GbE (10/100/1000) USB 8 ports USB v2.0 8 ports USB v2.0 8 ports USB v2.0 8 Audio Intel® HD Audio Intel® HD Audio Intel® HD Audio Accessories IPC Watchdog Yes Yes Yes TPM Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 PCI Express Support 6x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) PCI-Express x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 9

LPC Support Yes Yes Yes On-Modules Computer- Management Bus I2C, SMBus I2C, SMBus I2C, SMBus Power 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) Power States S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 Power Consumption TBD 14.5 W with Core™2 Duo SU9300 at 1.2 GHz and TBD W with Core™2 Duo P8400 at 2.26 GHz ETX 2 GB memory typical and 2 GB memory typical Operating Temperature 0 ~ +60° Celsius 0 ~ +60° Celsius 0 ~ +60° Celsius 10 Extreme Rugged Ampro by ADLINK Extended Temperature TBD selected modules: -20 ~ +70°C TBD Compatibillity PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 Dimensions Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Solid State Disk on Module optional SATA SSD 8 GB and up - - BSP & Software Support Windows® XP/Xpe, Windows® Vista, Windows® 7 Windows® XP/Xpe, Windows® Vista, Windows® 7 Windows® XP/Xpe, Windows® Vista, Windows® 7 Windows® CE, Linux® 2.6.x, AIDI Windows® CE, Linux® 2.6.x, AIDI library Windows® CE, Linux® 2.6.x, AIDI library Page Number 9-7 9-9 9-11

9-4 Selection Guide COM Express™

Basic (125 x 95 mm) Computer-On-Modules

Express-MC800 Express-NR Express-AT CPU Type Intel® Core™2 Duo (Merom) Intel® Core™2 Duo (Merom/Yonah) Intel® Atom™ up 2.2 GHz with 4 MB L2 cache up to 2.2 GHz with 4MB L2 cache up to 1.6 GHz with 512 KB L2 cache CPU Package µFC-PGA (Socket-P) or µFC-BGA µFC-PGA (Socket-M) or µFC-BGA µFC-BGA CPU Speeds / Numbers Celeron® M 550 (socket) Celeron® M 423, 440/530 Intel® Atom™ N270 at 1.6 GHz Core™2 Duo (Meron) U7500, L7500 Core™2 Duo L7400, U7500, U2500 Core™2 Duo T7500 (socket) Core™2 Duo T7400 (socket) FSB Speed 800/667/533 667/533 533 Main Chipset Intel® GME965 with ICH8M Intel® 945GME with ICH7M Intel® 945GSE with ICH7M System Memory 4 GB (max), dual channel 4 GB (max), dual channel 2 GB (max), single channel Memory Type Dual channel DDR2 667/533 Dual channel DDR2 667/533 DDR2 533 Soldered Memory - - - Socket Memory Max 4 GB on two 200-pin SODIMM Max 4 GB on two 200-pin SODIMM Max 2 GB on single 200-pin SODIMM Cache (L2) L2 depends on processor type L2 depends on processor type L2 cache 512 KB 2MB or 4MB 1MB, 2MB or 4MB BIOS Type AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend 9 BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Graphics Controller Intel® GMA X3100 Intel® GMA 950 Intel® GMA 950 Graphics Memory Max 384 MB UMA Max 256 MB UMA Max 256 MB UMA Integrated Display Support CRT (QXGA) CRT (QXGA) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) TV-out (PAL/NTSC/HDTV) TV-out (PAL/NTSC/HDTV) External Graphics Bus PCIe x16 Graphics Port, PCIe x16 Graphics Port, Single SDVO port or dual SDVO ports or dual SDVO ports Compatibillity OpenGL 2.0, DirectX 10 OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* 9.0c Parallel ATA (IDE) one channel, two devices one channel, two devices one channel, two devices Serial ATA three SATA-300 ports two SATA 150 ports two SATA 150 ports Matrix Storage Support optional (ICH8EM) optional (ICH7MDH) - Ethernet integrated Intel® GbE (10/100/1000) Intel® 82573 GbE Ethernet (10/100/1000) Realtek RTL8111C GbE (10/100/1000) USB 8 ports USB v2.0 8 ports USB v2.0 8 ports USB v2.0 Audio Intel® HD Audio Intel® HD Audio and AC’97 Intel® HD Audio and AC’97 Watchdog Yes Yes Yes TPM Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 PCI Express Support 5x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) 3x PCI-Express x1 PCI-Express x8, x4 or x1 (on PEG) PCI-Express x1 (on PEG) (optional 5 PCI Express x1) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI Ver. 2.3, 32-bit, 33MHz LPC Support Yes Yes Yes Management Bus I2C, SMBus I2C, SMBus I2C, SMBus Power 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) Power States S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 Power Consumption 19 W with Core™2 Duo U7500 16 W with Core™2 Duo U7500 9 W with Atom® N270 at 1.06 GHz and 2 GB memory typical at 1.06 GHz and 1 GB memory typical at 1.6GHz and 1 GB DDR2 typical Operating Temperature 0 ~ +60° Celsius 0 ~ +60° Celsius 0 ~ +60° Celsius Extended Temperature - selected modules: -20 ~ +70°C selected modules: -20 ~ +70°C Compatibillity PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 Dimensions Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Solid State Disk on Module - - optional PATA SSD 512 MB up to 4 GB BSP & Software Support Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® Vista Linux® 2.6.x, AIDI library Windows® CE, Linux® 2.6.x, AIDI library Windows® CE, Linux® 2.6.x, AIDI library Page Number 9-13 9-15 9-17

9-5 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA

Basic (125 x 95 mm) Compact (95 x 95 mm) Ultra (84 x 55 mm)

NEW NEW 2 6U cPCI Blades

Express-DW400 Express-IA533 Express-ATC nanoX-ML 3 Platforms 6U cPCI Intel® Core™2 Duo (Meron) Intel® Pentium® M Intel® Atom™ Intel® Atom™ Intel® Celeron® M (3xx series) up to 1.6 GHz with 512 KB L2 cache up to 1.6 GHz with 512 KB L2 cache µFC-PGA (socket-M) or µFC-BGA µFC-PGA (socket) or µFC-BGA µFC-BGA Celeron® M 423, 440/530 Celeron® M: 600MHz up to 1.5GHz Intel® Atom™ N270 at 1.6 GHz Intel® Atom™ Z530 at 1.6 GHz Core™2 Duo L7400, U7500, U2500 Pentium® M: 1.1GHz up to 2.0GHz Intel® Atom™ Z510 at 1.1 GHz Core™2 Duo T7400 (socket) 4 667/533 533/400 533 533/400 3U cPCI Blades Intel® 3100 Intel® 915GM with ICH6-M Intel® 945GSE with ICH7M Intel® SCH US15W 4 GB (max) 2 GB (max), dual channel 2 GB (max), single channel 1 GB (max), single channel DDR2 400 registered ECC DDR2 400/533 DDR2 533 DDR2 400/533 - 512MB soldered onboard - 512 MB or 1 GB DDR2 466/533 MHz Max 4 GB on two 200-pin SO-RDIMM Max 1 GB on 200-pin SODIMM Max 2 GB on single 200-pin SODIMM - 5

L2 depends on processor type L2 depends on processor type L2 cache 512 KB L2 cache 512 KB Platforms 3U cPCI 1MB, 2MB or 4MB 0KB, 512KB, 1MB or 2MB Phoenix® Award Phoenix® Award AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend Serial Console redirection Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support FWH, 8 Mbit Flash FWH, 4 Mbit Flash 8 Mbit Flash SPI FWH, 8 Mbit Flash 6 & MBs Industrial SBCs optionally on carrier board Intel® GMA 900 Intel® GMA 950 Intel® GMA 500 - Max 128 MB UMA Max 256 MB UMA Max 256 MB UMA - CRT (QXGA) CRT (QXGA) single channel 18/24-bit LVDS (WXGA) - Dual channel 18-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) supports HDTV/DHD decode and - TV-out (PAL/NTSC/HDTV) optional TV-out (PAL/NTSC/HDTV) MPEG, H.264, hardware decoding - PCIe x16 Graphics Port, or dual SDVO ports Single SDVO port Single SDVO port 7 Chassis Industrial - OpenGL 1.4, DirectX* 9.0 OpenGL 1.4, DirectX* 9.0c OpenGL 2.0, DirectX 10 one device (SATA to PATA) one channel, two devices one channel, two devices one channel, one device 4 SATA-150 ports two SATA-150 ports two SATA 150 ports one SATA-150 port - - - - Intel® 82573 GbE Ethernet (10/100/1000) Marvell Yukon GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) 4 ports USB v2.0 6 ports USB v2.0 6 ports USB v2.0 8 ports USB v2.0 8 Accessories IPC - Intel® HD Audio and AC’97 Intel® HD Audio and AC’97 Intel® HD Audio Yes Yes Yes Yes Yes - Yes Yes 2x PCIe x4 with EDMA (or 1 x8) 3x PCI-Express x1 3x PCI-Express x1 1x PCIe x1 3x PCIe x1 1x PCI-Express x1 (on PEG) (optional 5 PCI Express x1) (optional 2x PCIe without LAN function) 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz - 9 On-Modules Computer- Yes Yes Yes Yes I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 4.75V – 14V wide range (5Vsb optional for ATX function) S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 25 W with Intel® Core™2 Duo L7400 at 1.5GHz 12 W with Celeron® M 373 9 W with Atom® N270 5 W with Atom®Z510 at 1.1 GHz and 512 MB and 1 GB DDR2 at 1.0 GHz and 512 MB DDR2 typical at 1.6GHz and 1 GB DDR2 typical DDR2 typical 10 0 ~ +60° Celsius 0 ~ +60° Celsius 0 ~ +60° Celsius 0 ~ +60° Celsius Extreme Rugged Ampro by ADLINK - - selected modules: -20 ~ +70°C selected modules: -20 ~ +70°C PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 1 Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Compact Form Factor (95x95 mm) Ultra Form Factor (84x55mm) - - optional SSD 512 MB up to 4 GB optional SSD 1 GB up to 8 GB Linux® 32/64-bit, Windows® XP/Xpe Windows® XP/Xpe Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® CE, AIDI library Linux® 2.6.x, AIDI library Windows® CE, Linux® 2.6.x, AIDI library Linux® Moblin, AIDI library 9-19 9-21 9-23 9-27

9-6 COM Express™ Module with Intel® Core i7/i5 Express-CB Processor and QM57 Chipset

Features Intel® Core™ i7/i5 Processor Intel® QM57 chipset

Computer-On-Modules Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1) 18/24-bit LVDS and Embedded Displayport SATA-300, IDE (PATA), Gigabit LAN, USB 2.0

Specifications Audio Chipset Integrated on Intel® PCH QM57 Core System Audio Codec On carrier (ALC888) CPU Arrandale BGA type Intel® Core™ i7-620E, 2.26 GHz (3.33/3.06 S/D Turbo) with LAN 4MB L2 cache, 35 W Chipset Integrated on QM57 with TBD PHY Intel® Core™ i7-620LE, 2.0 GHz (2.8/2.53 S/D Turbo) with Interface 10/100/1000 Mbps Ethernet 4MB L2 cache, 25 W Intel® Core™ i7-620UE, 1.06 GHz (2.13/1.73 S/D Turbo) with Multi I/O 4MB L2 cache, 18 W Chipset Integrated on Intel® PCH QM57 9 Intel® Core™ i5-520E, 2.4 GHz (2.93/2.66 S/D Turbo) with 3MB L2 cache, 35 W USB Supports up to eight ports USB v. 2.0 Intel® Celeron® TBD SATA Four ports SATA-300 with optional support for RAID 0,1,5,10 Memory Dual stacked SODIMM socket supporting dual channel SATA SSD Optional SATA based Solid State Disk 8/16/32 GB memory max. 8 GB of non-ECC, 800/1066 MHz DDR3 PATA SATA to PATA bridge on SATA channel 1, Master only Chipset Intel® Mobile QM57 or Intel® Mobile HM55 L2 Cache 2 MB (Celeron® M), 4/3 MB (Intel® Core™ i7 / i5) Super I/O BIOS AMI EFI with CMOS backup in 16 Mbit SPI BIOS Connected to LPC bus on carrier if needed Hardware Monitor Supply voltages and CPU temperature Watchdog Timer Programmable timer ranges to generate RESET TPM Expansion Busses PCI Express x16 bus for discrete graphics solution or Chipset Infineon SLB9635TT1.2 general purpose PCI Express (2 x8 or 2 x4 or 2 x1) or Type TPM 1.2 Embedded Display Port (eDP) 7 PCI Express x1: Lanes 0/1/2/3/4/5 are free, lane 6 is Power Specifications occupied by GbE LAN; can be optionally configured as 1 x4 (on 0/1/2/3) and 2 x1 (4/5) Input Power AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) 32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters Power States Supports S0, S1, S3, S4, S5 LPC bus, SMBus (system) , I2C (user) Power Consumption TBD Smart Battery Support Yes Video Integrated with Gen 5.75 with 12 execution units Mechanical and Environmental Processor Operating Temp 0°C to 60°C Integrated Video DirectX 10 and OpenGL 2.1 Storage Temp -20°C to 80°C Feature Support Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0) Humidity 90% at 60°C Video capture via x1 concurrent PCI Express port Shock 15G peak-to-peak, 11ms duration, non-operation PAVP (Protected Audio-Video Path) support for Protected Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis Intel HD Audio Playback Operation 0.5 Grms, 5-500 Hz, each axis High performance MPEG-2 decoding Compatibility COM Express™ Type 2, standard form factor 125 mm x 95 mm WMV9 (VC-1) and H.264 (AVC) support Certification CE, FCC Hardware acceleration for MPEG2 VLD/iDCT Microsoft DirectX 10 support Operating Systems OpenGL 2.1 support Standard Support Windows® XP(e) / Vista / Windows® 7 Blu-ray support @ 40 Mb/s Linux® Hardware motion compensation Extended Support (BSP) Embedded XP support package Intermediate Z in classic rendering Linux® 2.6.x BSP (with Xorg OpenGL setup instructions) BSP CRT Interface Analog CRT support by 300-MHz DAC Vxworks 6.x BSP (on request) Analog monitor support up to QXGA ( 2048 X 1536) AIDI I2C Library for Windows and Linux LVDS Interface Single / Dual channel 18- or 24-bit panels Embedded DisplayPort TBD

9-7 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

DDR3 SODIMM DDR-3 Channel A CPU Memory 800/1066/1333 2 Core i7 Controller 6U cPCI Blades

Core i5 Channel B DDR3 SODIMM 800/1066/1333 PCIe x16 Gfx PCIe 2 x8 Embedded DisplayPort (eDP) 3 Platforms 6U cPCI Embedded Graphics Core

CRT 4

LVDS 3U cPCI Blades FDI

Audio DMI

CRT VGA SDVO 5 LVDS HDMI x3 Platforms 3U cPCI B dual 18/24-bit DVI x3 D HDA Audio Displayport x3 A C Intel Gbe LAN LAN (occupies PCIe x1 port 6) PHY MAC PCH PCIe x1 (port 0/1/2/3/4/5) PCI-E x1 QM57 6 & MBs Industrial SBCs

SATA (port 0) JM330 PATA IDE SATA to PATA PCI SATA (port 2/3/4/5) 6x 33 MHz PCI SATA 2 8x s O v2.3 I

USB P

SSD Mbu SATA (port 1) G

2.0 S SPI LPC 4/8/16 GB 7 Chassis Industrial

USB

Test SMBus header BIOS LM95235 LM87 GPIO I2C to GPIO Mon(T) Mon(T/V) 8 TPM Accessories IPC

I2C BC

LPC 9 On-Modules Computer-

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration 10 TBD TBD Extreme Rugged Ampro by ADLINK

9-8 COM Express™ Module with Intel® Core™2 Duo Express-MV Processor and GS45 / ICH9M-SFF Chipset

Features Intel® Core™2 Duo processor (up to 2.26 GHz) Intel® GS45 and ICH9M-SFF chipset

Computer-On-Modules Dual SODIMM for up to 8 GB DDR3 at 1066 MHz Five PCIe x1, one PCIe x16 for graphics (or general purpose x8, x4 or x1) Single/dual channel 18/24-bit LVDS and TV-out (SDTV and HDTV) SATA-300, IDE (PATA), Gigabit LAN, USB 2.0

Specifications Audio Chipset Integrated on Intel® ICH9M Core System Audio Codec HDA codec on carrier CPU Penryn SFF BGA type HDMI Audio routed to HDMI interface Intel® Core™2 Duo SP9300, FSB 1066, 2.26 GHz with 6MB L2 cache, 25 Watt LAN Intel® Core™2 Duo SL9400, FSB 1066, LV 1.86 GHz Chipset Integrated on Intel® ICH9M with Intel® 82567LM PHY with 6MB L2 cache, 17 Watt Interface 10/100/1000 Mbps Ethernet Intel® Core™2 Duo SU9300, FSB 800, ULV 1.2 GHz with 3MB L2 cache, 10 Watt Multi I/O Intel® Celeron® M 722, FSB 800, ULV 1.2GHz 9 ® with 1MB L2 cache, 5.5 Watt Chipset Integrated on Intel ICH9M Memory Dual stacked SODIMM sockets supporting dual channel USB Supports up to eight ports USB v. 2.0 memory, for max. 8 GB of non-ECC, 800/1066 MHz DDR3 SATA Four ports SATA-300 with (optional) support for RAID 0,1,5,10 Chipset Intel® GS45 Express Graphics Memory Controller Hub SFF PATA SATA to PATA JM20330 controller on SATA channel 3, (Small Form Factor) and Intel® I/O Controller Hub ICH9M-SFF Master only BIOS AMIBIOS®8 with CMOS backup in 16 Mbit SPI Flash Hardware Monitor Supply voltages and CPU temperature Super I/O Watchdog Timer programmable timer ranges to generate RESET Connected to LPC bus on carrier if needed Expansion Busses Graphics PCI Express x16 bus for SDVO/HDMI/DisplayPort or general purpose PCI Express (x8 / x4 / x1) TPM 6 PCI Express x1: 0/1/2/3/4 are free, 5 is occupied by GbE Chipset Infineon SLB9635TT1.2 LAN; 0/1/2/3 x1 can be optionally configured as 1 x4 Type TPM 1.2 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I2C Power Specifications Video Input Power AT mode (12 V +/- 5%) and ATX mode Chipset GS45 GMCH integrated Mobile Intel® Graphics Media (12 V and 5 Vsb +/- 5%) Accelerator 4500MHD with core render clock 533-MHz Power States Supports S0, S1, S3, S4, S5 @ 1.05-V core voltage or 266 MHz @ 1.025 L.P. Mode Power Consumption 14.5 W (with Core™2 Duo SU9300 and 2 GB memory typical) Integrated Video Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0) Feature Support Video capture via x1 concurrent PCI Express port Mechanical and Environmental PAVP (Protected Audio-Video Path) support for Protected Operating Temp. 0°C to 60°C Intel® HD Audio Playback Storage Temp. -20°C to 80°C High performance MPEG-2 decoding Humidity 90% at 60°C WMV9 (VC-1) and H.264 (AVC) support Shock 15G peak-to-peak, 11ms duration, non-operation Hardware acceleration for MPEG2 VLD/iDCT Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis Microsoft DirectX 10 support Operation: 0.5 Grms, 5-500 Hz, each axis Blu-ray support @ 40 Mb/s Form Factor COM Express™ Type 2, standard form factor, Hardware motion compensation 95 mm x 125 mm Intermediate Z in classic rendering Certifications CE, FCC CRT Interface Analog CRT support by 300MHz DAC Analog monitor support up to QXGA, supports CRT hot plug Operating Systems LVDS Interface Single / Dual channel 18/24-bit at 25~112 MHz Standard Support Windows® XP 32/64-bit TV-out NTSC/PAL up to 1024x768 resolution supported Windows® Vista 32/64-bit HDTV 480p/720p/1080i/1080p modes supported Windows® Server 2003/2008 (without Macrovision) Linux® 2.6.x Extended Support Embedded XP BSP Linux® 2.6.x BSP WinCE 6.0 BSP AIDI I2C Library for Win32, WinCE and Linux®

9-9 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

CPU 2 Celeron® M 6U cPCI Blades Core™2 Duo

Small Form Factor: 22 x 22 mm BGA 3 FSB Platforms 6U cPCI 800/1066 Mhz

GMCH DDR3 800/1066 ® Channel A SODIMM socket Intel GS45 DDR-3 Small Form Factor Memory 4

Controller 3U cPCI Blades Analog Graphics Core DDR3 800/1066 CRT Channel B VGA 4500MHD SODIMM socket PCIe x16 Gfx TV-out SDTV HDTV PCIe x8/x4/x1 SDVO (2) DisplayPort (3) LVDS LVDS dual 18/24-bit HDMI (2) 5 Platforms 3U cPCI

DMI PCIe x16 (multiplexed) Audio Audio

Intel LAN ICH Gbe PHY PCIe x1, lane 5 ® 6 82567LM MAC Intel ICH9M & MBs Industrial SBCs Small Form Factor AB Six CD PCIe x1, lane 0/1/2/3/4 or PCIe x4 JM30220 PCIe x1 1x SATA2 SATA / PATA IDE lanes RTC PCI SATA_0/1/2/3 3x SATA2 PCI 33 Mhz v2.3

bus 7 Chassis Industrial USB_0/1/2/3/4/5/6/7 8x USB 2.0 M S SPI LPC

Test SMBus header BIOS 8 F75111R LM95245 LM87 GPIO Accessories IPC TPM I2C BC

LPC 9 On-Modules Computer- Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MV-SP9300 COM Express™ Module with Intel® Core™2 Duo Heat Spreaders processor SP9300 at 2.26 GHz 10 HTS-MV-B Heatspreader for Express-MV (BGA CPU) with threaded Extreme Rugged Ampro by ADLINK Express-MV-SL9400 COM Express™ Module with LV Intel® Core™2 Duo standoffs processor SL9400 at 1.86 GHz Passive Heatsinks Express-MV-SU9300 COM Express™ Module with ULV Intel® Core™2 Duo THS-MV-BL Low Profile Heatsink for Express-MV (BGA CPU) with processor SU9300 at 1.20 GHz threaded standoffs for bottom mounting with long cooling Express-MV-722 COM Express™ Module with ULV Intel® Celeron® M fins (incl screws for 5 and 8 mm btb) processor 722 at 1.20 GHz Heatsink with Active Cooling THSF-MV-B High Performance Heatsink with Fan for Express-MV (BGA CPU) with threaded standoffs

9-10 COM Express™ Module with Intel® Core™2 Duo Express-MG Processor and GM45 / ICH9M Chipset

Features Intel® Core™2 Duo processor (up to 2.53 GHz) Intel® GM45 and ICH9M chipset

Specifications Audio Chipset Integrated on Intel® I/O Controller Hub 9 Mobile (ICH9M) Core System Audio Codec On carrier (ALC888) CPU Socket P HDMI Audio routed to HDMI interface Intel® Core™2 Duo T9400, FSB 1067, 2.53 GHz with 6-MByte L2 cache, 35 Watt LAN Intel® Core™2 Duo P8400, FSB 1067, 2.26 GHz with Chipset Integrated on ICH9M with Intel 82567LM PHY 3-MByte L2 cache, 25 Watt Interface 10/100/1000 Mbps Ethernet Intel® Dual Celeron® M T3100, FSB 800, 1.90 GHz with 1-MByte L2 cache, 35 Watt Multi I/O Intel® Celeron® M 575, FSB 667, 2.00 GHz with 1-MByte L2 9 ® cache, 31 Watt Chipset Integrated on Intel I/O Controller Hub 9 Mobile (ICH9M) Memory Two SODIMM sockets (one on top, one on bottom) USB Supports up to eight ports USB v. 2.0 supporting dual channel memory, for max. 8 GB of non-ECC, SATA Four ports SATA-300 with optional support for RAID 0,1,5,10 800/1067 MHz DDR3 PATA SATA to PATA JM330 controller on SATA channel 3, Master Chipset Intel® GM45 Express Graphics Memory Controller Hub and only (can be removed to free up fourth SATA channel) Intel® I/O Controller Hub 82801IEM (ICH9M-E) L2 Cache 1 MB (Celeron® M), 6/3 MB (Core™2 Duo) Super I/O ® BIOS AMIBIOS 8 with CMOS backup in 16 Mbit SPI Flash Connected to LPC bus on carrier if needed Hardware Monitor Supply voltages and CPU temperature Watchdog Timer Programmable timer ranges to generate RESET TPM Expansion Busses Graphics PCI Express x16 bus or SDVO/HDMI/DisplayPort or Chipset Infineon SLB9635TT1.2 general purpose PCI Express (x8/x4/x1) Type TPM 1.2 6 PCI Express x1: Lanes 0/1/2/3/4 are free, lane 5 is occupied by GbE LAN; lanes 0/1/2/3 x1 can be optionally configure as 1 x4 Power Specifications 32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters Input Power AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) LPC bus, SMBus (system), I2C (user) Power States Supports S0, S1, S3, S4, S5 Power Consumption 14.5 W (with Core™2 Duo SU9300 and 2 GB memory, typical) Video Smart Battery Support Yes Chipset GM45 GMCH integrated Mobile Intel® Graphics Media Accelerator X4500 with core render clock 533-MHz @ 1.05 Vcore Mechanical and Environmental Integrated Video Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0) Operating Temp 0°C to 60°C Feature Support Video capture via x1 concurrent PCI Express port Storage Temp -20°C to 80°C PAVP (Protected Audio-Video Path) support for Protected Humidity 90% at 60°C Intel® HD Audio Playback Shock 15G peak-to-peak, 11ms duration, non-operation High performance MPEG-2 decoding Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis WMV9 (VC-1) and H.264 (AVC) support Operation 0.5 Grms, 5-500 Hz, each axis Hardware acceleration for MPEG2 VLD/iDCT Compatibility COM Express™ Type 2, standard formfactor 125 mm x 95 mm Microsoft DirectX 10 support Certification CE, FCC OpenGL 2.1 support Blu-ray support @ 40 Mb/s Operating Systems Hardware motion compensation Standard Support Windows® XP(e) / Vista / Windows® 7 Intermediate Z in classic rendering Linux® CRT Interface Analog CRT support by 300-MHz DAC Extended Support (BSP) Embedded XP support package Analog monitor support up to QXGA and support for CRT hot Linux® 2.6.x BSP (with Xorg OpenGL setup instructions) plug Vxworks 6.x BSP (on request) LVDS Interface Single / Dual channel 18- or 24-bit panels AIDI I2C Library for Windows and Linux® TV-out NSTC/PAL up to 1024x768 resolution supported HDTV 480p/720p/1080i/1080p modes supported (without Macrovision)

9-11 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

CPU 6U cPCI Blades Core™2 Duo Celeron® M

Socket P 3 Platforms 6U cPCI FSB 800/1066 MHz

GMCH DDR3 800/1066 ® Channel A SODIMM socket Intel GM45 DDR-3 4

Memory 3U cPCI Blades Controller

Analog Channel B DDR3 800/1066 VGA SODIMM socket

SDTV PCIe x16 Gfx HDTV PCIe x8/x4/x1 SDVO (2) LVDS DisplayPort (3) dual 18/24-bit HDMI (2) 5 Platforms 3U cPCI

HDA only

DMI

Intel Audio PHY 82567LM Gbe ICH 6 (Multifunction with LAN)

port 5 N/A & MBs Industrial SBCs MAC ®

Intel ICH9M D PCI-E ports 0 / 1 / 2 / 3 / 4 six ports PCI-E x1 Small Form Factor AB C JM330 SATA (port 3) SATA / PATA PATA IDPAE (mTaAster only)

SATA ports 0/1/2 (0/1/2/3 if no PATA support) 4x SATA 2 RTC PCI PCI 33 MHz v2.3 u s O

I 7 b Chassis Industrial P M G USB_0/1/2/3/4/5/6/7 8x USB 2.0 S SPI LPC

Test SMBus header BIOS LM95235 LM87 8 I2C to GPIO GPIO Mon(T) Mon(T/V) Accessories IPC TPM

I2C BC

LPC 9 On-Modules Computer- Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MG-S/T9400 COM Express™ Module with socket type Intel® Core™2 Heat Spreaders Duo processor T9400 at 2.53 GHz 10 HTS-MG-S Heatspreader for Express-MG (socket CPU) with threaded Extreme Rugged Ampro by ADLINK Express-MG-S/P8400 COM Express™ Module with socket type Intel® standoffs Core™2 Duo processor P8400 at 2.26 GHz Passive Heatsinks Express-MG-S/T3100 COM Express™ Module with socket type Intel® THS-MG-S Low Profile Heatsink for Express-MG (socket CPU) with Dual Core Celeron® processor T3100 at 1.90 GHz threaded standoffs Express-MG-S / 575 COM Express™ Module with socket type Intel® Heatsink with Active Cooling ® Celeron processor 575 at 2.00 GHz THSF-MG-S High Performance Heatsink with FAN for Express-MG (socket CPU) with threaded standoffs

9-12 COM Express™ Module with Intel® Core™2 Duo Express-MC800 Processor and GME965 / ICH8-M Chipset

Features Intel® Core™2 Duo processor (up to 2.2 GHz) ® Computer-On-Modules Intel GME965 / ICH8M chipset Dual SODIMM for up to 4 GB DDR2 at 800MHz Five PCIe x1, one PCIe x16 graphic (or x8) Dual-channel 24-bit LVDS, TV-out SATA-300, PATA, Gigabit LAN, USB 2.0

Specifications Core System Multi I/O CPU Socket P type Chipset Intel® ICH8-M Intel® Core™2 Duo T7500, FSB 800, 2.2 GHz with IDE (PATA) Single channel IDE with Ultra ATA 100/66/33 support 4MB L2 cache, 34 W SATA Three ports SATA-300 Intel® Celeron® M 550, FSB 533, 2.0 GHz, with USB Up to eight ports USB 2.0 1MB L2 cache 27 W BGA type Intel® Core™2 Duo T7500, FSB 800, 2.2 GHz with Super I/O 9 4MB L2 cache, 34 W Connected to LPC bus on carrier if needed Intel® Core™2 Duo L7500, FSB 800, LV 1.5 GHz with 4MB L2 cache, 17 W Intel® Core™2 Duo U7500, FSB 533, ULV 1.06 GHz with TPM 2MB L2 cache, 10 W Chipset Infineon SLB9635TT1.2 Memory Dual stacked SODIMM sockets supporting dual channel Type TPM 1.2 memory, for max 4 GB of non-ECC, 533/667 MHz DDR2 Chipset Intel® GME965 GMCH and ICH8-M BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS Power Specifications Hardware Monitor Supply voltages and CPU temperature Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) Watchdog Timer Programmable timer ranges to generate RESET Power States Supports S0, S1, S3, S4, S5 Expansion Busses 6 PCI Express x1 (0 – 4 free, 5 occupied by GbE LAN), Power Consumption 24 W (with Core™2 Duo L7500 and 2 GB memory typical) optional configurable as x4 Graphics PCI Express x16 or PCI Express x8/x4/x1, or SDVO digital video bus Mechanical and Environmental 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters Operating Temp. 0°C to 60°C LPC, SMBus, I2C Storage Temp. 20°C to 80°C Humidity 90% at 60°C Video Shock 15G peak-to-peak, 11ms duration, non-operation ® Chipset GME965 integrated Mobile Intel GMA X3100 Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis CRT Interface Analog CRT support up to 2048 x1536 at 60-Hz, 32-bpp Operation: 0.5 Grms, 5-500 Hz, each axis LVDS Interface Single / Dual channel 18/24-bit at 25~112 MHz Form Factor COM Express™ Type 2, basic form factor, 95 mm x 125 mm TV-out NTSC/PAL up to 1024x768 resolution, Certifications CE, FCC HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Operating Systems Audio Standard Support Windows® XP 32/64-bit Chipset Integrated on Intel® ICH8-M Windows® Vista 32/64-bit Audio Codec HDA codec on carrier Windows® Server 2003 Linux® 2.6.x LAN Extended Support Embedded XP BSP Chipset ICH8-M integrated GbE MAC with Intel® 82566 PHY Linux® 2.6.x BSP Interface 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN AIDI I2C Library for Win32, WinCE and Linux® support

9-13 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

CPU Celeron® M 2

Core™2 Duo 6U cPCI Blades

SMT µFCBGA2 or µFCPGA2

FSB 533/800 Mhz 3 Platforms 6U cPCI

GMCH Channel A DDR2 533/667 Intel® GME965 SODIMM socket DDR-2 Memory Analog Controller CRT VGA Graphic Core Channel B DDR2 533/667 4 X3100 SODIMM socket 3U cPCI Blades SDTV TV-out HDTV Gfx PCIe x16 LVDS LVDS PCIe x8/x4/x2/x1 dual 18/24-bit or 2x SDVO

DMI 5 Platforms 3U cPCI PCIe x16 (multiplexed) HDA Audio Audio ICH GbE ® GbE PHY PCIe x1, lane 5 Intel 82566 MAC Intel ICH8M

PCI Express PATA 1x 6 PCIe x1, lane 0/1/2/3/4 or PCIe x4 lanes IDE0 & MBs Industrial SBCs RTC PCI SATA_0/1/3 3x SATA2 PCI 33 Mhz, v2.3 u s

USB 2.0 0/1/2/3/4/5/6/7 8x USB 2.0 SMb SPI LPC

I2C BC 7 Chassis Industrial SMBus TPM GPIO GPIO Monitor Monitor F75111R LM95235 LM87 BIOS

LPC header LPC 8 Accessories IPC

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration 9 Express-MC800-S COM Express™ Module with socket for Celeron® M or Heat Spreaders On-Modules Computer- Core™2 Duo processor HTS-MC800-B Heatspreader for Express-MC800 (BGA CPU) with ® (for Intel Core™2 Duo T7500 processor at 2.2 GHz or threaded standoffs Intel® Celeron® M 550 processor at 2.0 GHz) Passive Heatsinks Express-MC800-L7500 COM Express™ Module with LV Intel® Core™2 Duo THS-MC800-B Low Profile Heatsink for Express-MC800 (BGA CPU) with L7500 processor at 1.6 GHz threaded standoffs Express-MC800-U7500 COM Express™ Module with ULV Intel® Core™2 Duo THSH-MC800-B High Heatsink for Express-MC800 (BGA CPU) with U7500 processor at 1.06 GHz 10 threaded standoffs Extreme Rugged Ampro by ADLINK Heatsink with Active Cooling THSF-MC800-S High Performance Heatsink with Fan for Express-MC800 (socket CPU) with threaded standoffs

9-14 COM Express™ Module with Intel® Core™2 Duo Express-NR Processor and 945GME / ICH7-M Chipset

Features Intel® Core™2 Duo processor (up to 2.1 GHz) ® Computer-On-Modules Intel 945GME / ICH7-M chipset Dual SODIMM for up to 4 GB DDR2 at 667 MHz One PCIe® x16, five PCIe® x1 (or one x4) Single/dual 18/24-bit LVDS, TV-out SATA, PATA, Gigabit LAN, USB 2.0

Specifications Core System Multi I/O CPU Merom Core socket type Chipset Intel® ICH7-M Intel® Core™2 Duo T7400, 2.16GHz with 4MB L2 cache, 34 W IDE (PATA) Single channel IDE with UDMA 100 support Intel® Celeron® M 530, 1.73GHz with 1MB L2 cache, 27 W SATA Three SATA-150 ports Merom Core BGA type USB Up to eight USB 2.0 ports Intel® Core™2 Duo L7400, 1.5 GHz with 4MB L2 cache, 17 W Intel® Core™2 Duo U7500, 1.06 GHz with 2MB L2 cache, 10 W Super I/O 9 Yonah Core socket type Connected to LPC bus on carrier if needed Intel® Core™ Duo T2500, 2.0 GHz with 2MB L2 cache, 31 W Intel® Celeron® M 440, 1.86 GHz with 1MB L2 cache, 27 W TPM Yonah Core BGA type Chipset Infineon SLB9635TT1.2 Intel® Core™ Duo L2400, 1.66GHz with 2MB L2 cache, 15 W Type TPM 1.2 Intel® Core™ Duo U2500, 1.2 GHz with 2MB L2 cache, 9 W Intel® Celeron® M 423, 1.06GHz with 1MB L2 cache, 5.5 W Memory Dual SODIMM sockets supporting dual channel memory, for Power Specifications max 4 GB of non-ECC, 533/667 MHz DDR2 Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) Chipset Intel® 945GME Express Graphics Memory Controller Hub Power States Supports S0, S1, S3, S4, S5 Intel® I/O Controller Hub 7 Mobile (ICH7-M DH) Power Consumption 18 W typical (with Core™2 Duo U7500 and 1 GB memory) BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS Hardware Monitor Supply voltages and CPU temperature Mechanical and Environmental Watchdog Timer Programmable timer ranges to generate RESET Operating Temp. 0°C to 60°C Expansion Busses 6 PCI Express x1 (0 – 4 free, 5 occupied by GbE LAN), optional configurable as x4 Storage Temp. -20°C to 80°C Graphics PCI Express x16, or SDVO digital video bus Humidity up to 90% at 60°C 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters Shock 15G peak-to-peak, 11ms duration, non-operation LPC, SMBus, I2C Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis Operation: 0.5 Grms, 5-500 Hz, each axis Video Form Factor COM Express™ Type 2, basic form factor, 95 mm x 125 mm Chipset 945GME GMCH integrated graphics supports dual Certifications CE, FCC independent displays CRT Interface Analog VGA support up to 2048 x1536 resolution LVDS Interface Single / Dual channel 18/24-bit Operating Systems ® TV-out NTSC/PAL up to 1024x768 resolution, Standard Support Windows XP 32/64-bit HDTV 480p/720p/1080i/1080p modes supported Windows® Vista 32/64-bit (without Macrovision) Windows® Server 2003 Linux® 2.6.x Audio Extended Support Embedded XP BSP ® Chipset Integrated on Intel ICH7-M DH WinCE BSP Audio Codec HDA (Azalia) or AC97 codec on carrier Linux® 2.6.x BSP AIDI I2C Library for Win32, WinCE and Linux® LAN Chipset PCIe type Intel® 82573L Interface 10/100/1000 Mbps

9-15 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

CPU Celeron® M 2

Core™ Duo 6U cPCI Blades Core™2 Duo

SMT µFCBGA2 or µFCPGA2

FSB 3 533/667 Mhz Platforms 6U cPCI

GMCH Channel A DDR2 533/667 Intel® 945GME SODIMM socket DDR-2 Memory Analog Controller Graphic Core 4 CRT VGA DDR2 533/667 3U cPCI Blades 250 Mhz Channel B SODIMM socket SDTV TV-out HDTV PCIe x16 Gfx PCIe x1 or LVDS LVDS 2x SDVO Dual 18/24-bit 5 Platforms 3U cPCI DMI PCIe x16 (multiplexed) AC97 Audio or HDA Audio ICH GbE LAN PCIe x1, lane 5 ® Intel 82573L Intel ICH7-M DH Six 6 PCIe x1 & MBs Industrial SBCs PCIe x1, lane 0/1/2/3/4 or PCIe x4 lanes PATA 1x IDE RTC PCI SATA_0/1 2x SATA PCI 33 Mhz, v2.3 bus

USB_0/1/2/3/4/5/6/7 M 8x USB 2.0 S SPI LPC 7 Chassis Industrial

I2C BC

SMBus TPM GPIO GPIO LM95235 LM87 BIOS

LPC header LPC 8 Accessories IPC

Ordering Information Modules Accessories 9 On-Modules Computer- Model Number Description/Configuration Model Number Description/Configuration Express-NR-S COM Express™ Module with socket for Celeron® M / Heat Spreaders Core™ Duo / Core™2 Duo processor (for Intel® Core™2 Duo T7400 processor at 2.16 GHz or HTS-NR-B Heatspreader for Express-NR (BGA CPU) with threaded Intel® Celeron® M 440 processor at 1.86 GHz) standoffs Express-NR-L7400 COM Express™ Module with LV Intel® Core™2 Duo L7400 Passive Heatsinks 10

processor at 1.5 GHz THS-NR-B Low Profile Heatsink for Express-NR (BGA CPU) with Extreme Rugged Ampro by ADLINK Express-NR-L2400 COM Express™ Module with LV Intel® Core™ Duo L2400 threaded standoffs processor at 1.66 GHz THSH-NR-B High Heatsink for Express-NR (BGA CPU) with threaded Express-NR-U7500 COM Express™ Module with ULV Intel® Core™2 Duo standoffs U7500 processor at 1.06 GHz Heatsink with Active Cooling Express-NR-423 COM Express™ Module with ULV Intel® Celeron® M THSF-NR-S High Performance Heatsink with Fan for Express-NR 423 processor at 1.06 GHz (socket CPU) with threaded standoffs

9-16 COM Express™ Module with Intel® Atom™ Express-AT Processor N270 and 945GSE/ICH7-M Chipset

Features Intel® Atom™ processor N270 at 1.6 GHz Intel® 945GSE / ICH7-M chipset

Computer-On-Modules SODIMM for up to 2 GB DDR2 at 533 MHz Three PCIe x1 (optional 4 x1 or 1 x4) High resolution CRT, single/dual 18-bit LVDS and TV-out (SDTV and HDTV) SATA, IDE (PATA), Gigabit LAN, USB 2.0 Optional 512MB~8GB IDE-based Solid State Disk

Specifications Core System Multi I/O CPU BGA type Chipset Intel® ICH7-M Intel® Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2 IDE (PATA) Single IDE channel with UDMA100 with optional cache, 2.5 W, on-die primary 32-kB instruction cache 512MB - 8GB IDE-based Solid State Disk and 24 KB write-back data cache SATA Two port SATA-150 Hyperthreading support (2-threads) USB Up to eight ports USB 2.0 Advanced gunning transceiver logic (AGTL+) bus driver technology Super I/O 9 Enhanced Intel® SpeedStep® Technology Connected to LPC bus on carrier if needed Source synchronous double-pumped (2x) Address Source synchronous quad-pumped (4x) Data TPM C0 - C4 low power states supported Memory Single SODIMM socket memory, for max 2 GB of non-ECC, Chipset Infineon SLB9635TT1.2 400/533 MHz DDR2 Type TPM 1.2 Chipset Intel® 945GSE Express Graphic Memory Controller Hub and Intel® I/O Controller Hub 7 Mobile (ICH7-M) Power Specifications ® BIOS AMIBIOS 8 with CMOS backup in 8 Mbit SPI BIOS Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) Hardware Monitor Supply voltages and CPU temperature Power States Supports S0, S1, S3, S4, S5 Watchdog Timer Programmable timer ranges to generate RESET Power Consumption 9 W typical (with Atom™ N270 and 1 GB memory) Expansion Busses 4 PCI Express x1 (0/1/2 are free, 3 is occupied by GbE LAN) optionally configured as x4 Mechanical and Environmental Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters Operating Temp. 0°C to 60°C LPC, SMBus, I2C Storage Temp. -20°C to 80°C Humidity Up to 90% at 60°C Video Shock 15G peak-to-peak, 11ms duration, non-operation Chipset Intel® Graphics Media Accelerator 950 integrated into Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis 945GSE GMCH supporting dual independent displays Operation: 0.5 Grms, 5-500 Hz, each axis CRT Interface Analog CRT support up to 1600 x 1200 Form Factor COM Express™ Type 2, basic form factor, LVDS Interface Single / Dual channel 18-bit (optional 24-bit on carrier 95 mm x 125 mm through SDVO) Certifications CE, FCC TV-out NTSC/PAL up to 1024x768 resolution supported, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Operating Systems Standard Support Windows® XP 32-bit Audio Windows® Vista 32-bit ® Chipset Integrated on Intel® I/O Controller Hub 7 Mobile (ICH7-M) Linux 2.6.x Audio Codec HDA (Azalia) or AC97 codec on carrier Extended Support Embedded XP BSP WinCE BSP LAN Linux® 2.6.x BSP AIDI I2C Library for Win32, WinCE and Linux® Chipset PCIe x1 Realtek RTL8111C Interface 10/100/1000 Mbps

9-17 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram CPU 2 Atom™ N270 6U cPCI Blades

FSB 533 Mhz 3 Platforms 6U cPCI

DDR2 533 GMCH Channel A ® SODIMM socket Intel 945GSE up to 2 GB DDR-2 Analog Memory CRT Controller 4 VGA 3U cPCI Blades Graphic Core SDTV 250 Mhz TV-out HDTV

LVDS LVDS Single channel dual 18-bit SDVO 5 Platforms 3U cPCI

DMI SDVO HDA Audio Au dio ICH 6

GbE LAN Solid State & MBs Industrial SBCs PCIe x1 port 3 Realtek Intel® ICH7-M Drive RTL8111C Four 512MB up to 8 GB AB PCIe x1 CD lanes PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) PATA 1x IDE RTC PCI SATA_0/1 2x SATA PCI 33 MHz, v2.3 s 7 Chassis Industrial 8x USB bu USB_0/1/2/3/4/5/6/7 M 2.0 S SPI LPC

I2C BC

SMBus 8

TPM Accessories IPC GPIO GPIO LM87 BIOS

LPC header LPC 9 On-Modules Computer-

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration 10 Express-AT COM Express™ module with Intel® Atom™ N270 processor Extreme Rugged Ampro by ADLINK Heat Spreaders at 1.6 GHz HTS-CAT-B Heatspreader for Express-AT (BGA CPU) with threaded standoffs Passive Heatsinks THS-CAT-B Low Profile Heatsink for Express-AT (BGA CPU) with threaded standoffs

9-18 Server Level COM Express™ Module with Express-DW400 Intel® Core™2 Duo Processor and 3100 Chipset

Features Intel® Core™ Duo and Core™2 Duo Processor ® Computer-On-Modules Two PCI Express x4 or one x8 with EDMA Two vertical or one horizontal SO-RDIMM sockets for DDR2 400 with ECC Intel® 82573 GbE LAN USB 2.0, Serial ATA and IDE support PICMG® COM.0 COM Express™ Module Type 2, basic form factor

Specifications Core System Multi I/O CPU Merom Core socket type Chipset Integrated on Intel® 3100 Intel® Core™2 Duo T7400, 2.1GHz, 4MB L2 cache, 34 W USB Up to four USB 2.0 ports, supports legacy keyboard/mouse Intel® Celeron® M 530, 1.73GHz, 1MB L2 cache, 27 W SATA Four Serial ATA 150 ports Merom Core BGA type PATA IDE Single channel IDE for CF card support (SATA to IDE Intel® Core™2 Duo L7400, 1.5 GHz, 4MB L2 cache, 17 W conversion) Intel® Core™2 Duo U7500, 1.06 GHz, 2MB L2 cache, 10 W 9 Yonah Core socket type Super I/O Intel® Core™ Duo T2500, 2.0 GHz, 2MB L2 cache, 31 W Connected to LPC bus on carrier if needed Intel® Celeron® M 440, 1.86 GHz, 1MB L2 cache, 27 W Yonah Core BGA type TPM Intel® Core™ Duo U2500, 1.2 GHz, 2MB L2 cache, 9 W Chipset Infineon SLB9635TT1.2 Intel® Celeron M 423, 1.06GHz, 1MB L2 cache, 5.5 W Type TPM 1.2 Memory Single channel registered ECC DDR2 at 400MHz up to 4 GB Option 1: one horizontal SODIMM socket, max. 2 GB Power Specifications Option 2: two vertical SODIMM sockets, max. 4 GB Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) ® Chipset Intel 3100 single integrated chip (Memory Controller Hub + Power States Supports S0, S1, S3, S4, S5 I/O Controller Hub) Power Consumption 24.5 W (with Core™2 Duo U7500 and 2 GB memory typical) BIOS Phoenix® Award Hardware Monitor Supply voltages and CPU/system temperature Mechanical and Environmental Watchdog Timer Two stage watchdog timer Operating Temp. 0°C to 60°C Expansion Busses Two PCI Express® x4 lanes with EDMA support, configurable as a one x8 PCI Express® x8 lane, and three x1 lanes Storage Temp. -20°C to 80°C 32-bit PCI rev 2.3 at 33MHz Humidity Up to 90% at 60°C LPC bus Shock 15G peak-to-peak, 11ms duration, non-operation SMBus / I2C Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis Operation: 0.5 Grms, 5-500 Hz, each axis Video Form Factor COM Express™ Type 2, basic form factor, 95 mm x 125 mm On carrier Optional VGA support via PCI or PCIe bus on carrier Certifications CE, FCC LAN Operating Systems Chipset PCIe type Intel® 82573 Standard Support Windows® XP 32/64-bit Interface 10/100/1000 Mbps Linux® 2.6.26 and up Extended Support Embedded XP BSP Linux® 2.6.x BSP AIDI I2C Library for Win32 and Linux®

9-19 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram CPU Celeron® M 2

Core™ Duo 6U cPCI Blades Core™2 Duo

SMT µFCBGA2 or µFCPGA2

FSB 3

533/667 Mhz Platforms 6U cPCI

DDR2 400 MHz MCH Channel A SO-RDIMM socket DDR2 +ICH Memory (horizontal x1) Controller with ECC ® DDR2 400 MHz 4

Intel 3100 3U cPCI Blades Channel A SO-RDIMM socket (optional 2x vertical)

PCIe with EDMA One PCIe x 8 Two PCIe x4 or Two PCIe x1 5 Platforms 3U cPCI

PCIe x8 (or 2 x4, or 2 x1)

GbE LAN PCIe x1, lane 0 Intel 82573 SATA to Four 1x SATA SATA_0 PATA IDE PCIe x1 JM20330 6

lanes & MBs Industrial SBCs PCIe x1, lane 1/2/3

RTC PCI SATA_1/2/3/4 4x SATA PCI 33 MHz, v2.3

USB_0/1/2/3 4x USB 2.0 LPC

GPIO BIOS 7

I2C Chassis Industrial

SMBus TPM LM95235 LM87

LPC header LPC 8 Accessories IPC

Ordering Information Modules Accessories 9 On-Modules Computer- Model Number Description/Configuration Model Number Description/Configuration Express-DW400-S Server level COM Express™ module with socket for CPU Heat Spreaders Express-DW400V-S Server level COM Express™ module with socket for CPU HTS-DW400-B Heatspreader for Express-DW400 (BGA CPU, horizontal and two vertical SO-RDIMM sockets SORDIMM) with threaded standoffs Express-DW400-423 Server level COM Express™ module with Intel® Heatsink with Active Cooling Celeron® M 423 at 1.06 GHz THSF-DW400V-S High Performance Heatsink with Fan for Express-IW400 10 Express-DW400-U2500 Server level COM Express™ module Intel® Core™ Duo and DW400 (socket CPU and dual vertical SODIMMs) with Extreme Rugged Ampro by ADLINK U2500 at 1.20 GHz threaded standoffs Express-DW400- U7500 Server level COM Express™ module with Intel® Core™2 THSF-DW400-S High Performance Heatsink with Fan for Express-IW400 Duo U7500 at 1.06 GHz and DW400 (socket CPU and single horizontal SODIMM) Express-DW400-L7400 Server level COM Express™ module with Intel® Core™2 with threaded standoffs Duo L7400 at 1.5 GHz V-type (Vertical): All modules above are with single horizontal SO-RDIMM socket, expect for DW400V type that has two vertical placed SO-RDIMM sockets

9-20 COM Express™ Module with Intel® Pentium® M Express-IA533 Processor and 915GME/ICH6-M Chipset Functional Diagram

Features CPU Intel® Pentium® M Processor up to 2.1 GHz ® ® Celeron M Computer-On-Modules Intel 915GME Express chipset Pentium® M

Dual-Channel DDR2 533 MHz SMT µFCBGA or Three PCI Express® x1 lanes and one socket µFCPGA PCI Express® x16 Graphics lane FSB Onboard Gigabit Ethernet 400 /533 Mhz SATA, USB 2.0, LVDS, SDVO GMCH Intel® 915GME DDR2 400/533 Channel A SODIMM Socket DDR-2 CRT VGA Memory Specifications Controller Channel B DDR2 533 soldered onboard Core System Multi I/O PCIe x16 Gfx LVDS PCIe x1 LVDS CPU Socket 479 type Chipset Intel® ICH6-M 2x 18-bit or 2x SDVO Intel® Pentium® M 760, 2.0 GHz, with 2MB L2 cache IDE (PATA) One Ultra ATA 100/66/33 IDE port Intel® Pentium® M 745, 1.8 GHz, with 2MB L2 cache SATA Two SATA-150 ports BGA type USB Up to eight USB 2.0 ports, supports legacy KB / Mouse DMI Intel® Pentium® M 738, 1.4 GHz, with 2MB L2 cache PCIe x16 (multiplexed) Intel® Celeron® M 373, 1.0 GHz, with 1MB L2 cache Super I/O GPIO Gigabit 9 Memory 400/533 MHz DDR2, non-ECC, unbuffered Connected to LPC bus on carrier if needed Ethernet Channel A: SO-DIMM socket for DDR2 memory, max 1 GB Marvell Yukon ICH6-M 88E8053 Channel B: soldered DDR2 memory, max 512 MB AC97 RTC AB

TPM CD Chipset Intel® 915GME Express Graphic Memory Controller Hub and PORT 3 Chipset Infineon SLB9635TT1.2 PORT 2 Intel® I/O Controller Hub 6 Mobile (ICH6-M) four ports Type TPM 1.2 PORT 1 PCI-E x1 single BIOS Phoenix AWARD BIOS in 1 MB FWH with console redirection IDE0 PATA and CMOS EEPROM backup PORT 0 Power Specifications SATA1 2x SATA Hardware Monitor Supply voltages and CPU temperature PCI PCI 33 Mhz v2.3 SATA0 8x USB 2.0 LPC Watchdog Timer Programmable timer ranges to generate RESET Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) Expansion Busses Four PCI Express x1 lanes (one occupied by GbE LAN) Power States Supports S0, S1, S3, S4, S5 Six 32-bit PCI 2.3 Masters at 33/66 MHz Power Consumption 18 W typical (with Pentium® M 738 and 1 GB memory) Low Pin Count (LPC) interface for Super I/O on carrier BIOS C SMBus 2.0 interface support Mechanical and Environmental 2 / I s

Operating Temp. 0°C to 60°C Monitor EEPROM u

Dual B Temp CMOS Video Storage Temp. -20°C to 80°C Watchdog M Chipset 915GME GMCH integrated chipset supports dual Voltage Backup S Humidity Up to 90% at 60°C independent displays Shock 15G peak-to-peak, 11ms duration, non-operation CRT Interface Analog CRT support up to 2048 x1536 Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis LPC LVDS Interface Dual channel 18-bit Operation: 0.5 Grms, 5-500 Hz, each axis Graphic Expansion busses One PCI Express® x16 Graphics port Form Factor COM Express™ Type 2, basic form factor, 95 mm x 125 mm Two Serial DVO ports (multiplexed with PCI Express® x16) Certifications CE, FCC Audio Ordering Information Operating Systems Chipset Integrated on Intel® ICH6-M Accessories Standard Support Windows® XP 32-bit Modules Audio Codec Optional AC’97 codec on carrier Linux® 2.6.x Model Number Description/Configuration Model Number Description/Configuration Extended Support Embedded XP BSP Express-IA533-S/0 COM Express module with socket for Intel® Celeron®/ Heat Spreaders LAN ® Linux 2.6.x BSP Pentium® M processor HTS-IA533-B Heatspreader for Express-IA533 (BGA CPU) with threaded Chipset Yukon-EC 88E8053 PCIe Gigabit Ethernet Controller 2 ® AIDI I C Library for Win32 and Linux Express-IA533-760/0 COM Express module with Intel Pentium® M 760 at 2.0GHz standoffs Interface Triple speed 10/100/1000BASE-T IEEE 802.3 compliant with fully integrated ASF 2.0 functionality Express-IA533-745/0 COM Express module with Intel Pentium® M 745 at 1.8GHz Passive Heatsinks Express-IA533-738/0 COM Express module with Intel Penium® M 738 at 1.4GHz THS-IA533-B Low Profile Heatsink for Express-IA533 (BGA CPU) with Express-IA533-373/0 COM Express module with Intel Celeron® M 373 at 1GHz threaded standoffs Note: All models optional soldered memory Heatsink with Active Cooling THSF-IA533-S High Performance Heatsink with Fan for Express-IA533 (socket CPU) with threaded standoffs

9-21 http://www.adlinktech.com/Computer-on-Module COM Express™ Module with Intel® Pentium® M Express-IA533 Processor and 915GME/ICH6-M Chipset 1 Procucts AdvancedTCA Functional Diagram

Features CPU Intel® Pentium® M Processor up to 2.1 GHz ® 2 ® Celeron M 6U cPCI Blades Intel 915GME Express chipset Pentium® M

Dual-Channel DDR2 533 MHz SMT µFCBGA or Three PCI Express® x1 lanes and one socket µFCPGA PCI Express® x16 Graphics lane FSB Onboard Gigabit Ethernet 400 /533 Mhz 3 Platforms 6U cPCI SATA, USB 2.0, LVDS, SDVO GMCH Intel® 915GME DDR2 400/533 Channel A SODIMM Socket DDR-2 CRT VGA Memory 4 Specifications Controller 3U cPCI Blades Channel B DDR2 533 soldered onboard Core System Multi I/O PCIe x16 Gfx LVDS PCIe x1 LVDS CPU Socket 479 type Chipset Intel® ICH6-M 2x 18-bit or 2x SDVO Intel® Pentium® M 760, 2.0 GHz, with 2MB L2 cache IDE (PATA) One Ultra ATA 100/66/33 IDE port Intel® Pentium® M 745, 1.8 GHz, with 2MB L2 cache SATA Two SATA-150 ports DMI 5 BGA type USB Up to eight USB 2.0 ports, supports legacy KB / Mouse Platforms 3U cPCI Intel® Pentium® M 738, 1.4 GHz, with 2MB L2 cache PCIe x16 (multiplexed) Intel® Celeron® M 373, 1.0 GHz, with 1MB L2 cache Super I/O GPIO Gigabit Memory 400/533 MHz DDR2, non-ECC, unbuffered Connected to LPC bus on carrier if needed Ethernet Channel A: SO-DIMM socket for DDR2 memory, max 1 GB Marvell Yukon ICH6-M 88E8053 Channel B: soldered DDR2 memory, max 512 MB AC97 RTC AB

TPM CD ® PORT 3 Chipset Intel 915GME Express Graphic Memory Controller Hub and Chipset Infineon SLB9635TT1.2 6

PORT 2 & MBs Industrial SBCs Intel® I/O Controller Hub 6 Mobile (ICH6-M) four ports Type TPM 1.2 PORT 1 PCI-E x1 single BIOS Phoenix AWARD BIOS in 1 MB FWH with console redirection IDE0 PATA and CMOS EEPROM backup PORT 0 Power Specifications SATA1 2x SATA Hardware Monitor Supply voltages and CPU temperature PCI PCI 33 Mhz v2.3 SATA0 8x USB 2.0 LPC Watchdog Timer Programmable timer ranges to generate RESET Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) Expansion Busses Four PCI Express x1 lanes (one occupied by GbE LAN) Power States Supports S0, S1, S3, S4, S5 Six 32-bit PCI 2.3 Masters at 33/66 MHz Power Consumption 18 W typical (with Pentium® M 738 and 1 GB memory) 7 Low Pin Count (LPC) interface for Super I/O on carrier BIOS Chassis Industrial C 2

SMBus 2.0 interface support Mechanical and Environmental I / s

Operating Temp. 0°C to 60°C Monitor EEPROM u

Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis Accessories IPC LVDS Interface Dual channel 18-bit Operation: 0.5 Grms, 5-500 Hz, each axis Graphic Expansion busses One PCI Express® x16 Graphics port Form Factor COM Express™ Type 2, basic form factor, 95 mm x 125 mm Two Serial DVO ports (multiplexed with PCI Express® x16) Certifications CE, FCC Audio Ordering Information Operating Systems Chipset Integrated on Intel® ICH6-M Accessories Standard Support Windows® XP 32-bit Modules 9

Audio Codec Optional AC’97 codec on carrier On-Modules Computer- Linux® 2.6.x Model Number Description/Configuration Model Number Description/Configuration Extended Support Embedded XP BSP Express-IA533-S/0 COM Express module with socket for Intel® Celeron®/ Heat Spreaders LAN ® Linux 2.6.x BSP Pentium® M processor HTS-IA533-B Heatspreader for Express-IA533 (BGA CPU) with threaded Chipset Yukon-EC 88E8053 PCIe Gigabit Ethernet Controller 2 ® AIDI I C Library for Win32 and Linux Express-IA533-760/0 COM Express module with Intel Pentium® M 760 at 2.0GHz standoffs Interface Triple speed 10/100/1000BASE-T IEEE 802.3 compliant with fully integrated ASF 2.0 functionality Express-IA533-745/0 COM Express module with Intel Pentium® M 745 at 1.8GHz Passive Heatsinks Express-IA533-738/0 COM Express module with Intel Penium® M 738 at 1.4GHz THS-IA533-B Low Profile Heatsink for Express-IA533 (BGA CPU) with 10 Express-IA533-373/0 COM Express module with Intel Celeron® M 373 at 1GHz threaded standoffs Extreme Rugged Ampro by ADLINK Note: All models optional soldered memory Heatsink with Active Cooling THSF-IA533-S High Performance Heatsink with Fan for Express-IA533 (socket CPU) with threaded standoffs

9-22 “Compact” COM Express™ Module with Intel® Atom™ Express-ATC Processor N270 and 945GSE/ICH7-M Chipset

Features Intel® Atom™ processor N270 at 1.6 GHz Intel® 945GSE/ICH7-M chipset

Specifications Core System Multi I/O CPU BGA type Chipset Intel® ICH7-M Intel® Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2 IDE (PATA) Single IDE channel with UDMA100 with optional cache, 2.5 W, on-die primary 32-kB instruction cache 1GB ~ 8GB IDE-based Solid State Drive and 24 KB write-back data cache SATA Two ports SATA-150 Hyper-Threading support (2-threads) USB Up to eight ports USB 2.0 Advanced gunning transceiver logic (AGTL+) bus driver technology Super I/O 9 Enhanced Intel SpeedStep® Technology Connected to LPC bus on carrier if needed Source synchronous double-pumped (2x) Address Source synchronous quad-pumped (4x) Data TPM C0 - C4 low power states supported Memory Single SODIMM socket memory, for max 2 GB of non-ECC, Chipset Infineon SLB9635TT1.2 400/533 MHz DDR2 Type TPM 1.2 Chipset Intel® 945GSE Express Graphic Memory Controller Hub and Intel® I/O Controller Hub 7 Mobile (ICH7-M) Power Specifications ® BIOS AMIBIOS 8 with CMOS backup in 8 Mbit SPI BIOS Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb) Hardware Monitor Supply voltages and CPU temperature Power States Supports S0, S1, S3, S4, S5 Watchdog Timer Programmable timer ranges to generate RESET Power Consumption 9 W typical (with Atom™ N270 and 1 GB memory) Expansion Busses 4 PCI Express x1 (0/1/2 are free, 3 is occupied by GbE LAN) optionally configured as one PCIe x4 Mechanical and Environmental Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters Operating Temp. 0°C to 60°C LPC, SMBus, I2C Storage Temp. -20°C to 80°C Humidity Up to 90% at 60°C Video Shock 15G peak-to-peak, 11ms duration, non-operation Chipset Intel® Graphics Media Accelerator 950 integrated into Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis 945GSE GMCH supporting dual independent displays Operation: 0.5 Grms, 5-500 Hz, each axis CRT Interface Analog CRT support up to 1600 x 1200 Form Factor COM Express™ Type 2, compact form factor, LVDS Interface Single / Dual channel 18-bit (optional 24-bit on carrier 95 mm x 95 mm through SDVO) Certifications CE, FCC TV-out NTSC/PAL up to 1024x768 resolution supported, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Operating Systems Standard Support Windows® XP 32-bit Audio Windows® Vista 32-bit ® Chipset Integrated on Intel® I/O Controller Hub 7 Mobile (ICH7-M) Linux 2.6.x Audio Codec HDA (Azalia) or AC97 codec on carrier Extended Support Embedded XP BSP WinCE BSP LAN Linux® 2.6.x BSP AIDI I2C Library for Win32, WinCE and Linux® Chipset PCIe x1 Realtek RTL8111C Interface 10/100/1000 Mbps

9-23 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

CPU 2 6U cPCI Blades Atom™ N270

FSB 533 Mhz 3 Platforms 6U cPCI

DDR2 533 GMCH Channel A ® SODIMM socket Intel 945GSE up to 2 GB DDR-2 Analog Memory 4 CRT VGA Controller 3U cPCI Blades Graphic Core SDTV 250 Mhz TV-out HDTV

LVDS LVDS Single channel dual 18-bit SDVO 5 Platforms 3U cPCI

DMI SDVO HDA Audio Au dio ICH 6 GbE LAN Solid State & MBs Industrial SBCs PCIe x1 port 3 Realtek Intel® ICH7-M Drive RTL8111C Four 512MB up to 8 GB AB PCIe x1 CD lanes PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) PATA 1x IDE RTC PCI SATA_0/1 2x SATA PCI 33 MHz, v2.3 s 7 Chassis Industrial 8x USB bu USB_0/1/2/3/4/5/6/7 M 2.0 S SPI LPC

I2C BC

SMBus 8 TPM Accessories IPC GPIO GPIO LM87 BIOS

LPC header LPC 9 On-Modules Computer-

Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration 10 Extreme Rugged Ampro by ADLINK Express-ATC-N270 Compact COM Express™ module with Intel® Atom™ N270 Heat Spreaders processor at 1.6 GHz HTS-ATC-B Heatspreader for Express-ATC (BGA CPU) with threaded standoffs Passive Heatsinks THS-ATC-B Low Profile Heatsink for Express-ATC (BGA CPU) with threaded standoffs

9-24 COM Express™ Reference Carrier Board Express-BASE with ATX Form Factor

Features Five PCI Express® x1 slots

Computer-On-Modules PCI Express x16 Graphic slot / SDVO slot Two Legacy 32-bit PCI slots Dual LPC BIOS, single step execution LPC Super I/O (enable/disable) CF Card or Express Card Integrated POST Code ATX / AT or Battery Powered

Specifications Functional Diagram Form Factor LPT1 COM1 ® Core Module Interface PICMG COM Express™ Revision 1.0 W83627HF COM2 Primary Supports Type 1 and Type 2 Basic Form Factor Modules Super I/O KB/MS Dimensions 305 mm x 240 mm (AT/ATX) FDD PCI Express x16 Expansion Busses One 32-bit PCI™ v2.3 slot PCI Express x16 (can also be used for Debug Header ® onboard slot LPC Five PCI Express x1 slots SDVO ADD2 card) Secondary One PCIe x16 slot / SDVO slot BIOS LPC bus header POST Code 9 Display

4 onboard BIOS / Debug SATA SATA headers POST LEDs Onboard diagnostics for BIOS POST code data and address on LPC bus Audio Audio on B D Codec Rear I/O IDE Connector PATA Single Channel A Allows single step BIOS execution C Gigabit Ethernet Secondary BIOS Onboard socket for secondary LPC BIOS on carrier Rear I/O

CRT VGA Active Components Rear I/O TV-out Audio ALC880 High Definition Audio Codec header LVDS Super I/O Winbond WF83627HG on LPC headers

PCI P 32-bit PCI PP 1 slot Six PCI Express x1 C P Connectors CC P I C I I C E I COM Express™ Two x 220-pin (Type 2) EE I Express 11 E Card 1 E CRT DB15 on Rear I/O panel for VGA/CRT displays 15

LVDS Two onboard headers supporting dual channel LVDS 6x USB on Rear I/O Eight USB 1x USB on header TV-out 8-pin header (extension cable included) Audio Mic/Line-in/Speakers on rear I/O panel, Mic/Line-in on header, S/PDIF on header PATA IDE One 40-pin header Ordering Information SATA IDE Four SATA connectors Carrier PCIe Mini Card One socket onboard LAN 10/100/1000BaseT compatible RJ45 on rear I/O panel Model Number Description/Configuration USB 2.0 Four + two on rear I/O panel, two on header and one through Express-BASE COM Express™ Reference Carrier Board in ATX Formfactor Mini Express Card Serial Port One DB-9 on rear I/O panel, one header onboard Parallel Port One DB-25 on rear I/O panel FDD 34-pin header KB/Mouse Two 6-pin mini DIN (on rear I/O panel) Digital I/O 8-pin header

Power and Operation Connectors Standard ATX or 12 V terminals Switches Onboard RESET button and ATX mini switch

Ask for availability

9-25 http://www.adlinktech.com/Computer-on-Module This Computer-on-Module Starter Kit gets you going with Starter Kit - COM Express Carrier Board Design and Software Verification in no time 1 Procucts AdvancedTCA

Features COM Express™ module of choice 2 CPU, Memory of choice 6U cPCI Blades Express-BASE Reference Carrier Board Thermal Solution (heatspreader and heatsink) Schematics, Designs Guide, and User Manuals 3

ADLINK USB stick with Documentation, Drivers, Platforms 6U cPCI BSPs, Libraries

4 3U cPCI Blades The Starter Kit consists of a COM Express™ core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, PCI slot, serial ATA, SDVO, CRT, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included. 5 Contents Ordering Information Platforms 3U cPCI Standard Items ADLINK provides a “tailor made” Starter Kit service. • Express-Base evaluation carrier board We let you choose your preferred module, CPU type and • Accessory kit: memory to suit your application development needs. - IDE cable 6 & MBs Industrial SBCs - SATA cable - TV out cable Select a core module, memory, - CF adapter thermal solution, and CPU (for socket - PCI 2-slot riser card type) according to your needs 7 - USB Memory Stick with documentations, drivers, libraries, and Chassis Industrial BSP for Linux, WinCE, Embedded XP - Baseboard design guide and product manual Optional Items Contact an ADLINK sales • COM Express™ module of choice 8 representative in your region Accessories IPC • Socket type CPU of choice • Memory of choice • Thermal solution of choice (heatspreader, heatsink) 9 On-Modules Computer- Get the specific part number for your starter kit

10 Extreme Rugged Ampro by ADLINK

9-26 COM Express™ Type 1 Pinout Compatible Module with nanoX-ML Intel® Atom™ Processor Z5xx and US15W Chipset

Features Intel® Atom™ processor Z530/Z510 Intel® System Controller Hub US15W

Computer-On-Modules One PCIe x1 (opt. 2 without LAN) 18/24-bit LVDS and SDVO GbE LAN, SATA, USB 2.0, SDIO, LPC AMIBIOS®8 BIOS with TPM 1.2 support Solid State Disk : 1 GB up to 8 GB Ultra Compact 84 x 55 mm footprint

Specifications Core System Multi I/O CPU Intel® Atom™ processor Z530 at 1.6 GHz with 533 MHz FSB, IDE (PATA) Single channel IDE with UDMA (33/66/100) connects to 2.3 watts TDP, supports Hyper-Threading onboard Solid State Disk of 1 GB up to 8 GB Intel® Atom™ processor Z510 at 1.1 GHz with 400 MHz FSB, SATA PATA to SATA bridge and 2.0 watts TDP One SATA port Memory Soldered 512 MB or 1 GB of non-ECC, unbuffered 400/533 USB Eight USB v2.0 ports capable of transfers up to 480 MB/s; MHz DDR2 one port optionally configurable as USB client 9 Chipset Intel® System Controller Hub US15W BIOS AMIBIOS®8 with CMOS backup in 8 Mbit LPC Flash TPM Hardware Monitor Supply voltages and CPU temperature Chipset Infineon SLB9635TT1.2 Watchdog Timer Programmable timer ranges to generate RESET Type TPM 1.2 Expansion Busses Two PCI Express x1 LPC bus Power Specifications 2 SMBus / I C Input Power 4.75V ~ 14V wide range input support, with optional 5Vsb for ATX support Video Power States Supports S0, S1, S3, S4, S5 Chipset GMA 500 integrated on Intel® on System Controller Hub Power Consumption 5 W (with Atom Z510 and 512 MB memory typical) US15W Features Ultra low power integrated 3D graphics core with full HD HW video decode engine and dual independent display support Mechanical and Environmental CRT Interface Analog VGA not supported Operating Temp. 0°C to 60°C LVDS Interface Single channel 18/24-bit at 25~112 MHz Storage Temp. -20°C to 80°C SDVO May be used for any external display device (HDMI/DVI, Humidity 10% to 90%, storage: 5% to 95% (non condensing) analog TV, VGA/CRT and LVDS); includes EDID and Shock 15G peak-to-peak, 11ms duration, non-operation EDID-less support, and a 160 MHz pixel clock Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis Operation: 0.5 Grms, 5-500 Hz, each axis Audio Form Factor COM Express™ Type 1 compatible pinout Chipset Integrated on Intel® System Controller Hub US15W “Ultra” size : 84 mm x 55 mm Type Supports Intel® High Definition Audio codec on carrier board Certifications CE, FCC

LAN Operating Systems Chipset Realtek RTL8111C PCI Express Gigabit Ethernet Controller Standard Support Windows® XP 32-bit Interface 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN Windows® Vista 32-bit support Linux® 2.6.26 and up Extended Support Embedded XP BSP WinCE BSP Linux® 2.6.x BSP AIDI I2C Library for Win32, WinCE and Linux®

9-27 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

CPU 6U cPCI Blades AtomTM Z510/Z530

FSB 3 400/533 Platforms 6U cPCI MHz

SCH ® 4 3U cPCI Blades Intel US15W DDR-2 400/533 Channel A DDR2 Memory soldered LVDS Graphic Core Controller 18/ 24-bit 250 Mhz

HDA Audio Audio O 5 Platforms 3U cPCI V USB_0/1/2/3/4/5/6/7 8x USB 2.0 SDVO SD

PCIe x1, lane 0

Gbe PCIe LAN PCIe x1 RT8111C 6 & MBs Industrial SBCs TPM

LPC EIDE SD/MMC Master Solid State Disk PATA 1x 1 GB up to 8 GB I2C BC 7

SMBus Chassis Industrial GPIO

Slave PATA to Slave SATA 8 Accessories IPC

Ordering Information Modules Accessories 9 On-Modules Computer- Model Number Description Model Number Description nanoX-ML-51/512-0 Ultra COM Express™ Type 1 compatible module with Intel® Heat Spreaders Atom™ processor Z510 at 1.1 GHz and 512 MB DDR2 HTS-nML-B Heatspreader for nanoX-ML (BGA CPU) with threaded nanoX-ML-53/512-0 Ultra COM Express™ Type 1 compatible module with Intel® standoffs Atom™ processor Z530 at 1.6 GHz and 512 MB DDR2 THS-nML-B Low profile Heatsink for nanoX-ML (BGA CPU) with threaded standoffs 10 Extreme Rugged Ampro by ADLINK

9-28 COM Express™ Type 1 Reference Carrier Board nanoX-BASE with onboard PCIe to PCI Bridge

Features Six PCI Express® x1 (5 slots, 1 PCIe Mini Card slot) PCIe to PCI bridge, two PCI™ slots

Computer-On-Modules SDVO ADD2 card slot LPC based Super I/O (enable/disable) SDIO/MMC support, multiplexed on GPIO Dual BIOS (both LPC and SPI) Compatible with PICMG® COM Express™ Carrier Design Guide

Specifications Form Factor Connectors Core Module Interface PICMG® COM Express™ Revision 1.0 COM Express™ Connector AB only, one x 220-pin (Type 1) Supports Type 1 and Type 2, basic and “Ultra” form factor CRT DB15 on I/O panel for VGA/CRT displays modules LVDS Onboard 34-pin header Dimensions 305 mm x 240 mm (AT/ATX) TV-out RCA and S-Video connector Expansion Busses Five PCI Express® x1 slots Audio Mic/Line-in/Line-out and S/PDIF on I/O panel Two 32-bit PCI™ v2.3 slot SATA 4 SATA connectors 9 One PCI Express® Mini Card slot PCIe Mini Card One socket onboard (USB + PCIe x1) One SDVO ADD2 slot LAN 10/100/1000Base-T compatible RJ45 on I/O panel LPC bus header USB 2.0 Six on I/O panel, two on header and one through Mini Express Card BIOS / Debug Serial Port One DB-9 on I/O panel, one header onboard POST LED Onboard diagnostics for BIOS POST code data and address Parallel Port One header onboard on LPC bus KB/Mouse Two 6-pin mini DIN (on rear I/O panel) Allows single step BIOS execution SDIO/MMC SD socket for bootable storage or function extension Secondary BIOS Sockets for secondary LPC BIOS or secondary SPI BIOS on 2 carrier Feature Connectors SMBus, I C, module control signals, flat panel control signals Miscellaneous Pin Reset, Power LED, HDD LED, Buzzer Active Components Header PCI Express Switch PLX PEX8505 switch with PCIE0 input from module Power and Operation PCI Express to PLX PEX8112 bridge with PCIe x1 input from PEX8505 PCI bridge switch Connectors Standard ATX or 12 V terminals Super I/O Winbond WF83627DHG on LPC bus Switches Onboard RESET button and ATX mini switch Audio Codec Realtek ALC888 High Definition Audio Codec Digital I/O I2C to GPIO bridge PCA9535

9-29 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Functional Diagram

Analog VGA (CRT) USB0 DB25 USB1 4-port 2

Dual Channel LVDS 6U cPCI Blades Header USB2 USB Flat Panel Control signals USB3 Header

USB4 PCIe x16 Slot SDVO Flat cable in RJ-45 USB5 & RCA TV-out LAN 2-port 3 Platforms 6U cPCI S-Video USB USB7 Mini USB

SATA SATA0 USB7 s SATA1 PCIe (x1) s Card SATA CI pre

P 4 3U cPCI Blades x E SATA SATA2 Mini

SATA3 PCIe PCIe (x1) SATA PCIE0 (x1) PCIe x16 Slot Switch PCIe (x1) PEX 8505 PCIe x1 Slot

Audio 7.1 HDA / AC97 PCI Audio 5

Channel Platforms 3U cPCI Audio e Codec (x

ALC888 1 )

S/PDIF out AB PCI PCIe to PCI Slot PCI bridge GPIO / SDIO PEX 8505 PCI SDIO / MMC PCI Slot 6 PCIE1 (x1) & MBs Industrial SBCs Header PCIe x1 Slot

PCIE2 (x1) PCIe x1 Slot SMBus Header PCIE3 (x1) PCIe x1 Slot GPIO 7

Header Chassis Industrial PCA9535 LPT1 I2C Header COM1

COM2 EEPROM Super I/O LPC Winbond IrDA Feature / Control Signals W83627DHG 8 Header Accessories IPC PS/2 KB/MS

nd SPI LPC nd 2 SPI BIOS 2 LPC BIOS

9 Ordering Information On-Modules Computer- Carrier Model Number Description nanoX-BASE COM Express™ Type 1 Reference Carrier Board with onboard PCIe to PCI bridge 10 Extreme Rugged Ampro by ADLINK

9-30 Computer-On-Modules

Computer-On-Modules ETX® (Embedded Technology eXtended) is a PCI™/ISA based Computer-on-Modules that offers complete PC functionality within a 95 mm x 114 mm footprint

Best for customization The ETX®module includes most generic functions needed for almost any application, such as graphics, Ethernet,sound, IDE, FDD, keyboard/mouse, parallel, serial, and USB ports. ETX® modules are available in different performance levels with CPU speeds ranging from 300 MHz to 2.0 GHz.

A custom designed carrier board complements the ETX® core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplifies system integration. A single carrier board can be used with different ETX® modules when the 9 same functionality is required at different performance levels, allowing great ease in end product diversification. Software Support Fastest Time to Market To ensure software development does not lag behind The ETX® approach of custom carrier boards combined with hardware development, we provide a full set of BSPs to off-the-shelf Computers-on-Modules is an excellent solution get you up and running in no time. BSPs for the following when you need to customize, but lack the time or quantity operating systems are provided : for a complete design from the ground up. The average time Embedded Linux® Development Kit to design a carrier board is less than half of that for a full custom OEM board. ETX® is economically feasible for system Linux® BSP integration projects with production volumes in the range of Windows® CE .Net BSP 500 to 10,000 pcs per year. The ETX® concept is well accepted VxWorks® BSP and has numerous advantages over full custom designs. It reduces engineering complexity, lowers the threshold for total Windows® XP Embedded support project quantity, and last but not least, brings your product to the market in no time.

114 mm X4 X2 Ethernet ISA bus IDE1 / IDE2 Power Signals Speaker, Battery I2C & SMB bus

ETX® Core Module

X3 95 mm (Top View) X1 VGA / LCD/ Video COM1 / COM2 32-bit PCI™ bus LPT1/FDD USB IrDA Audio Mouse Keyboard

8-319-31 http://www.adlinktech.com/Computer-on-Module ® Selection Guide ETX 1 Procucts AdvancedTCA

Intel® AMD

2 6U cPCI Blades

3 ETX-NR667 ETX-AT ETX-GLX Platforms 6U cPCI CPU Type Intel® Core™2 Duo (Merom/Yonah) Intel® Atom™ up to 1.6 GHz AMD Geode™ LX800 up to 2.2 GHz with 4MB L2 cache with 512 KB L2 cache CPU Package µFC-BGA µFC-BGA BGU CPU Speeds / Numbers Celeron® M 423, 440 Intel® Atom™ N270 at 1.6 GHz LX800 @ 500 MHz Core™2 Duo L7400, U7500, L2400 4

FSB Speed 667/533 533 - 3U cPCI Blades Main Chipset Intel® 945GME with ICH7M Intel® 945GSE with ICH7M Geode™ CS5536 companion device System Memory 2 GB (max) 2 GB (max) 1 GB (max) Memory Type DDR2 667/533 MHz DDR2 533 MHz DDR 333 /400 MHz Soldered Memory - - 128/256 MB Socket Memory Max 2 GB on one 200-pin SODIMM Max 2 GB on one 200-pin SODIMM Max 1 GB on one 200-pin SODIMM 5 Cache (L2) L2 depends on processor type L2 cache 512 KB 128 KB Platforms 3U cPCI 1MB, 2MB or 4MB BIOS Type AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend Phoenix® Award BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI FWH, 4 Mbit Flash 6 & MBs Industrial SBCs Graphics Controller Intel® GMA 950 Intel® GMA 950 Geode GPU (intgr. in LX800) Graphics Memory max 256 MB UMA max 256 MB UMA max 254 MB UMA Integrated Display Support CRT (QXGA) CRT (QXGA) CRT (WUXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) TV-out (PAL/NTSC/HDTV) TV-out Focus (optional) Compatibillity OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* 9.0c 7 Chassis Industrial Parallel ATA (IDE) two channels, four devices two channels, four devices two channels, four devices Serial ATA two SATA 150 ports on module two SATA 150 ports on module two SATA 150 ports on module Matrix Storage Support optional (ICH7-M DH) - - Super I/O FDD/LPT shared, 2 Serial, PS2 KB/MS FDD/LPT shared, 2 Serial, PS2 KB/MS FDD/LPT shared, 2 Serial, PS2 KB/MS Ethernet integrated Intel® Ethernet (10/100) Realtek RTL8111C GbE (10/100) Intel® 82551QM Ethernet (10/100) USB 4 ports USB v2.0 4 ports USB v2.0 4 ports USB v2.0 8 Accessories IPC Audio ALC262 HDA Codec ALC262 HDA Codec ALC655 AC’97 Codec Watchdog Yes Yes Yes TPM Yes Yes - PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 2x PCI rev. 2.2, 32-bit, 33MHz ISA Support ITE8888 PCI/ISA bridge ITE8888 PCI/ISA bridge ITE8888 PCI/ISA bridge 9 2 2 Management Bus I C, Smbus I C, Smbus I2C, Smbus On-Modules Computer- Power 5V only (AT), 5V and 5Vsb (ATX) 5V only (AT), 5V and 5Vsb (ATX) 5V only (AT), 5V and 5Vsb (ATX) Power States S0 S1 S3 S4 S5 S0 S1 S3 S4 S5 S0 S1 S4 S5 Power Consumption 16 W with Core™2 Duo U7500 9 Watts typical with Atom™ N270 7 Watts typical with LX800 and at 1.06 GHz and 1 GB memory typical at 1.6GHz and 1 GB DDR2 typical 512MB DDR 333 typical Operating Temperature 0 ~ +60° Celsius 0 ~ +60° Celsius 0 ~ +60° Celsius 10 Extended Temperature selected modules: -20 ~ +70°C - - Extreme Rugged Ampro by ADLINK Compatibillity ETX® Rev 3.0 (SATA on module) ** ETX® Rev 3.0 (SATA on module) ** ETX® Rev 3.0 (SATA on module) ** Dimensions 95 x 114 mm 95 x 114 mm 95 x 114 mm Solid State Disk on module - - - BSP & Software Support Windows® XP/XPe, Windows® Vista Windows® XP/XPe, Windows® Vista Windows® XP/XPe / 2K / NT40 / WinCE Windows® CE, Linux® 2.6.x, AIDI Windows® CE, Linux® 2.6.x, AIDI Linux® 2.6.x, AIDI Page Number 9-33 9-35 9-37

** Note : ETX-3.0 and ETX 2.7 are 100% pin compatible on the board to board connectors (X1~X4), the ETX 3.0 revsision only adds SATA as connector on top of the module

9-32 ETX® Module with Intel® Core™2 Duo Processor ETX-NR667 and 945GME / ICH7-M Chipset

Features Intel® Core™ Duo/Core™2 Duo processor ® Computer-On-Modules Intel 945GME/ICH7-M chipset Maximum 2 GB DDR2 667 MHz SDRAM Single, dual 18/24-bit LVDS, TV out SATA, PATA, LAN, USB 2.0, and ISA

Specifications Core System Multi I/O CPU (BGA type) Merom Core BGA type IDE (PATA) Dual channel IDE with UDMA 33 support Intel® Core™2 Duo L7400, 1.5 GHz with 4MB L2 cache, 17 W SATA Two SATA ports on module Intel® Core™2 Duo U7500, 1.06 GHz with 2MB L2 cache, 10 W USB Up to four ports USB 2.0 Yonah Core BGA type Serial Two high speed RS-232C ports (COM1/COM2) Intel® Core™ Duo L2400, 1.66GHz with 2MB L2 cache, 15 W IrDA Supports SIR IrDA 1.1 compliant Intel® Core™ Duo U2500, 1.2 GHz with 2MB L2 cache, 9 W Parallel SPP, EPP, and ECP mode (pin out shared with FDD) 9 Intel® Celeron® M 423, 1.06GHz with 1MB L2 cache, 5.5 W FDD One drive (pin out shared with LPT) Memory Single SODIMM socket memory, max 2 GB of non-ECC, Keyboard & Mouse One PS/2 keyboard and one PS/2 mouse 533/667 MHz DDR2 Chipset Intel® 945GME Express Graphic Memory Controller Hub Power Specifications ® Intel I/O Controller Hub 7 Mobile (ICH7-M) Input Power AT mode (5 V only) and ATX mode (5 V and 5 Vsb) ® BIOS AMIBIOS 8 with CMOS backup Power States Supports S0, S1, S3, S4, S5 Hardware Monitor Supply voltages and CPU temperature Power Consumption 18 W typical (with Core™2 Duo U7500 and 1 GB memory) Watchdog Timer Programmable timer ranges to generate RESET Expansion Busses 32-bit PCI 2.3 Masters at 33 MHz Mechanical and Environmental ISA 16-bit Operating Temp. 0°C to 60°C SMBus/I2C Storage Temp. -20°C to 80°C Video Humidity 5% to 95% relative humidity, non condensing Shock 15G peak-to-peak, 11ms duration, non-operation Chipset 945GME GMCH integrated chipset supports dual Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis independent displays Operation: 0.5 Grms, 5-500 Hz, each axis CRT Interface Analog VGA support up to 2048 x1536 resolution Form Factor ETX® rev. 3.02, size 95 mm x 114 mm LVDS Interface Dual channel 18/24-bit with Chrontel 7308B on SDVO Certifications CE, FCC TV-out NTSC/PAL up to 1024x768 resolution, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Operating Systems Standard Support Windows® Vista 32/64-bit Audio Windows® XP 32/64-bit Chipset Integrated on Intel® ICH7-M Linux® 2.6.x Audio Codec Realtek ALC 268 HDA compatible Extended Support Embedded XP BSP Windows® CE 6.0 BSP LAN Linux® 2.6.x BSP Chipset ICH7-M integrated MAC with Intel® 82562 PHY AIDI I2C Library for Win32, WinCE and Linux® Interface 10/100 Mbps with Wake-on-LAN and Alert on LAN support

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CPU Celeron® M 4xx 2 Core™ Duo 6U cPCI Blades Core™2 Duo

Micro-FCBGA

3 Platforms 6U cPCI LAN PHY Intel 82562EZ SODIMM Northbridge DDR2 667 MHz ®

X4 PATA Intel 945GME IDE0/IDE1 PCIe DDR2 4

CRT VGA 3U cPCI Blades Memory Controller TV-out SDTV HDTV PCI / ISA SDVO_B IT8888G LVDS SDVO_C X2 Single/dual 18/24-bit CH7308B 5 Platforms 3U cPCI

Southbridge Intel® ICH7M SATA Ethernet MAC PCI PCI Bus Controller 6

IDE & MBs Industrial SBCs PATA PCIe to Audio Audio Codec PATA PCI RTC Realtek

SATA JML368 Express x1 USB 2.0 ALC268 X1 SATA SMbus SPI LPC Four port USB 2.0 I2C 7 Chassis Industrial Debug Keyboard header BIOS Mouse

Super I/O X3 LPT1/FDD Winbond W83627HG 8

COM1 Accessories IPC

COM2

Ordering Information 9 On-Modules Computer- Modules Accessories Model Number Description/Configuration Model Number Description/Configuration ETX-NR667-L7400 ETX® Module with Intel® Core™2 Duo L7400 processor at Heat Spreaders 1.5 GHz HTS-NR667-B Heatspreader for ETX-NR667 (BGA CPU) with threaded ETX-NR667-L2400 ETX® Module with Intel® Core™ Duo L2400 processor at standoffs 1.66 GHz 10 Passive Heatsinks Extreme Rugged Ampro by ADLINK ® ® ETX-NR667-U7500 ETX Module with Intel Core™2 Duo U7500 at 1.06 GHz THS-NR667-B Low Profile Heatsink for ETX-NR667 (BGA CPU) with ETX-NR667-423 ETX® Module with Intel® Celeron® M 423 processor at threaded standoffs 1.06 GHz Heatsink with Active Cooling THSF-NR667-B High Performance Heatsink with Fan for ETX-NR667 (BGA CPU) with threaded standoffs

9-34 ETX® Module with Intel® Atom™ Processor ETX-AT N270 and 945GSE/ICH7-M Chipset

Features Intel® Atom™ Processor N270 at 1.6 GHz ® Computer-On-Modules Intel 945GSE/ICH7-M chipset Up to 2 GB DDR2 533 MHz SDRAM Single/dual 18/24-bit LVDS and TV-out 2 SATA, 2 IDE (PATA), LAN, USB 2.0

Specifications Core System Multi I/O CPU BGA type IDE (PATA) Dual channel IDE with UDMA 33 Intel® Atom™ N270, 1.6 GHz with 512 KB L2 cache, 2.5 Watt SATA Two channels SATA-150 with connectors on module On-die, primary 32-kB instruction cache and 24-kB, (ETX-AT-N270-SD supports one SATA channel only) write-back data cache USB Supports up to four ports v. 2.0 Hyperthreading (2-thread) support Advanced gunning transceiver logic (AGTL+) bus driver Super I/O technology 9 Enhanced Intel SpeedStep® Technology Chipset W83627HG Source synchronous double-pumped (2x) Address Serial Two high speed RS-232C ports (COM1/COM2) Source synchronous quad-pumped (4x) Data IrDA Supports SIR IrDA 1.1 compliant C0 - C4 low power states supported Parallel SPP, EPP, and ECP mode (pin out shared with FDD) Memory Single SODIMM socket supporting : FDD One drive (pin out shared with LPT) - up to 2 GB of non-ECC, un-buffered, 533 MHz standard Keyboard & Mouse One PS/2 keyboard and one PS/2 mouse DDR2 SODIMM memory - Virtium SSDDR type module combining NAND flash SATA Solid State Drive (SATA SSD) and DDR2 memory on a single TPM SODIMM module (ETX-AT-N270-SD only) Chipset Infineon SLB9635TT1.2 ® Chipset Intel 945GSE Express Graphic Memory Controller Hub and Type TPM 1.2 Intel® I/O Controller Hub 7 Mobile (ICH7-M) BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS Hardware Monitor Supply voltages and CPU temperature Power Specifications Watchdog Timer Programmable timer ranges to generate RESET Input Power AT mode (5 V only) and ATX mode (5 V and 5 Vsb) Expansion Busses PCI 32-bit: PCI ver 2.3 at 33MHz, supporting 4 bus masters Power States S0, S1, S3, S4, S5 Fast ISA 16-bit (through PCI/ISA bridge) Power Consumption 9 W typical (with Atom® N270 and 1 GB memory) SMBus, I2C Mechanical and Environmental Video Operating Temp. 0°C to 60°C Chipset 945GSE GMCH integrated chipset supports dual Storage Temp. -20°C to 80°C independent displays Humidity 5% to 95% relative humidity, non condensing CRT Interface Analog CRT support up to 2048 x1536 resolution Shock 15G peak-to-peak, 11ms duration, non-operation LVDS Interface Dual channel 18/24bit with Chrontel 7308B on SDVO Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis TV-out NTSC/PAL , SDTV, HDTV supported (without Macrovision) Operation: 0.5 Grms, 5-500 Hz, each axis Form Factor ETX® rev. 3.02, size 95 mm x 114 mm Audio Certifications CE, FCC Chipset Integrated on Intel® I/O Controller Hub 7 Mobile (ICH7-M) Audio Codec Realtek ALC 262 HDA compatible Operating Systems Standard Support Windows® Vista 32-bit LAN Windows® XP 32-bit ® Chipset ICH7M integrated MAC with Intel® 82562 PHY Linux 2.6.x Interface 10/100 Mbps with Wake-on-LAN and Alert on LAN support Extended Support Embedded XP BSP WinCE 6.0 BSP Linux® 2.6.x BSP AIDI I2C Library for Win32, WinCE and Linux®

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CPU 2 Atom® N270 6U cPCI Blades

Micro-FCBGA

3 Platforms 6U cPCI LAN PHY optional SSDDR Intel DDR2 + SATA SSD 82562 EZ SODIMM 4 Northbridge DDR2 533 MHz ® X PATA Intel 945GSE IDE0/IDE1 4 3U cPCI Blades PCIe CRT VGA DDR2 Memory Graphic Controller TV-out SDTV Core HDTV 250 MHz PCI / ISA 2 SDVO_B IT8888G LVDS X Single/Dual 5 Platforms 3U cPCI 18/24-bit CH7308B

Southbridge ® 6 Intel ICH7-M & MBs Industrial SBCs SATA Ethernet MAC PCI PCI Bus Controller IDE

A PATA PCIe to Audio Audio Codec

PATA PCI RTC Realtek 1

SAT JML368 Express x1 USB 2.0 ALC268 X SATA 7 Chassis Industrial SMBus SPI LPC Four port USB 2.0

I2C BC Debug Header Keyboard BIOS TPM Mouse 8 Accessories IPC 3 Super I/O

X LPT1/FDD Winbond W83627HG COM1

COM2 9 On-Modules Computer- Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration ETX-AT-N270-18 ETX Module with Intel® Atom™ Processor N270 at 1.6 GHz Heat Spreaders with 18-bit integrated LVDS support 10 HTS-EAT-B Heatspreader for ETX-AT (BGA CPU) with threaded Extreme Rugged Ampro by ADLINK ETX-AT-N270 ETX® Module with Intel® Atom™ Processor N270 at 1.6 standoffs GHz with 24-bit LVDS support Passive Heatsinks ® ETX-AT-N270-18SD ETX Module with Intel Atom™ Processor N270 at 1.6 GHz THS-EAT-B Low Profile Heatsink for ETX-AT (BGA CPU) with threaded with 18-bit integrated LVDS and SSDDR support standoffs ® ETX-AT-N270-SD ETX Module with Intel Atom™ Processor N270 at 1.6 GHz SSDDR SSDDR by Virtium Technology Inc. is available in following with 24-bit LVDS and SSDDR support configurations: 1GB DDR2, 4GB-16GB SSD 2GB DDR2, 4GB-16GB SSD

9-36 ETX® Module with AMD Geode™ LX 800 ETX-GLX and SATA Support

Features Low power AMD Geode™ LX 800

Computer-On-Modules Display support for VGA, TFT LVDS, and TV-out USB 2.0, Serial ATA and IDE support Optional 128/256 MB DDR soldered onboard Serial Console, EEPROM CMOS backup, USB boot legacy

Specifications Core System Multi I/O CPU AMD Geode™ LX 800 CPU 500 MHz SATA One port for up to two ATAPI devices with UDMA support Memory Single SODIMM socket for up to 512 MB DDR at PATA (IDE) Two ports for up to four ATAPI devices with UDMA support 333/400 MHz USB Up to four ports USB 2.0 Optional 128/256 MB DDR at 333/400 MHz soldered on Serial Two high speed RS-232C module LPT/FDD Shared Total memory support 768 MB Keyboard & Mouse One PS/2 keyboard and one PS/2 mouse Chipset AMD Geode™ CS5536 companion device 9 BIOS Phoenix® AWARD 2 Mb Flash BIOS with ACPI and APM 1.2 power management with console redirection and CMOS Power Specifications backup in onboard EEPROM Input Power AT mode (5 V only) and ATX mode (5 V and 5 Vsb) Hardware Monitor Supply voltages and CPU temperature Power States S0, S1, S4, S5 Watchdog Timer 255-level timer generates system reset Power Consumption 7 W typical (LX800 with 512 MB DDR memory) Expansion Busses 16-bit ISA and 32-bit PCI rev. 2.2 Mechanical and Environmental Video Operating Temp. 0°C to 60°C Chipset Integrated on AMD Geode™ LX Storage Temp. -20°C to 80°C CRT Interface Analog VGA support up to QXGA 1920 x 1440 resolution Humidity 5% to 90% Non-condensing LVDS Interface 24-bit TFT supports resolutions up to 1280 x 1024 x 24-bit at Shock 15G peak-to-peak, 11ms duration, non-operation 60 Hz Vibration Non-operation: 1.88 Grms, 5-500 Hz, each axis TV-out (optional) VT1622A, supports NTSC/PAL Operation: 0.5 Grms, 5-500 Hz, each axis Form Factor ETX® rev 2.7, size 95 mm x 114 mm Audio Certifications CE, FCC Chipset Integrated on CS5536 Audio Codec AC’97 Realtek ALC655 codec Operating Systems Standard Support Windows® XP 32-bit LAN Windows® NT 2K Chipset Intel® 82551QM Linux® 2.6.x Interface 10BASE-T/100BASE-TX with TCP/UDP/IP checksum Extended Support Embedded® XP BSP off-loading and PXE boot support Windows® CE 5.0/6.0 BSP Linux® 2.6.x BSP AIDI I2C Library for Win32 and WinCE

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CPU DDR 400 MHz AMD Geode SODIMM Socket 2 LX800 6U cPCI Blades CRT

X4 DDR Memory DDR 400 MHz LVDS TTL soldered 18 or 24-bit Controller

TV-out PCI Controller PCI bus Focus FS455 3 (optional) AC’97 Codec Platforms 6U cPCI ALC 655 Audio X1

4x USB 2.0

Ethernet Mac/PHY PCI ver. 2.2 - 33/66 MHz 4 Intel 82551QM 3U cPCI Blades

Secondary IDE SATA PCI/SATA VIA 6421A SATA 5 Platforms 3U cPCI CS5536 I/O Companion

I2C PCI/ISA ISA bus

EEPROM Bridge X2 CMOS Audio IT8888G 6 backup & MBs Industrial SBCs Primary LPC USB 2.0 IDE

BIOS IrDA 7 Chassis Industrial Keyboard Super I/O Winbond LPC W83627HG header Mouse

X3 LPT1 / FDD 8 COM1 Accessories IPC

COM2

Ordering Information On-Modules Computer- Modules Accessories Model Number Description/Configuration Model Number Description/Configuration ETX-GLX-800/0 AMD Geode™ LX 800 module Heat Spreaders ETX-GLX-800/128 AMD Geode™ LX 800 module with 128 MB DDR soldered HTS-GLX Heatspreader for ETX-GLX with threaded standoffs ETX-GLX-800/256 AMD Geode™ LX 800 module with 256 MB DDR soldered 10 Extreme Rugged Ampro by ADLINK

9-38 ETX-Proto ETX® Reference Carrier Board in ATX Form Factor

Features Four PCI slots, three ISA slots, one Mini PCI slots Computer-On-Modules POST Code Diagnostics Secondary Multi I/O Disk-On-Chip and CF Card support Audio Amplifier

Specifications Audio Core System Type Onboard amplifier with Line-In, Speaker-out and Mic (on rear Core Module Interface ETX® ver 2.7 (3.0) I/O panel) Board Form factor 304.8 mm x 190 mm (ATX) Expansion Busses Four 32-bit PCI slots Video Three16-bit ISA slots One MiniPCI slot CRT DB25 connector for analog VGA displays (on rear I/O panel) POST LEDs Onboard diagnostics for BIOS POST codes LVDS Onboard header supporting 36-bit LVDS 9 TV-out Onboard header for PAL/NTSC TV IDE Support Four IDE devices (two connectors) Parallel Port One port SSP, ECP, and EEP mode Serial Port Two 16550 compatible RS-232 ports (COM1/2) POST Code Display Two additional ports COM3/4 from secondary multi I/O KB/Mouse Two 6-pin mini DIN connectors (on rear I/O panel) LED 2-digit 7-segment LED display USB Four ports (on rear I/O panel) v1.1 and v2.0 compatible Function Displays POST (Power On Self Test) code LAN RJ-45 (on rear I/O panel) Audio Line-In/Out, Speaker-out Power and Operation Video TV-out (NTSC , PAL), LVDS 32-bit Connectors ATX and AT (P8/P9) onboard Switches Onboard RESET and ATX switch Secondary Multi I/O FDD Up to two floppy drives Serial One 16550 compatible RS-232 ports (COM3), one RS-232/422/485 Compatible port (COM4) and one IrDA header Parallel Secondary parallel port Manual says F75111R is a low power general purpose IO chip providing 20 GPIO. (p.8, Sec. 1.1)

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LPT2 2

COM3 6U cPCI Blades IDE0 FDC37C869 secondary COM4 IDE1 Super I/O

Power Signals FDD2 I I I 3 Ethernet S Platforms 6U cPCI

2 S ISA bus A S I2C bus A X4 A X 1 SMbus 2 3 F75111R DiskOnChip 20-bit GPIO 20-bit GPIO and watchdog socket 4 3U cPCI Blades

W83782D H/W Monitor 5 Platforms 3U cPCI

CRT VGA

Dual channel LVDS 6 & MBs Industrial SBCs 4x USB Video-out Amplifier Audio Keyboard X1 X3 P Mouse CP 7 PCI bus CP Chassis Industrial I P LPT1 I C I C 1 I FDD 2 3 4 COM1 8 Accessories IPC Mini COM2 PCI

IrDA 9 On-Modules Computer- Ordering Information Carrier Model Number Description/Configuration ETX-Proto ETX® Reference Carrier Board in ATX form factor (includes CF socket assembly, UDMA HDD cable, SATA 10 cable, FDD cable, TV-out cable) Extreme Rugged Ampro by ADLINK

9-40 This Computer-on-Module Starter Kit gets you going with Starter Kit - ETX Carrier Board Design and Software Verification in no time

Features ETX module of choice CPU, Memory of choice Computer-On-Modules Thermal Solution (heatspreader, and heatsink) of choice Reference Carrier Board Schematics, Design Guide, and User Manuals ADLINK USB Stick with Documentation, Software, and BSPs

The Starter Kit consists of an ETX® core module with reference carrier board that offers four PCI slots, three ISA slots, SDVO, CRT, LVDS, TV-out, USB 2.0, LAN, and Super I/O.

The Starter Kit comes with full baseboard schematics, ETX® design guide, product manuals and BSP. Everything needed to get a user going with his own baseboard design and software verification in no time.

Contents Ordering Information 9 Standard Items ADLINK provides “Custom Starter Kit” services. We offer several options for you to select your preferred items for your • ETX-Proto evaluation carrier board application development. • Accessory kit: The starter kit contains the following items: - IDE cable - SATA cable Select a core module, memory, - TV out cable thermal solution, and CPU (for socket - CF adapter type) according to your needs - USB Memory Stick with documentations, drivers, libraries, and BSP for Linux, WinCE, Embedded XP - Baseboard design guide and product manual Optional Items Contact an ADLINK sales representa- • ETX® module of choice tive in your region • Socket type CPU of choice • Memory of choice • Thermal solution of choice (heatspreader, heatsink)

Get the specific part number for your starter kit

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2 6U cPCI Blades

3 Platforms 6U cPCI

4 3U cPCI Blades

5 Platforms 3U cPCI

COM Express 6 & MBs Industrial SBCs

7 Chassis Industrial

8 Select an ADLINK ETX or COM Express development kit. Accessories IPC

9 On-Modules Computer-

10 Extreme Rugged Ampro by ADLINK

Add the ETX/COM Express module of choice to you new

9-42 Computer-On-Modules

COM Express

Select an ADLINK ETX or COM Express development kit.

Add the ETX/COM Express module of choice to you new

9-43 http://www.adlinktech.com/Computer-on-Module 1 Procucts AdvancedTCA Get Three Carrier Board Samples in just 30 Working Days! Don’t want to spend the time and resources on developing your own carrier boards? No problem! With our carrier board design service, you will receive samples in only 30 working days! Designing a custom carrier board is fast and cost-effective compared to a full custom solution. We will help get your product to market in a minimum amount of time and for a fraction of 2 6U cPCI Blades the cost. Of course, if you still decide to design your own carrier boards, we will support you with relevant schematics.

Inquiry and Evaluation Carrier Inquiry to Sales The ADLINK sales team receives your carrier board design service inquiry. A meeting with our Carrier Design Team is arranged to evaluate the request. 3 Platforms 6U cPCI Project Evaluation Meeting Duration 2 days

Functional an Mechanical 3U cPCI Blades Specifications from Customer Customer Specifications and Quote After the evaluation meeting, any additional specifications with mechanical dimensions and constraints are submitted by you. The quotation is Quote to Customer prepared based on this information. 5 Duration 1 week Platforms 3U cPCI Customer agrees with Quotation 6 ADLINK produces specification and Engineering Specifications & MBs Industrial SBCs mechanical draft Our R&D department will prepare the Engineering Specification Draft that reflects the technical implementation of you functional and mechanical specifications. Once agreed, you simply submit the signed draft and pay the NRE fee and production will begin. Customer confirms draft Duration 2 weeks 7

and pays NRE Chassis Industrial

30 Days to Samples 30 Working Days During the 30 working days production cycle, schematics and layout are for 3 Product Samples finalized while project specific components are ordered. PCB production 8 then begins, followed by SMT/DIP and system debug. Carrier board Accessories IPC documentation and packaging is also prepared.

3 Carrier Board 9

Sample Evaluation On-Modules Computer- Samples to Customer You will be provided with three samples for evaluation. After your approval, full production will begin.

Customer Evaluation Duration 2 weeks And Approval 10 Production Stage Extreme Rugged Ampro by ADLINK Production Phase Production includes PCB manufacturing, part procurement, SMT, and QC.

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