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2008 PC104 Resource Guide

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For Single Pnt For Single Pnt www.smallformfactors.com www.pc104online.com Volume 12 • Number 1 Audio/Video .................39 COLUMNS Frame grabber/Codec Frame grabbers 8 Focus on Form Factors: StackableUSB USB, minus the cables, connects boards Board level ..................41 By Susan Wooley DSP resource boards System boards 10 European Technology SFF-bots handle heavy lifting By Hermann Strass Carrier boards................42 106 Editor’s Insight ETX A new SIG in town By Chris A. Ciufo Communications ..............43 Datacom: Serial controller GPS FEATURES Modem Modem/Fax modem EXECUTIVE VIEWPOINT Wireless 12 Economies of scale helping low-volume design and manufacturing Q & A with Wade Clowes, RadiSys Industrial automation ..........47 14 Got any Gumstix? A look at shrinking SDR Fieldbus: CAN Q & A with Steve Jennis, PrismTech, and Gordon Kruberg, Gumstix Image processing/machine vision DESKTOP TRENDS SHRINK TO SMALL FORM FACTORS 16 Wi-Fi By Don Dingee Mezzanines ..................50 PMC XMC 18 A big future for small rugged devices By Herb Turzer, Psion Teklogix For Single Pnt 22 Wireless loggers self-adjust temperature monitoring data Packaging ...................56 By Ana Carmona-Rodriguez, Gemini Data Loggers Connectors Enclosures 26 USB Power supplies By Don Dingee 28 UMPCs get a direct connection to users’ primary PCs Processor boards/SBCs.........59 By Alex Chow, PLX Technology BitsyX COM Express 32 Portable fuel cell powers PC/104 platforms COM/SOM EBX By Amar Ganwani and Ted Prescop, UltraCell EPIC ETX Fanless JRex DEPARTMENTS Mini-ITX PC/104 PC/104-Plus PCI-104 23,36,37 Editor’s Choice Products Stand Alone Board System boards By Don Dingee XTX 102 New Products By Robin DiPerna Ruggedized/Mil-Spec . 94 ARINC Avionics ON THE COVER: MIL-STD-1553 Desktop technologies like Wi-Fi and USB are expanding their influence by shrinking to fit small form factor devices. Coverage of these prolific design trends starts on page 16. Storage.....................96 Solid-State Disk Published by: OpenSystems Test and Analysis..............97 Publishing™ Data acquisition I/O: FPGA © 2008 OpenSystems Publishing © 2008 PC/104 and Small Form Factors I/O: Multifunction All registered brands and trademarks in PC/104 and Small Form Factors are property of their respective owners. guide resource 4 / 2008 PC/104 and Small Form Factors Resource Guide For Single Pnt ADVERTISER INFORMATION Page/RSC# Advertiser/Ad title 19 ACCES I/O Products, Inc. – Boldly go 29 Advantech Corporation – Total Rugged Solutions A N OPEN S Y S TEM S PUBLIC A TI O N 55 Aprotek, Inc. – PC/104 Modems Military & Aerospace Group 9 Arcom Control Systems, Inc. – Digital technologies n DSP-FPGA.com Resource Guide n DSP-FPGA.com 95 BMC Communications – ARINC & MIL-STD-1553 n DSP-FPGA.com E-letter n Military Embedded Systems 2 Diamond Systems Corporation – 4 things you’ll love n Military Embedded Systems E-letter 3 EEPD North America, Inc. – COM Express n PC/104 and Small Form Factors n PC/104 and Small Form Factors E-letter 31 EuroTecH SpA – Everyware n PC/104 and Small Form Factors Resource Guide n VME and Critical Systems 17 Excalibur Systems, Inc. – 4000 Magic Plus Series n VME and Critical Systems E-letter 93 ICP America, Inc. – NANO-9453 EPIC Group Editorial Director Chris Ciufo [email protected] 38 IEI Technology USA Corp. – Wide Range Applications Contributing Editor Don Dingee 101 Jacyl Technology Inc. – XG-5000K [email protected] Senior Associate Editor Jennifer Hesse 107 Kontron – Kontron Centered [email protected] Senior Editor (columns) Terri Thorson 21 LiPPERT Automationstechnik GmbH – [email protected] Lippert CoreExpress Associate Editor Sharon Schnakenburg 37 Logic Supply – Leaders in ITX Assistant Editor Robin DiPerna European Representative Hermann Strass 5 Micro/sys, Inc. – We’ve Slashed Slow Boot-Up [email protected] Senior Web Developer Konrad Witte 95 Radicom Research, Inc. – PC/104 modem Web Content Specialist Matt Avella 57 Sensoray Co., Inc. – 4 channels Creative Director Steph Sweet Art Director David Diomede 7 Servo Halbeck GmbH – POSYS motion controllers Graphic Coordinator Sandy Dionisio Circulation/Office Manager Phyllis Thompson 13 Technologic Systems – TS-7800 [email protected] 15 Toronto MicroElectronics, Inc. – nSy Embedded Computer Solutions For Single OpenSystemsi h ng™ Pnt Publishing 25 Toronto MicroElectronics, Inc. – Editorial/Production office: Embedded Computer Solutions 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 Tel: 480-967-5581 n Fax: 480-837-6466 35 Toronto MicroElectronics, Inc. – PC104-P3 Website: www.opensystems-publishing.com Publishers John Black, Michael Hopper, Wayne Kristoff 20 Tri-M Systems Inc. – TRI-M Engineering Vice President Editorial Rosemary Kristoff 24 Tri-M Systems Inc. – TRI-M Systems Communications Group 27 VersaLogic Corp. – When You Design Editorial Director Joe Pavlat 11 WDL Systems – The Power Inside Assistant Managing Editor Anne Fisher Senior Editor (columns) Terri Thorson 108 WinSystems, Inc. – -40° to +70°C Fanless Technology Editor Curt Schwaderer European Representative Hermann Strass Senior Designer Joann Toth E-LETTER Embedded and Test & Analysis Group Spring: www.smallformfactors.com/eletter Editorial Director Jerry Gipper Earthquake research satellite demonstrates ruggedness of Editorial Director Don Dingee Diamond Systems Senior Associate Editor Jennifer Hesse By Stephen Baginski, Diamond Systems Special Projects Editor Bob Stasonis European Representative Hermann Strass An advanced course on PC/104 Q & A with Jim Blazer, PC/104 Embedded Consortium ISSN Print 1096-9764, ISSN Online 1550-0373 Publication Agreement Number: 40048627 Technical Committee Canada return address: WDS, Station A, PO Box 54, Windsor, ON N9A 615 PC/104 and Small Form Factors is published five times a year by OpenSystems Publishing LLC, 30233 Jefferson Ave., St. Clair Shores, MI 48082. Subscriptions are EVENTS free upon request to persons interested in PC/104 and other small form factor single board computer technology. For others inside the US and Canada, subscriptions are ESC Silicon Valley $35/year. For 1st class delivery outside the US and Canada, subscriptions are April 14-18 • McEnery Convention Center, San Jose, CA $50/year (advance payment in US funds required). www.cmpegevents.com/web/esv/home POSTMASTER: Send address changes to PC104 and Small Form Factors 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 6 / 2008 PC/104 and Small Form Factors Resource Guide For Single Pnt Max Component Height = 6.17 (.243) Max Component Height = 8.76 (.345) 6.35 (.250) 10.59 Primary target applications: (.417) Rugged industrial applications 7.06 (.293) Max Component He ght = 4.83 (.190) that require or can benefit from 7.06 (.293) USB interfaces. Max Component Height = 4.83 (.190) 0 00 ( 0 00) Sponsors: 90 805 (3 575) 85 73 Micro/sys Inc., Samtec (3 375) 82 55 (3 250) 3 175 Specification release:April 2007 (0 125) 5 08 ( 0 200) 17 78 I/O Connectors may overhang in this area (0 700) 5 08 (Includes Mating Connector) ( 0 200) Specification information: 0 00 Free download available at StackableUSB.org. ( 0 00) Product royalties apply for usage. See www.stackableUSB.org. 3 81 (0 150) 5 08 (0 200) Unshaded Area Top Clearance 15 24 mm Stack 8 76 ( 345) Dimensions: Top Clearance 11 mm Stack 6 17 ( 243) Available on 3.550" x 3.775" PC/104 format; half and quarter Bottom Clearance 4 83 ( 190) 64 50 size formats available. Implementation on other form factors (2 9) Shaded Area 74 93 Top Clearance 15 24 mm Stack 11 05 ( 435) (2 950) in progress. Top Clearance 11 mm Stack 8 46 ( 333) 77 47 Bottom Clearance 2 54 ( 100) (3 050) 80 01 2 5 (0 984) ( 15 ) Mandatory features: 85 0 (3 350) 97 79 On approved form factors, connector locations, connector pinouts, (3 8 0) and mounting hole locations are specified and required. Mounting: One SBC and one peripheral card are I/O Connectors may overhang in this area stacked together to produce a “brick.” For Single Pnt (Includes Mating Connector) StackableUSB supports up to 16 USB peripherals stacked on top, on bottom, or both top and bottom of a single SBC USB, minus the cables, connects boards without the use of a hub card. With the use of hub cards, By Susan Wooley, Micro/sys, Inc. 76 peripherals can be connected to a single SBC. StackableUSB was created to take advantage of USB’s growing popularity as an I/O channel. With USB 2.0 as its foundation, StackableUSB incor- Power input: porates all of USB 2.0’s advantages while also providing new benefits in +5 VDC, Samtec Q2 single bank connector. expansion, power supply, and ruggedness. StackableUSB specifies the interconnection between a USB host SBC and Expansion bus interfaces: USB devices without the use of any cables. It is based on stacking and At least one USB port must be present on the SBCs and bolting boards together to form a rugged “brick.” one I2C port. Support for up to 16 USB ports, 8 on top and The architecture uses a pair of connectors to route up to 16 USB pairs to 8 on bottom. Peripherals usually consume one USB port StackableUSB devices mounted both above and below a StackableUSB SBC. This innovative signal routing maintains the USB star topology but can use more if desired. (point-to-point) while preserving the signal integrity required by the high- speed serial links called for in USB 2.0. Up to 10x more power is available for devices in both 5 V and 3.3 V, elimi- nating the need for regulators on StackableUSB devices. Removal of the standard USB cable is the key to making StackableUSB so robust. Standard USB cables do not have a retention mechanism and are therefore suscep- tible to inadvertent disconnection when exposed to rugged environments.
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  • Reliance Industries

    Reliance Industries

    14 April 2020 Company Update Reliance Industries Investment in consumer business paying BUY off, upgrade to Buy CMP (as on 13 Apr 20) Rs 1,191 Target Price Rs 1,400 RIL stock has corrected by 25% from its peak over the past 4 months driven by global economic slowdown concerns. Our view that the stock price correction NIFTY 8,994 is overdone, and the stock should outperform, is premised on 1) Non-cyclical domestic consumer business accounting for 56% of FY21E EBITDA (31% in KEY CHANGES OLD NEW FY19), 2) The stock factoring only an USD 3.0/bbl FY21E refining margin, 49% Rating ADD BUY lower than Global Financial Crises (GFC) quarterly trough and 3) Interest Price Target Rs 1,566 Rs 1,400 Coverage ratio of 4.3x and Net Debt/EBITDA of 1.6x in FY22E (12-35% better FY21E FY22E than the FY19 lows). The stock offers 18% upside at our TP of INR 1,400. EPS % -27% -10% No financial stress even under economic slowdown conditions KEY STOCK DATA We estimate that even with refining margins of USD 5.9/bbl (lowest quarterly Bloomberg code RIL IN margin during the Global Financial Crises and 36% lower than 3QFY20) and Petchem margins at a discount of 29% to 3QFY20 (lowest quarterly margin in No. of Shares (mn) 6,339 last 13 years), RIL’s FY21E EBITDA would be INR 775bn, more than adequate to MCap (Rs bn) / ($ mn) 7,737/101,358 service its INR 2.9trn of debt. 6m avg traded value (Rs mn) 17,400 52 Week high / low Rs 1,618/876 Jio: Next catalysts-Mobile revenue growth, fibre broadband ramp-up With about USD 50bn (50% of market cap) invested in telecom, Jio’s revenue STOCK PERFORMANCE (%) market share growth and monetisation continues to drive a significant 3M 6M 12M proportion of the value creation opportunity for RIL’s shareholders.