An I/O View of Small Form Factor Choices

Total Page:16

File Type:pdf, Size:1020Kb

An I/O View of Small Form Factor Choices Technology General-purpose I/O options An I/O view of small form factor choices By Eric Rossi With all the small form factor choices available, the process of selecting an SBC takes more than a little time and consideration. Evaluating each option based on a handful of significant factors including I/O requirements helps designers make informed decisions. Designers looking for small form factor PC/104 connector. Although this form SBCs have many choices, including the factor has x86 roots, new PC/104 SBCs more widely fielded PC/104, EBX, and based on RISC (primarily ARM) archi- System-On-Module (SOM). With so tecture recently have been introduced. Figure 1 many options, how do designers deter- This allows RISC-based SBCs to make ly mine which one to use? use of the various PC/104 peripheral n modules. EBX The right choice depends on three key EBXO is a larger (5.75" x 8.0") format usu- issues plus several other considerations One of the definite advantages of thet ally utilized with higher-end processors, listed in Table 1: PC/104 format is the number of SBC and although low-end processor EBX boards peripheral options and enclosuresi navail- are available. EBX allows both PC/104 n What are the I/O requirements? able. The PC/104 standard allowsr these and PCI expansion. A standard PCI card n How much processing is required? peripheral modules toP be stacked one on slot provides for PCI bus connection (see n What are the constraints (power top of another so that almost any applica- Figure 2). Numerous manufacturers pro- consumption, size, temperature, and tion can bel implementede with a PC/104 vide boards with the EBX form factor so on)? module stack (see Figure 1). To keep up and mounting holes but do not abide by with theg higher PCI-based I/O bus speed the designated connector locations or in The answers to these questions will inthe PC/104 standard was expanded to some cases, eliminate the PC/104 con- provide the criteria needed to make an include PCI bus connections. This up- nectors altogether. This normally is not an informed choice. Let’s examine some S of dated specification, called PC/104-Plus, issue unless a designer is trying to replace these issues for each form factorr with a has a derivative called PCI-104 that omits a true EBX board or needs PC/104 when focus on how I/O can beo added. the ISA bus. it is not provided. Some manufacturers such as EMAC have enhanced their EBX PC/104 F Due to the popularity of the x86 archi- offerings by providing PC/104-Plus and PC/104 is a small (3.55" x 3.78") expand- tecture, the PC/104 format will run just Mini PCI. able format. Due to this size, PC/104 SBCs about any Operating System (OS) with usually are based on lower-end 32-bit x86 any programming language. Some of the processors (386 to Pentium). Some manu- x86 PC/104 options draw less power than facturers take liberties with the specifica- other larger form factors with higher-end tion and add small wings, increasing the processors, however RISC-based PC/104 size of the board and thus allowing faster boards can offer even lower power con- processors and/or more I/O. sumption. A PC/104 peripheral module will cost quite a bit more than an equiva- Derived from the legacy PC x86 archi- lent commodity ISA/PCI card, but the tecture, the PC/104 standard provides PC/104 card is a much smaller and more ISA bus connectivity through a special rugged alternative. Important considerations when selecting an SBC Is it a new application or a retrofit? What is the target cost? Figure 2 What is the development budget? Having a PCI card slot can be handy What Operating System (OS) and programming language are being used? when a specialty card that does not come Is there existing software that will be reused? in any other format is required. If more Will the system run on a battery or have any other special power supply requirements? than a single PCI slot is required, a riser card can provide two PCI slots that fold Is there a special card/module that must be used? over the EBX board at a right angle. The Table 1 problem with using PCI cards in this way PC104 and Small Form Factors ©2007 OpenSystems Publishing. Not for Distribution. Technology General-purpose I/O options is that they are difficult to mount and hold such as data acquisition and control, for connections makes an inherently more secure without fabricating custom brack- example, will require one or more PC/104 reliable system. ets. EMAC offers enclosures that handle expansion modules and possibly a termi- EBX boards with PCI cards holding them nal board or two. Although this is a less Like SBCs, SOMs come in a variety of securely. than optimum solution, it is off the shelf, flavors, some of which are standards minimizing time to market and incurring based and others that are propriety EBX, like the PC/104 form factor, is minimal design cost. Alternatively, a full designs. ETX, COM Express, XTX, and based on x86 architecture and will run custom solution might be favorable but STX are examples of standard SOMs almost any OS with any programming would incur a large engineering design covered by the ETX Industrial Group language. In addition, since EBX is rela- effort. Additionally, the processor core (www.etx-ig.org), PICMG (www.picmg. tively large, four serial ports and four or can be the riskiest part of the design, org), the XTX Consortium (www.xtx- more USB ports are usually provided as especially with higher-end processors. standard.org), and the STX Consortium well as one or more Ethernet ports. As (www.stx-consortium.com), respectively. mentioned, some EBX boards provide SOM splits the difference between off- These standards are primarily based on Mini PCI expansion, which is ideal for the-shelf and full custom designs, taking 32-bit x86 architecture and feature a adding wireless 802.11 Ethernet. the best elements of both approaches. This combination of ISA, PCI, or PCI Express semicustom SOM approach comprises expansion buses.l yThe advantage of these The 3.5" Half EBX format is a very pop- two components: the processor module SOMs isn that a number of manufacturers ular derivative of the EBX form factor, and the carrier board. The off-the-shelf second source them. Proprietary SOMs, which as its name indicates is half the processor module contains the processor, whichO are usually smaller and less expen- size of a full EBX board. In addition to memory, real-time clock, Ethernet, serialt sive than their standard counterparts, its smaller size, the Half EBX board uti- ports, hard disk and/or flash disk inter- come in a variety of form factors and use lizes onboard connectors for its standard face, and other processor-specificin I/O. a mix of 8-, 16-, and 32-bit processors. I/O (such as serial DB9, RJ-45 Ethernet, The module plugs into a carrierr board, They are usually pin compatible within a USB, PS2 keyboard, and DB15 video), which provides all theP system connectors manufacturer’s product line but not from eliminating some of the cables EBX and and any additional I/O components manufacturer to manufacturer even when PC/104 boards require. The cables are required forl thee application. the exact same form factor is used. usually not included with a full EBX board and are purchased separately. Whileg carrier boards can be purchased In either case, by utilizing a pin compati- inoff the shelf, enabling immediate soft- ble SOM product line, the SOM approach ware development, the carrier board must provides an upgrade path when future Sbe custom designed for the application enhancements call for a more powerful r at hand to reap the benefits of the SOM processor. In addition, once an applica- approach (see Figure 3). The customer tion is built around a particular processor “SOM splits theo or module manufacturer can perform a module, the development environment F custom carrier board design, but regard- and all the code written for it should less of who performs it, the time frame, come across seamlessly to the next proj- difference between design cost, and risk are reduced over ect. SOM also increases product longev- a full custom design. An SOM design ity. Unlike what’s possible with a full can decrease the cabling and expansion custom approach, the processor module off-the-shelf and full module stacking found in a strictly off- can be replaced easily once the processor, the-shelf approach, not to mention the flash, or RAM becomes obsolete. system unit cost savings. In addition, the custom designs, taking reduction in cabling and module inter- Narrowing the choices PC/104 is an ideal solution for applica- tions that demand an off-the-shelf small the best elements of form factor with low- to mid-range pro- cessing power. The primary disadvan- tages are multiple cables that tend to both approaches.” come loose if not secured and relatively expensive system cost when several mod- ules are required. EBX is well suited for high-end appli- SOM cations especially when a PCI card is While PC/104 and EBX have been around required. It has the same cabling issues as for a while, the System-On-Module PC/104 and is much larger than a PC/104 (SOM, also referred to as Computer-On- module.
Recommended publications
  • The Worldwide Merchant Embedded Computing Market 2018 Edition
    THE WORLDWIDE MERCHANT EMBEDDED COMPUTING MARKET 2018 EDITION A Comprehensive Report on the Latest Embedded Computing Technologies Plus Forecasts of Key Markets Report Highlights Technical Trends PCI C ompactPCI AdvancedTCA PC/104 AdvancedMC MicroTCA COM Express PMC VMEbus OCP Market Trends Total Available Market Competitive Strategies Corporate Relations Industry Analysis and Forecast, 2015-2022 MEC Market Total A vailable MEC Market By Segment (Communications, Industrial, Medical, Aerospace/Military, Other Applications) Company Profiles (89) New Venture Research Corp. A Technology Market Research Company 337 Clay St., Suite 101 [email protected] Nevada City, CA 95959 www.newventureresearch.com Tel: (530) 265-2004 Fax: (530) 265-1998 The Worldwide Merchant Embedded Computing Market - 2018 Edition Synopsis The Worldwide Merchant Embedded The Industrial market segment also holds strong Computing Market - 2018 Edition report potential for the process control industries (oil & gas, analyzes the performance of the standards-based mining, agriculture, paper/pulp and textiles) as the and non-standards-based industry from 2015 - Industrial Internet of Things begins to impact 2022. Although there are several hundred manufacturing and engage Big Data solutions for companies in the standards-based MEC market, increased productivity and output. Related industries most are fairly small in revenue and highly like robotics will require high performance designs specialized, focusing on specific application that utilize advanced artificial intelligence and virtual segments with unique product requirements. reality solutions. Clean energy is also examined for However, the report also examines the world’s optimizing efficiency in solar, wind and tidal technical leading contract manufacturers that participate in solutions. the non-standards-based product assemblies in the same market segments.
    [Show full text]
  • Focus on Your Core Competency the COM Express Standard
    Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1.
    [Show full text]
  • COM Express® Basic, Compact, Mini • Qseven® • SMARC™
    • • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™
    [Show full text]
  • Highrel PC/104 ISA, PCI & Pcie Modules and Systems
    Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing
    [Show full text]
  • Embedded Computing Highlights About Congatec 02|03
    Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies.
    [Show full text]
  • ETX Driving Embedded
    An ACCES I/O Products Whitepaper ETX Driving Embedded I/O ACCES I/O Products, Inc., 10623 Roselle Street, San Diego, CA 92121 (858) 550-9559 • Fax (858) 550-7322 • [email protected] • www.accesio.com One of the fastest-growing concepts in the embedded world is the “computer-on-module” or COM.The COM approach takes the traditional concept of a computer motherboard with plug- in I/O modules and turns it around so that the motherboard, now called a baseboard, con- tains all the I/O and the CPU with its core support chips and memory plug in as a module. The result of this reversal is an approach that blends the advantages of custom design with those of standard products. Products based on the COM approach maintain long-term viabil- ity while retaining access to the latest in computer technology. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron in early 2000. The ETX specification defines a module that is approximate- ly 100-mm square (see Figure 1) and contains the core of a personal computer (PC), including CPU, chipset, mem- aper ory, and core I/O capability. The core I/O includes Ethernet, graphics, USB, keyboard, mouse, and serial interfaces along with a PCI/ISA bus for connection to additional peripherals. Four surface-mount connectors route the mod- ule’s I/O to the baseboard, which can be designed to meet an application’s specific needs. P The original ETX specification was quickly adopted in the embedded industry and is now monitored by the ETX Industrial Group (ETXIG), which is dedicated to keeping the specification in line with advancing technology and market needs.
    [Show full text]
  • Line Up-A Copy
    Industrial Cloud Services Embedded Core Platforms Intelligent Self-Management Agent for Embedded Platforms One-Click Installation for Industrial Clouds Full Spectrum of Embedded Boards, A built-in chip with a standardized API provides a perfect solution and integrates several unique platform consolidating Featuring auto-synchronization and an intuitive interface, CloudBuilder functions to improve consistency, lighten the development effort and speed-up product time-to-market. provides resources and tools for developers to build their own cloud-based Modules and Software Services services in just 3 steps to effectively keep software current and up-to-date. Self Management • Dynamic Control Smart Fan • Multi-stage CPU Throttling • Smart Power Saving Mode Computer On Modules Embedded Single Board Computers Auto Protection MI/O Extension SBCs • Multi-level Watchdog • Real-time Detection & Response Industrial Motherboards Slot Single Board Computers Secure Storage Industrial Peripherals & Modules • Encrypted Data Space • EEPROM User Storage Regional Service & Customization Centers China Taiwan Netherlands Poland USA/ Canada Kunshan Taipei Eindhoven Warsaw Milpitas, CA Smart Access to Embedded Devices 86-512-5777-5666 886-2-2692-6076 31-40-267-7000 48-22-33-23-730 1-408-519-3800 SUSIAccess is an application for System Integrators that centralizes monitoring and management of embedded devices. By providing a ready-to-use remote access solution, system integrators can focus more on their own applications, and let Worldwide Offices SUSIAccess configure
    [Show full text]
  • QSEVEN's SECRET FORMULA for LONGEVITY  Contents
    white paperpaper QSEVEN'S SECRET FORMULA FOR LONGEVITY contents EXECUTIVE SUMMARY: // 4 QSEVEN CONTINUES TO DEMONSTRATE VALUE INTRODUCTION: // 4 SMALL FORM FACTOR COMS IN BIG DEMAND WHICH SMALL COM FORMAT? // 4 THE CHOICE IS YOURS QSEVEN: GAME CHANGERS // 4 QSEVEN: LATEST PROCESSOR SOLUTIONS // 4 QSEVEN: DESIGN BENEFITS AND APPLICATIONS // 4 KONTRON: AT THE FOREFRONT OF QSEVEN COM // 4 SOLUTIONS MAXIMIZING SECURITY - APPROTECT // 4 KONTRON AND QSEVEN: VALUE ADDED // 4 SUMMARY // 4 WHITE PAPER www.kontron.com // // 2 A decade since its inception, the popularity of SGET’s Qseven small form factor architecture for Computer-on-Module shows no sign of fading. With new Intel and ARM processor Qseven modules on the market there are more good reasons why devel- opers and users should stick to an architecture they know and trust. processors supported. At the same time, availability of the latest Qseven modules from large global embedded manufacturers such as Kontron allows those completely new to this form factor to enjoy a seamless experience. Ratifi ed by SGET (Standardization Group for Embedded Technologies) in 2008, Qseven’s extensive and long- established ecosystem has been the key to its longevity. It off ers designers and users considerable fl exibility on development time and cost savings when it comes to design options, avoiding the need for architectural redesigns and replacement of existing specialized Qseven boards. //// Qseven-Q7APL,Qs SMARC-sXAL (E2) In this arena, where reliability and technology familiarity are perhaps the most important factors, Qseven continues to survive and thrive as a trusted platform. Based on market reports, Qseven technology is predicted EXEXECUTIVEEECUTIVE SUMMARY: QSEQSEVENVE CONTINUES TO to be in signifi cant demand for many years to come, DEMONSTRATE VALUE ensuring it remains one of the most popular industry Qseven is well-proven as one of the embedded standard ‘credit card size’ formats on the market.
    [Show full text]
  • COM/104 Specification
    StackPCTM Specification Including Adoption on PC/104, EBX, EPIC and 3.5” SBCs Form Factors Version 1.1 April 29, 2013 Please Note This specification is subject to change without notice. While every effort has been made to ensure the accuracy of the material contained within this document, Fastwel decline the responsibility for incidental or consequential damages or related expenses resulting from the use of this specification. If errors are found, please notify Fastwel. StackPC is a trademark of Fastwel Co. Ltd. All other trademarks are the property of their respective companies and organizations. Copyright 2013, Fastwel Co. Ltd IMPORTANT INFORMATION AND DISCLAIMERS Fastwel Co. Ltd (“Fastwel”) makes no warranties with regard to this StackPC Specification (“Specification”) and, in particular, neither warrant nor represent that these Specifications or any products made in conformance with them will work in the intended manner. Nor does the Fastwel assume responsibility for any errors that the Specifications may contain or have any liabilities or obligations for damages including, but not limited to, special, incidental, indirect, punitive, or consequential damages whether arising from or in connection with the use of these Specifications in any way. This specification is subject to change without notice. While every effort has been made to ensure the accuracy of the material contained within this document, the publishers shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this specification. If errors are found, please notify the publishers. No representations or warranties are made that any product based in whole or part on these Specifications will be free from defects or safe for use for its intended purposes.
    [Show full text]
  • COM Express™ COM.0 Revision 2.0
    COM Express™ COM.0 Revision 2.0 PICMG® adopts new specification for COM Express™ modules. What is new? If it’s embedded, it ’s Kontron. Whitepaper COM Express™ COM.0 Revision 2.0 Five years after its debut, the PCI Industrial Computer Manufacturers Group (PICMG®) has now released revision 2.0 of the COM Express™ COM.0 Computer-on-Module standard. COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies by dropping out a number of interfaces that are less useful. The growing significance of graphics and displays is evident in the changes made to the COM Express™ specification. These optimizations now make smaller COM Express™ form factors possible. Even with the changes to the specification, the pin-out types produced to date will continue to be available with new generations of chips, thereby ensuring the scalability of existing applications. The new COM Express™ COM.0 Revision 2.0 specification can be ordered directly at PICMG: https://www.picmg.org/v2internal/specorderformsec-member.htm COntents COM Express™ COM.0 Revision 2.0. 1 Summary . 2 Contents. 2 Taking stock — pin-out types 1 through 5 . 3 Pin-out type 6 opens up a new world of graphics . 3 Extensive support for additional display interfaces . .3 From SDVO to DisplayPort . 4 10 for 1. 4 Other changes . 6 External BIOS Boot . 7 Compact form factor now officially standard . 7 Conclusion . 7 About Kontron .
    [Show full text]
  • COM-HPC™ Taking Standardized Coms to the Next Level  CONTENTS
    WHITE PAPER COM-HPC™ Taking Standardized COMs to the next level CONTENTS COM Express® FROM STRENGTH TO STRENGTH // 4 COM Express® 7: ENABLING // 4 IIOT HPC EDGE SERVER ENVIRONMENTS WHY COM-HPC™? // 5 COM-HPC™: // 5 FOR HIGH-END EMBEDDED HPC APPLICATIONS COM-HPC™: KEY HIGHLIGHTS // 6 THE FUTURE OF EMBEDDED HPC: // 7 COMe TYPE 7 & COM-HPC™ KONTRON: VALUE ADDED // 8 SUMMARY // 9 WHITE PAPER // www.kontron.com // 2 The long-established COM Express® standard for Computer- on-Modules (COM) will soon be joined by a new High Performance Computing standard. This is currently being finalized by the PCI Industrial Computer Manufacturers Group (PICMG®). Why is this necessary and what does it mean for the widely adopted COM Express®? EXECUTIVE SUMMARY Enabling more powerful and sophisticated embedded 400 Pin Connector Heiß ersehnt - neuer servers and client devices for High Performance Computing Computer on (HPC) applications is a constant challenge for the embed- ded computing industry. In 2017 this led the PCI Industrial Computer Manufacturers Group (PICMG®) to introduce its 400400 Pin Pin Pin Connector Connector Connector 400 Pin Connector COM Express® Type 7 standard. Kontron was fast to market with its first COMe Type 7 multicore processor embedded solutions, supporting powerful data analysis and real-time processing for edge server platforms. 400400 Pin Pin Pin Connector Connector Connector However, the embedded computing industry must always be ready to anticipate and respond quickly to the challeng- es of future technologies and applications. These are being driven by the industrial internet of things (IIoT), some of which are already starting to make an impact: artificial intelligence, autonomous driving and 5G wireless will COM Express® create enormous data volumes and require unprecedented basic computing power and greater connectivity.
    [Show full text]
  • Ampro XTX 830 Core™ Duo Computer-On-Module
    Computer-On-Module Products RoHS Ampro XTX 830 2002/95/EC Core™ Duo Computer-On-Module Blazing Performance, Power Management Choose Ampro XTX 830 for… Specifications Modular, ultra high performance applications that PROCESSORS NETWORK INTERfacE require notebook-style power management. • Choice of • Ethernet – Intel 82562 (10/100BaseT) ™ – Core Duo T2500 2.0GHz VIDEO INTERfacE Description – Core™ Solo TBD • Controller – Integrated Intel GMA 950 Ampro XTX 830 is a small ultra high- • Cache – 2MB Level 2 – AGP 3D engine performance, Dual Core processor module with • Chipset – Intel 945GM/ICH7M – Supports resolutions to 2048x1536 advanced networking and high-performance • FSB – 533MHz or 667MHz – Up to 224MB DVMT Frame Buffer graphics in a modular format that plugs into your • System Controllers – PC-compatible DMA and • Multiple Display support existing ETX baseboard with minimal design interrupt controllers and timers – LVDS, TV-out CRT change. • Watchdog Timer SOFTWARE & DEVELOPMENT TOOLS ® MEMORY • OS Support – Windows CE 5.0, XP, XPe • DRAM – Up to 1GB DDR2 400/533/667 (See Web site for details) • Up to 1GB DDR2 Memory SODIMM • BIOS – AMI with ACPI 2.0 including S3 BUS INTERfacE MECHANICAL • New XTX standard • PCI Express™ 4 x1, PCI and LPC • Size – 95x114mm (3.7x4.5"); XTX form factor • Power Requirements • PCI Express, SATA I/O • EIDE –Single PCI-bus Enhanced Ultra DMA (w/512MB RAM, 100% Loaded) – 2.0GHz TBD @ 5V • ACPI 2.0 with S3 support 66/100 Synchronous IDE Interface supports up to two hard drives • Temperature (100 CFM system air flow) • Latest chipset, without a complete • SATA – 2 ports – Standard: 0° to +60°C baseboard re-design • Serial – 2 ports, TTL, transceivers on baseboard – Storage: –20° to +75°C • Parallel – EPP/ECP bidirectional port • Floppy – Supports 1 or 2 drives, shared with parallel • USB – 6 USB 2.0 ports For more information, pricing, and • Keyboard/Mouse – PS/2 interface details on volume discounts, please • Audio – AC97/HD speaker, mic, headphone call us at 1.
    [Show full text]