Linköping Studies in Science and Technology Dissertation No. 1532 Low Overhead Memory Subsystem Design for a Multicore Parallel DSP Processor Jian Wang Department of Electrical Engineering Linköping University SE-581 83 Linköping, Sweden Linköping 2014 ISBN 978-91-7519-556-8 ISSN 0345-7524 ii Low Overhead Memory Subsystem Design for a Multicore Parallel DSP Processor Jian Wang ISBN 978-91-7519-556-8 Copyright ⃝c Jian Wang, 2014 Linköping Studies in Science and Technology Dissertation No. 1532 ISSN 0345-7524 Department of Electrical Engineering Linköping University SE-581 83 Linköping Sweden Phone: +46 13 28 10 00 Author e-mail:
[email protected] Cover image Combined Star and Ring onchip interconnection of the ePUMA multicore DSP. Parts of this thesis are reprinted with permission from the IEEE. Printed by UniTryck, Linköping University Linköping, Sweden, 2014 Abstract The physical scaling following Moore’s law is saturated while the re- quirement on computing keeps growing. The gain from improving sili- con technology is only the shrinking of the silicon area, and the speed- power scaling has almost stopped in the last two years. It calls for new parallel computing architectures and new parallel programming meth- ods. Traditional ASIC (Application Specific Integrated Circuits) hardware has been used for acceleration of Digital Signal Processing (DSP) subsys- tems on SoC (System-on-Chip). Embedded systems become more com- plicated, and more functions, more applications, and more features must be integrated in one ASIC chip to follow up the market requirements. At the same time, the product lifetime of a SoC with ASIC has been much reduced because of the dynamic market.