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Copyrighted Material - Taylor & Francis
6 Low-Power Commercial, Automotive, and Appliance Connections AnthonyCopyrighted Lee and George Drew Material - Taylor & Francis They weighed me, dust by dust— They balanced film by film Emily Dickinson COntents 6.1 Introduction ........................................................................................................................ 376 6.2 Connectors ..........................................................................................................................377 6.2.1 Functional Requirements .....................................................................................377 6.2.2 Types of Connectors .............................................................................................. 378 6.2.3 Mechanical Considerations .................................................................................. 381 6.3 Contact Terminals ..............................................................................................................384 6.3.1 Contact Physics ......................................................................................................384 6.3.2 Terminal Types ......................................................................................................384 6.3.3 Other Electrical Contact Parameters ................................................................... 392 6.4 Degradation of Connector Contact ................................................................................. 393 6.4.1 Surface Films ......................................................................................................... -
Transistor Circuit Guidebook Byron Wels TAB BOOKSBLUE RIDGE SUMMIT, PA
TAB BOOKS No. 470 34.95 By Byron Wels TransistorCircuit GuidebookByronWels TABBLUE RIDGE BOOKS SUMMIT,PA. 17214 Preface beforemeIa supposepioneer (along the my withintransistor firstthe many field.experiencewith wasother Weknown. World were using WarUnlike solid-stateIIsolid-state GIs) today's asdevices somewhat experimen- receivers marks of FIRST EDITION devicester,ownFirst, withsemiconductors! youwith a choice swipedwhichor tank. ofto a sealed,Here'sexperiment, pairThen ofhow encapsulated, you earphones we carefullywe did had it: from totookand construct the veryonenearest exoticof our the THIRDSECONDFIRST PRINTING-SEPTEMBER PRINTING-AUGUST PRINTING-JANUARY 1972 1970 1968 plane,wasyouAnphonesantenna. emptywound strung jeep,apart After toiletfull outand ofclippingas paper wire,unwoundhigh closelyrollandthe servedascatchthe far spaced.wire offas as itfrom a thewouldsafetyThe thecoil remaining-pin,magnetreach-for form, you inside.which stuckwire the Copyright © 1968by TAB BOOKS coatedNext,it into youneeded,a hunkribbons of -ofwooda razor -steel, soblade.the but point Oh,aItblued was noneprojected placedblade of the -quenchat so fancy right the pointplastic-bluedangles.of -, Reproduction or publicationPrinted inof the ofAmerica the United content States in any manner, with- themindfoundphoneground pin you,the was couldserved right not wired contact lacquerspotas toa onground blade, it. theblued.blade'sAconnector, pin,bayonet bluing,and stuck antennaand you hilt thecould coil.-deep other actuallyIfin ear- youthe isoutherein. assumed express -
Switched-Capacitor Circuits
Switched-Capacitor Circuits David Johns and Ken Martin University of Toronto ([email protected]) ([email protected]) University of Toronto 1 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Opamps • Ideal opamps usually assumed. • Important non-idealities — dc gain: sets the accuracy of charge transfer, hence, transfer-function accuracy. — unity-gain freq, phase margin & slew-rate: sets the max clocking frequency. A general rule is that unity-gain freq should be 5 times (or more) higher than the clock-freq. — dc offset: Can create dc offset at output. Circuit techniques to combat this which also reduce 1/f noise. University of Toronto 2 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Double-Poly Capacitors metal C1 metal poly1 Cp1 thin oxide bottom plate C1 poly2 Cp2 thick oxide C p1 Cp2 (substrate - ac ground) cross-section view equivalent circuit • Substantial parasitics with large bottom plate capacitance (20 percent of C1) • Also, metal-metal capacitors are used but have even larger parasitic capacitances. University of Toronto 3 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Switches I I Symbol n-channel v1 v2 v1 v2 I transmission I I gate v1 v p-channel v 2 1 v2 I • Mosfet switches are good switches. — off-resistance near G: range — on-resistance in 100: to 5k: range (depends on transistor sizing) • However, have non-linear parasitic capacitances. University of Toronto 4 of 60 © D. Johns, K. Martin, 1997 Basic Building Blocks Non-Overlapping Clocks I1 T Von I I1 Voff n – 2 n – 1 n n + 1 tTe delay 1 I fs { --- delay V 2 T on I Voff 2 n – 32e n – 12e n + 12e tTe • Non-overlapping clocks — both clocks are never on at same time • Needed to ensure charge is not inadvertently lost. -
Switched Capacitor Concepts & Circuits
Switched Capacitor Concepts & Circuits Outline • Why Switched Capacitor circuits? – Historical Perspective – Basic Building Blocks • Switched Capacitors as Resistors • Switched Capacitor Integrators – Discrete time & charge transfer concepts – Parasitic insensitive circuits • Signal Flow Graphs • Switched Capacitor Filters – Comparison to Active RC filters – Advantages of Fully Differential filters • Switched Capacitor Gain Circuits • Reducing the Effects of Charge Injection • Tradeoff between Speed and Charge Injection Why Switched Capacitor Circuits? • Historical Perspective – As MOS processes came to the forefront in the late 1970s and early 1980s, the advantages of integrating analog blocks such as active filters on the same chip with digital logic became a driving force for inovation. – Integrating active filters using resistors and capacitors to acturately set time constants has always been difficult, because of large process variations (> +/- 30%) and the fact that resistors and capacitors don’t naturally match each other. – So, analog engineers turned to the building blocks native to MOS processes to build their circuits, switches & capacitors. Since time constants can be set by the ratio of capacitors, very accurate filter responses became possible using switched capacitor techniques Æ Mixed-Signal Design was born! Switched Capacitor Building Blocks • Capacitors: poly-poly, MiM, metal sandwich & finger caps • Switches: NMOS, PMOS, T-gate • Op Amps: at first all NMOS designs, now CMOS Non-Overlapping Clocks • Non-overlapping clocks are used to insure that one set of switches turns off before the next set turns on, so that charge only flows where intended. (“break before make”) • Note the notation used to indicate time based on clock periods: ... (n-1)T, (n-½)T, nT, (n+½)T, (n+1)T .. -
Printed Circuit Board Mount Switches Shock Proof • Waterproof • Explosion
shock proof • waterproof • explosion proof Printed Circuit Board Mount Switches These versatile switches are a great choice for many applications due to their small size and variety of connection styles. Although these switches are built to connect to a printed circuit board, they can also be retrotted for nearly any application by connecting wire leads. These switches can sense a pressure ranging from 6 inches of water all the way up to 65 PSI. For a frame of reference, a trumpet player blows 55 inches of water (or 2 PSI) on average, so these switches have a broad range. They can also be used to sense a vacuum ranging between 6 inches of water to 65 inches of water. Therefore, these miniature single pole and double pole switches are used as pressure, vacuum, or dierential pressure switches where moderate accuracy is sucient. Presair switches deliver critical benefits: CSPSSGA - PC Mount Switch SAFE: Presair switches deliver complete electrical isolation with zero voltage at the actuator to shock the user or spark an explosion. 1”x1”x1.5” ECONOMICAL:Presair’s switching system costs are comparable or lower than digital controls meeting the needs of original equipment manufacturers. ACCURATE: All switches are 100% tested to meet 100,000+ cycle life. General Specification: RATING: 1 amp resistive 250 VAC Ratings are dependent on actuation pressure and must be derated at lower pressures. APPROVAL: UL Recognized, CUL Recognized. File #E80254 MATERIAL: Lower body: Rynite w/ pin terminals molded Upper body: Acetal Diaphram material is dependent on application. PRESSURE RANGE: When used as a pressure or vacuum switch the actuation point must be factory set. -
Electronic Circuit Design and Component Selecjon
Electronic circuit design and component selec2on Nan-Wei Gong MIT Media Lab MAS.S63: Design for DIY Manufacturing Goal for today’s lecture • How to pick up components for your project • Rule of thumb for PCB design • SuggesMons for PCB layout and manufacturing • Soldering and de-soldering basics • Small - medium quanMty electronics project producMon • Homework : Design a PCB for your project with a BOM (bill of materials) and esMmate the cost for making 10 | 50 |100 (PCB manufacturing + assembly + components) Design Process Component Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process Module Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process • Test circuit – bread boarding/ buy development tools (breakout boards) / simulaon • Component Selecon– spec / size / availability (inventory! Need 10% more parts for pick and place machine) • PCB Design– power/ground, signal traces, trace width, test points / extra via, pads / mount holes, big before small • PCB Manufacturing – price-Mme trade-off/ • Place Components – first step (check power/ground) -- work flow Test Circuit Construc2on Breadboard + through hole components + Breakout boards Breakout boards, surcoards + hookup wires Surcoard : surface-mount to through hole Dual in-line (DIP) packaging hap://www.beldynsys.com/cc521.htm Source : hap://en.wikipedia.org/wiki/File:Breadboard_counter.jpg Development Boards – good reference for circuit design and component selec2on SomeMmes, it can be cheaper to pair your design with a development -
Integrated Circuits
CHAPTER67 Learning Objectives ➣ What is an Integrated Circuit ? ➣ Advantages of ICs INTEGRATED ➣ Drawbacks of ICs ➣ Scale of Integration CIRCUITS ➣ Classification of ICs by Structure ➣ Comparison between Different ICs ➣ Classification of ICs by Function ➣ Linear Integrated Circuits (LICs) ➣ Manufacturer’s Designation of LICs ➣ Digital Integrated Circuits ➣ IC Terminology ➣ Semiconductors Used in Fabrication of ICs and Devices ➣ How ICs are Made? ➣ Material Preparation ➣ Crystal Growing and Wafer Preparation ➣ Wafer Fabrication ➣ Oxidation ➣ Etching ➣ Diffusion ➣ Ion Implantation ➣ Photomask Generation ➣ Photolithography ➣ Epitaxy Jack Kilby would justly be considered one of ➣ Metallization and Intercon- the greatest electrical engineers of all time nections for one invention; the monolithic integrated ➣ Testing, Bonding and circuit, or microchip. He went on to develop Packaging the first industrial, commercial and military ➣ Semiconductor Devices and applications for this integrated circuits- Integrated Circuit Formation including the first pocket calculator ➣ Popular Applications of ICs (pocketronic) and computer that used them 2472 Electrical Technology 67.1. Introduction Electronic circuitry has undergone tremendous changes since the invention of a triode by Lee De Forest in 1907. In those days, the active components (like triode) and passive components (like resistors, inductors and capacitors etc.) of the circuits were separate and distinct units connected by soldered leads. With the invention of the transistor in 1948 by W.H. Brattain and I. Bardeen, the electronic circuits became considerably reduced in size. It was due to the fact that a transistor was not only cheaper, more reliable and less power consuming but was also much smaller in size than an electron tube. To take advantage of small transistor size, the passive components too were greatly reduced in size thereby making the entire circuit very small. -
What Is a Neutral Earthing Resistor?
Fact Sheet What is a Neutral Earthing Resistor? The earthing system plays a very important role in an electrical network. For network operators and end users, avoiding damage to equipment, providing a safe operating environment for personnel and continuity of supply are major drivers behind implementing reliable fault mitigation schemes. What is a Neutral Earthing Resistor? A widely utilised approach to managing fault currents is the installation of neutral earthing resistors (NERs). NERs, sometimes called Neutral Grounding Resistors, are used in an AC distribution networks to limit transient overvoltages that flow through the neutral point of a transformer or generator to a safe value during a fault event. Generally connected between ground and neutral of transformers, NERs reduce the fault currents to a maximum pre-determined value that avoids a network shutdown and damage to equipment, yet allows sufficient flow of fault current to activate protection devices to locate and clear the fault. NERs must absorb and dissipate a huge amount of energy for the duration of the fault event without exceeding temperature limitations as defined in IEEE32 standards. Therefore the design and selection of an NER is highly important to ensure equipment and personnel safety as well as continuity of supply. Power Transformer Motor Supply NER Fault Current Neutral Earthin Resistor Nov 2015 Page 1 Fact Sheet The importance of neutral grounding Fault current and transient over-voltage events can be costly in terms of network availability, equipment costs and compromised safety. Interruption of electricity supply, considerable damage to equipment at the fault point, premature ageing of equipment at other points on the system and a heightened safety risk to personnel are all possible consequences of fault situations. -
Introduction What Is a Polymer Capacitor?
ECAS series (polymer-type aluminum electrolytic capacitor) No. C2T2CPS-063 Introduction If you take a look at the main board of an electronic device such as a personal computer, you’re likely to see some of the six types of capacitors shown below (Fig. 1). Common types of capacitors include tantalum electrolytic capacitors (MnO2 type and polymer type), aluminum electrolytic capacitors (electrolyte can type, polymer can type, and chip type), and MLCC. Figure 1. Main Types of Capacitors What Is a Polymer Capacitor? There are many other types of capacitors, such as film capacitors and niobium capacitors, but here we will describe polymer capacitors, a type of capacitor produced by Murata among others. In both tantalum electrolytic capacitors and aluminum electrolytic capacitors, a polymer capacitor is a type of electrolytic capacitor in which a conductive polymer is used as the cathode. In a polymer-type aluminum electrolytic capacitor, the anode is made of aluminum foil and the cathode is made of a conductive polymer. In a polymer-type tantalum electrolytic capacitor, the anode is made of the metal tantalum and the cathode is made of a conductive polymer. Figure 2 shows an example of this structure. Figure 2. Example of Structure of Conductive Polymer Aluminum Capacitor In conventional electrolytic capacitors, an electrolyte (electrolytic solution) or manganese dioxide (MnO2) was used as the cathode. Using a conductive polymer instead provides many advantages, making it possible to achieve a lower equivalent series resistance (ESR), more stable thermal characteristics, improved safety, and longer service life. As can be seen in Fig. 1, polymer capacitors have lower ESR than conventional electrolytic Copyright © muRata Manufacturing Co., Ltd. -
Capacitors and Inductors
DC Principles Study Unit Capacitors and Inductors By Robert Cecci In this text, you’ll learn about how capacitors and inductors operate in DC circuits. As an industrial electrician or elec- tronics technician, you’ll be likely to encounter capacitors and inductors in your everyday work. Capacitors and induc- tors are used in many types of industrial power supplies, Preview Preview motor drive systems, and on most industrial electronics printed circuit boards. When you complete this study unit, you’ll be able to • Explain how a capacitor holds a charge • Describe common types of capacitors • Identify capacitor ratings • Calculate the total capacitance of a circuit containing capacitors connected in series or in parallel • Calculate the time constant of a resistance-capacitance (RC) circuit • Explain how inductors are constructed and describe their rating system • Describe how an inductor can regulate the flow of cur- rent in a DC circuit • Calculate the total inductance of a circuit containing inductors connected in series or parallel • Calculate the time constant of a resistance-inductance (RL) circuit Electronics Workbench is a registered trademark, property of Interactive Image Technologies Ltd. and used with permission. You’ll see the symbol shown above at several locations throughout this study unit. This symbol is the logo of Electronics Workbench, a computer-simulated electronics laboratory. The appearance of this symbol in the text mar- gin signals that there’s an Electronics Workbench lab experiment associated with that section of the text. If your program includes Elec tronics Workbench as a part of your iii learning experience, you’ll receive an experiment lab book that describes your Electronics Workbench assignments. -
Notes for Lab 1 (Bipolar (Junction) Transistor Lab)
ECE 327: Electronic Devices and Circuits Laboratory I Notes for Lab 1 (Bipolar (Junction) Transistor Lab) 1. Introduce bipolar junction transistors • “Transistor man” (from The Art of Electronics (2nd edition) by Horowitz and Hill) – Transistors are not “switches” – Base–emitter diode current sets collector–emitter resistance – Transistors are “dynamic resistors” (i.e., “transfer resistor”) – Act like closed switch in “saturation” mode – Act like open switch in “cutoff” mode – Act like current amplifier in “active” mode • Active-mode BJT model – Collector resistance is dynamically set so that collector current is β times base current – β is assumed to be very high (β ≈ 100–200 in this laboratory) – Under most conditions, base current is negligible, so collector and emitter current are equal – β ≈ hfe ≈ hFE – Good designs only depend on β being large – The active-mode model: ∗ Assumptions: · Must have vEC > 0.2 V (otherwise, in saturation) · Must have very low input impedance compared to βRE ∗ Consequences: · iB ≈ 0 · vE = vB ± 0.7 V · iC ≈ iE – Typically, use base and emitter voltages to find emitter current. Finish analysis by setting collector current equal to emitter current. • Symbols – Arrow represents base–emitter diode (i.e., emitter always has arrow) – npn transistor: Base–emitter diode is “not pointing in” – pnp transistor: Emitter–base diode “points in proudly” – See part pin-outs for easy wiring key • “Common” configurations: hold one terminal constant, vary a second, and use the third as output – common-collector ties collector -
The Pennsylvania State University the Graduate School THE
The Pennsylvania State University The Graduate School THE EFFECTS OF INTERFACE AND SURFACE CHARGE ON TWO DIMENSIONAL TRANSITORS FOR NEUROMORPHIC, RADIATION, AND DOPING APPLICATIONS A Dissertation in Electrical Engineering by Andrew J. Arnold © 2020 Andrew J. Arnold Submitted in Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy August 2020 The dissertation of Andrew J. Arnold was reviewed and approved by the following: Thomas Jackson Professor of Electrical Engineering Co-Chair of Committee Saptarshi Das Assistant Professor of Engineering Science and Mechanics Dissertation Advisor Co-Chair of Committee Swaroop Ghosh Assistant Professor of Electrical Engineering Rongming Chu Associate Professor of Electrical Engineering Sukwon Choi Assistant Professor of Mechanical Engineering Kultegin Aydin Professor of Electrical Engineering Head of the Department of Electrical Engineering ii Abstract The scaling of silicon field effect transistors (FETs) has progressed exponentially following Moore’s law, and is nearing fundamental limitations related to the materials and physics of the devices. Alternative materials are required to overcome these limitations leading to increasing interest in two dimensional (2D) materials, and transition metal dichalcogenides (TMDs) in particular, due to their atomically thin nature which provides an advantage in scalability. Numerous investigations within the literature have explored various applications of these materials and assessed their viability as a replacement for silicon FETs. This dissertation focuses on several applications of 2D FETs as well as an exploration into one of the most promising methods to improve their performance. Neuromorphic computing is an alternative method to standard computing architectures that operates similarly to a biological nervous system. These systems are composed of neurons and operate based on pulses called action potentials.