2018 1 ° Literature: G.Gy. Homepage, presentations, handouts, articles ° http://www.uni- obuda.hu/users/grollerg/Manufacturing%20engineeri ng/
° Dr Mojzes Imre (szerk): Mikroelektronika és elektronikai technológia MK 1995 ° Happy Holden: The HDI Handbook http://www.hdihandbook.com/download.php
2 ® CONTENTS ® Chapter 1 Introduction to High-Density Interconnects ...... 16 ® Chapter 2 The HDI Market ...... 62 ® Chapter 3 Design of Advanced Printed Circuits (HDI) ...... 88 ® Chapter 4 Electrical Performance ...... 156 ® Chapter 5 Materials for HDI ...... 186 ® Chapter 6 The HDI Manufacturing Processes ...... 230 ® Chapter 7 Small Hole Via Formation ...... 260 ® Chapter 8 Desmear and Metallization ...... 272 ® Chapter 9 Fine-Line Imaging and Etching ...... 302 ® Chapter 10 Electrodeposition and Solderable Finishes for HDI ...... 354 ® Chapter 11 Electrical Test of High-Density Interconnects ...... 400 ® Chapter 12 Quality, Acceptability and Reliability ...... 436 ® Chapter 13 Assembly and Test Processes for HDI ...... 478 ® Chapter 14 Embedded Components ...... 496 ® Chapter 15 Advanced HDI Structures and Next Generation Technologies ...... 536 ® Chapter 16 Advanced Packaging and System-in-Packages ...... 576 ® Index ...... i
3 ® http://www.pcb007.com/pages/thepcbmagazine.cgi ® http://www.smtonline.com/pages/smtmagazine.cgi ® http://www.pcbdesign007.com/pages/thepcbdesignmagazine.cgi ® http://www.electroiq.com/index.html ® http://ledsmagazine.com/magazine Homework (teamwork): ° Choose one journal ° Subscribe to one of them ° Choose one issue, one topic and show us in a short presentation – deadline: 31.03. ° Presentation: April, 10 – 15 min, team = 2 students
4 ® Lectures: 2/week, mid term mark ® Laboratory: 4 x 3h/ week,
° 1. test: 7th week, 25 points Theme: PCB manufacturing and Assembly ° 2. test: 13th week, 25 points Theme: Hibrids, Semiconductors, MEMS, printed electronics ° Student presentations: 10 – 12th week, 25 points
5 PCB manufacturing 5th week: inroduction
° 1 + 4 times 3 hour 7, 9, 10, 11th week: ° Double sided PCB labor working ° Plated through hole ° SMT and THT parts ° Leader: Gröller György
6 Electronic technology means technology of electronic interconnections ° Introduction, Electronic products, modules,technologies ° Printed Circuit Boards, Design for Manufacturing ° Assembly ° Hybrid IC-s, Multichip Modules (MCM) ° Technology of semiconductors ° Micro-Electro-Mechanical Systems MEMS, Printed Electronics
7 Materials Product (parts ) Process By-products Energy Waste Knowledge Rejections Technological prescriptions, Emissions parameters, patents, skill of workers Associations 8 ° The elementary steps of a technological series ° Not depends only one technology ° „Thieving” ideas, solutions are allowed, (recommended) (Patents are different!) Example: background of the modern photolithography: ° Etching 14 – 15th century ° Printing 16 – 17th century ° Screen printing 19th century ° Photography 19 – 20th century ° Chocolate factory ⇒ liquid curtain
9 ® Cake coating by chocolate.
® Curtain coating of PCB by solder resist.
10 ° Computer Aided Design (CAD), modelling, simulating ° Computer Aided Manufacturing CAM ° Importance of logistic ° Continuous control of technological parameters, measuring data, documentation ° Optimized control system after (or before) the expensive steps ° Global supply chain, many transport, divided responsibility ° Quality management ° Moderate acceptance of environmental aspects
11 ° Decrease size, increase circuit density ° Increase device speed ° Decrease energy use ° Increase number of parts/device, number of interconnections ° Moore’s-law: Semiconductor industry, 1965-68 (experience) ° Every 2 years the number of components on an area of silicon doubled. ° The price of one transistor be halved. ° The goal is similar in the PCB production but the speed of development is not so fast. ° HDI: High Density Interconnection
12 Recent feature size: ® IC: 22 → 12 → 7 nm PCB: 100 → 50µm
13 14
Digital Digital camera By Kálmán Sándor Haraszthy Ágoston 1812, Pest, Hungary
He was the first Hungarian to settle permanently in the United States and only the second to write a book about the country in his native language.
The Pioneer winemaker in California. Before it was Silicon Valley, the Santa Clara Valley was a land of orchards and farmland. This photo, taken in 1914, shows the wide expanse of the valley. Silicon Valley, 1960
In 1947, William Shockley led a Palo Alto-based team at Bell Labs that invented the world's first amplifying semiconductor, the transistor. They won a Nobel Prize in physics. (John Bardeen, William Shockley, and Walter H. Brattain) In 1956, William Shockley founds the Shockley Transistor Corporation to produce semiconductor-based transistors to replace vacuum tubes. In October 1957, 8 ‘traitors’ formed Fairchild, the first venture-funded startup of the Silicon Valley.
The first IC chip for the market, consisting of 4 transistors + 3 resistors + 1 capacitor Robert Noyce, Fairchild, 1961 In April 2005, Intel offered $10,000 to purchase a copy of the original Electronics issue in which Moore's article appeared. An engineer living in the United Kingdom was the first to find a copy and offered it to Intel. In 1966 there were 2,623 computers in the USA (1,967 worked for the Defense Department). Andrew Grove, founder of Intel in 1968 Steve Jobs in his garage, 1976 Stanford University District of Natural and Engineering Sciences
KLA Tencor cleanroom, 1990 Sub-20 nm FinFET product line