Thin Film WBR (Wire Bond Resistor) Top Contact

GENERAL DESCRIPTION Top Contact Precision wire bondable resistors are ultra-stable with high reliability. Resistors are laser trimmed to tight tolerance. Customizable value and unique marking of that value. This device is built in 0202 chip outline and is ideal for but not limited to hybrid circuit applications. These are designed specifically for applications that require thermo-compression, epoxy or ultra-sonic attachment.

BENEFITS APPLICATIONS • Top Contact/ Bottom Isolated • Unique Value Marking • Medical Implantable • High-Rel Microelectronics • Ultra High Stability • 250 mW Power Rating • Military / Defense • RF / Microwave communications • High Reliability • Small package size • Hybrid Designs • Extremely Tight Tolerance • Multi-Chip Module (MCM) • Test & Measurement Instrumentation HOW TO ORDER

WBR 0202 S C 1R051 F G W

Series Code Case Size Material Resistance Tolerance Termination Code Packaging WBR = Wire Bond 0202 = 0202 S = Silicon TCR (ppm/°C) Example Values D = ±0.5% G = Bondable Gold W = Waffle Pack Resistor 0S0S = Special Request G = Glass A = ±25 1R500=1.5 ohm F = 1% A = Aluminum Please supply C = Custom B = ±50 1R051=10.5ohm G = 2% Design or C = ±100 (standard) 1R052=105ohm J = 5% contact factory D = ±150 1R053=1,050ohm S = Special S = Special 2R553=2,550ohm Request supply Request supply 1R054=10,500ohm design or design or 1R007=10Megohm contact factory contact factory

MECHANICAL DIMENSIONS Inches (mm) 0.002 (0.05) 0.002 Size Length (L) Width(W) Minimum Bond Area (0.05) 0.020 ± 0.003 0.020 ± 0.003 0.0038 ± 0.0038 0202 0.020 (0.51 ± 0.076) (0.51 ± 0.076) (0.09 x 0.09) (0.51)

Other sizes available upon request 0.004 (0.10)

GENERAL CHARACTERISTICS ENVIRONMENTAL TESTS Resistance Range 1.0 Ohm - 10.0 Mohm Test Limits Specification MIL-STD-202 MTD 108, Resistance Tolerance ± 1%, ± 2% ± 0.1%, ± 0.5%, Life Test/ Stability ±0.25% Max Δ R/R 1000hrs, 125ºC,50mW Termination Type Gold, Aluminum Thermal Shock ±0.25% Max Δ R/R MIL-STD-202 MTD 107 Backing Bare (Lapped) Substrate High Temperature Operating Temperature -55ºC ± 125ºC ±0.25% Max Δ R/R 100 Hrs @ 150ºC Exposure Insulation Resistance 106MOhm Moisture Resistance ±0.25% Max Δ R/R MIL-STD-202 MTD 106 Custom values up to 10meg Ohm available upon request 4 Gram Min Wire Bond Test MIL –PRF-55342 (1.25 Mil Wire) Short Time Overload ±0.25% Max Δ R/R MIL –PRF-55342

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 5 061021