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Contributing Authors Contributing Authors FrankAndros-Associate Director of the Integrated Electronics Engineering Center-State University of New York at Binghamton, Binghamton, NY. He received a B.S. degree from Michigan Technological University in Mechanical Engineering, and M.S. and Ph.D. degrees from Arizona State University in Tempe, AZ, in mechanical engineering, and is a member of ASME and the IEEE. Dr. Andros joined the IBM Corporation in Endicott, NY, in 1968 where he held several technical and managerial assignments in electronic packaging, including Packaging Manager, Technical Support (Thermal, Electrical, Reliability) for Semiconductor Packages, Product Development Manager for Ceramic Substrates/Packages, TAB Product Development Manager, and was a Senior Technical Staff Member at IBM Microelectronics, Precision Flex Operations. He retired from IBM in 1997. Eugene R. Atwood-Advisory Engineer/Research Scientist-IBM Microelectronics Divi­ sion, Poughkeepsie, New York. Mr. Atwood currently works as a test engineer in the IBM Microelectronics Bond, Assembly and Test Facility in Poughkeepsie, NY. His assignments in­ clude design for test development and implementation for multi-chip modules, known good die, high-frequency manufacturing test methods, and embedded analog test methodologies. Mr. Atwood received a Bachelor of Fine Arts in 1981 from Nova Scotia College of Art and Design, a Bachelor of Electrical Engineering in 1990 and a Masters of Electrical Engi­ neering in 1991, both from Rensselaer Polytechnic Institute Troy, NY. Prior to accepting a position at IBM, Mr. Atwood worked for the Center for Integrated Electronics at the Jonsson Engineering Center Microwave Laboratory at Rensselaer Polytechnic Institute. Donald Barr-Senior Technical Staff Member-World Wide Packaging Applications, IBM Microelectronics, Interconnect Products at Endicott, NY. Dr. Barr has diversified indus­ trial and technical experience at three major US corporations with emphasis on fundamen­ tal science and technical management. He received a Ph.D. degree from the University of Massachusetts, where he was awarded an EDEA Fellowship. Don has 20 years expe­ rience with the IBM Corporation in electronic packaging, has publications and patents in the area of electronic processes; and is a member of the IBM Academy of Techno­ logy, and the American Chemical Society. Prior to joining IBM, he was the Technical Director of Research and Development at GAF Photo and Repro Division in Binghamton, NY. 1146 Contributing Authors w. Dale Becker-Senior Engineer-IBM Enterprise Systems, Poughkeepsie, NY. Dale leads the MCM design team that integrates and implements multiprocessor designs for IBM's S/390 platforms. Dr. Becker's current interests focus on the electrical design of components utilized in high-frequency CMOS processor systems. He specializes in the application of electromag­ netic numerical methods related to signal integrity and simultaneous switching noise in elec­ tronic packaging, the measurement of these phenomenon, and the model verification. Dale received a B.E.E. degree from the University of Minnesota, a M.S.E.E. degree from Syracuse University, and a Ph.D. degree from the University of Illinois. Steven M. Bedore--EngineerlScientist-IBM Microelectronics Division, Burlington facil­ ity, Essex Junction, VT. Steven is currently the lead engineer for die picking and the unit leader for the Continual Total Operating Performance (CTOP) cost savings program in Wafer Finishing Engineering. Mr. Bedore received his Bachelor of Science degree in Electrical Engineering from Western New England College in 1994. Claude L. Bertin-Consultant-Burlington, VT. Dr. Bertin retired from IBM in 2000, where he held technical and managerial assignments in the areas of semiconductor technology development, logic and memory product design, and package development. Most recently he was a Senior Technical Staff Member and manager of 256 megabit SDRAM memory design as part of an alliance between IBM, Infineon (Siemens subsidiary) and Toshiba. He specialized in electronic fuse/antifuse development for redundancy and on-chip voltage and performance optimization. Previously he was lead engineer in a partnership between IBM and Irvine Sensors Corporation, which developed dense, light-weight, 3-dimensional, memory packaging for computer and aerospace recorder applications. Earlier IBM projects included high-performance CMOS static RAM (SRAM) development providing stand alone cache memory products and embedded SRAM cores in ASIC products. Dr. Bertin held both engi­ neering and management positions in NMOS and CMOS product development for ASIC and PLA logic, ROM, and manufacturing transfer to IBM locations in Manassas, VA, Burlington, VT, and Essones, France. He was elected to the IBM Academy of Technology in 1992. He received his Ph.D. in Electrical Engineering from Rensselaer Polytechnic Institute (1969), and a Masters degree in Electrical Engineering from Columbia University. Dr. Bertin began his career with the Bell Telephone Laboratory. He is a member of IEEE, Sigma Xi, Tau Beta Pi, and Eta Kappa Nu. He has 82 US patents in the area of memory and logic devices, and packaging; and eight publications. Katarina Boustedt-Senior Specialist, Microelectronics Packaging-Ericsson Mobile Com­ munications, Kumla, Sweden. Ms. Boustedt is involved with advanced packaging develop­ ment, such as flip chip for commercial applications at Ericsson's largest manufacturing plant, the mobile phone facility in Kumla, Sweden. Previously she focused on the implementation of flip chips for very high frequency products at the Ericsson Microwave Systems High Speed and Microwave Research Center in Molndal, Sweden. Before joining Ericsson, Ms. Boustedt was a project manager of packaging and interconnection research at the Department of Elec­ tronics Packaging at IVF, the Swedish Institute of Products Engineering Research, Molndal, Sweden. Research topics included advanced packaging, such as flip chip, chip scale packag­ ing, and high-density substrate techniques. Katarina graduated from Chalmers University of Technology in 1989, studied Engineering Physics, majoring in Material Science. Ms. Boustedt is an industrial mentor for doctoral candidates at Swedish and international universities, and Contributing Authors 1147 currently lectures at Linkoping Institute of Technology, Sweden. She has served on the board of IMAPS Nordic since 1997. Peter J. Brofman-Senior Technical Staff Member-IBM Microelectronics Division, East Fishkill, NY. Dr. Brofman joined IBM in 1980, and is considered a leading technical ex­ pert in bond, assembly, and interconnect process technology. He is currently responsible for packaging technology strategy. Dr. Brofman received BS, MS, MBA and Ph.D. degrees from Rensselaer Polytechnic Institute, the latter in physical metallurgy, He is a member of the American Society of Metals International, International Microelectronics and Packaging Society (IMAPS), and is the IBM representative to the Semiconductor Research Center's Packaging thrust. Dr. Brofman has published various papers and articles dealing with mi­ croelectronic packaging particularly physical metallurgy, brazing and solder interconnect technology, and holds various patents in these areas. Mark Brown-Regional Marketing Manager-Kulicke and Soffa Industries, Santa Clara, CA. Mr. Brown is responsible for marketing and applications in North America for the dicing systems group. Prior to K & S Industries, he held several positions at Disco where he was responsible for dicing and grinding marketing and sales efforts in North America. His 23 years of experience give him a wide perspective in die dicing and grinding applications. Stephen 1. Buchwalter-Manager of Packaging Materials and Processing-IBM Thomas J. Watson Research Center, Yorktown Heights, NY; [email protected]. Dr. Buchwalter has done research on polymeric materials for packaging applications since 1985, during which time he has developed several new materials in the area of microelectronic encapsulation. He has also worked closely with the IBM Microelectronics Division on packaging processing to assure the reliability of polymeric interfaces, for which he has received three IBM Technical Achievement Awards. He received a BA in chemistry from the College of Wooster and a Ph.D. in organic chemistry from Harvard University. He is a member of the American Chemical Society and the American Association for the Advancement of Science. He has published twenty-four scientific and technical papers and has received thirty-two patents. Barrie C. Campbell-Advisory Engineer-IBM Microelectronics Division, Poughkeepsie, NY. Dr. Campbell supports the MCM BondiAssemblyrrest facility and has headed the BGA, Encapsulation and Final Inspection sectors. His prior IBM experience included large panel assembly, metallized ceramic substrate fabrication and flexible chip carrier fabrication. He has received seven awards, including a Corporation Outstanding Technical Achievement Award. Prior to joining IBM in 1981, Dr. Campbell served as Vice President of Research for Billings Energy Corporation, investigating the use of hydrogen as a vehicular and pipeline fuel. He holds 4 issued patents and has published 9 technical articles. He received a BS degree in Physics in 1973, and a Ph.D. in Chemistry in 1983, both from Brigham Young University. Tom Chung-Executive Vice President-FICTA Technology San Jose, CA. Prior to his current position, Dr. Chung was Vice President of APTOS Corporation where his respon­ sibilities
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