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ET820 IP510 Baseboard
ETX ET820 Intel® Atom™ N270 ETX CPU Module w/ Baseboard Intel® 945GSE Chipset CPU IP510 Winbond W83627EHG Multi I/O DDR2 SO-DIMM Socket Intel® 945GSE Chipset Audio SATA II PCI to ISA ICH7M 10/100 LAN ICH7M SATA 8 42 2 11 USB COM SATAII Gbe10/100 LAN Features Mini ITX Nano ETX Express Baseboard ● Onboard Intel® Atom™ Processor N270, 1.6GHz, 533MHz FSB ● 1x DDR2 SO-DIMM, Max. 2GB Features ● Supports CRT and LVDS (18/24-bit dual channel) ● Winbond W83627EHG ● Integrated ICH7M 10/100BaseT LAN ● Watchdog timer, 4-in / 4-out digital I/O ● Watchdog timer, PCI to ISA ● 2x SATA , 2x IDE, 4x USB 2.0, 2x COM ● 2x Realtek 8111DL GbE LAN ● Edge connectors for PS/2, VGA, COM1, dual RJ45, 4x USB, audio connector (Line-out, Line-in & Mic.) Specifications ● 1x Mini-PCIe (x1), 1x PCI slots CPU Intel® Atom™ Processor N270, 1.6GHz ● Board connectors for 1x SATA, 1x LVDS, 2x USB, 1x LPT, System Memory 1x DDR2 SO-DIMM, Max. 2GB 3x COM and Nano ETX Express connector ® System Chipset Intel 945GSE + ICH7M, 533MHz FSB ● ATX power connector BIOS Award ● 170mm x 170mm Watchdog Timer 256 levels SSD DOM or CF socket on baseboard Ordering Information H/W Monitor Yes 4x ETX connectors for PCI bus, USB, audio, VGA/CRT, LVDS, LAN, IP510: Mini ITX Nano ETX Express baseboard Expansion Slot COM ports, LPT, IDE, PS/2 keyboard/mouse and ISA bus Intel® 945GSE integrated Graphics Media Accelerator 950 (GMA Dimensions Drawing VGA Controller 950), supports CRT/LVDS VGA Memory Shared memory - Max. -
Focus on Your Core Competency the COM Express Standard
Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. -
ETX-DC® Document Revision: 1.18
ETX-DC® Document Revision: 1.18 If it’s embedded, it’s Kontron » Table of Contents « 1 User Information ............................................................................ 1 1.1 About This Document ................................................................................................................................. 1 1.2 Copyright Notice ....................................................................................................................................... 1 1.3 Trademarks .............................................................................................................................................. 1 1.4 Standards ................................................................................................................................................ 1 1.5 Warranty .................................................................................................................................................. 2 1.6 Technical Support ...................................................................................................................................... 2 2 Introduction ................................................................................. 3 2.1 ETX®-DC .................................................................................................................................................. 3 2.2 ETX® Documentation ................................................................................................................................. 3 2.3 ETX® -
COM Express® Basic, Compact, Mini • Qseven® • SMARC™
• • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™ -
Highrel PC/104 ISA, PCI & Pcie Modules and Systems
Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing -
Embedded Computing Highlights About Congatec 02|03
Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies. -
ETX Driving Embedded
An ACCES I/O Products Whitepaper ETX Driving Embedded I/O ACCES I/O Products, Inc., 10623 Roselle Street, San Diego, CA 92121 (858) 550-9559 • Fax (858) 550-7322 • [email protected] • www.accesio.com One of the fastest-growing concepts in the embedded world is the “computer-on-module” or COM.The COM approach takes the traditional concept of a computer motherboard with plug- in I/O modules and turns it around so that the motherboard, now called a baseboard, con- tains all the I/O and the CPU with its core support chips and memory plug in as a module. The result of this reversal is an approach that blends the advantages of custom design with those of standard products. Products based on the COM approach maintain long-term viabil- ity while retaining access to the latest in computer technology. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron in early 2000. The ETX specification defines a module that is approximate- ly 100-mm square (see Figure 1) and contains the core of a personal computer (PC), including CPU, chipset, mem- aper ory, and core I/O capability. The core I/O includes Ethernet, graphics, USB, keyboard, mouse, and serial interfaces along with a PCI/ISA bus for connection to additional peripherals. Four surface-mount connectors route the mod- ule’s I/O to the baseboard, which can be designed to meet an application’s specific needs. P The original ETX specification was quickly adopted in the embedded industry and is now monitored by the ETX Industrial Group (ETXIG), which is dedicated to keeping the specification in line with advancing technology and market needs. -
QSEVEN's SECRET FORMULA for LONGEVITY Contents
white paperpaper QSEVEN'S SECRET FORMULA FOR LONGEVITY contents EXECUTIVE SUMMARY: // 4 QSEVEN CONTINUES TO DEMONSTRATE VALUE INTRODUCTION: // 4 SMALL FORM FACTOR COMS IN BIG DEMAND WHICH SMALL COM FORMAT? // 4 THE CHOICE IS YOURS QSEVEN: GAME CHANGERS // 4 QSEVEN: LATEST PROCESSOR SOLUTIONS // 4 QSEVEN: DESIGN BENEFITS AND APPLICATIONS // 4 KONTRON: AT THE FOREFRONT OF QSEVEN COM // 4 SOLUTIONS MAXIMIZING SECURITY - APPROTECT // 4 KONTRON AND QSEVEN: VALUE ADDED // 4 SUMMARY // 4 WHITE PAPER www.kontron.com // // 2 A decade since its inception, the popularity of SGET’s Qseven small form factor architecture for Computer-on-Module shows no sign of fading. With new Intel and ARM processor Qseven modules on the market there are more good reasons why devel- opers and users should stick to an architecture they know and trust. processors supported. At the same time, availability of the latest Qseven modules from large global embedded manufacturers such as Kontron allows those completely new to this form factor to enjoy a seamless experience. Ratifi ed by SGET (Standardization Group for Embedded Technologies) in 2008, Qseven’s extensive and long- established ecosystem has been the key to its longevity. It off ers designers and users considerable fl exibility on development time and cost savings when it comes to design options, avoiding the need for architectural redesigns and replacement of existing specialized Qseven boards. //// Qseven-Q7APL,Qs SMARC-sXAL (E2) In this arena, where reliability and technology familiarity are perhaps the most important factors, Qseven continues to survive and thrive as a trusted platform. Based on market reports, Qseven technology is predicted EXEXECUTIVEEECUTIVE SUMMARY: QSEQSEVENVE CONTINUES TO to be in signifi cant demand for many years to come, DEMONSTRATE VALUE ensuring it remains one of the most popular industry Qseven is well-proven as one of the embedded standard ‘credit card size’ formats on the market. -
Kontron Design Guide ®
® Kontron Design Guide ® ETX® Document Revision 2.4 This page intentionally left blank Table of Contents Table of Contents 1 User Information ........................................................................................................ 6 1.1 Objective ......................................................................................................... 6 1.2 Target Audience ................................................................................................ 6 1.3 Assumptions .................................................................................................... 6 1.4 Scope.............................................................................................................. 6 1.5 About This Document ......................................................................................... 6 1.6 Copyright Notice ............................................................................................... 7 1.7 Trademarks ...................................................................................................... 7 1.8 Standards ........................................................................................................ 7 1.9 Warranty ......................................................................................................... 7 1.10 Technical Support .............................................................................................. 8 2 Introduction ............................................................................................................. -
COM/104 Specification
StackPCTM Specification Including Adoption on PC/104, EBX, EPIC and 3.5” SBCs Form Factors Version 1.1 April 29, 2013 Please Note This specification is subject to change without notice. While every effort has been made to ensure the accuracy of the material contained within this document, Fastwel decline the responsibility for incidental or consequential damages or related expenses resulting from the use of this specification. If errors are found, please notify Fastwel. StackPC is a trademark of Fastwel Co. Ltd. All other trademarks are the property of their respective companies and organizations. Copyright 2013, Fastwel Co. Ltd IMPORTANT INFORMATION AND DISCLAIMERS Fastwel Co. Ltd (“Fastwel”) makes no warranties with regard to this StackPC Specification (“Specification”) and, in particular, neither warrant nor represent that these Specifications or any products made in conformance with them will work in the intended manner. Nor does the Fastwel assume responsibility for any errors that the Specifications may contain or have any liabilities or obligations for damages including, but not limited to, special, incidental, indirect, punitive, or consequential damages whether arising from or in connection with the use of these Specifications in any way. This specification is subject to change without notice. While every effort has been made to ensure the accuracy of the material contained within this document, the publishers shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this specification. If errors are found, please notify the publishers. No representations or warranties are made that any product based in whole or part on these Specifications will be free from defects or safe for use for its intended purposes. -
COM Express™ COM.0 Revision 2.0
COM Express™ COM.0 Revision 2.0 PICMG® adopts new specification for COM Express™ modules. What is new? If it’s embedded, it ’s Kontron. Whitepaper COM Express™ COM.0 Revision 2.0 Five years after its debut, the PCI Industrial Computer Manufacturers Group (PICMG®) has now released revision 2.0 of the COM Express™ COM.0 Computer-on-Module standard. COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies by dropping out a number of interfaces that are less useful. The growing significance of graphics and displays is evident in the changes made to the COM Express™ specification. These optimizations now make smaller COM Express™ form factors possible. Even with the changes to the specification, the pin-out types produced to date will continue to be available with new generations of chips, thereby ensuring the scalability of existing applications. The new COM Express™ COM.0 Revision 2.0 specification can be ordered directly at PICMG: https://www.picmg.org/v2internal/specorderformsec-member.htm COntents COM Express™ COM.0 Revision 2.0. 1 Summary . 2 Contents. 2 Taking stock — pin-out types 1 through 5 . 3 Pin-out type 6 opens up a new world of graphics . 3 Extensive support for additional display interfaces . .3 From SDVO to DisplayPort . 4 10 for 1. 4 Other changes . 6 External BIOS Boot . 7 Compact form factor now officially standard . 7 Conclusion . 7 About Kontron . -
COM-HPC™ Taking Standardized Coms to the Next Level CONTENTS
WHITE PAPER COM-HPC™ Taking Standardized COMs to the next level CONTENTS COM Express® FROM STRENGTH TO STRENGTH // 4 COM Express® 7: ENABLING // 4 IIOT HPC EDGE SERVER ENVIRONMENTS WHY COM-HPC™? // 5 COM-HPC™: // 5 FOR HIGH-END EMBEDDED HPC APPLICATIONS COM-HPC™: KEY HIGHLIGHTS // 6 THE FUTURE OF EMBEDDED HPC: // 7 COMe TYPE 7 & COM-HPC™ KONTRON: VALUE ADDED // 8 SUMMARY // 9 WHITE PAPER // www.kontron.com // 2 The long-established COM Express® standard for Computer- on-Modules (COM) will soon be joined by a new High Performance Computing standard. This is currently being finalized by the PCI Industrial Computer Manufacturers Group (PICMG®). Why is this necessary and what does it mean for the widely adopted COM Express®? EXECUTIVE SUMMARY Enabling more powerful and sophisticated embedded 400 Pin Connector Heiß ersehnt - neuer servers and client devices for High Performance Computing Computer on (HPC) applications is a constant challenge for the embed- ded computing industry. In 2017 this led the PCI Industrial Computer Manufacturers Group (PICMG®) to introduce its 400400 Pin Pin Pin Connector Connector Connector 400 Pin Connector COM Express® Type 7 standard. Kontron was fast to market with its first COMe Type 7 multicore processor embedded solutions, supporting powerful data analysis and real-time processing for edge server platforms. 400400 Pin Pin Pin Connector Connector Connector However, the embedded computing industry must always be ready to anticipate and respond quickly to the challeng- es of future technologies and applications. These are being driven by the industrial internet of things (IIoT), some of which are already starting to make an impact: artificial intelligence, autonomous driving and 5G wireless will COM Express® create enormous data volumes and require unprecedented basic computing power and greater connectivity.