Design Guide COM-Express

Total Page:16

File Type:pdf, Size:1020Kb

Design Guide COM-Express Design Guide COM-Express Carrier Board Design Guide Advantech COM-Express Carrier Board Design Guide Addendum Notices The copyright on this user manual remains with Advantech Co., Ltd. No part of this user manual may be transmitted, reproduced, or changed. Other companies’ product names that may be used herein remain the property of their respective owners. The product specifications, design and this user’s manuals content are subject to change without notice. If you have any questions, please contact your merchant or our service center for clarification. We are not responsible for any losses resulting from using this product no matter what the reason. Revision History Version/Revision date Date Description Version 1.0 July, 2006 Initial release Version 1.1 July, 2007 Version 1.2 April, 2009 Change format to Addendum Version 2.0 May, 2010 Version 2.1 August, 2010 Part No. 2006001801 Edition 2.1 Printed in Taiwan August 2010 2 Notices Advantech COM-Express Carrier Board Design Guide Addendum Table of Contents Table of Contents .......................................................................................................3 Chapter 1 Introduction ............................................................................................7 1.1 COM-Express Overview ................................................................ 7 1.2 Terminology .................................................................................. 8 Table 1.1 Conventions and Terminology .......................................8 1.3 Referenced Documents .............................................................. 10 Table 1.2 Referenced Documents ...............................................10 Chapter 2 Carrier Board Schematic Guidelines .................................................11 2.1 Gigabit Ethernet (GBE) ............................................................... 11 2.1.1 Signal Descriptions .......................................................................11 2.1.2 DC Specifications .........................................................................11 2.1.3 Schematic Guidelines ...................................................................12 2.1.4 Layout Guidelines .........................................................................13 2.2 AC’97 Audio / HD Audio .............................................................. 18 2.2.1 Signal Description .........................................................................18 2.2.2 DC Specifications .........................................................................18 2.2.3 AC’97 Audio Spec.........................................................................18 2.2.4 Schematic Guidelines ...................................................................19 2.2.5 Layout Guidelines .........................................................................22 2.3 Serial ATA ................................................................................... 25 2.3.1 Schematic Guidelines ...................................................................25 2.3.2 Layout Guidelines .........................................................................26 2.4 Primary IDE ................................................................................. 27 2.4.1 Signal Description .........................................................................27 2.4.2 DC Specifications .........................................................................27 2.4.3 IDE Spec.......................................................................................28 2.4.4 Schematic Guidelines ...................................................................28 2.4.5 Layout Guidelines .........................................................................30 2.5 PCI Express Bus ......................................................................... 31 2.5.1 Signal Description .........................................................................31 2.5.2 Schematic Guidelines ...................................................................32 2.5.3 Layout Guidelines .........................................................................35 2.6 SDVO .......................................................................................... 38 2.7 PCI-Bus ....................................................................................... 39 2.7.1 Signal Description .........................................................................39 2.7.2 DC Specifications .........................................................................40 2.7.3 AC Specifications..........................................................................40 2.7.4 Schematic Guidelines ...................................................................40 2.7.5 Layout Guidelines .........................................................................44 2.8 Universal Serial Bus (USB) ......................................................... 47 2.8.1 Signal Description .........................................................................47 2.8.2 DC Specifications .........................................................................47 2.8.3 USB Spec. ....................................................................................47 2.8.4 Schematic Guidelines ...................................................................47 2.8.5 Layout Guideline ...........................................................................49 2.9 LVDS ........................................................................................... 51 2.9.1 Signal Description .........................................................................51 2.9.2 DC Specifications .........................................................................51 2.9.3 Schematic Guidelines ...................................................................51 2.9.4 Layout Requirements....................................................................52 Table of Contents 3 Advantech COM-Express Carrier Board Design Guide Addendum 2.10 VGA ............................................................................................ 53 2.10.1 Signal Description .........................................................................53 2.10.2 DC Specifications .........................................................................53 2.10.3 VGA Specifications .......................................................................54 2.10.4 Schematic Guidelines ...................................................................54 2.10.5 Layout Guideline ...........................................................................54 2.11 TV-Out ........................................................................................ 55 2.11.1 Signal Description .........................................................................55 2.11.2 Schematic Guidelines ...................................................................55 2.11.3 Layout Guidelines .........................................................................57 2.12 LPC ............................................................................................. 57 2.12.1 Signal Description .........................................................................57 2.12.2 Schematic Guidelines ...................................................................58 2.12.3 Layout Guidelines .........................................................................58 2.12.4 Application Notes for Super I/O Functions ....................................58 2.13 Power Management Signals ....................................................... 62 2.13.1 Power Good / Reset Input ............................................................62 2.13.2 Reset signals ................................................................................63 2.14 Miscellaneous ............................................................................. 64 2.14.1 Miscellaneous Signal Descriptions ............................................... 64 2.14.2 SPKR ..........................................................................................64 2.14.3 I2C Bus .........................................................................................65 2.14.4 I2C Spec .......................................................................................66 2.14.5 SMBus ..........................................................................................66 2.14.6 WDT ..........................................................................................67 Chapter 3 Power Management and Power Delivery ...........................................68 3.1 Power Design Guidelines ............................................................ 68 3.1.1 ATX Power Delivery Block Diagram ............................................. 68 3.1.2 ATX power with Super I/O ............................................................69 3.1.3 ATX power w/o Super I/O .............................................................69 3.1.4 AT Power Delivery Block Diagram ................................................70 3.1.5 AT Power Working as ATX Mode .................................................71 Chapter 4 PCB Layout Guidelines .......................................................................72 4.1 Nominal Board Stack-Up ............................................................. 72 4.1.1 Four-layer board stack-up .............................................................73 Table 4-1 Recommended Four-Layer Stack-Up Dimensions ...... 73 4.1.2 Six-layer board stack-up ...............................................................74
Recommended publications
  • In This Video We Are Going to See How a Personal Computer Hardware Is Organised the PC Was Designed with an Open Architecture
    In this video we are going to see how a personal computer hardware is organised The PC was designed with an open architecture. This means that it uses standard modular components. We can add, replace, update or swap them easily and the computer will identify and handle the new devices automatically. The main component of a computer system is the motherboard or main board. It is a printed circuit board (PCB) that holds the main components of the computer and the electronics needed to communicate between them and to expand the system. We could say that it is the central nervous system of the computer. A motherboard provides the electrical connections by which the other components of the system communicate. Unlike a backplane, it also contains the central processing unit and hosts other subsystems and devices The form factor is the specification of a motherboard – the dimensions, power supply type, location of mounting holes, number of ports on the back panel, etc. In the IBM PC compatible industry, standard form factors ensure that parts are interchangeable across competing vendors and generations of technology, while in enterprise computing, form factors ensure that server modules fit into existing rack mount systems. Traditionally, the most significant specification is for that of the motherboard, which generally dictates the overall size of the case. The most used form factor for IBM PC compatible motherboards is ATX (Advanced Technology Extended) and its derivatives. For small form factor mainboards mini ITX is the de facto standard. A power supply unit (PSU) converts mains AC to low- voltage regulated DC power for the internal components of a computer.
    [Show full text]
  • PCI/104-Express and Pcie/104 Specification
    PCI/104-Express™ & PCIe/104™ Specification Including Adoption on 104™, EPIC™ and EBX™ Form Factors Version 2.10 February 18, 2013 Please Note This specification is subject to change without notice. While every effort has been made to ensure the accuracy of the material contained within this document, the PC/104 Consortium shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this specification. If errors are found, please notify the PC/104 Consortium. The PC/104 logo, PC/104, PC/104-Plus, PCI-104, PCIe/104, PCI/104-Express, 104, EPIC and EBX are trademarks of the PC/104 Consortium. All other marks are the property of their respective companies. Copyright 2007 - 2013, PC/104 Consortium IMPORTANT INFORMATION AND DISCLAIMERS The PC/104 Consortium (“Consortium”) makes no warranties with regard to this PCI/104-Express and PCIe/104 Specifications (“Specifications”) and, in particular, neither warrant nor represent that these Specifications or any products made in conformance with them will work in the intended manner. Nor does the Consortium assume responsibility for any errors that the Specifications may contain or have any liabilities or obligations for damages including, but not limited to, special, incidental, indirect, punitive, or consequential damages whether arising from or in connection with the use of these Specifications in any way. This specification is subject to change without notice. While every effort has been made to ensure the accuracy of the material contained within this document, the publishers shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this specification.
    [Show full text]
  • Qseven MSC Q7-MB-RP3
    Qseven MSC Q7-MB-RP3 Description Qseven™ 2.0 Evaluation Board The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify Qseven™ Rev. 2.0 modules for compatibility with the SGET specification. The board is shipped with a complete set of design files. An extensive design guide for the Qseven™ module technology is also provided to allow the motherboard designer to easily implement a custom version of a Qseven™ carrier. The Qseven™ Rev. 2.0 reference platform MSC Q7-MB-RP3 offers a large variety of interfaces commonly used in industrial applications such as Gigabit LAN, USB 3.0/2.0, RS232 and CAN as well as HDMI, DP and LVDS 435 x 170 for display attachment. In addition PCI Express is supported with one x16 and three PCIe x1 slots. This platform for N.A. rapid prototyping helps to assess the fitness of a specific CPU Technology. It is a key instrument to shorten design N.A.N.A. cycles and to improve time to market of new Qseven™ based systems. Highlights . One PCI Express™ x16 slot and 3 x1 slots . Two graphic card slots for HDMI / DP / eDP / LVDS . Mini PCI Express™ & mSATA slot . SD Card socket and SIM Card slot . Two SATA onboard connectors . Winbond W83627DHG Super I/O . EXAR X28V384 Super I/O . 7x COM, HW monitor . CAN Transceiver . HD audio codec . USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces avnet.com/embedded Qseven Technical Data - MSC Q7-MB-RP3 Formfactor Wide-ATX Storage Interfaces 2x SATA USB USB 3.0, 4x USB 2.0 Host, USB 2.0 Client Serial Interfaces 2x COM from Winbond Super I/O 4x COM from EXAR Super I/O 1x COM from Qseven module Bus Interfaces PCI express x16, 3x PCIe x1 Display Interfaces HDMI, DP, eDP, LVDS on add-on cards Network Interface GbE Audio Interface HD Audio on 6 connectors + S/PDIF Power Requirement 12V on standard connectors Certificates UL avnet.com/embedded Qseven Order Reference - MSC Q7-MB-RP3 Order Description Reference Cat Number 1135005 The MSC Q7-MB-RP3 is a reference platform designed for evaluation and MSC Q7-MB-RP3 PV test of Qseven Rev.
    [Show full text]
  • Focus on Your Core Competency the COM Express Standard
    Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1.
    [Show full text]
  • Picopsu-120-WI-25 12-25V, 120Watt ATX Power Supply
    picoPSU-120-WI-25 12-25V, 120Watt ATX Power Supply Quick Installation Guide Version 1.0b P/N picoPSU-120-WI-25 ATX DC-DC Converter Series Introduction The picoPSU-120-WI-25 is a small yet powerful and fully compliant ATX power supply designed to power a wide variety of motherboard from a single 12-25V unregulated power source. The picoPSU-120-WI-25 is the only “plug-in” wide input range power supply solution for general purpose low power motherboards. Compatible with most VIA C3/C7 CPUs M/B and with Pentium-M / Core Duo boards, picoPSU-120-WI-25 provides cool, 100% silent power for your system. The PICOPSU-120-WI-25 has many advantages over a regular power supply: -Smallest ATX PSU to date -100% silent operation -Low heat dissipation with combined efficiency over 94% -Plugs directly into the motherboard’s power connector, no cable mess Quick installation Instructions The PICOPSU-120-WI-25 has been specifically designed for the Mini- ITX form factor, thus eliminating the need for ATX power cables. It is also 1U compliant – height will not exceed the 1U formfactor. 1) After the picoPSU module was ‘snapped in’, hook the hard drive power or floppy power to your floppy/hard drives. If more hard drives or floppy connectors are needed, use a HDD/floppy “Y” splitter cable. 2) picoPSU-120-WI-25 Quick Installation Guide Page 2 ATX DC-DC Converter Series 2) Connect a 12-25VDC power adapter (peak should not exceed 26.5V) to the input connector. 3) Turn on the PC using the motherboard ON/OFF switch Typical configuration The picoPSU-120-WI-25 has been tested with all mini-ITX board under virtually any disk/floppy/CDROM/PCI configuration.
    [Show full text]
  • COM Express® Basic, Compact, Mini • Qseven® • SMARC™
    • • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™
    [Show full text]
  • Highrel PC/104 ISA, PCI & Pcie Modules and Systems
    Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing
    [Show full text]
  • Embedded Computing Highlights About Congatec 02|03
    Product Guide Spring 2014 EMBEDDED COMPUTING HIGHLIGHTS About congatec 02|03 congatec AG is the preferred global vendor for innovative embedded solutionsto enable competitive advantages for our customers. Letter from the CEO Since the company’s inception in December Moreover, we bolstered our sales presence in adopting in order to not only offer benefits for 2004, congatec AG has established itself as a Australia and New Zealand through opening customers, but also to further tap target markets. globally recognized expert and reliable partner a new branch in Queensland. The Australian for embedded computer-on-modules solutions, market offers great potential, especially in the This would all be impossible without our coupled with excellent service and support. We segments of entertainment (gaming), agricultural employees’ commitment. I would like to take have secured second ranking worldwide in our technology, transportation management and this opportunity to again express my thanks to all market segment within the space of just eight medical technology, where congatec products congatec employees. In the passion with which years after our founding thanks to our clear can be deployed optimally. they pursue their daily activities, and through focus. customer-orientation, creativity and team Following the opening of the branches in Japan spirit, they have already brought the company congatec has already ranked among the Deloitte Australia, congatec is now represented with six to a leading position, and, together with the On our way to market leadership Technology Fast 50 for the second consecutive branches on four continents – Asia (Taiwan and company’s management, continue to stand for year1. This award distinguishes Germany’s Japan), Australia, Europe (Germany and the a sustainable and partnership-based corporate congatec AG, headquartered in Deggendorf, highest-growth technology companies.
    [Show full text]
  • Features Pcie/104 Qseven
    PCIE/104 QSEVEN CARRIER BOARD PART NUMBER: QCG001 Connect Tech’s PCIe/104 Qseven Carrier Board is a small embedded carrier board that allows complete integration with any industry standard Qseven module. This carrier board utilizes the PC/104 form factor with 4 x1 PCIe lanes, and the PCIe/104 bus. The on-board connectors enable connection to SATA, USB, Ethernet, LVDS Video, VGA Video, and RS-232 & RS-422/485. Easily upgrade to the latest processor and memory technology while maintaining the I/O interfaces. FEATURES ✓ PCIe/104 form factor ✓ Uses any off-the-shelf Qseven module ✓ Ideal for applications with low ✓ Connectors and cables included for power requirements easy connection to Qseven features Custom Design Services Note: Qseven CPU module mounted Can’t find the feature you need or require a different form factor? on bottom side. Qseven module sold separately. The PCIe/104 Qseven Carrier Board allows you to prototype your application, while Connect Tech’s design services creates a custom solution. SPECIFICATIONS Form Factor PCIe/104, 4 x1 PCIe lanes Display VGA, LVDS flat panel Storage 2x SATA Serial Interface 2x RS-232, 2x RS-485 USB 4x USB 2.0 Ethernet 1x Gigabit Ethernet Dimensions PC/104 compliant Temperature -20°C to 70°C (-4°F to 158°F) Power ATX supply input Additional I/O PS/2 keyboard and mouse Warranty and Accessories Optional Cable Kit 2 Year Warranty and free technical support Support Specifications subject to change without notice. ©2020 Connect Tech Inc. All trademarks are property of their respective holder. CTIX-00076(0.05) - 2021-07-20 Connect Tech Inc.
    [Show full text]
  • ETX Driving Embedded
    An ACCES I/O Products Whitepaper ETX Driving Embedded I/O ACCES I/O Products, Inc., 10623 Roselle Street, San Diego, CA 92121 (858) 550-9559 • Fax (858) 550-7322 • [email protected] • www.accesio.com One of the fastest-growing concepts in the embedded world is the “computer-on-module” or COM.The COM approach takes the traditional concept of a computer motherboard with plug- in I/O modules and turns it around so that the motherboard, now called a baseboard, con- tains all the I/O and the CPU with its core support chips and memory plug in as a module. The result of this reversal is an approach that blends the advantages of custom design with those of standard products. Products based on the COM approach maintain long-term viabil- ity while retaining access to the latest in computer technology. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron in early 2000. The ETX specification defines a module that is approximate- ly 100-mm square (see Figure 1) and contains the core of a personal computer (PC), including CPU, chipset, mem- aper ory, and core I/O capability. The core I/O includes Ethernet, graphics, USB, keyboard, mouse, and serial interfaces along with a PCI/ISA bus for connection to additional peripherals. Four surface-mount connectors route the mod- ule’s I/O to the baseboard, which can be designed to meet an application’s specific needs. P The original ETX specification was quickly adopted in the embedded industry and is now monitored by the ETX Industrial Group (ETXIG), which is dedicated to keeping the specification in line with advancing technology and market needs.
    [Show full text]
  • Micro Fly Cases
    Micro Fly Cases Micro Fly, Micro ATX Case In the past, trying to find a compact case that is still versatile and truly dynamic was a daunting task. But that's all changed now that there's the Ultra Micro Fly! The Micro Fly can utilize any micro ATX motherboard, and because the Micro Fly is 1.5" deeper than similar cases, it can accept standard depth ATX power supplies and standard depth optical drives. Despite Micro Fly's compact size, cooling is never a problem since the Micro Fly comes included with an 80MM fan in the front bringing cool air in, and a 120MM fan in the rear pulling hot air out. The Micro Fly also includes front USB, Firewire and Audio Outputs and is available with an optional, Ultra V-Series 400W power 120mm Fan Full Size ATX Power Supply Bay (Included) (Included In Some Models) supply with custom length cables. Black Includes 400W V-Series PSU Part #: ULT33114 Model #: MFBK400 UPC#: 022769331140 Motherboard 4 Expansion Slots Temperature Display MS-Blue Backplate Includes 400W V-Series PSU Specifications · Expansion Slots: Part #: ULT33115 · Colors: Black, MS Blue, Silver Model #: MFBL400 - 4 Standard Slots UPC#: 022769331157 · 5 Drive Bay: · Rear 120mm Fan 2 - External 5.25" · Front 80mm Fan 1 - External 3.5” · Dimensions: Black w/ Clear Side 2 - Internal 3.5” Includes 400W V-Series PSU - Width: 11.25" · Material: Aluminum Part #: ULT33116 Front Temperature Display, - Height: 9" Model #: MFCLRBK400 USB, Firewire, and Audio Inputs · Form Factor: Micro ATX - Depth: 15” UPC#: 022769331164 Black w/ Clear Side 400 Watt V-Series
    [Show full text]
  • Line Up-A Copy
    Industrial Cloud Services Embedded Core Platforms Intelligent Self-Management Agent for Embedded Platforms One-Click Installation for Industrial Clouds Full Spectrum of Embedded Boards, A built-in chip with a standardized API provides a perfect solution and integrates several unique platform consolidating Featuring auto-synchronization and an intuitive interface, CloudBuilder functions to improve consistency, lighten the development effort and speed-up product time-to-market. provides resources and tools for developers to build their own cloud-based Modules and Software Services services in just 3 steps to effectively keep software current and up-to-date. Self Management • Dynamic Control Smart Fan • Multi-stage CPU Throttling • Smart Power Saving Mode Computer On Modules Embedded Single Board Computers Auto Protection MI/O Extension SBCs • Multi-level Watchdog • Real-time Detection & Response Industrial Motherboards Slot Single Board Computers Secure Storage Industrial Peripherals & Modules • Encrypted Data Space • EEPROM User Storage Regional Service & Customization Centers China Taiwan Netherlands Poland USA/ Canada Kunshan Taipei Eindhoven Warsaw Milpitas, CA Smart Access to Embedded Devices 86-512-5777-5666 886-2-2692-6076 31-40-267-7000 48-22-33-23-730 1-408-519-3800 SUSIAccess is an application for System Integrators that centralizes monitoring and management of embedded devices. By providing a ready-to-use remote access solution, system integrators can focus more on their own applications, and let Worldwide Offices SUSIAccess configure
    [Show full text]