Highrel PC/104 ISA, PCI & Pcie Modules and Systems

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Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply.

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PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply

SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge the property of their respective companies. the property of their respective Inc. All rights reserved. Inc. Embedded Technologies, The Leading Source for Express. RTD Design, Engineering, Manufacturing & Tech Support Copyright © 2010Copyright All trademarks or registered trademarks are All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com

Volume 14 • Number 5

COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing SFF designs next year By Robert A. Burckle, WinSystems By Jim Blazer

8 Euro Small Tech 16 Outside the black box: Small controllers push shopping cart production Focusing designs on I/O By Hermann Strass By John Hentges, ACCES I/O Products

26 Editor’s Insight SFF Rx for medical device design challenges 20 BUYER’S GUIDE By Jennifer Hesse 2011 PC/104 and Small Form Factors Buyer’s Guide 3.5-inch COM Express WEB RESOURCES COM/SOM Subscribe to the magazine or E-letter Industrial automation Live industry news • Submit new products Mini-ITX http://submit.opensystemsmedia.com Packaging and power supplies White papers: PC/104 Read: http://whitepapers.opensystemsmedia.com PC/104-Plus Submit: http://submit.opensystemsmedia.com PCI/104-Express Pico-I/O Rugged/Mil-Spec SUMIT

ON THE COVER: SFFs require interoperability to allow different manufacturers’ products to work together like gears in a well-oiled machine. Designers’ mission, if they choose to accept it, is to build compatible components by adhering E-CASTS to industry standards and using proven interconnect technologies. Register at http://ecast.opensystemsmedia.com Enabling Telehealth Devices with Embedded Computing Presented by Microchip and Grammatech Published by: November 16, 2 p.m. EST

2010 OpenSystems Media® © 2010 PC/104 and Small Form Factors Four Key Strategies for Enabling Innovation in the Age of Smart All registered brands and trademarks in PC/104 and Small Form Factors are property of their respective owners. Presented by IBM ISSN: Print 1096-9764, ISSN Online 1550-0373 November 17, 2 p.m. EST

Take Your Design to the Next Level with Intel Atom Presented by Advantech, Microsoft, Intel Embedded Alliance 4 / Winter 2010 PC/104 and Small Form Factors December 14, 2 p.m. EST TS-WIFIBOX-2 A Complete Solution for 802.11g WiFi Applications Military EMBEDDED SYSTEMS

Military & Aerospace Group qty 1 Chris Ciufo, Group Editorial Director Hermann Strass, European Representative 185 [email protected] [email protected]

Jennifer Hesse, Assistant Managing Editor Konrad Witte, Senior Web Developer [email protected] Steph Sweet, Creative Director Sharon Hess, Assistant Managing Editor [email protected] Joann Toth, Senior Designer Terri Thorson, Senior Editor (columns) David Diomede, Art Director [email protected] Matt Jones, Web Developer Monique DeVoe, Web Content Editor [email protected] Phyllis Thompson, Circulation/Office Manager Powered by a Christine Capuano, Web/Editorial Assistant [email protected] 250 MHz ARM9 CPU Sales Group Low power (3.2 watts), fanless Dennis Doyle, Senior Account Manager Regional Sales Managers [email protected] Barbara Quinlan, Midwest/Southwest Power via 5-12 VDC, USB, PoE (opt.) [email protected] Tom Varcie, Senior Account Manager 64MB DDR-RAM [email protected] Denis Seger, Southern California 256MB ultra-reliable XNAND drive [email protected] Rebecca Barker, Strategic Account Manager Micro-SD Card slot [email protected] Sydele Starr, Northern California [email protected] RS-232, RS-485, CAN, RTC Bridget Hildebrand Strategic Account Manager Ron Taylor, East Coast/Mid Atlantic Header with SPI and 11 DIO [email protected] [email protected] 480Mbit/s USB, Ethernet, PoE option Christine Long, Digital Content Manager Ad Coordinator [email protected] Steph Sweet Boots Linux 2.6.24 in < 3 seconds [email protected] International Sales Un-brickable, boots from SD or flash Dan Aronovic, Account Manager – Israel Reprints and PDFs [email protected] Customizable FPGA - 5K LUT Plus Nan Holliday Optional DIN mountable enclosure Elvi Lee, Account Manager – Asia 800-259-0470 [email protected] [email protected] Ideal for gateway or firewall, protocol Editorial/Business Office converter, web server, WiFi audio, and unattended remote applications 16626 E. Avenue of the Fountains, Ste. 203 Vice President Editorial: Rosemary Kristoff Fountain Hills, AZ 85268 Vice President Marketing & Sales: Over 25 years in business Tel: 480-967-5581 ■ Fax: 480-837-6466 Patrick Hopper Website: www.opensystemsmedia.com Never discontinued a product [email protected] Publishers: John Black, Michael Hopper, Business Manager: Karen Layman Engineers on Tech Support Wayne Kristoff Open Source Vision

Page Advertiser/Ad title Page Advertiser/Ad title Custom configurations and designs w/ 8 ACCES I/O Products, Inc. – USB embedded I/O solutions 3 RTD Embedded Technologies, Inc. – excellent pricing and turn-around time 11 Advantech Embedded Group – Intel Atom E6xx Catch the express Most products ship next day processor series 14, 15 RTD Embedded Technologies, Inc. –

INFO 2 Diamond Systems Corporation – Blurring speed HighRel PC/104 ISA, PCI & PCIe modules and systems in a remarkably small package 5 Technologic Systems – TS-WIFIBOX-2 25 EMAC, Inc. – Low cost, low power PC/104+ 7 Tri-M Systems Inc. – PC/104 FlexTainer rugged 13 Excalibur Systems, Inc. – Dense? aluminum enclosure 9 IEI Technology USA Corp. – Fanless Intel Atom D525 25 Tri-M Systems Inc. – Intel Pentium M 745 1.8GHz, processor family 2MBL2, ATX Technologic 27 LiPPERT Embedded Computers – Embedded PCs 24 VersaLogic Corp. – The Leopard moves FAST! SYSTEMS COMplete 17 WDL Systems – The power inside tomorrow’s 19 Logic Supply – Extreme environment solutions technology We use our stuff. 28 WinSystems, Inc. – Embedded Atom SBC with 9 RAF Electronic Hardware – RAF male-female stacking visit our TS-7800 powered website at SUMIT expansion

ADVERTISER spacers www.embeddedARM.com (480) 837-5200 Enabling SFF systems: More than just CPUs I’ve written earlier about SFF-SIG’s holistic view of the Small solution and test-marketed its general parameters with a variety Form Factor (SFF) market and the need for multiple standards in of CPU manufacturers outside of SFF-SIG. The results were various technology arenas to truly enable the design and imple- positive, with excellent feedback regarding how to make the mentation of open, interoperable SFF systems. The need goes far solution applicable across a wide variety of CPU solutions and beyond that for SFF CPU and I/O boards. Other areas for consid- form factors, even with form factors not currently supported by eration of new standards include memory modules, display inter- SFF-SIG members. faces, thermal solutions, enclosures, and more. In reality, this is a lot easier to talk about than to do. Each of these areas has its own The group is working to fully define the specification and will set of experts and suppliers. It’s tough to get a bunch of CPU sup- initiate testing to determine if the solution truly meets the needs pliers to talk about I/O boards. It’s even of rugged SFF systems. We expect to tougher to get them to talk (intelligently) “It’s tough to announce the details of the specifica- about enclosures and display interfaces. tion in early 2011. Meanwhile, the draft specification will only be available to SFF-SIG has indeed delivered in this get a bunch of CPU SFF-SIG members. space by issuing standards for interfaces (SUMIT and COMIT), form fac- suppliers to talk about This experience only serves to reinforce tors for CPU boards (SUMIT-ISM and the perspective that industry subject- Pico-ITXe), I/O boards (SUMIT-ISM matter experts are needed to drive stan- and Pico-I/O), and replaceable expan- I/O boards. It’s even dards as we move outside the realm of sion storage (MiniBlade). Despite this CPU and I/O boards. SFF-SIG is provid- success, I’d certainly hoped to be farther ing a “big tent” for members from various along on “other areas for consideration” tougher to get them technology areas to meet and discuss the by this time. To do so requires bringing unique needs of SFF systems. In the case together key experts in these other areas to talk (intelligently) of the Rugged Memory Working Group, to define new standards under SFF-SIG we have the technology suppliers (the auspices. SFF-SIG is much more about memory suppliers) in a give-and-take broad member involvement and healthy about enclosures and debate with technology users (the SBC debate than simply rubber-stamping and COM suppliers) to ensure that the ideas submitted by members. display interfaces.” solution is viable and meets real needs in the market. That said, I am pleased to report significant progress in one of these areas – rugged SFF memory SFF-SIG welcomes proposals and participation from other tech- expansion. Our investigation into this area was based upon the nology suppliers to initiate and drive efforts in the SFF space. supposition that standard SODIMM solutions are inadequate for While each of these individual areas has its own well-established rugged, high-reliability applications requiring superior resistance standards group, no other organization has the SFF focus that to shock and vibration, even with clips, straps, glue, or other tie- is critical to the growth of the embedded market going forward. down mechanisms. We also considered that soldering memory This focus is orthogonal to each of the individual building blocks, chips directly onto a CPU board has been shown to result in prod- but is essential to tackle the overarching system trade-offs. Your uct mix, forecasting, and inventory challenges, and is desirable expertise is both welcomed and respected. Information about the primarily for custom CPU boards. SFF-SIG can be found at www.sff-sig.org.

In July, SFF-SIG initiated a Rugged Memory Working Group Small Form Factor SIG under the leadership of Virtium Technologies. Four memory 408-480-7900 suppliers and four manufacturers of SBC and COM CPU prod- [email protected] ucts have provided input and participated in this working group. www.sff-sig.org After much discussion, the group narrowed down a potential

6 / Winter 2010 PC/104 and Small Form Factors Promotions and spec revisions on tap for next year The annual PC/104 and Small Form Factors Buyer’s Guide signals that we are nearing the end of the year, and the global economy has many saying good riddance. The PC/104 Embedded Consortium is looking ahead to next year by planning how to best promote the PC/104 architecture worldwide.

For the past year, the PC/104 Embedded Consortium has concentrated on advancing our specifications and reviewing technical proposals for our specifications. Our Marketing Committee, headed by Michele Kasza of Connect Tech, continues to do an excellent job. The committee planned and coordinated trade shows, media opportunities, and website activities. Next year’s activities include attending the ESC Silicon Valley, Real Time & Embedded Computing Conference Santa Clara, and Embedded World trade shows. Other committee efforts will involve articles, press releases, and incremental website updates.

The Consortium will continue to provide member benefits including media partner programs offering user surveys and discounted print and online sponsorship opportunities. Our media partners have developed articles and placement options and encouraged member-contributed articles. The Consortium is always looking for article ideas, so if there is a PC/104-related topic you have been waiting to read about, contact the PC/104 Embedded Consortium office at [email protected].

Technical Committee Chairman Jonathan Miller of Diamond Systems is working on a major specification revision that should be out for member vote soon. I can’t really say much about it yet, as it has not been publically released, but I’m sure it will once again advance the stackable PC to the benefit of all members.

If you have not visited the PC/104 Consortium website at www.pc104.org lately, I encourage you to do so. We have been making additions and continuous improvements to the site. The board plans to open a design examples section sometime next year. The website allows you to keep abreast of the latest specifications for free and provides a product section where you can search by specification, member company, product type, or keyword. The product directory includes a picture, description, hotlinks, and company contact info for each product. If your company does not have its products listed in the directory, you are missing a great benefit of Consortium membership.

It is critical for the PC/104 Embedded Consortium to present a clear and focused presence of PC/104 technology to avoid confusion in the marketplace. We must protect the Consortium’s trademarks, copyrights, and IP to safeguard members’ investments. We will continue monitoring technological advancements for possible inclusion into the PC/104 architecture.

The PC/104 Consortium fosters open communications with members through its open member forum at every board meeting and keeps technical and marketing committees open to voting and nonvoting members (as observers). If you are interested in participat- ing in the PC/104 Embedded Consortium or on a committee, contact Jeff Milde at the PC/104 Consortium office.

PC/104 Consortium 916-270-2016 • [email protected] • www.pc104.org

PC/104 and Small Form Factors Winter 2010 / 7 Small controllers push shopping cart production

Welding under SFF control use it today (see Figure 1). The inventor In 1937 Sylvan Goldman invented an early version of the shopping cart, called a founded Wanzl GmbH, which is currently “folding basket carrier,” which had a pair of large wire baskets attached to tubular metal the world’s largest producer of shopping arms with four wheels. In 1950 Rudolf Wanzl patented the stackable shopping cart as we carts, with 40 percent market share in China and 80 percent in Germany. Wanzl also produces similar equipment for air- ports, hospitals, and warehouses. Most of these products are made from welded steel wire nettings of different sizes and geometries.

High-quality welding machines have a long lifespan. The welding process does not change over time; however, the control electronics need to become faster, more flexible, and more precise. Wanzl is replacing older electronic control systems on its welding equipment with modern Speedway-767 small form factor modules from WAGO. These modules are positioned directly on the large machines, which they control in a decentralized setup, and are linked together and to upper-layer controllers using industrial Ethernet or fieldbus (see Figure 2).

The Speedway-767 system family includes master modules (75 mm x 117 mm) for uplink communication and up to 64 I/O modules (50 mm x 117 mm) per master module for connection to sensors and actors. All modules are linked via a serial cable bus. Because of the dis- tance between the modules (up to 500 m total), a backplane bus cannot be used. Mechanical mounting on a C-Clamp (DIN-rail) is optional.

Flexible electronic control is needed to precisely weld different diameter steel wires into nets of different geometries. Wires are held in position by magnets until welded. The distributed processor and I/O modules are linked via the serial bus for reliable operation in an electromagneti- cally polluted environment. Measuring 25 mm or more in height, the individually enclosed SFF boards are ingress-protected according to IP67 (akin to NEMA 6.6P), ensuring protection against dust and water. The fanless system has an operating temperature range from -25 °C to 8 / Winter 2010 PC/104 and Small Form Factors Figure 1 | Manufacturing Wanzl’s shopping carts and other products requires electronic control systems to manage the welding equipment used for connecting the steel wire nettings.

+65 °C. Uplink communication is pro- an industrial bonding technology trade vided via industrial Ethernet (EtherNet/IP, show, MOTEK covered topics including PROFINET, SERCOS III) or fieldbus mechatronics, education and research, (CANopen, MODBUS, PROFIBUS). and medical equipment assembly. More The software tool WAGOframe is used to than 1,000 companies from 23 countries set parameters according to standardized presented their products to more than Field Device Type/Device Type Manager 31,000 experts from 82 countries. (FDT/DTM) procedures. A CoDeSys software package based on the IEC 61131-3 InnoTrans, one of the world’s most prom- standard is supplied with Speedway-767 inent trade fairs for railway technology, systems. was held September 21-24 in Berlin. More than 106,000 visitors from 110 countries, Industrial technology events not including the general public during WAGO exhibited its products at two recent the weekend opening after the fair, had events in Germany. MOTEK, an interna- the opportunity to preview 2,400 exhibi- tional trade fair for assembly line and pro- tors’ products, some of which were based duction handling automation equipment, on small form factor modules designed was held September 13-16 in Stuttgart. for control electronics. Colocated with MICROSYS, a nano- technology trade show, and BONDexpo, For more information, contact Hermann at [email protected].

RAF Male-Female Stacking Spacers

Use these precision-made components to build structurally secure standalone stacks. Compatible with more than 100 different PC/104 ultra-compact bus board modules.

Figure 2 | The Speedway-767 small form factor controller module from WAGO provides uplink communication via Ethernet or fieldbus. www.rafhdwe.com PC/104 and Small Form Factors Winter 2010 / 9 THE BIG YET SMALL PICTURE Mission interoperable Achieving compatibility by standardizing SFF designs

By Robert A. Burckle

Without standards, chaos would result when implementing module-level designs in ways that best fit each particular application. Modules would be incompatible with other manufacturers’ products and perhaps even with engineers’ own previous designs. Basing designs on industry standards such as SFF-SIG’s specifications provides interconnection with a variety of boards and support for current and future I/O technologies.

nteroperability is the ability of a system Interoperability is required at multiple help companies utilize SFF technologies or a product to work with other systems or levels to allow different manufacturers’ in their products to protect their invest- Iproducts. Major well-known programs, products to work with each other. One ments over the long term. With a focus on from weapon systems to Microsoft’s IT key question designers need to address ultra-low-power and mobile processors initiatives, have been conducted to deliver is: At what level of definition and inte- including the Intel Atom and VIA Nano innovative solutions in mixed environ- gration should standards be defined and processor families, the SIG aims to blend ments. The same logic applies to the implemented? This is a difficult question high-speed PCI Express and USB serial designer using Small Form Factor (SFF) because it involves balancing the conflict- buses with Serial Peripheral Interface boards, as interoperability builds customer ing issues of including too much versus (SPI), Low Pin Count (LPC), and SMBus choice, drives developer innovation, and too little specification detail. However, (I2C) buses in a compact, cost-effective grows industry opportunity. answering the detail question is essential manner. when considering a standard’s impact on The main way to achieve interoperability SFF boards. It took the SFF-SIG four months to define in SFF designs is by adhering to and Stackable Unified Modular Interconnect building upon industry standards. For Consolidating I/O ecosystems Technology (SUMIT), a form factor- and SFF-based designs, this applies to board The SFF-SIG took up this challenge as it processor-independent connector stan- size, CPU and I/O architecture, software set out to define stackable solutions for dard. SUMIT connectors take up a very compatibility, connectorization, and next-generation embedded systems. The small amount of space on SBCs or I/O packaging. Each has a significant element SFF-SIG’s charter is devoted to identify- cards yet support tremendous processing to play. ing, creating, and promoting standards that power. Unifying the expansion interfaces 10 / Winter 2010 PC/104 and Small Form Factors on SBC form factors has the potential SUMIT A Connector SUMIT B Connector to consolidate I/O ecosystems, which 2 52 2 52 improves economies of scale for I/O (see Figure 1).

SUMIT is an electromechanical connectorization specification using two 52-pin 1 51 1 51 high-density (0.025" pitch) connectors Contains Contains with center ground blades for impedance, PCI Express x1: One PCI Express x1 & x4 EMI, and DC ground return purposes. USB 2.0: Four or LPC (Low Pin Count) Bus PCI Express x1: Five Each connector is optional depending SPI/Microwire Power on the target applications of a particular SMBus/I2C Bus Ground SBC. The SUMIT Type A connector con- ExpressCard Control Signals tains one PCI Express x1 lane, four USB Figure 1 | SUMIT supports standard expansion buses on a stackable connector. ports with a global overcurrent signal, LPC bus for expansion serial ports and other legacy I/O, SPI/Microwire, and a general-purpose I2C bus typically connected to SMBus for x86 chipsets. The multitude of low-speed buses available on SUMIT enables a smooth transition away from the long-standing ISA bus, which most of the embedded market uses for tasks like switching on relays or low-rate data acquisition.

The SUMIT Type B connector adds another PCI Express x1 lane and a x4 lane, primarily for storage/RAID, networking, video output or frame grabbers, high-speed acquisition, and scientific applications. There are three configurations defined as SUMIT A, SUMIT B, and for both connectors, SUMIT AB. Form factor details are distinct from the SUMIT connector and pinout details, and are therefore left to those respective specifications. This allows the smaller SUMIT-enabled interconnect solution to be used on a variety of boards, from 60 mm x 72 mm Pico-I/O modules to 5.75" x 8.0" EBX-sized boards.

SUMIT maps well to the new single- chip chipsets for sub 10 W designs and closely follows the trend of replacing parallel interfaces with high-speed serial interfaces. Another stackable expansion interface that was defined by a different organization was principally for three- chip x86 solutions, but it doesn’t scale down to the low cost, space, and power needed in today’s two-chip x86 platforms. PCI Express is replacing parallel PCI, Serial ATA is replacing Parallel ATA (PATA, or IDE), and GbE and USB 2.0 are gradually replacing serial ports and other cabled board-to-board or board-to- peripheral interfaces. SUMIT supports the legacy peripherals that are still pervasive in many applications by allowing external LPC-to-ISA bridges plus LPC UART and PC/104 and Small Form Factors Winter 2010 / 11 THE BIG YET SMALL PICTURE Mission interoperable

super I/O devices, with legacy interrupt using the same form factor and usually The main reason the SFF-SIG defined support provided through the essential the same enclosure. SUMIT-ISM was to continue module SERIRQ serial interrupt signal. interoperability by supporting existing The ISM Specification provides an customers who have designed or pur- Maintaining legacy support explicit form-factor-only definition upon chased PC/104 modules for years. Roughly Interoperability among different form which the SUMIT-ISM Specification is 50-80 percent of existing customer stacks factor SBCs and stackable I/O cards took built. Because the SUMIT Specification include PC/104 (ISA) bus cards. If de- a leap forward with the introduction of defines only a board-to-board interface signers are using the original PC/104 bus SUMIT as a low-risk, small-footprint, (connectors and pin definition), the modules, they don’t want additional stack and high-performance next-generation ISM Specification is necessary to define height or software changes for existing system interconnect. But to be used in a the form factor while the SUMIT-ISM I/O cards from third-party vendors or meaningful way, the SUMIT connector Specification defines how SUMIT is the customers themselves. SUMIT-ISM had to be integrated onto several different implemented on ISM. allows them to preserve the size envelope board sizes. One problem the SFF-SIG but doesn’t tie them down to the older I/O identified was PC/104 boards’ incom- To support a variety of legacy 90 mm x expansion. Furthermore, SUMIT-ISM is patibility with other proposed stackable 96 mm modules marketed as PC/104 future-proof, as it includes only standard PCI Express solutions. Therefore, the or PCI-104 on a SUMIT-ISM stack, the x86 buses and interfaces that are included SFF-SIG defined an Industry Standard SUMIT-ISM Specification offers design in x86 chipset vendors’ current offerings Module (ISM) and ISM with SUMIT to flexibility while it maintains compat- and roadmaps for years to come. fill this void. ibility. The SUMIT-ISM Specification defines two legacy stack types using slot- Many companies have added SUMIT The 90 mm x 96 mm board size has ted mounting holes on ISM to provide connectors on EPIC and EBX SBCs for become an industry standard; however, symmetry not found with PC/104. stackable I/O. The SFF-SIG has also there are multiple variations with con- SUMIT-ISM can thus be created with defined a new, smaller SUMIT-enabled nectors located in different parts of the legacy support for either the PC/104 ISA I/O module called Pico-I/O, which is half board. Separating connector issues from bus or the PCI-104 PCI bus by allowing the the size of a 90 mm x 96 mm board (see the expansion board form factor lets a module to be rotated 180 degrees as neces- Figure 2). designer choose a different connector sary to fit the legacy type required while and place it where it’s most appropriate maintaining the SUMIT interface. Legacy Stackable I/O for the on the board. By sticking to the 90 mm x bus support can be supplied by the CPU next generation 96 mm “PC/104” form factor and mount- and maintained up the stack or provided Designers requiring future-proofing capa- ing holes, a system can be upgraded through a bridge module in the stack. bility for embedded systems with interoperable, stackable I/O and leading-edge technology such as PCI Express can use SUMIT to work seamlessly with different next-generation mobile and low-power processors. SUMIT’s standardization enables interoperability in a multi-vendor, multi-board, multi-form-factor environment, which explains why so many new products conform to this standard. For more information on the SUMIT and SUMIT-ISM Specifications, visit www.sff-sig.org/sumit.html. ➤

Robert A. Burckle is VP of WinSystems. He has 30-plus years of experience in embedded computing and earned both Bachelor’s and Master’s degrees in Electrical Engineering from the University of Louisville plus an MBA from the University of North Texas. WinSystems 817-274-7553 [email protected] Figure 2 | SUMIT connectors on an EBX-sized board offer mounting hole patterns for both www.winsystems.com Pico-I/O and SUMIT-ISM. 12 / Winter 2010 PC/104 and Small Form Factors

Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. AS9100 and ISO9001 Certified A Founder ofthe PC/104 Consortium ECC Memory availableECC Memory onPentium M. visit www.rtd.com for Expansion

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interface. CME147786CX650HR Drive T VSLVDS LVDS TTL CML147786CX650HR TM

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CME137686LX500HR plus TM Wireless Telematics Communication Modules Video Controllers Frame Grabbers Specialty I/O dspModules™ Power Supplies Bridge Modules Mass Storage Motion Controllers • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Accelerated conduction cooling withadvanced MIL-STD-704/461 PCI/104-Express PC/104 &PC/104- PCI to PCIe to expressMate CompactFlash 1.8/2.5” IDE&PCMCIA Synchro, Resolver, LVDT DC Motor Controllers GPS &Wi-Fi EDGE, GPRS, SMS GSM &GSM-R USB 2.0andFireWire Copper orFiber Ethernet 5-Port Ethernet Switch Express Dual1GEthernet TTL andDVI Analog VGA MPEG-2 Compression Single orMulti-channel Opto-Isolated MOSFET Incremental Encoder Pulse Width Modulator Coprocessors &Accelerators UPS Backup ATX 50/75/83/88/100 Watts Octal PCISerial Dual Synchronous Serial CAN heat pipesandfins Power Bus&CAN ISA PCI Supplies panels TM Spider TM Plus Family TM

DIGITAL ANALOG Bus Advanced Advanced Digital I/O Analog Out Analog Input Features Features

SDM7540HR

SDM8540HR

DM6420HR

DM6425HR

DM6430HR

DM7520HR

DM6812HR

DM6814/16HR

DM6888HR

DM7820HR

DM8820HR

DM9820HR

FPGA7800HR HighRel PC/104 ISA, PCI & PCIe Modules and Systems -40 to +85°C

Data Acquisition Wireless Telematics TI 8000 MIPS dspModuleTM

Smart A/D Analog I/O Digital I/O

-40 to +85°C DM6812HR DM6420HR DM6425HR DM6430HR DM7520HR DM6888HR DM7820HR DM8820HR DM9820HR SDM7540HR SDM8540HR FPGA7800HR DM6814/16HR

Active Bus PCI PCI ISA ISA ISA PCI ISA ISA ISA PCI PCI PCIe PCI Passthrough Bus ISA ISA ISA PCI ISA† Bus CME137686LX500HR CME136686LX500HR CML147786CX650HR CME146786CX650HR CME147786CX650HR CMX147786CX650HR DMA or PCI Bus Master

CMA157886PX1400HR CMX158886PX1400HR           CMD158886PX1400HR CMA & CMX22MVD1860HR CMA & CMX22MVD1200HR ECC CMX158886PX1400HR- CMX158886PX1400HR-BRG CMD158886PX1400HR-BRG McBSP Serial Ports    Single-Ended Inputs 16 16 16 32 16 16

the property of their respective companies. the property of their respective Differential Inputs 8 8 8 16 8 8 Bus Max Throughput (KHz) 1250 1250 500 100 1250 Expansion Resolution (bits) 12 12 12 12 16 12 Input Ranges/Gains 3/7 3/7 3/4 3/4 1/4 3/6 Analog Input Autonomous Calibration   PCIe/104 cpuModule™ featuring Intel® CoreTM 2 Duo Data Marker Inputs 3 3 3 3 processor, with eight PCIe x1 links, one PCIe x16 Analog Outputs 2 2 2 4 2 2 link, 8 analog inputs, 2 SATA, LPC, 6 USB 2.0 and Dual Ethernet. Shown here with Analog Max Throughput (KHz) 200 200 200 200 100 200 ®

CPU and BIOS dataModule and ATX Power Supply

ANALOG Resolution (bits) 12 12 12 12 16 12 Output Ranges 4 4 3 3 1 4 Analog Out

trademarks or registered trademarks are All trademarks or registered Conduction-cooled, Hybrid D/A FIFO Buffer 8K 8K 8K RF/Embedded System Channel-Gain Table 1K 1K 1K 1K 1K 1K • VHF/UHF receiver Scan/Burst/Multi-Burst       • Multi-band synthesizer A/D FIFO Buffer 8K 8K 8K 8K 8K 8K • FPGA Coprocessor

Features Sample Counter       Advanced Advanced • High-end GPS receiver Peripherals SyncBus    • Pentium M cpuModule Total Digital I/O 16 16 16 16 16 16 48 18/9 64 48 48 48 48 • Isolated Power Supply Bit Programmable I/O 8 8 8 8 8 8 24 6/0 48 48 48 † Input FIFO Buffer 8K 8K 8K 8K 8K 8K HiDANplusTM Opto-Isolated Inputs 48

Digital I/O Opto-Isolated Outputs 16 ®

All rights reserved. Inc. Embedded Technologies, HiDAN Systems User Timer/Counters 3 3 2 2 2 3 3 3 10 10 10 6 I/O DIGITAL • Rugged, watertight enclosure RTD Advanced Interrupts 2 2 2 2 2 2 2 2 2 2 † • Integrated tongue & groove O-ring Versatile Memory Buffer 4M 4M 4M 8MB • Environmental sealing & EMI suppression External Trigger           †

Features • Structural heat sinks & heat pipes Advanced Advanced Incr. Encoders/PWMs 3/9 4/8 4/8 4/8 †

Copyright © 2010Copyright • Milled aluminum frames with opt. heat fins † visit www.rtd.com for complete product listing User-defined, realizable in FPGA • MIL cylindrical I/O connectors SW • MIL-SPEC paint & shock-mounts optional

IDAN® — Intelligent Data Acquisition Node HiDANplusTM Systems • Rugged PC/104 stackable framed modules • HiDAN with IDAN modularity • Quick interchangeability and expansion • Stackable signal raceway • Structural heat sinks, cooling fins & heat pipes • Milled aluminum frames • Standard PC connectors • Optional MIL-SPEC paint & shock mounts HiDANplusTM

“Accessing the Analog World”

“MIL Value for COTS prices”TM THE BIG YET SMALL PICTURE Mission interoperable

Outside the black box: Focusing designs on I/O

By John Hentges

When designing an embedded device, designers should consider the I/O requirements first. Implementing COTS components to assemble proof-of-concept prototypes saves money and time. By using a full-size PC and USB data acquisition modules, designers can prove the functionality of a device and avoid most if not all engineering expenses.

ny embedded system can be described several questions. Consider the example expectation that they might relate to the as an algorithmic black box con- of a vending machine design. How many production unit. These early builds are Anected to inputs and outputs. In most buttons will it have? Each button will usually designed on shoestring budgets to embedded applications, the inputs consist have associated digital signals. How many get a feel for the system or to sell the idea of digital bits, frequencies, voltages, cur- vending motors will it need? Each motor to management. rents, and similar familiar signals, while needs frequency, voltage, current, and/or the outputs include more digital bits, fre- pulse-width modulation control outputs. Leveraging these expenses into future quencies, voltages, and currents. More Does it need to be networked for logis- stages of the production cycle can be complex embedded devices incorporate tics? That would point at POTS or perhaps costly. However, by integrating interop- RS-422, Ethernet, or NTSC or HDMI TCP/UDP. How many blinkenlights will erable I/O modules, designers can keep connections. it have? using the same modules throughout production and circumvent the need Inside this conceptual black box, the algo- The answers to these questions are more to rewrite code for a new input device rithms align to monitor and control the product-defining than the decisions about (or vendor) while moving through the inputs and outputs. All of this algorithmic which language or processor the device design cycle. functionality can be labeled as “software” should run – more critical than what is and set aside. Whether implemented in inside the black box. No matter which At each phase in the process, device VHDL, microcode, C, or Java, firmware or inputs and outputs are involved, the embed- designs must conform to smaller, lower- software, the algorithms that perform the ded device design is defined by them. power, quieter, cooler, and/or cheaper device’s functionality are capable of run- footprints. Interoperable I/O modules ning on any available hardware platform. Consistency throughout the can enable the device to continue work- design cycle ing with each iteration of the black box, Before a design can exist, designers must Many companies make prototypes using regardless of the architecture. Instead of define the inputs and outputs, addressing arbitrary hardware and software with no running on a desktop full-size PC, the 16 / Winter 2010 PC/104 and Small Form Factors years down the road when the algorithmic black box isn’t available anymore, USB “At any scale of will still be there for the product’s I/O.

custom or COTS design, One concern worth noting is that USB interconnects vary among embedded platforms, especially when compared to from desktop PCs desktop PCs. An ordinary desktop uses USB A connectors to host its USB bus. purchased online to PC/104, EPIC, ETX, and other “medium”- sized form factors offer a variety of possible connection methods. In some designs, solid-state fanless a full USB A is provided. Others only Figure 1 | Designers can use a desktop PC with USB data acquisition modules in have a 5-pin micro header requiring a a proof-of-concept design. Pico-ITXe systems measuring less than 100 mm on one side, USB is present.” device can be powered by Mini-ITX, Computer-on-Module (COM), Pico-ITXe, or a full custom backplane using the exact Temperature measurement,monitor,and alarm same plug-in data acquisition modules. Software selectable timeout from 4 µsec Watchdog open collector reset outputs USB helps ensure longevity USB is the key to achieving this interop- Fan status and speed control erability. At any scale of custom or COTS Two general purpose 8-bit A/D inputs design, from desktop PCs purchased online to solid-state fanless Pico-ITXe Light sensor for enclosure security P104-WDG-CSM systems measuring less than 100 mm on Extended temperature (-40C ~ +85C) available one side, USB is present. Every modern interconnect architecture includes USB interfaces. Stackable Unified Modular Interconnect Technology (SUMIT), EPIC, Pico-I/O, ETX, and other standard form factors all include at least one and usually four or more USB ports. Each DM&P SoC CPU Vortex86DX- 800MHz port can be expanded with off-the-shelf hubs – boxes or chips – to get more PC/104 compliant, PCI-104 & PC/104+ (Optional) than 100 USB devices in a system, per XGI Volari Z9s Chipset, 32MB VGA Memory USB controller. Integrated 10/100Mbps Ethernet Choosing I/O on USB eliminates the Watchdog Timer, software programmable hassle of making changes to the data acqui- 256/512MB DDR2 onboard sition module as designers iterate closer to production designs. Use any desktop Extended Temperature (-40C ~ +85C) VDX-6354 PC with USB data acquisition modules in the proof-of-concept (Figure 1), then build the engineering prototype using Mini-ITX or ETX, and wrap up the production unit design with Pico-ITXe or a SUMIT – Industry Standard Module (ISM) system – each and every choice The Embedded Products Source will have USB available. Even the IP for 1.800.548.2319 www.wdlsystems.com [email protected] FPGA or ASIC full custom designs is readily available. Later on, three or five PC/104 and Small Form Factors Winter 2010 / 17 THE BIG YET SMALL PICTURE Mission interoperable

cable kit or some other adapter to remain integrating a ubiquitous bus like USB that shrinking the black box smaller and compatible with the off-the-shelf USB I/O allows the same I/O devices and the same smaller (see example in Figure 2). Then, if selected during the prototyping phase. development effort to be used while pro- necessary, those same modules’ underly- ceeding toward production designs. ing designs can be slapped onto a custom This is also a concern as designers prog- ETX baseboard or SUMIT-ISM module, ress to the final designs. SUMIT-ISM, As production quantities get larger, a full and the software will work the same way Pico-ITXe, and other smaller form factors custom solution becomes more appealing; it did in the original prototypes. only provide their USB bus on the embed- however, engineering costs are very high, ded (often SUMIT) connector, without so the cost-per-unit versus non-recurring As the long-term intended level of offering a cable connection. During the engineering expense must be weighed integration gets deeper, the form factors development process, designers can add an against production volume. Historically, of the I/O modules used in the original adapter to break out these signals, but the the break-even point for full custom prototyping phases matter less and less, long-term solution is to integrate the USB solutions is measured in hundreds of while the need to choose an interoperable I/O device onto a SUMIT-ISM, Pico-I/O, thousands of pieces. technology such as USB remains. How- or similar module. This is simply a layout ever, if a design will not be integrated concern. No real engineering is neces- ETX and other COM systems have beyond a multiboard level, it is impor- sary, as the device retains the same USB lowered that barrier and proven to be cost- tant to choose CPU and baseboard form bus architecture. Changing the physical effective for production runs measured in factors that will be available for the long layout of the I/O device has little or no mere thousands. By using USB and other haul – industry-standard, modular, and impact on its schematic when USB is kept interoperable bus I/O modules, design- vendor-neutral specifications like ETX at its heart. ers can squeeze that break-even point and other COM systems, SUMIT-ISM, down to product runs measured in the and Pico-ITXe (Figure 3). This ensures In fact, SUMIT and other connectors used hundreds. The right vendor can take the that designers will be able to fill the black in many embedded platforms allow more existing schematics for one or more USB box for years to come. than one USB device to be added easily data acquisition I/O devices and integrate using modern lane-shifting techniques them onto a single ETX baseboard for far If quantities justify building a fully inte- that eliminate setup and configuration less time and money than any new design grated PCB, the underlying designs headaches. can be engineered. should be available for that situation as well. This reduces engineering expenses More cost-effective This means designers can build a proof- because instead of designing in-house, production runs of-concept using one or more USB or designers can simply integrate vendor IP Using a PC in a production device can USB/104 data acquisition devices and directly into their system. Using a bus like simplify prototyping, particularly when continue using the same modules while USB means the software doesn’t need to change.

Open source provides code visibility To further ensure interoperability, designers should select vendors that embrace open source. USB is a multilayered protocol stack, from the bare serial port interface at its heart to the packetization specification all the way up to high-level APIs from the I/O vendor. When iterating a design to the production-ready stage, it might be useful to eliminate layers in the protocol stack. An I/O module that documents each of these layers of communication provides the requisite information should this become necessary.

Open source designs also enable support for the I/O device in environments both new and old. Does the I/O device support development in COBOL? What about Haskell? Even if the environment the application requires is too old, too exotic, or too new to be supported by the vendor directly, having the source Figure 2 | A 1U rack chassis design uses a PCI-104 CPU and seven USB/104 I/O boards. code available to every layer of the 18 / Winter 2010 PC/104 and Small Form Factors for every layer of driver, dynamic link no protocol for accessing LPC lanes – library, shared object, sample program, between vendors. and utility. Some vendors including ACCES I/O Products also provide on-card USB is thus the simplest and most inter- firmware source code in the cross- operable choice for vendor neutrality, platform C language. compatibility, and flexibility throughout the design cycle. ➤ The best bus choice Although this article focuses on USB, John Hentges is much of the discussion to some extent head of design and Figure 3 | To help ensure longevity, applies to other communication chan- customer service for designers should choose standard form nels on modern module interconnects. ACCES I/O Products. factors like Pico-ITXe, shown here with ACCES Pico-I/O stacking modules SUMIT and other connector specifi- His experience using SUMIT. cations include PCI Express and LPC includes 21 years at channels in addition to USB. However, ACCES I/O Products software stack ensures that interoperabil- despite the possibility of using these and directing ity is achievable. other buses across the same connectors, data acquisition software projects for true vendor neutrality and interoper- companies such as Duracell, Harris, Thus, designers can benefit from using ability are currently best achieved Lawrence Livermore National Laboratory, USB data acquisition modules like those by sticking with USB when latency Honeywell, and the X PRIZE Foundation. offered by ACCES I/O Products that pro- and throughput match the application vide a high-level API for OS X, Linux, requirements. For example, the LPC ACCES I/O Products and Windows, as well as document all bus, although included, does not have 858-550-9559 vendor-specific USB Control Requests. a software layer defined – there is no [email protected] These modules supply full source code register map standard, no base address, www.accesio.com

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© 2010 Logic Supply, Inc. All products and company names listed are trademarks or trade names of their respective companies. 2011 BUYER’S GUIDE PC/104 and Small Form Factors Buyer’s Guide Index Industrial automation Tri-M Technologies Inc...... 23 Kontron ...... 21 VersaLogic Corp...... 23 3.5-inch Logic Supply ...... 21 Advanced Digital Logic (ADL) ...... 20 PCI/104-Express Avalue Technology Inc...... 20 Mini-ITX Sponsored by Connect Tech Inc. WDL Systems ...... 21 Advanced Digital Logic (ADL) ...... 23 COM Express Connect Tech Inc...... 23 ADLINK Technology, Inc...... 20 Packaging and power supplies RTD Embedded Technologies, Inc...... 23

Avalue Technology Inc...... 20 RAF Electronic Hardware ...... 22 COM Express Eurotech ...... 20 Tri-M Technologies Inc...... 22 Pico-I/O ACCES I/O Products, Inc...... 23 LiPPERT Embedded Computers ...... 20 PC/104 Pinnacle Data Systems, Inc...... 21 Advantech Corporation ...... 22 Rugged/Mil-Spec COM/SOM Kontron ...... 22 Acromag ...... 24 Sponsored by Eurotech WinSystems, Inc...... 22 Eurotech ...... 24 Excalibur Systems, Inc...... 24 EMAC, Inc...... 21 PC/104-Plus Eurotech ...... 21 Advanced Digital Logic (ADL) ...... 22 SUMIT Technologic Systems ...... 21 Avionics Interface Technologies ...... 22 Diamond Systems Corporation ...... 24

Advanced Digital Logic (ADL) ADLGS45HD Based on the Intel Core 2 Duo/Celeron M Small Form Factor (SFF) processors and the Intel GS45 Express (Cantiga) chipset • Up to 8GB DDR3-1066MHz DRAM • 2x 10/100/1000Mbit LAN controllers • 2x DVI/ HDMI • 2x SATA 3Gb/s with RAID 0/1 support • 8x USB 2.0 ports • 4x RS-232/TTL ports • 6-channel High Deﬁ nition Audio • RTC and watchdog timer • Integrated Trusted Platform Module (ITPM) • PCI Express bus (four x1 or one x4) via 2x40-pin custom connector • IDE interface • mPCI connector • Serving the PC/104 industry for over 15 years www.adl-usa.com smallformfactors.com/p46617 Avalue Technology Inc. ECM-QB 3.5-inch ® ™ ® Intel Atom E620/640/660/680 Series 3.5" Micro Module with Intel Platform Controller Hub EG20T COM/SOM Features & Beneﬁ ts: • Intel® Atom™ Processor E620/640/660/680 Series • Intel® Platform Controller Hub EG20T • Onboard DDR2 1GB Memory • 5.1-CH Audio, Dual Intel® Gigabit Ethernet • 2 x SATA, 3 x RS-232, 1 x RS-422, 1 x RS-485, 1 x CANbus • 4 x USB, 16-bit GPIO • 1 x Micro SD, 1 x CF socket 3.5-inch | COM Express • 1 PCIe Mini Card slot • Wide temperature tolerance www.avalue.com.tw or [email protected] smallformfactors.com/p46624

ADLINK Technology, Inc. Express-CBR Extreme Rugged COM Express Type 2 Computer-On-Module (COM) • Combines the latest high-performance Intel Core i7 processor running at up to 2.0 GHz with the advanced Mobile Intel QM57 Express chipset • Applications include the aerospace, military, defense, transportation, and gaming industries • Operation over a wide power supply range from 9 V to 16 V and over an extended temperature range of -40 °C to +85 °C • Extensible Firmware Interface (EFI) for a highly reliable, versatile, and adaptable BIOS layer • Supports up to 8 GB of DDR3 memory and provides onboard I/O interfaces for GbE, eight USB 2.0 ports, four SATA ports, and an IDE (PATA) channel • Legacy support provided for PCI, LPC, SMBus, and I2C www.adlinktech.com smallformfactors.com/p44189 Avalue Technology Inc. ESM-QM57 Intel® Core™ i7/Core™ i5/Celeron® COM Express Module with Intel® QM57 Chipset Features & Beneﬁ ts: • Supports Intel® Core™ i7 620LE/620UE/Celeron® P4505 CPU • Intel® QM57 Chipset • Two 204-pin SODIMM sockets up to 8GB DDR3 800/1066 SDRAM • Dual-view, dual-channel 18/24-bit LVDS • Intel® High Deﬁ nition Audio • Intel® 82574L Gigabit Ethernet • 4 SATA, 8 USB 2.0 • LPC, 4 PCI, 6 PCIe x1, 1 PCIe x16, SDVO (optional) • Supports RAID 0/1/5/10 • TPM www.avalue.com.tw or [email protected] smallformfactors.com/p46625

Eurotech Adbc8031 – COM Express with Core i5/i7 The Adbc8031 from Eurotech provides the graphics and performance capabilities of the Intel® Core i5/i7™ processor in a low-power COM Express standard. This module is ideal for applications such as automotive, COM Express controls, gaming, digital signage, and more. The Adbc8031 makes it possible to run multiple processes concurrently for extensive data-crunching capabilities while maintaining a low power speciﬁ cation. In Industrial automation addition, the Adbc8031 is the perfect choice for devices where security and reliability are critical. It is equipped with an Advanced Encryption Standard (AES) engine and has Error Correction Code (ECC), which helps to detect and correct errors in memory transactions in sensitive applications. www.eurotech.com smallformfactors.com/p46620

LiPPERT Embedded Computers Toucan-TC The COM Express compact module features an Intel® Atom™ E6xxT with max. 2 GB soldered DDR2 RAM. Onboard are SDVO and LVDS interfaces, SATA, PATA, 5 PCIe x1, 7 USB 2.0 ports, Gigabit LAN, and a µSD card slot. CANbus and 4 UART ports on lockable option connectors require external transceivers. The Toucan-TC offers a fail-safe BIOS, optional SSD (up to 64 GB), a µSD card slot, and comprehensive

condition monitoring (LEMT), which provides numerous additional software functions. Mini-ITX The Toucan-TC is optionally available for extended temperatures from -40 °C to +85 °C. www.lippertembedded.com smallformfactors.com/p46621

20 / Winter 2010 PC/104 and Small Form Factors PC/104 and Small Form Factors 2011 BUYER’S GUIDE COM Express | COM/SOM Industrial automation | Mini-ITX Pinnacle Data Systems, Inc. AMD Socket S1 COM Express Module PDSi’s AMD Socket S1 COM Express Module (COMX-S1) is a low cost, compact, embeddable computing core with the capability to drive a broad range of OEM applications. Built around AMD’s x86-based Socket S1 processors, it enables 64-bit computing at a progression of performance levels from the ultra low-power AMD Sempron™ 2100+ (perfect for fanless applications) to the dual-core muscle of the AMD Turion™ X2 TL62. The Computer-on-Module design is fully compliant with PICMG COM Express Type 2 speciﬁ cations, offering a large variety of interfaces to cover the needs of most embedded applications. COM Express www.pinnacle.com – [email protected] smallformfactors.com/p44294 Eurotech Catalyst LP Eurotech’s Catalyst LP delivers the latest Intel® Atom™ N450 and D510 processors in a small 67 x 100 mm form factor. The Intel Atom processors are available with both single-core (N450) and dual-core (D510) capabilities, a 400MHz graphics engine, and 667MHz DDR2 memory. The Intel® ICH8M companion chip brings out high-speed I/O such as Gigabit Ethernet and USB 2.0.

With so much capability and performance, Catalyst LP is suited for a range of target applications such as industrial automation, HMI, medical, and other markets. It offers sophisticated graphics for applications requiring high-end 2-D and 3-D visualization with high-resolution graphics capabilities. In addition, high-bandwidth I/O capability including PCIe and data storage interfaces like SATA make data retrieval and processing easy and reliable. All of this power is built into the small, fanless design at under 7W of power consumption, which means the Catalyst LP can be tailored for battery-operated handheld devices. COM/SOMwww.eurotech.com smallformfactors.com/p44389 EMAC, Inc. SoM-9G45/9M10 3.5-inch

COM/SOM The SoM-9G45/9M10 is a System-On-Module (SOM) based on either the Atmel ARM9 AT91SAM9G45 or AT91SAM9M10 processor. This fanless ARM9, 400 MHz SOM has an Ethernet PHY included along with 4 serial ports. It utilizes up to 256MB of external DDR2/SDRAM and 1GB of NAND Flash and includes an MMU, which allows it to run Linux and Windows CE Operating Systems. The SoM-9G45/9M10 is the ideal processor engine for your next design. All of the ARM processor core is included on this tiny board, including: Flash, memory, serial ports, Ethernet, I2S audio, PWMs, timer/counters, A/D, digital I/O lines, video, clock/calendar, and more. For more info visit: www.emacinc.com/som/som9g45.htm. COM/SOMwww.emacinc.com smallformfactors.com/p44298

Technologic Systems TS-SOCKET Macrocontrollers TS-SOCKET Macrocontrollers are CPU core modules that securely connect to a baseboard using the TS-SOCKET connector standard. COTS baseboards are available, or design your own baseboard for a custom solution with drastically reduced design time and complexity. Start your embedded system around a TS-SOCKET Macrocontroller to reduce your overall project risk and accelerate time to market. Models include: TS-4200

Atmel ARM9 with super low power • TS-4300 Cavium ARM11 with dual 600 MHz and FPU • TS-4500 Cavium COM/SOM ARM9 at very low cost • TS-4700 Marvell PXA168 with video and 1.2 GHz CPU • TS-4800 Freescale iMX515 with video and 800 MHz CPU. Industrialwww.embeddedARM.com automation smallformfactors.com/p44297

Kontron Kontron MICROSPACE™ 2X Family of Box PCs

Kontron’s smallest Box PC using PC/104 technology is conﬁ gurable to your needs. Passive cooling with (Sponsored by Eurotech www.eurotech.com) LX800-500MHz processing. 3x USB, up to 4x RS-232, LPT, opt. 2x CAN, XVGA, stereo sound, 2x LAN 100Mb/s, 256MB (max.1GB), CF with Linux, opt. 2.5" HD with 160GB, power supply: 8V-28VDC, 165 x 110 x 27mm, Boot-CF with DOS, Linux.

Industrialwww.kontron.com automation smallformfactors.com/p46616

Logic Supply PT-9WC1 The Extreme Environment PT-9WC1 takes high-performance computing to a whole new level. Touting a COM Express 2.26 GHz Intel Core 2 Duo processor in a ruggedized, fanless enclosure, it has the ability to withstand

Industrial automation extended temperatures of -40 °C ~ 70 °C and is resilient to shock and vibration, making it a ﬂ exible computing platform. It features dual Gb LAN, up to four RS-232 COM support, DVI-D (can be switched out to either a Digital I/O or Parallel port with included cable), VGA, DisplayPort, and watchdog timer. The PT-9WC1 is excellent for use in harsh industrial environments. Mini-ITXwww.logicsupply.com smallformfactors.com/p46613

WDL Systems Mini-ITX Boards WDL Systems distributes the latest technology to provide customers with Commercial Off-The-Shelf (COTS) products for all embedded requirements • Mini-ITX embedded motherboards are easily cooled, highly versatile main boards featuring low-power processors, onboard LAN, various integrated AGP graphics, audio options, slots, and connectors Mini-ITX

www.wdlsystems.com smallformfactors.com/p39216

PC/104 and Small Form Factors Winter 2010 / 21 Packaging2011 BUYER’S GUIDE PC/104 and Small Form Factors

RAF Electronic Hardware Male-Female Stacking Spacers Male-Female Stacking Spacers help overcome space limitations when PC/104 or PC/104-Plus bus drives are

Plus installed. With this approach, stand-alone module stacks are used like ultra-compact bus boards, but without needing backplanes or bird cages. Module boards are spaced exactly 0.6 inches apart using RAF precision-made nylon or aluminum spacers to build structurally secure stand-alone stacks. RAF spacers allow embedded system designers to employ application-speciﬁ c module stacks for their products that are easily and securely assembled. The RAF hardware can be used with more than 100 different modules produced by manufacturers today. Packagingwww.rafhdwe.com smallformfactors.com/p30218

Tri-M Technologies Inc. HPSC104-SER The HPSC104-SER is a 160W PC/104 DC-DC converter that includes a ﬂ ash-based microcontroller and 4A charger for advanced power management and smart battery charging from 10V to 35V. It provides PC/104- Plus up to four stages of battery charging and can charge SLA, NiCd, NiMh, and level two and three SMBus compatible batteries. The HPSC104-SER allows timed on/off control, notiﬁ cation of changes to main power or battery status, and monitoring of up to 16 temperatures using I²C digital temp sensors. It is available with RoHS compliance and has a standard operating temperature of -40 °C to +85 °C. Packaging and power supplies PC/104www.tri-m.com smallformfactors.com/p46628

Advantech Corporation PCM-3364 Advantech recently announced a new full range of embedded boards based on the new Intel® Atom™ Processor E6xx Series (formerly codenamed Tunnel Creek). Advantech’s PCM-3364 (PC/104 in 96 x 90 mm) is a stackable single board computer that integrates all functions including: LVDS, CRT, Ethernet, USB client, Mini-PCI Express, UART, GPIO, CFast, and CANbus onto one small form factor. Designed with fanless thermal solutions for easier system integration, the PCM-3364 is an ideal solution for vehicle, medical, POS, CNC, and extended temperature applications. Advantech also provides multi OS support, including Windows 7, XPe, WinCE, QNX, and Linux. PC/104www.advantech.com smallformfactors.com/p46622

Kontron Kontron Embedded PC/104 compatible SBCs Kontron’s family of 3.5-inch PC/104 compatible SBCs delivers scalable performance and power consumption. From the power-efﬁ cient JREXplus-DC to the high-performance JREXplus-690, there is an off-the-shelf option for a wide array of applications. Application developers have access to all of the onboard features of the JREXplus SBCs including USB, COM, 2x LAN, 2x SATA II, and more. Plus, these SFF SBCs can be integrated with a variety of PCI-104 I/O expansion cards. Whether it’s a control core for an industrial PC or a solution capable of intense graphics, Kontron JREXplus SBCs can help you achieve your application goals and get to market quickly. PC/104www.kontron.com smallformfactors.com/p46614 Packaging and power supplies | PC/104 PC/104- and power Packaging

Kontron Kontron Small Form Factor PC/104 SBCs PC/104 The demands placed on appliances used in the ﬁ eld range from extreme temperature exposure to constant vibration and more. The solutions need to be designed to be reliable and survive under such conditions. Kontron offers PC/104 SBCs including Intel® Atom™ and Core™ Duo processor offerings within the MICROSPACE® family that do just that. Kontron uses industrial-grade components for by-design solutions that can withstand the harsh conditions. Additionally, 100 percent extended temperature tested solutions are available to ensure the solution meets the application-speciﬁ c temperature requirements. PCI/104-Express PC/104www.kontron.com smallformfactors.com/p46615

WinSystems, Inc. Fanless, Low Power 1GHz PC/104 SBC The low power PCM-VDX-2-512 is designed for headless space- and power-limited systems. With its diverse range of functions, most applications will not require additional I/O cards; however, it has onboard Mini PCI and PC/104 connectors for specialty I/O expansion. Powered with a 1GHz Vortex86DX processor, the PCM-VDX supports 512MB DRAM and 1MB battery-backed SRAM, with onboard CompactFlash socket and optional 512MB SSD ﬂ ash disk. Its full-featured I/O includes two 10/100 Mbps Ethernet ports, four USB ports, and four serial RS-232/422/485 ports with ESD protection on LAN, USB, and serial ports; it also runs Linux, DOS, and other x86-compatible operating systems in extended temperature environments. PC/104www.winsystems.com-Plus smallformfactors.com/p46627

Advanced Digital Logic (ADL) ADLS15PC PC/104-Plus CPU based on the Intel Atom processor and Intel US15W (Poulsbo) chipset • 1.1 GHz (Z510) and 1.6 GHz (Z530) • Up to 2 GB DDR2 DRAM and up to 8 GB onboard SSD • 8x USB 2.0 ports, 2x RS-232/422/485 COM, LPT, 7.1 HD Audio • 10/100/1000BASE-T Ethernet and GPIO interface • CRT/LVDS, PATA, and SMBus interfaces • Extended temperature version available • Various active and passive cooling options available • Serving the PC/104 industry for over 15 years

PC/104www.adl-usa.com-Plus smallformfactors.com/p41831

Avionics Interface Technologies PC104p-CMB

Combination MIL-STD-1553 and ARINC 429 Test and Simulation Module for PC/104-Plus • One or two PC/104- Plus MIL-STD-1553A/B streams • Eight ARINC 429 channels • Single board fully VXI compliant • Ten programmable Input/Output (I/O) lines • Optional PMC slot for third-party PMC boards • Onboard IRIG-B for synchronization Pico-I/O

www.aviftech.com smallformfactors.com/p46629

22 / Winter 2010 PC/104 and Small Form Factors PC/104 and Small Form Factors PC/104-Plus 2011 BUYER’S GUIDE PC/104- Tri-M Technologies Inc. VDX104+ The VDX104+ is a rugged, fanless 800MHz PC/104-Plus CPU module featuring an operating temperature of -40 ºC to +85 ºC, soldered RAM, and RoHS compliancy. This compact, low power package comes standard with 512MB DDR2 RAM, four COM ports, two USB 2.0 ports, and dual 10/100 Ethernet. In addition to 8MB onboard SPI Flash (ﬂ oppy emulation), the VDX104+ includes both a Type I CompactFlash™ socket as well as a microSD socket. System expansion is supported by the PC/104-Plus interface. Plus

PC/104-www.tri-m.comPlus smallformfactors.com/p46626 | PCI/104-Express | Pico-I/O

VersaLogic Corp. Tomcat 800 MHz performance • 3 W typical power draw • DMP Vortex86DX chip • Fully static SoC • Compatibility PC/104- Plus with Windows, Linux, and other popular 32-bit RTOSs • Supports PC/104 and PC/104-Plus expansion • 128-512 MB soldered-on RAM • Interfaces include two USB 2.0, two RS-232/422/485, 10/100 Ethernet, LPT, IDE, a CompactFlash socket, and a legacy PS/2 interface for keyboard and mouse • Available in commercial and industrial temperature versions • Ruggedized SBC is qualifi ed to MIL-STD-202G shock and Packaging and power supplies vibration standards, enabling deployment in harsh environment applications • Options include conformal PCI/104-Expresscoating, connector changes, revision locks, testing and screening, and redesign services www.versalogic.com smallformfactors.com/p45036 Connect Tech Inc. Xtreme/CPU – PCI/104-Express Single Board Computer Connect Tech’s PCI/104-Express Single Board Computers offer a variety of embedded processor solutions including Intel Atom, Freescale i.MX51, TI OMAP and Nvidia Tegra • Our single board computers give instant access to a full range of PCI/104-Express peripherals from a rapidly growing ecosystem including FPGA solutions, multi-port serial, frame grabbers and more • Xtreme/CPU solutions are modular and completely scalable, with access to the most current embedded processors that are easily upgradable to accommodate future generations of Intel Atom processors, such as Tunnel Creek, or ARM based processors, such as Cortex A8 • Depending on your choice of processor module, Xtreme/CPU solutions provide on-board connectors allowing for instant access to a variety of features including 2x SATA, 1x Gigabit Ethernet, LVDS, 4x USB 2.0, VGA Video, 2x RS-232, 2x RS-422/485 • Xtreme/CPU is an ideal off-the-shelf solution for a broad range of applications. Achieve rapid proof of concept and deploy systems for fi eld trials with off-the-shelf hardware • Engineering Services: Benefi t from Connect Tech’s modifi ed designs. Our engineering team is skilled at creating customer-specifi c products that ensure both time to market and price targets are met • For detailed information about Connect Tech’s Xtreme/CPU – PCI/104-Express Single Board Computer, please visit our website at http://www.connecttech.com/sbc. PCI/104-Express PCI/104-Expresswww.connecttech.com or [email protected] smallformfactors.com/p46031 Now supports TUNNEL CREEK!

PC/104 Advanced Digital Logic (ADL) ADLGS45PC Based on the Small Form Factor (SFF) Intel Celeron M/Core 2 Duo & Intel GS45/ICH9M-E chipset • Up to 4GB DDR3-1066 MHz DRAM • 2x 10/100/1000Mbit LAN controllers • CRT/LVDS interface onboard • 4x SATA Generation 2 (3 Gb/s) with onboard RAID 0/1 support • 8x USB 2.0 ports, COM1, COM2, and LPT1 • SMBus interface, real-time clock, watchdog timer, and 8-channel HD Audio • Various active and passive cooling options available • PCIe v1.1 - 4 x1 or 1 x4 Lanes, or x16 PEG • Serving the PC/104 industry (Sponsored by Connect Tech Inc. www.connecttech.com) for over 15 years PCI/104-Express PCI/104-Expresswww.adl-usa.com smallformfactors.com/p43638

RTD Embedded Technologies, Inc. ATX104-Express 88 Watt Synchronous Poly Phase Power Supply • +90% efﬁ ciency at full load • Synchronized design to reduce surge-induced EMI • Wide input voltage range • Low input ripple current • Low output ripple voltage • Status LEDs placed conveniently next to PCI Express bus for easy viewing • Reverse polarity protection to 40 Volts • Continuous output short circuit protection • Input voltage transient protection • Remote ON/OFF operation available • Operating temperature: -40 °C to +85 °C

PCI/104-Expresswww.rtd.com smallformfactors.com/p46618

RTD Embedded Technologies, Inc. CMA22MVD Complete PC-compatible PCI/104-Express Single Board Computer • PCI-104 and PCIe/104 Type 1 & Type 2 buses • Intel Core 2 Duo (1.20 GHz or 1.86 GHz) and Intel Celeron 1.20 GHz • 1 GB or 2 GB surface-mounted dual-channel DDR2 memory • Eight x1 PCIe links, one x16 PCIe link (conﬁ gurable as one x8 or one x4) • Onboard SATA ﬂ ash disk up to 8 GB and two external SATA ports • Six USB 2.0 ports, four on the stackable PCIe bus • Gigabit Ethernet, Analog VGA & LVDS panel, four serial ports • Advanced Digital I/O (aDIO), 14 I/O with interrupts • Advanced Analog I/O (aAIO), 8-channel, 16-bit A/D, or HD audio • 1.86 GHz: -40 °C to +70 °C, 1.20 GHz: -40 °C to +85 °C operating temperature Pico-I/Owww.rtd.com smallformfactors.com/p44442

ACCES I/O Products, Inc. Multifunction Pico-I/O Modules Choose from Pico-I/O USB device featuring SUMIT stacking connector and up to four I/O expansion boards PC/104- Plus in SUMIT stack or wired high-speed USB 2.0 device • 8 individually optically isolated inputs • Polarity insensitive AC/DC inputs accept up to 31 VDC or AC RMS • Jumper selectable ﬁ ltering per input channel for AC or voltage transients • 4 optically isolated fully protected FET high-side switch outputs • Outputs capable of switching from 5-34 VDC at up to 3A • Two general purpose 16-bit A/D inputs with optional Pico-I/O 4-20mA • Custom high-speed function driver • Extended temperature • Optional USB connector allows for standard USB connectivity www.accesio.com smallformfactors.com/p46623

PC/104 and Small Form Factors Winter 2010 / 23 PC/104 and Small Form Factors Rugged/Mil-Spec2011 BUYER’S GUIDE

Acromag IOS-7400 Rugged, industrial PC with fanless design delivers high-reliability operation • 4 plug-in I/O module slots provide easy, low-cost interface to instrumentation • High-density, interchangeable I/O modules enable mix and match ﬂ exibility • 20+ I/O modules available for a wide variety of analog, digital, and serial I/O functions • Thermally controlled chassis meets extreme operating temperature requirements • Compact shock- and vibration-resistant design

Rugged/Mil-Specwww.acromag.com smallformfactors.com/p43878

Eurotech Catalyst TC Eurotech’s Catalyst TC is a deeply embedded, highly integrated module based on the Intel® Atom™ E6xx processor and Intel® PCH EG20T companion chip. The Catalyst TC showcases a long list of features directly on the module such as SATA, Gigabit Ethernet, CAN, and multimedia interfaces. Compliant with the PCIe standard, the ﬂ exible Catalyst TC allows any PCIe-compliant device to be easily connected, thereby expanding the I/O support and freeing up carrier board designs to focus on minimizing space and size usage while optimizing capabilities. With so much performance in a low-power design, Eurotech’s Catalyst TC is ideal for OEMs looking for greater integration, ﬂ exibility, and cost optimization in their designs. Rugged/Mil-Spec

Rugged/Mil-Spec | SUMIT Rugged/Mil-Specwww.eurotech.com smallformfactors.com/p46619

Excalibur Systems, Inc. EXC-2000PCIe Multiprotocol PCI Express avionics communication board • Supports up to two independent 4000 family avionics communication modules, allowing different protocols to be mixed and matched on a single card • Supports fast DMA transfers for reducing processor and system latency time • Supports the following protocols: ARINC 429/575, ARINC 708/453, discrete I/O, serial RS-232/422/485, CAN 2.0 • Supports error- injection and -detection capabilities • Available in an extended operating temperature range of -40 °C to +85 °C • Supplied with C drivers, including source code and Mystic software for Windows • Fully compatible with Excalibur’s Exalt Plus Data Analysis and Laboratory Tools EPICwww.mil-1553.com smallformfactors.com/p43496

Diamond Systems Corporation Aurora Aurora is a rugged SUMIT-ISM form factor SBC based on the 1.6GHz Intel Atom Z530 CPU. Aurora supports up to 2GB of SO-DIMM SDRAM and provides high-resolution LVDS and SDVO graphics. I/O ports include SATA, USB, serial, digital I/O, Gigabit Ethernet, and optional on-board USB ﬂ ash disk. Flexible system expansion is based on stackable PC/104 and SUMIT-A modules. Aurora’s power-efﬁ cient design leverages

Intel’s ultra-low-power Atom Z530P processor and US15W chipset, which are positioned on the board’s SUMIT underside for efﬁ cient heat removal via a heatspreader for wide-temperature, fanless operation. www.diamondsystems.com smallformfactors.com/p46244

The Leopard moves FAST! Ultra-high performance PC/104-Plus Core 2 Duo The compact “Leopard” embedded computer offers amazing performance with its Intel® Core™2 Duo processor. This rugged dual board computer is backed by VersaLogic’s long-term (5+ year) product availability guarantee and legendary quality.

 2.26 GHz Intel Core 2 Duo processor  Up to 4 GB DDR3 RAM  Mid power, 21W (typical)  PC/104-Plus expansion  Small footprint (4.2” x 3.8”)  Industrial temp. (-40º to +85ºC) version  Dual gigabit Ethernet  High-performance video and audio

Evaluate the Leopard today! Customization is available even in low volumes.

With more than 30 years experience delivering extraordinary support and Recipient of the VDC on-time delivery VersaLogic has perfected the art of service, one customer at a Platinum Vendor Award time. Experience it for yourself. Call 800-824-3163 for more information! for five years running!

800-824-3163 | 541-485-8575 | www.VersaLogic.com / lep

24 / Winter 2010 PC/104 and Small Form Factors PC/104 and Small Form Factors Additional products available at www.smallformfactors.com

ADLINK Technology Evoc Technology www.adlinktech.com www.evoc.com www.smallformfactors.com/p43610 www.smallformfactors.com/p44438 Avionics Interface Technologies Excalibur Systems, Inc. www.aviftech.com www.mil-1553.com www.smallformfactors.com/p46240 www.smallformfactors.com/p45234 Axiomtek LiPPERT Embedded Computers www.axiomtek.com www.lippertembedded.com www.smallformfactors.com/p45437 www.smallformfactors.com/p46027 congatec Sealevel Systems, Inc. Rugged/Mil-Spec www.congatec.us www.sealevel.com www.smallformfactors.com/p46032 www.smallformfactors.com/p43572 Diamond Systems Corporation VersaLogic Corp. www.diamondsystems.com www.versalogic.com www.smallformfactors.com/p46521 www.smallformfactors.com/p45445 EMAC, Inc. VIA Technologies www.emacinc.com www.via.com.tw www.smallformfactors.com/p41262 www.smallformfactors.com/p46182 Emerson Network Power WIN Enterprises Embedded Computing www.win-ent.com www.emerson.com/EmbeddedComputing www.smallformfactors.com/p42796 www.smallformfactors.com/p46216 WinSystems Eurotech www.winsystems.com SUMIT www.eurotech.com www.smallformfactors.com/p46015 www.smallformfactors.com/p35716

Low Cost, Low Power PC/104+ PCM-3362 � Intel® Atom Fanless N450 Processor � Low Power Consumption � 3 Serial ports � PC/104+ Expansion � 4 USB 2.0 Host Ports � Gig Ethernet & Audio � PS/2 mouse & keyboard � 1 SATA supporting 2 drives � 2 GB On-Board Flash � Dual Independent Display: CRT + LVDS � Linux, Embedded XP or Windows CE OS Options 2.6 KERNEL

The PCM-3362's design is based on the PC/104+ form factor and provides expansion support via ISA & PCI Busses. The PCM-3362 gives developers a low power, low cost and scalable platform that can fit into the tightest places. On-board features include: 3 serial ports, 4 USB 1.1/2.0 ports, a Gig Ethernet port, an Audio port and a PS/2 keyboard/mouse interface. For Rugged applications the 2GB of on-board flash can be utilized in place of a hard drive. Pricing starts at $339.00 and includes integration and testing! For more info visit: www.emacinc.com/sbc_pc_compatible/pcm_3362.htm Since 1985 OVER 24 YEARS OF SINGLE BOARD SOLUTIONS EQUIPMENT MONITOR AND CONTROL Phone: (618) 529-4525� Fax: (618) 457-0110� www.emacinc.com

PC/104 and Small Form Factors Winter 2010 / 25 SFF Rx for medical device design challenges The American people have spoken about which candidates they to board-level design changes. For example, the Corsys-M10 want in office this election season, but the discussion on what to Medical Tablet is designed to withstand common hospital chemi- do about health care is far from over. cals and significant physical abuse for reliable performance in its intended environment. As politicians continue to debate the pros and cons of Obamacare, medical device developers are working on innovative devices Kontron partners with strategic suppliers to extend the life of its and equipment that can minimize operating costs and improve products for medical environments, such as its ETXexpress base- patient care. The embedded technologies powering these devices board and ETXexpress-CD video frame grabber used in dental are helping create medical breakthroughs and revolutionizing the imaging systems. health care industry in emerging fields such as telehealth, which “We are seeing faster turnover because of the rapid pace of will be highlighted in our upcoming E-cast entitled “Enabling change in technology, and for this reason, we go with Computer- Telehealth Devices with Embedded Computing” (register at On-Module (COM) technology so the computer can scale with ecast.opensystemsmedia.com). the application as processor performance improves,” Kontron’s

Several embedded technology vendors are taking advantage of Jack London stated during the Q&A session of a webcast earlier * available Q1/2011 this momentum and developing Small Form Factor (SFF)-related this year. products that fulfill the need for secure, convenient solutions cer- * available Q1/2011 Accuracy, reliability, interoperability tified to strict rules and regulations. The following excerpts from Providing an interconnected personal telehealth system wherein a recent Intel Embedded Community blog series explore how physicians can remotely prescribe treatments and patients can SFF companies are addressing the numerous technical challenges monitor their health status requires accurate, reliable information specific to medical device design. communicated via interoperable devices. This priority represents Portability and low power consumption the objective of the Continua Health Alliance, a nonprofit coali- In a 2009 report, Gartner identified mobile health monitoring as tion of health care and technology companies. one of the top 10 consumer mobile technologies for 2012, citing Eurotech, a member of Continua, uses standardized form factors its potential for reducing costs and improving quality of life for like COM Express, EPIC, and PC/104-Plus when developing prod- patients. SFFs are particularly suited to mobile medical applica- ucts for medical deployments, such as the Helios edge controller tions, as they offer low power consumption and the ability to be platform. The company develops its platforms using processes unplugged and powered by batteries. to ensure robust design with reliable signal integrity, EMI, and Medical tablets including Advantech’s MICA-101 and Arbor thermal performance, helping OEMs achieve FDA certification. Technology’s M1255 maintain low Thermal Design Power To meet certification requirements, medical systems need (TDP) while providing a consolidated view of patient data in a operating systems built for safety-critical reliability, such as convenient platform suited for clinical environments. Bedside those offered by LynuxWorks. These OSs have been used in high- infotainment stations such as Avalue Technology’s MTP-1503 end imaging, life support, and bedside patient monitoring help health care providers avoid the trouble of back-and-forth applications, including a recent proof-of-concept platform that recharging as devices are used on the go. connected more than 25 wireless biometric sensors using a COM Express modules are especially useful in medical designs Portwell Mini-ITX board and the LynxSecure real-time hyper- because they enable I/O to be customized while providing a visor and separation kernel to isolate the Bluetooth networking wide processor and power selection to meet market demand. stack from other system software. Intel Atom-based COM Express and Pico-ITX products from The Continua Health Alliance is striving to make medical system RadiSys such as the Procelerant Z500 and PICOZ500 have been design and interoperability easier for companies by reducing the successfully deployed in patient monitoring and portable ultra- complexity of standards and providing events, training, and a sound equipment. rigorous certification program. Long life support “Companies are transitioning their products to target the broad, In medical imaging, a picture is worth a thousand words and international, standards-based market and leveraging the tools several gigabytes of data. MRI and CT scans, mass-spectrometry, and resources Continua has to offer to minimize effort and ensure phenotyping, and genetic studies generate hundreds of terabytes high quality,” said Rick Cnossen, Continua’s president and chair of data that must be processed and stored by powerful supercom- of the board of directors. puters, like the Intel Xeon-based SGI Altix UV being used to support the efforts of the Institute of Cancer Research in England. Better, cheaper, easier – these are the words you want to describe the equipment used to manage your health. For more innovative Medical equipment manufacturers want their end products to ideas in technologies for medical applications, see our Telehealth sell for 5-10 years to recoup ROI from their investments in these channel at channels.opensystemsmedia.com/Telehealth and “big iron” machines. check out the telehealth virtual panel discussion in the December To help ensure long-term operation, Corvalent “overengineers” issue of our sister publication, Embedded Computing Design its motherboards using various processes, from conformal coating (www.embedded-computing.com). 26 / Winter 2010 PC/104 and Small Form Factors * available Q1/2011

* available Q1/2011

Embedded PCs COMplete! COM Module with Intel® Atom™ Processor E6xxT/EG20T

CoreExpress-ECO2 Module Toucan-TC • Smallest COM module standard, 65x58mm COM Express-Compact Module • CPUs E620T, E640T, E660T and E680T • COM Express form factor, 95x95mm, Type 2 pinout • Up to 2 GB soldered DDR2 RAM • CPUs E620T, E640T, E660T and E680T • Processor independent standard (sff-sig.org) • Up to 2 GB soldered DDR2 RAM • Especially designed for battery-driven mobile systems • SATA SSD, max. 64 GB, soldered • CPU + Chipset: max. 5 watts Thermal Design Power (TDP) • MicroSD card slot • CAN controller • CAN and 4 COM ports on option connector • Shock and vibration resistant • Shock and vibration resistant • Wide temperature range (-40°C ... +85°C) • Wide temperature range (-40°C ... +85°C) • Fail-safe BIOS support for remote BIOS update • Fail-safe BIOS support for remote BIOS update • Condition monitoring using LEMT • Condition monitoring using LEMT (new: with power sense) (new: with power sense) • Module availability 10 years • Module availability 10 years

LiPPERT Embedded Computers Inc. 5555 Glenridge Connector, Suite 200 Atlanta, GA 30342 Phone (404) 459 2870 · Fax (404) 459 2871 [email protected] · www.lippertembedded.com Embedded Atom™ SBC with SUMIT Expansion Runs Fast, Stays Cool

Our fanless EBC-Z510-G is a powerful, next- generation EBX-size computing platform. Its outstanding complement of onboard I/O is augmented with MiniPCIe, SUMIT, and PC/104 connectors for high- bandwidth PCIe and USB 2.0 interfaces plus standard legacy bus expansion. This extended temperature SBC is compact and flexible enough to meet a broad range of application requirements. • Low power Intel® Atom™ processor: fanless 1.1GHz or 1.6GHz with fan • Intel® Graphics Media Accelerator displays resolutions up to 1920 x 1080 • Supports CRT and LVDS flat panels simultaneously • Custom splash screen on startup • Wireless supported with MiniPCIe socket • Two independent Gigabit Ethernet ports • CompactFlash (CF) connector • Four serial RS-232/422/485 COM ports, four dUSB USB 2.0 ports, 48 bidirectional TTL digital I/O lines, and UDMA IDE port WinSystems also offers... • HD audio, LPT, and keyboard supported • EBX sized: 5.75” x 8.0” Quick Start Kits CompactFlash PC/104 Modules • Free software drivers for Windows® XPe and Linux • SUMIT-AB and PC/104 connectors for additional I/O expansion capability Convenient and efficient Industrial-grade Reliability With SUMIT expansion • -40° to +70°C operational temperature range • Responsive and knowledgeable technical support • Quick Start Kit for software development Call 817-274-7553orVisit Contact our factory application engineers for additional www.winsystems.com/EBC-Z510 product information, custom configurations, and pricing. Ask about our 30-day product evaluation.

TM 715 Stadium Drive • Arlington, Texas 76011 Phone 817-274-7553 • FAX 817-548-1358 E-mail: [email protected]