Intel ® Atom™ Processor E6xx Series SKU for Different Segments” on Page 30 Updated Table 15

Intel® Atom™ Processor E6xx Series Datasheet July 2011 Revision 004US Document Number: 324208-004US INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. 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For more information including details on which processors support Intel® HT Technology, see http://www.intel.com/products/ht/hyperthreading_more.htm. β Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate CODEC and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, CODEC, drivers and speakers. For more information about Intel® HD audio, refer to http://www.intel.com/. χ 64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Performance will vary depending on your hardware and software configurations. 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SMBus is a subset of the I2C* bus/protocol and was developed by Intel. Implementations of the I2C* bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation. BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino Inside, Core Inside, i960, Intel, the Intel logo, Intel AppUp, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, the Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel Sponsors of Tomorrow., the Intel Sponsors of Tomorrow. logo, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, InTru, the InTru logo, InTru soundmark, Itanium, Itanium Inside, MCS, MMX, Moblin, Pentium, Pentium Inside, skoool, the skoool logo, Sound Mark, The Journey Inside, vPro Inside, VTune, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2011, Intel Corporation. All rights reserved. Intel® Atom™ Processor E6xx Series DS July 2011 2 Document Number: 324208-004US Contents—Intel® Atom™ Processor E6xx Series Contents 1.0 Introduction ............................................................................................................ 23 1.1 Terminology ..................................................................................................... 23 1.2 Reference Documents ........................................................................................ 25 1.3 Components Overview ....................................................................................... 25 1.3.1 Low-Power Intel® Architecture Core.......................................................... 26 1.3.2 System Memory Controller ...................................................................... 27 1.3.3 Graphics ............................................................................................... 27 1.3.4 Video Decode ........................................................................................ 27 1.3.5 Video Encode......................................................................................... 27 1.3.6 Display Interfaces .................................................................................. 27 1.3.6.1 LVDS Interface ......................................................................... 28 1.3.6.2 Serial DVO (SDVO) Display Interface ........................................... 28 1.3.7 PCI Express* ......................................................................................... 28 1.3.8 LPC Interface......................................................................................... 28 β β 1.3.9 Intel® High Definition Audio (Intel® HD Audio ) Controller.......................... 28 1.3.10 SMBus Host Controller ............................................................................ 29 1.3.11 General Purpose I/O (GPIO)..................................................................... 29 1.3.12 Serial Peripheral Interface (SPI) ............................................................... 29 1.3.13 Power Management ................................................................................ 29 1.3.14 Watchdog Timer (WDT)........................................................................... 29 1.3.15 Real Time Clock (RTC) ............................................................................ 29 1.3.16 Package ................................................................................................ 29 1.3.17 Intel® Atom™ Processor E6xx Series SKU.................................................. 30 2.0 Signal Description ................................................................................................... 31 2.1 System Memory Signals ..................................................................................... 32 2.2 Integrated Display Interfaces.............................................................................. 33 2.2.1 LVDS Signals ......................................................................................... 33 2.2.2 Serial Digital Video Output (SDVO) Signals ................................................ 34 2.3 PCI Express* Signals ......................................................................................... 35 β 2.4 Intel® High Definition Audio Interface Signals ...................................................... 35 2.5 LPC Interface Signals ......................................................................................... 36 2.6 SMBus Interface Signals..................................................................................... 36 2.7 SPI Interface Signals ......................................................................................... 36 2.8 Power Management Interface Signals................................................................... 37 2.9 Real Time Clock Interface Signals ........................................................................ 38 2.10 JTAG and Debug Interface .................................................................................. 39 2.11 Miscellaneous Signals and Clocks......................................................................... 40 2.12 General Purpose I/O .........................................................................................

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