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Custom and Multichip Packaging Contract Manufacturing
Custom & Multichip Packaging Contract Manufacturing Micross’ contract assembly offers design and engineering support, BOM procurement, and a wide selection of package, substrate and interposer materials. Micross provides comprehensive semiconductor packaging services for multiple electronic components, including digital, mixed signal, analog, multi-chip and System-in-Package (SiP). We design, build and test hermetic QML and chip scale packaging for various markets including down-hole, aerospace, satellite and military. We combine advanced processes and product development to provide full turnkey support for prototype to volume production of flip chip and wire bond packages including single chip, multichip and SiP applications on organic substrates or ceramic substrates. By ensuring delivery of finished wafers through our relationships with silicon OCMs, and full coordination of customer BOM requirements, we offer complete supply-chain management services for micro- electronic assemblies. Micross Components can support your custom design with: Micross supplies modules and contract assembly services for multiple platforms: industrial, airborne; commercial and government satellites; • Complete turnkey product - including program missile and ordnance; C4ISR and medical. and vendor management of all elements throughout the product lifecycle • Co-development of a statement of work (SOW) Custom Multichip Packaging (MCP) is a die based system or sub-system • Co-design, starting with schematic, netlist or product definition and documentation assembled into a single package which is then mounted to the PCB. • Environmental requirements review In its simplest form factor, two or more of the same die are combined in one industry standard package that is smaller than the equivalent • Package and material selection for optimization of electrical and environmental performance, single die packages combined. -
Introduction to System IC Design Flow
Introduction to System IC and Design Flow Outline System-on-a-Chip (SoC) Trend SoC Integration & Challenge System-in-a-Package (SIP) IC Industry and Chip Production Flow System IC Design Flow Chip Debugging Tools and Reliability Issues 2 SoC Concept Analog Memory PCB ASIC CPU Chip System on a Board Analog IP Memory IP Chip IP IP CPU System on a Chip 3 Soc Advantages Minimize System Cost PCB, passive components Assembling Testing Compact System Size Board layout vs. chip layout Reduce System Power Consumption I/O, passive components, current levels Increase System Performance Interconnecting delay High speed parallel bus 4 Years 2002 – 2008 Worldwide Communication SoC Market Values Unit: Million U.S. Dollars Product 2002 2003 2004 2005 2006 2007 2008 Digital Cellular 7,480 9,463 12,560 15,210 15,855 17,202 19,013 LAN Wireless 138 333 492 662 777 938 1,134 Mobile Infrastructure 325 344 418 537 511 479 481 Other Mobile Comms. 378 520 673 859 1,077 1,215 1,440 LAN 140 184 248 316 348 392 446 Premises and CO Line Card 167 161 188 201 199 204 219 Broadband Remote Access 918 1,313 1,617 1,793 1,717 1,837 1,978 Public Infrastructure 304 360 481 607 667 810 934 Other Wired Comms. 428 568 811 1,128 1,175 1,365 1,515 Total Communications 10,278 13,246 17,488 21,313 22,326 24,442 27,160 Source: Dataquest (2004/06) 5 Example1: Siemens C35i Phone 13 1. Infineon E-GOLD PMB2851E, GSM Baseband controller and DSP. -
FC-PBGA, Flip Chip Plastic Ball Grid Array
TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc. Table of Contents Slide 1. FC-PBGA Package Configurations 3 2. Printed Circuit Board Design for FC-PBGA 11 3. Surface Mount Assembly 16 4. Component Level Qualification 29 5. Board-Level Reliability 31 6. Thermal Performance 38 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 2 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc. TM FC-PBGA Package Configurations Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. -
Manufacturing and Reliability Challenges with QFN
Manufacturing and Reliability Challenges With QFN Dr. Craig Hillman and Cheryl Tulkoff DfR Solutions SMTA DC Chapter Ashburn, VA February 25, 2009 QFN as a ‘Next Generation’ Technology What is ‘Next Generation’ Technology? Materials or designs currently being used, but not widely adopted (especially among hi-rel manufacturers) Carbon nanotubes are not ‘Next Generation’ Not used in electronic applications Ball grid array is not ‘Next Generation’ Widely adopted © 2004 - 2007 2 Introduction (cont.) Why is knowing about ‘Next Generation’ Technologies important? These are the technologies that you or your supply chain will use to improve your product Cheaper, Faster, Stronger, ‘Environmentally-Friendly’, etc. And sooner then you think! © 2004 - 2007 3 Reliability and Next Gen Technologies One of the most common drivers for failure is inappropriate adoption of new technologies The path from consumer (high volume, short lifetime) to high rel is not always clear Obtaining relevant information can be difficult Information is often segmented Focus on opportunity, not risks Can be especially true for component packaging BGA, flip chip, QFN © 2004 - 2007 4 Component Packaging Most of us have little influence over component packaging Most devices offer only one or two packaging styles Why should you care? Poor understanding of component qualification procedures Who tests what and why? © 2004 - 2007 5 Component Testing Reliability testing performed by component manufacturers is driven by JEDEC JESD22 series (A & B) Focus is -
Land Grid Array (LGA) Package Rework
Freescale Semiconductor Document Number: AN3241 Application Note Rev. 1.0, 10/2009 Land Grid Array (LGA) Package Rework 1 Introduction Contents 1 Introduction . 1 This application note describes rework considerations 2 What is LGA? . 3 for the Land Grid Array (LGA) style package. 3 LGA Rework . 5 4 Package Removal . 6 Freescale has introduced radio frequency (RF) modules 5 LGA Reliability . 14 such as the MC1320x and MC1321x in LGA packages as 6 References . 14 an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead in finished products and are Reduction of Hazardous Substances (RoHS) compliant, optimized for improved radio-frequency (RF) performance for wireless applications, and/or reduce the overall height of the package by eliminating the stand-off height associated with BGA balls. For assistance with any questions about the information contained in this note or for more details about the MC1320x and MC1321x devices, visit www.freescale.com/802154. or contact the appropriate product applications team. © Freescale Semiconductor, Inc., 2009. All rights reserved. Introduction 1.1 Acronyms and Abbreviations BGA Ball Grid Array BT Bismaleimide Triazine CBGA Ceramic Ball Grid Array CTE Coefficient of Thermal Expansion EU European Union ESD Electrostatic Discharge HCTE High Coefficient of Thermal Expansion HDI High Density Interconnect LGA Land Grid Array LTCC Low Temperature Co-fired Ceramic MSLn Moisture Sensitivity Level n NSMD Non-Solder Mask Defined OSP Organic Solderability Protectant PCB Printed Circuit Board RF Radio Frequency RoHS Reduction of Hazardous Substances SMD Solder Mask Defined SMT Surface Mount Technology Land Grid Array (LGA) Package Rework Application Note, Rev. -
Recommendations for Board Assembly of Infineon Ball Grid Array Packages
Recommendations for Board Assembly of Infineon Ball Grid Array Packages Additional Information Please read the Important Notice and Warnings at the end of this document Revision 4.0 www.infineon.com page 1 of 18 2020-11-09 Recommendations for Board Assembly of Infineon Ball Grid Array Packages Table of Contents Table of Contents Table of Contents ........................................................................................................................... 2 Acronyms and Abbreveations ........................................................................................................... 3 1 Package Description ............................................................................................................... 4 1.1 BGA Package Type ................................................................................................................................... 4 1.3 Package Features and General Handling Guidelines ............................................................................. 5 2 Printed Circuit Board .............................................................................................................. 7 2.1 Routing .................................................................................................................................................... 7 2.2 Pad Design ............................................................................................................................................... 7 3 PCB Assembly ....................................................................................................................... -
INTEGRATED CIRCUITS Introduction
INTEGRATED CIRCUITS Introduction Integrated circuits (ICs) are a keystone of modern electronics. They are the heart and brains of most circuits. They are the ubiquitous little black “chips” you find on just about every circuit board. Unless you’re some kind of crazy, analog electronics wizard, you’re likely to have at least one IC in every electronics project you build, so it’s important to understand them, inside and out. Integrated circuits are the little black “chips”, found all over embedded electronics. An IC is a collection of electronic components – resistors, transistors, capacitors, etc. – all stuffed into a tiny chip, and connected together to achieve a common goal. They come in all sorts of flavors: single-circuit logic gates, op amps, 555 timers, voltage regulators, motor controllers, microcontrollers, microprocessors, FPGAs…the list just goes on-and-on IC Packages The package is what encapsulates the integrated circuit die and splays it out into a device we can more easily connect to. Each outer connection on the die is connected via a tiny piece of gold wire to a pad or pin on the package. Pins are the silver, extruding terminals on an IC, which go on to connect to other parts of a circuit. These are of utmost importance to us, because they’re what will go on to connect to the rest of the components and wires in a circuit. There are many different types of packages, each of which has unique dimensions, mounting-types, and/or pin- counts. Polarity Marking and Pin Numbering All ICs are polarized, and every pin is unique in terms of both location and function. -
Lessons from the Sony CD DRM Episode
Lessons from the Sony CD DRM Episode J. Alex Halderman and Edward W. Felten Center for Information Technology Policy Department of Computer Science Princeton University Abstract system called XCP that had been installed when he in- In the fall of 2005, problems discovered in two Sony- serted a Sony-BMG music CD into his computer’s CD BMG compact disc copy protection systems, XCP and drive. MediaMax, triggered a public uproar that ultimately led News of Russinovich’s discovery circulated rapidly on to class-action litigation and the recall of millions of the Internet, and further revelations soon followed, from discs. We present an in-depth analysis of these technolo- us,1 from Russinovich, and from others. It was discov- gies, including their design, implementation, and deploy- ered that the XCP rootkit makes users’ systems more ment. The systems are surprisingly complex and suffer vulnerable to attacks, that both CD DRM schemes install from a diverse array of flaws that weaken their content risky software components without obtaining informed protection and expose users to serious security and pri- consent from users, that both systems covertly transmit vacy risks. Their complexity, and their failure, makes usage information back to the vendor or the music label, them an interesting case study of digital rights manage- and that none of the protected discs include tools for unin- ment that carries valuable lessons for content companies, stalling the software. (For these reasons, both XCP and DRM vendors, policymakers, end users, and the security MediaMax seem to meet the consensus definition of spy- community. ware.) These and other findings outraged many users. -
Package Outline Diagram Page Layout Used in This Data Book
Package Outline Diagram Page Layout Used in This Data Book Header: Shows form and number of pins FINE PITCH BALL GRID ARRAY PACKAGE 176 PIN PLASTIC BGA-176P-M03 Package code 176-pin plastic FBGA Lead pitch 0.50 mm Package width × 8.00 × 8.00 mm package length Characteristics Lead shape Soldering ball Sealing method Plastic mold Mounting height 1.13 mm MAX BGA Illustration Weight 0.12g (BGA-176P-M03) PLASTIC Ta b : S h ow s fo r m 176-pin plastic FBGA (BGA-176P-M03) +0.20 8.00±0.10(.315±.004)SQ 0.93 Ð0.10 176-¯0.30±0.10 Mounting height 0.05(.002) M +.008 (176-¯.012±.004) .037 Ð.004 0.50(.020) TYP 15 Package outline 14 13 12 diagram 11 10 0.08(.003) 9 7.00(.276) 8 REF INDEX 7 6 5 4 3 2 1 DEFGHJKLMNPR ABC INDEX AREA 0.25±0.10 Stand off (.010±.004) Dimensions in mm (inches). C 2000 FUJITSU LIMITED B176003S-1c-1 1 Introduction to Packages 1.1 Overview...................................................................................................... 3 1.2 Package Lineup .......................................................................................... 4 1.3 Package Forms 1.3.1 Lead insertion types .......................................................................... 6 1.3.2 Surface mounted types...................................................................... 6 1.4 Package Structures 1.4.1 Structure diagrams ............................................................................ 8 1.4.2 Sample Assembly Process.............................................................. 11 1.4.3 Structural materials ......................................................................... 13 1.4.4 Lead-Free Packages........................................................................ 15 1.5 How Package Dimensions Are Indicated 1.5.1 SOP dimensions.............................................................................. 16 1.6 Package Codes 1.6.1 Fujitsu Code Labeling...................................................................... 18 1.7 Marking 1.7.1 Standard marking ........................................................................... -
Copy Protection
Content Protection / DRM Content Protection / Digital Rights Management Douglas Dixon November 2006 Manifest Technology® LLC www.manifest-tech.com 11/2006 Copyright 2005-2006 Douglas Dixon, All Rights Reserved – www.manifest-tech.com Page 1 Content Protection / DRM Content Goes Digital Analog -> Digital for Content Owners • Digital Threat – No impediment to casual copying – Perfect digital copies – Instant copies – Worldwide distribution over Internet – And now High-Def content … • Digital Promise – Can protect – Encrypt content – Associate rights – Control usage 11/2006 Copyright 2005-2006 Douglas Dixon, All Rights Reserved – www.manifest-tech.com Page 2 1 Content Protection / DRM Conflict: Open vs. Controlled Managed Content • Avoid Morality: Applications & Technology – How DRM is impacting consumer use of media – Awareness, Implications • Consumers: “Bits want to be free” – Enjoy purchased content: Any time, anywhere, anyhow – Fair Use: Academic, educational, personal • Content owners: “Protect artist copyrights” – RIAA / MPAA : Rampant piracy (physical and electronic) – BSA: Software piracy, shareware – Inhibit indiscriminate casual copying: “Speed bump” • “Copy protection” -> “Content management” (DRM) 11/2006 Copyright 2005-2006 Douglas Dixon, All Rights Reserved – www.manifest-tech.com Page 3 Content Protection / DRM Content Protection / DRM How DRM is being applied • Consumer Scenarios: Impact of DRM – Music CD Playback on PC – Archive Digital Music – Play and Record DVDs – Record and Edit Personal Content • Industry Model: Content -
Digital Rights Management
Journal of Intellectual Property Rights Vol 9, July 2004, pp 313-331 Digital Rights Management: An Integrated Secure Digital Content Distribution Technology P Ghatak, R C Tripathi, A K Chakravarti Department of Information Technology, Electronics Niketan, 6, CGO Complex, New Delhi-110 003 Received 5 December 2003 The ability to distribute copyrighted works in digital form through high capacity prere- corded disks (CD ROMs, DVDs etc.) and Internet-enabled transmissions have brought new challenges to the protections of such content from unauthorized copying and use. Technological advancements in this regard are reviewed. Despite the ease with which digital content owners can now transfer data, images, music, video and multimedia documents across the Internet, cur- rent technology does not let them protect their rights to the works, which has resulted into wide- spread music and video piracy. In fact, although the Internet permits widespread dissemination of digital content, the easy-to-copy nature of digital data limits content owners’ willingness to distribute their documents electronically. Digital Rights Management (DRM) technology is a key enabler for the distribution of digital content. DRM refers to protecting ownership/copyright of electronic content by restricting the extent of usage an authorized recipient is allowed in re- gard to that content. DRM technology has historically been viewed as the methodology for the protection of digital media copyrights. But DRM technology products can be leveraged to ad- dress much larger issues, including the control of rights and usage permissions of content and digital information. DRM presents the opportunity to package, price, distribute and sell content in many new ways that have never been possible before. -
EE Concierge Style Guide PCB Layout and Component Creation
EE Concierge Style Guide PCB Layout and Component Creation For more information or component creation services visit EEConcierge.com Version 1.2 For more information or component creation services visit EEConcierge.com Table of Contents Introduction Checklist: What a perfect part looks like Style Guide: Pins Number of Pins Pin Numbers Pin Names Pin Types Style Guide: Attributes Step by Step Walkthrough Style Guide: Symbols Step by Step Walkthrough Headers Pin Organization Style Guide: Footprints General Tips Component Origin Layers Top Component Top Package Outline Top Solder Mask Top Paste Mask Top Copper Top Courtyard Top Silkscreen Top Keepout Bottom Layers Mechanical Details, Rulers, Notes, Design Rules Hole Layer Hole Sizing Plated Through Holes TO-92 and Other Parts With Overlapping Holes/Pads Non Plated Through Holes (NPTH) Axial Components DIP Components Thermal Pads BGAs Additional Guidelines Common Mistakes Made Missing refdes (both symbol and footprint) For more information or component creation services visit EEConcierge.com Holes not big enough (exact size of the hole) The datasheet is for a different part No part number on IC schematic No keepouts (this came up with antennas) Ground or power pins on the top or bottom of a symbol No pin one marker (footprint) Footprints not centered Missing mechanical details or holes on the wrong layers Wrong number of pins Bad pin names Missing overbars or # or n in the pin name Marking pin one improperly Specific Guidelines for Axial Components Specific Guidelines for Radial Components