Resistors, Capacitors and Inductors Are Not As They Appear
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What Is a Neutral Earthing Resistor?
Fact Sheet What is a Neutral Earthing Resistor? The earthing system plays a very important role in an electrical network. For network operators and end users, avoiding damage to equipment, providing a safe operating environment for personnel and continuity of supply are major drivers behind implementing reliable fault mitigation schemes. What is a Neutral Earthing Resistor? A widely utilised approach to managing fault currents is the installation of neutral earthing resistors (NERs). NERs, sometimes called Neutral Grounding Resistors, are used in an AC distribution networks to limit transient overvoltages that flow through the neutral point of a transformer or generator to a safe value during a fault event. Generally connected between ground and neutral of transformers, NERs reduce the fault currents to a maximum pre-determined value that avoids a network shutdown and damage to equipment, yet allows sufficient flow of fault current to activate protection devices to locate and clear the fault. NERs must absorb and dissipate a huge amount of energy for the duration of the fault event without exceeding temperature limitations as defined in IEEE32 standards. Therefore the design and selection of an NER is highly important to ensure equipment and personnel safety as well as continuity of supply. Power Transformer Motor Supply NER Fault Current Neutral Earthin Resistor Nov 2015 Page 1 Fact Sheet The importance of neutral grounding Fault current and transient over-voltage events can be costly in terms of network availability, equipment costs and compromised safety. Interruption of electricity supply, considerable damage to equipment at the fault point, premature ageing of equipment at other points on the system and a heightened safety risk to personnel are all possible consequences of fault situations. -
Selecting the Optimal Inductor for Power Converter Applications
Selecting the Optimal Inductor for Power Converter Applications BACKGROUND SDR Series Power Inductors Today’s electronic devices have become increasingly power hungry and are operating at SMD Non-shielded higher switching frequencies, starving for speed and shrinking in size as never before. Inductors are a fundamental element in the voltage regulator topology, and virtually every circuit that regulates power in automobiles, industrial and consumer electronics, SRN Series Power Inductors and DC-DC converters requires an inductor. Conventional inductor technology has SMD Semi-shielded been falling behind in meeting the high performance demand of these advanced electronic devices. As a result, Bourns has developed several inductor models with rated DC current up to 60 A to meet the challenges of the market. SRP Series Power Inductors SMD High Current, Shielded Especially given the myriad of choices for inductors currently available, properly selecting an inductor for a power converter is not always a simple task for designers of next-generation applications. Beginning with the basic physics behind inductor SRR Series Power Inductors operations, a designer must determine the ideal inductor based on radiation, current SMD Shielded rating, core material, core loss, temperature, and saturation current. This white paper will outline these considerations and provide examples that illustrate the role SRU Series Power Inductors each of these factors plays in choosing the best inductor for a circuit. The paper also SMD Shielded will describe the options available for various applications with special emphasis on new cutting edge inductor product trends from Bourns that offer advantages in performance, size, and ease of design modification. -
Capacitors and Inductors
DC Principles Study Unit Capacitors and Inductors By Robert Cecci In this text, you’ll learn about how capacitors and inductors operate in DC circuits. As an industrial electrician or elec- tronics technician, you’ll be likely to encounter capacitors and inductors in your everyday work. Capacitors and induc- tors are used in many types of industrial power supplies, Preview Preview motor drive systems, and on most industrial electronics printed circuit boards. When you complete this study unit, you’ll be able to • Explain how a capacitor holds a charge • Describe common types of capacitors • Identify capacitor ratings • Calculate the total capacitance of a circuit containing capacitors connected in series or in parallel • Calculate the time constant of a resistance-capacitance (RC) circuit • Explain how inductors are constructed and describe their rating system • Describe how an inductor can regulate the flow of cur- rent in a DC circuit • Calculate the total inductance of a circuit containing inductors connected in series or parallel • Calculate the time constant of a resistance-inductance (RL) circuit Electronics Workbench is a registered trademark, property of Interactive Image Technologies Ltd. and used with permission. You’ll see the symbol shown above at several locations throughout this study unit. This symbol is the logo of Electronics Workbench, a computer-simulated electronics laboratory. The appearance of this symbol in the text mar- gin signals that there’s an Electronics Workbench lab experiment associated with that section of the text. If your program includes Elec tronics Workbench as a part of your iii learning experience, you’ll receive an experiment lab book that describes your Electronics Workbench assignments. -
Notes for Lab 1 (Bipolar (Junction) Transistor Lab)
ECE 327: Electronic Devices and Circuits Laboratory I Notes for Lab 1 (Bipolar (Junction) Transistor Lab) 1. Introduce bipolar junction transistors • “Transistor man” (from The Art of Electronics (2nd edition) by Horowitz and Hill) – Transistors are not “switches” – Base–emitter diode current sets collector–emitter resistance – Transistors are “dynamic resistors” (i.e., “transfer resistor”) – Act like closed switch in “saturation” mode – Act like open switch in “cutoff” mode – Act like current amplifier in “active” mode • Active-mode BJT model – Collector resistance is dynamically set so that collector current is β times base current – β is assumed to be very high (β ≈ 100–200 in this laboratory) – Under most conditions, base current is negligible, so collector and emitter current are equal – β ≈ hfe ≈ hFE – Good designs only depend on β being large – The active-mode model: ∗ Assumptions: · Must have vEC > 0.2 V (otherwise, in saturation) · Must have very low input impedance compared to βRE ∗ Consequences: · iB ≈ 0 · vE = vB ± 0.7 V · iC ≈ iE – Typically, use base and emitter voltages to find emitter current. Finish analysis by setting collector current equal to emitter current. • Symbols – Arrow represents base–emitter diode (i.e., emitter always has arrow) – npn transistor: Base–emitter diode is “not pointing in” – pnp transistor: Emitter–base diode “points in proudly” – See part pin-outs for easy wiring key • “Common” configurations: hold one terminal constant, vary a second, and use the third as output – common-collector ties collector -
Class D Audio Amplifier Application Note with Ferroxcube Gapped Toroid Output Filter
Class D audio amplifier Application Note with Ferroxcube gapped toroid output filter Class D audio amplifier with Ferroxcube gapped toroid output filter The concept of a Class D amplifier has input signal shape but with larger bridge configuration. Each topology been around for a long time, however amplitude. And audio amplifier is spe- has pros and cons. In brief, a half bridge only fairly recently have they become cially design for reproducing audio fre- is potentially simpler,while a full bridge commonly used in consumer applica- quencies. is better in audio performance.The full tions. Due to improvements in the bridge topology requires two half- speed, power capacity and efficiency of Amplifier circuits are classified as A, B, bridge amplifiers, and thus more com- modern semiconductor devices, appli- AB and C for analog designs, and class ponents. cations using Class D amplifiers have D and E for switching devices. For the become affordable for the common analog classes, each type defines which A Class D amplifier works in the same person.The mainly benefit of this kind proportion of the input signal cycle is way as a PWM power supply, except of amplifier is the efficiency, the theo- used to switch on the amplifying device: that the reference signal is the audio retical maximum efficiency of a class D Class A 100% wave instead of the accurate voltage design is 100%, and over 90% is Class AB Between 50% and 100% reference. achieve in practice. Class B 50% Class C less than 50% Let’s start with an assumption that the Other benefits of these amplifiers are input signal is a standard audio line level the reduction in consumption, their The letter D used to designate the class signal.This audio line level signal is sinu- smaller size and the lower weight. -
Effect of Source Inductance on MOSFET Rise and Fall Times
Effect of Source Inductance on MOSFET Rise and Fall Times Alan Elbanhawy Power industry consultant, email: [email protected] Abstract The need for advanced MOSFETs for DC-DC converters applications is growing as is the push for applications miniaturization going hand in hand with increased power consumption. These advanced new designs should theoretically translate into doubling the average switching frequency of the commercially available MOSFETs while maintaining the same high or even higher efficiency. MOSFETs packaged in SO8, DPAK, D2PAK and IPAK have source inductance between 1.5 nH to 7 nH (nanoHenry) depending on the specific package, in addition to between 5 and 10 nH of printed circuit board (PCB) trace inductance. In a synchronous buck converter, laboratory tests and simulation show that during the turn on and off of the high side MOSFET the source inductance will develop a negative voltage across it, forcing the MOSFET to continue to conduct even after the gate has been fully switched off. In this paper we will show that this has the following effects: • The drain current rise and fall times are proportional to the total source inductance (package lead + PCB trace) • The rise and fall times arealso proportional to the magnitude of the drain current, making the switching losses nonlinearly proportional to the drain current and not linearly proportional as has been the common wisdom • It follows from the above two points that the current switch on/off is predominantly controlled by the traditional package's parasitic -
How to Select a Proper Inductor for Low Power Boost Converter
Application Report SLVA797–June 2016 How to Select a Proper Inductor for Low Power Boost Converter Jasper Li ............................................................................................. Boost Converter Solution / ALPS 1 Introduction Traditionally, the inductor value of a boost converter is selected through the inductor current ripple. The average input current IL(DC_MAX) of the inductor is calculated using Equation 1. Then the inductance can be [1-2] calculated using Equation 2. It is suggested that the ∆IL(P-P) should be 20%~40% of IL(DC_MAX) . V x I = OUT OUT(MAX) IL(DC_MAX) VIN(TYP) x η (1) Where: • VOUT: output voltage of the boost converter. • IOUT(MAX): the maximum output current. • VIN(TYP): typical input voltage. • ƞ: the efficiency of the boost converter. V x() V+ V - V L = IN OUT D IN ΔIL(PP)- xf SW x() V OUT+ V D (2) Where: • ƒSW: the switching frequency of the boost converter. • VD: Forward voltage of the rectify diode or the synchronous MOSFET in on-state. However, the suggestion of the 20%~40% current ripple ratio does not take in account the package size of inductor. At the small output current condition, following the suggestion may result in large inductor that is not applicable in a real circuit. Actually, the suggestion is only the start-point or reference for an inductor selection. It is not the only factor, or even not an important factor to determine the inductance in the low power application of a boost converter. Taking TPS61046 as an example, this application note proposes a process to select an inductor in the low power application. -
TSEK03: Radio Frequency Integrated Circuits (RFIC) Lecture 7: Passive
TSEK03: Radio Frequency Integrated Circuits (RFIC) Lecture 7: Passive Devices Ted Johansson, EKS, ISY [email protected] "2 Overview • Razavi: Chapter 7 7.1 General considerations 7.2 Inductors 7.3 Transformers 7.4 Transmission lines 7.5 Varactors 7.6 Constant capacitors TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "3 7.1 General considerations • Reduction of off-chip components => Reduction of system cost. Integration is good! • On-chip inductors: • With inductive loads (b), we can obtain higher operating frequency and better operation at low supply voltages. TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "4 Bond wires = good inductors • High quality • Hard to model • The bond wires and package pins connecting chip to outside world may experience significant coupling, creating crosstalk between parts of a transceiver. TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "5 7.2 Inductors • Typically realized as metal spirals. • Larger inductance than a straight wire. • Spiral is implemented on top metal layer to minimize parasitic resistance and capacitance. TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "6 • A two dimensional square spiral inductor is fully specified by the following four quantities: • Outer dimension, Dout • Line width, W • Line spacing, S • Number of turns, N • The inductance primarily depends on the number of turns and the diameter of each turn TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "7 Magnetic Coupling Factor TSEK03 Integrated Radio Frequency Circuits 2019/Ted Johansson "8 Inductor Structures in RFICs • Various inductor geometries shown below are result of improving the trade-offs in inductor design, specifically those between (a) quality factor and the capacitance, (b) inductance and the dimensions. -
AN826 Crystal Oscillator Basics and Crystal Selection for Rfpic™ And
AN826 Crystal Oscillator Basics and Crystal Selection for rfPICTM and PICmicro® Devices • What temperature stability is needed? Author: Steven Bible Microchip Technology Inc. • What temperature range will be required? • Which enclosure (holder) do you desire? INTRODUCTION • What load capacitance (CL) do you require? • What shunt capacitance (C ) do you require? Oscillators are an important component of radio fre- 0 quency (RF) and digital devices. Today, product design • Is pullability required? engineers often do not find themselves designing oscil- • What motional capacitance (C1) do you require? lators because the oscillator circuitry is provided on the • What Equivalent Series Resistance (ESR) is device. However, the circuitry is not complete. Selec- required? tion of the crystal and external capacitors have been • What drive level is required? left to the product design engineer. If the incorrect crys- To the uninitiated, these are overwhelming questions. tal and external capacitors are selected, it can lead to a What effect do these specifications have on the opera- product that does not operate properly, fails prema- tion of the oscillator? What do they mean? It becomes turely, or will not operate over the intended temperature apparent to the product design engineer that the only range. For product success it is important that the way to answer these questions is to understand how an designer understand how an oscillator operates in oscillator works. order to select the correct crystal. This Application Note will not make you into an oscilla- Selection of a crystal appears deceivingly simple. Take tor designer. It will only explain the operation of an for example the case of a microcontroller. -
Resistors, Diodes, Transistors, and the Semiconductor Value of a Resistor
Resistors, Diodes, Transistors, and the Semiconductor Value of a Resistor Most resistors look like the following: A Four-Band Resistor As you can see, there are four color-coded bands on the resistor. The value of the resistor is encoded into them. We will follow the procedure below to decode this value. • When determining the value of a resistor, orient it so the gold or silver band is on the right, as shown above. • You can now decode what resistance value the above resistor has by using the table on the following page. • We start on the left with the first band, which is BLUE in this case. So the first digit of the resistor value is 6 as indicated in the table. • Then we move to the next band to the right, which is GREEN in this case. So the second digit of the resistor value is 5 as indicated in the table. • The next band to the right, the third one, is RED. This is the multiplier of the resistor value, which is 100 as indicated in the table. • Finally, the last band on the right is the GOLD band. This is the tolerance of the resistor value, which is 5%. The fourth band always indicates the tolerance of the resistor. • We now put the first digit and the second digit next to each other to create a value. In this case, it’s 65. 6 next to 5 is 65. • Then we multiply that by the multiplier, which is 100. 65 x 100 = 6,500. • And the last band tells us that there is a 5% tolerance on the total of 6500. -
Fundamentals of MOSFET and IGBT Gate Driver Circuits
Application Report SLUA618A–March 2017–Revised October 2018 Fundamentals of MOSFET and IGBT Gate Driver Circuits Laszlo Balogh ABSTRACT The main purpose of this application report is to demonstrate a systematic approach to design high performance gate drive circuits for high speed switching applications. It is an informative collection of topics offering a “one-stop-shopping” to solve the most common design challenges. Therefore, it should be of interest to power electronics engineers at all levels of experience. The most popular circuit solutions and their performance are analyzed, including the effect of parasitic components, transient and extreme operating conditions. The discussion builds from simple to more complex problems starting with an overview of MOSFET technology and switching operation. Design procedure for ground referenced and high side gate drive circuits, AC coupled and transformer isolated solutions are described in great details. A special section deals with the gate drive requirements of the MOSFETs in synchronous rectifier applications. For more information, see the Overview for MOSFET and IGBT Gate Drivers product page. Several, step-by-step numerical design examples complement the application report. This document is also available in Chinese: MOSFET 和 IGBT 栅极驱动器电路的基本原理 Contents 1 Introduction ................................................................................................................... 2 2 MOSFET Technology ...................................................................................................... -
Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development*
IJEE 1830 Int. J. Engng Ed. Vol. 22, No. 1, pp. 000±000, 2006 0949-149X/91 $3.00+0.00 Printed in Great Britain. # 2006 TEMPUS Publications. Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development* PHILLIP A.M.SANDBORN AND PETER A.SANDBORN CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD, USA.E-mail: [email protected] Embedded resistors are planar resistors that are fabricated inside printed circuit boards and used as an alternative to discrete resistor components that are mounted on the surface of the boards.The successful use of embedded resistors in many applications requires that the resistors be trimmed to required design values prior to lamination into printed circuit boards.This paper describes a simple emulation approach utilizing conductive paper that can be used to characterize embedded resistor operation and experimentally optimize resistor trimming patterns.We also describe a hierarchy of simple modeling approaches appropriate to both college engineering students and pre-college students that can be verified with the experimental results, and used to extend the experimental trimming analysis.The methodology described in this paper is a simple and effective approach for demonstrating a combination of measurement methods, uncertainty analysis, and associated engineering model development. Keywords: embedded resistors; embedded passives; trimming INTRODUCTION process that starts with a layer pair that is pre- coated with resistive material that is selectively EMBEDDING PASSIVE components (capaci- removed to create the resistors.The layer contain- tors, resistors, and possibly inductors) within ing the resistor is laminated together with other printed circuit boards is one of a series of technol- layers to make the finished printed circuit board.