Edsfair 2007 Exhibition Report

Contents

1.On the Announcement of the Electronic Design and Solution Fair 2007 1 2.Greeting from the EDSFair2007 Executive Committee Chairman 1 3.Exhibition Outline 2 4.Opening Ceremony 2 5.Ribbon Cutters' Exhibition tour 2 6.Exhibitors 3 7.Applicable Products 4～7 8.Emerging Company Area 8 9.Suite 8 10.University Plaza 8 11.Keynote Speech 8 12.Exhibitor Seminars 8 13.Special Lecture 9 14.SPIRIT Lecture 9 15.Special Presentation Stage 9 16.EDAC Seminar and Party 9 17.Jointly held event 9 18.Concurrently held conference 9 19.PR Activities 10 20.Number and Date of Vistors 11 1.On the Announcement of the Electronic Design and Solution Fair 2007

The Japan Electronics and Information Technology Industries industry’s human resources – particularly the engineers needed to Association (JEITA) will be hosting the Electronic Design and realize these innovations. Solution Fair 2008 at the Pacifico Yokohama on January 24 & 25, 2008. This will be the 15th time that this event has been held, “World-Leading Technologies – Yours to Discover” is the theme of including EDSFair’s predecessor, the EDA TechnoFair. this Electronic Design and Solution Fair 2008. You will find on display world-class, cutting-edge technologies tailored for an age The goal of EDSFair is to introduce and disseminate information that demands new solutions. There are a variety of seminars and a about the latest design solutions, design technologies, and EDA conference offering a wide range of up-to-date information. There technologies required to produce the semiconductors and electronic are open sessions catering to young engineers, new zones that bring systems for the IT applications that will form the foundation of the together both Japanese and foreign venture businesses, as well as future information society, whose citizens will enjoy a ubiquitous initiatives for promoting substantive technical exchanges between computing environment. The fair thus contributes to the industry, academia and government. development of electronics and other IT-related industries. It is the fervent desire of all of us in JEITA that EDSFair will From the second half of last year there have been signs of recovery contribute to enhancing the design technologies available to Japan's in Japan's electronics industry, with both production and exports on electronic and IT industries, and also that both visitors and the rise, and this recovery has been gathering momentum this year. exhibitors will be able to make the best use of the opportunities This is especially noticeable in the fields of semiconductors and afforded by this event for conducting effective and fruitful displays, where a growing number of companies are increasing their exchanges of information, and for generating new business. capital investment. We greatly look forward to the participation of many companies JEITA forecasts that this year Japan's electronics industry will and professionals in this upcoming trade show. achieve a 2.3% increase over last year in its domestic production. Depending on business conditions in the second half, it is possible that the final figure may even exceed ¥20 trillion. Furthermore, this upturn is not limited in scope: everything from components and semiconductors to home IT appliances and mobile phones are expected to benefit from growing demand.

Japan Electronic and Information Technology Nevertheless, facing increased competition in the international Industries Association (JEITA) arena, Japan’s industries as a whole need to enhance their Chairman Naoyuki Akikusa competitive power, and this requires innovations on many different (also Chairman and Representative Director, levels. It is therefore of critical importance that we foster the Fujitsu Limited)

2.Greeting from the EDSFair2007 Executive Committee Chairman

The Electronic Design and Solution Fair 2007 (EDSFair2007)-held Venture Company Pavilion and various seminars at a Special Event for two days from Thursday, January 25, 2007-ended without Stage, which were well-received. The EDSFair Executive incident, with a record 154 companies exhibiting in 348 booths to Committee will examine and implement a variety of measures to 11,136 visitors. increase visitor and exhibitor satisfaction for the continued advancement of the Electronic Design and Solution Fair. I would like to extend my cordial gratitude to the exhibitors, our supporters and assisting organizations, and our other backers, as We are scheduling the upcoming Electronic Design and Solution well as those associated with the Executive Committee, our Fair 2008 (EDSFair2008) for Thursday, January 24 and Friday, management staff, and many others whose cooperation made the January 25, 2008 (two days), at Pacifico Yokohama. event a success. I request your continued support and cooperation in these efforts. In hosting EDSFair2007 we succeeded in introducing into the whole industry the latest solutions for hardware and software design required for ever more sophisticated electronic systems and semiconductors. We believe this enabled attendees to gather valuable information and disseminate information on the latest trends, as well as providing a venue for fruitful industry communication.

In response to visitor requests to hear more about Japanese and overseas venture companies and about the industry and technology EDSFair2007 Executive Committee trends expected at an industry-wide event such as this, we set up a Chairman Mitsuru Nadaoka

1 3.Exhibition Outline qExhibition Outline Name Electronic Design and Solution Fair 2007 (EDSFair2007) Duration ...... Thursday, January 25 and Friday, January 26, 2006 (2 days) 10:00 a.m. to 6:00 p.m. Location ...... Pacifico Yokohama (Exhibition Hall and Annex Hall) 1-1-1 Minato Mirai, Nishi-ku, Yokohama 220-0012, Japan Admission...... Exhibition: Free (registration required at show entrance) Conference: Fees charged for some sessions Sponsorship ...... Japan Electronics and Information Technology Industries Association (JEITA) Cooperation ...... Electronic Design Automation Consortium (EDAC) Support ...... Ministry of the Economy, Trade and Industry, Japan (METI) Embassy of the United States of America in Japan Distributors Association of Foreign Semiconductors (DAFS) City of Yokohama Assistance ...... The Institute of Electronics, Information and Communication Engineers (IEICE) Information Processing Society of Japan (IPSJ) Japan Printed Circuit Association (JPCA) Spacial Assistance...... Hewlett-Packard Japan, Ltd. Sun Microsystems K.K Management ...... Japan Electronics Show Association (JESA) wOverview EDSFair2007 welcomed a host of booth exhibitors in such fields as LSI At the Special Event Stage in the Exhibition Hall there was also a design related tools, PCB related tools, embedded software, embedded session entitled “Understand What It's Too Late to Ask!” catering to processor development environments, IP and all manner of design young engineers and designers, as well as a special display exhibition, services, as well as those from FPGA vendors, EDA vendors and design called University Plaza, for promoting technical exchange among service companies. Both the number of booth spaces and the number of industry, academia and government. exhibitors topped those of last year's fair, with exhibitors in particular We additionally held conferences to which we invited leading industry totaling a record 154 companies-a 9.6% increase over last year-due in figures to give keynote speeches and special lectures, an exhibitors' part to campaigns inviting Japanese and overseas venture companies to seminar put on by exhibiting companies and a co-sponsored conference, participate. for a total of 11,136 visitors, exceeding last year's attendance.

■Companies ■Booth spaces ■No.of Visitors 160 350 11,500 300 130 11,000 250 100 200 10,500 148 154 336 343 348 11,153 11,003 11,136 70 150 306 10,787 105 119 100 10,000 40 50 000 2004 2005 2006 2007 2004 2005 2006 2007 2004 2005 2006 2007 4.Opening Ceremony The Opening Ceremony was held at the gate of the Exhibition Hall at 9:50a.m. on Thursday, January 25. The ceremony opened with congratulatory remarks from Hidehiro Yokoo, Director of the Information Communication Equipment Department, Commerce and Information Policy Bureau of the Ministry of Economy, Trade and Industry, and Toshiharu Nagashima, Policy Planning Director for Life Science and New Business Attraction, City of Yokohama Economic and Tourism Bureau. Masashi Muromachi, Chairman of the JEITA Semiconductor Board then gave his greetings on behalf of the sponsor, and the aforementioned people, along with JEITA Managing Director Kazuo Kaneko, conducted the ribbon cutting. 5.Ribbon Cutters' Exhibition Tour After the Opening Ceremony, the aforementioned guests and other people concerned toured the following six booths, listening to presentations on new technologies and R&D achievements on display: Denali Software K.K., University Plaza, Nihon Synopsys Co., Ltd., Venture Company Pavilion, NEC System Technologies, Ltd., and the Semiconductor Technology Academic Research Center.

2 6.Exhibitors

304 AET, Inc. 604 KANEMATSU ELECTRONICS LTD. 306 Agilent Technologies Japan, Ltd. 502 KeyBridge, Inc. 108 Altera Japan, LTD. 702 Magma Design Automation Co., Ltd. 608 Ansoft Japan K.K. 209 Marubeni Solutions Corp. 514 APACHE DESIGN SOLUTIONS, K.K. 701 MENTOR GRAPHICS JAPAN CO., LTD. 208 Applied Simulation Technology, LTD. 501 MENTOR GRAPHICS JAPAN CO., LTD. 101 Applistar Corp. 206 MISH International Co., Ltd. 603 ARM K.K. 303 MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED 503 ASIP Solutions, Inc. 302 MITSUBISHI ELECTRIC MICRO-COMPUTER APPLICATION SOFTWARE Co., LTD. 416 ASTRON, Inc. 419 NEC System Technologies, Ltd. 611 AT DESIGN LINKS CORPORATION 313 NetWell Corporation Accelicon Technologies, Inc. 103 Nihon Eve K.K. 605 Atrenta K.K. 003 Nihon Synopsys Co., Ltd. 203 AWR Japan 504 Nikkei Business Publications, Inc. 312 BERKELEY DESIGN AUTOMATION, Inc. 305 NIPPON SYSTEMWARE CO., LTD. 412 Brion Technologies Co., Ltd. 507 Novaflow, Inc. 704 Cadence Design Systems, Japan Novas Software, Inc INNOTECH CORPORATION Silicon Canvas, Inc 602 CALYPTO DESIGN SYSTEMS K.K. ForteLink, Inc 509 Carbon Design Systems Japan K.K. 417 Oki Network LSI Co., Ltd. 407 Celoxica Japan K.K. 405 OneSpin Solutions 002 CoWare K.K. 307 PALTEK CORPORATION 211 CQ Publishing Co., Ltd. 205 PLATFORM COMPUTING K.K. 410 CreDist, Inc. 414 Primegate Ltd. 202 CYBERNET SYSTEMS CO., LTD. 401 PROTOtyping Japan Corp. 310 CyberTec Ltd. 408 PULSIC JAPAN Limited Jasper Design Automation 510 Reed Business Information Japan K.K. 212 DAIKIN INDUSTRIES, LTD. 413 Sagantec North America, Inc. 512 Dempa Publications, Inc. 606 Semiconductor Technology Academic Research Center 105 Denali Software K.K. 403 Sequence Design K.K. 515 Digital Technologies Corporation 508 Sierra Design Automation IBM Japan, Ltd. 106 SILVACO Japan 402 DSM Solutions Corporation 505 SK-Electronics Co., LTD. 409 E2 Publishing Corporation 204 SOLITON SYSTEMS K.K. 516 FISHTAIL DESIGN AUTOMATION Aldec, Inc. 511 FORTE DESIGN SYSTEMS GE Fanuc Embedded Systems, Inc. 308 Non-Profit Organization FPGA Consortium MOSAID Technologies Inc. 301 FUKUOKA INDUSTRY, SCIENCE & TECHNOLOGY FOUNDATION Novocell Semiconductor, Inc. SAILING Co,.Ltd. Y Explorations, Inc. Analogist company, Ltd. 418 SONICS, Inc. MDI Corporation 309 SPINNAKER SYSTEMS INC. 102 GAIA System Solutions Inc. 001 Synplicity K.K. 210 GENESIS TECHNOLOGY INC. 415 TAKUMI TECHNOLOGY K.K. 610 GiDEL 207 Tanner Research Japan K.K. 406 HANDSHAKE Solutions 404 Tensilica K.K. 609 hdLab, Inc. 506 TOOL CORPORATION 601 hdLab, Inc. EDA Unit 419 Zuken Inc. 004 Hitachi Information & Communication Engineering, Ltd. 607 Hitachi ULSI Systems Co., Ltd. Emerging Company Area 703 INNOTECH CORPORATION 236 ADVANCED RFIC (SINGAPORE) PTE LTD Arteris SA 234 ADVINNO TECHNOLOGIES PTE LTD Beach Solutions, Inc. 235 APRIO TECHNOLOGIES, INC. ChipVision Design Systems AG 230 AXIOM DESIGN AUTOMATION eASIC 237 AZURO, INC. Jazz Semiconductor 226 BEACH SOLUTIONS INC. Target Compiler Technologies N.V. 240 BITROUTER Triant Technologies (2005) Inc. 223 CEBATECH, INC. 201 ISHIZUE Design Automation Corp. 231 CHIPVISION DESIGN SYSTEMS AG 104 ITOCHU Techno-Solutions Corporation 222 ENTASYS DESIGN, INC. REAL INTENT, INC. 227 HELIC S.A. Prolific Inc. 218 KYOSHIN TECHNOSONIC CO., LTD. SARNOFF Corporation 228 LIBRARY TECHNOLOGIES, INC. Xyalis 239 MUNEDA GMBH Dassault Systemes 220 PYXIS TECHNOLOGY, INC Sun Microsystems K.K 233 RIDGETOP GROUP INC. EMC JAPAN K.K 217 SIDENSE CORPORATION Macnica Networks Corp. 224 SOFTJIN TECHNOLOGIES PRIVATE LIMITED Actis Design, LLC 221 SOLIDO DESIGN AUTOMATION INC. ANOVA SOLUTIONS INC 219 SYNTEST JAPAN, LTD. Celoxica Japan K.K 229 TARGET COMPILER TECHNOLOGIES N.V. Nihon Eve K.K. 232 TENISON DESIGN AUTOMATION Obsidian Software, Inc. 225 THE SPIRIT CONSORTIUM INC. Blaze DFM, Inc. 238 VERIFIC DESIGN AUTOMATION DAFCA, Inc. ■JEVeC Village 513 IVIS Co., Ltd. 214 GIGA HERTZ TECHNOLOGY CORP. 311 JAPAN NOVEL CORPORATION 213 JAPAN EDA VENTURE CONSORTIUM (JEVeC) ACE Associated Compiler Experts bv 216 KEIREX TECHNOLOGY INC. 107 Jedat Inc. 215 MATHEMATICAL SYSTEMS INC. 214 SYSTEM JD CO., LTD.

3 7.Applicable Products Hardware Solutions Hardware Development (EDA) S A MPU/MCU/D FPGA/PLD Other y S

s 1 IC/A IC design tools tem L S Logic de Te DFM(OPC/RET/P Other An Logic verific Phy Phy S s y ign SS s s tem level de a t(DFT/BI s s S log de a P ic ic I s l integrity l integrity a a S l verific l implement s P ign (RTL to net li s s ign/verific S ign (higher th a S T/ATPG/other M/LRC/ TCAD/other tion a a tion/ n a ly a a tion a s a n n RTL) i tion s a ly s s s s i ) t) s Booth No. Name of Exhibitor ) 603 ARM K.K. ● 513 IVIS Co., Ltd. ● ● ● ● ● ● ● 306 Agilent Technologies Japan, Ltd. ● ● ● ● ● 416 ASTRON, Inc. ● ● ● ● ● ● ● ● ● ● 611 AT DESIGN LINKS CORPORATION ● ● ● 605 Atrenta K.K. ● ● ● ● 514 APACHE DESIGN SOLUTIONS, K.K. ● ● ● 208 Applied Simulation Technology, LTD. ● ● ● 101 Applistar Corp. ● ● ● ● 608 Ansoft Japan K.K. ● ● ● ● 409 E2 Publishing 201 ISHIZUE Design Automation Corp. ● 104 ITOCHU Techno-Solutions Corporation ● ● ● ● ● ● ● ● 703 INNOTECH CORPORATION ● ● ● ● ● ● 503 ASIP Solutions, Inc. ● 304 AET, Inc. ● 203 AWR Japan ● ● ● ● 505 SK-Electronics Co., LTD. ● ● ● 609 hdLab, Inc. ● ● ● ● 601 hdLab, Inc. EDA Unit ● ● ● ● 419 NEC System Technologies, Ltd. ● 308 Non-Proﬁt Organization FPGA Consortium 417 Oki Network LSI Co., Ltd. 509 Carbon Design Systems Japan K.K. ● ● 102 GAIA System Solutions Inc. ● ● ● ● 604 KANEMATSU ELECTRONICS LTD. 602 CALYPTO DESIGN SYSTEMS K.K. ● ● 502 KeyBridge, Inc. ● ● ● 410 CreDist, Inc. 002 CoWare K.K. ● 310 CyberTec Ltd. ● 202 CYBERNET SYSTEMS CO., LTD. 413 Sagantec North America, Inc. ● 211 CQ Publishing Co., Ltd. 403 Sequence Design K.K. ● ● ● ● 107 Jedat Inc. ● ● ● ● ● 210 GENESIS TECHNOLOGY INC. 508 Sierra Design Automation ● 610 GiDEL ● 106 SILVACO Japan ● ● ● ● ● 001 Synplicity K.K. ● ● ● ● ● 419 Zuken Inc. ● ● ● 309 SPINNAKER SYSTEMS INC. ● ● 418 SONICS, Inc. 204 SOLITON SYSTEMS K.K. ● ● ● ● 212 DAIKIN INDUSTRIES, LTD. ● ● 415 TAKUMI TECHNOLOGY K.K. ● ● ● ● 207 Tanner Research Japan K.K. ● ● ● 402 DSM Solutions Corporation ● ● ● 515 Digital Technologies Corporation ● 105 Denali Software K.K. ● ● 404 Tensilica K.K. ● ● 512 Dempa Publications, Inc. 506 TOOL CORPORATION ● ● ● 504 Nikkei Business Publications, Inc. 305 NIPPON SYSTEMWARE CO., LTD. ● ● ● 108 Altera Japan, Ltd. ● ● ● ● ● ● ● ● ● 103 Nihon Eve K.K. ●

4 IP core, macro, cell librarie De Univer Embedded processor Design data Ma PR- s

Software solutions IC tester/analyzer Design service-related s development environments i management tool related g k De Embedded O Device driver Firmwe Middlew Other IC te PCB te Other Reconfig H Other De De An Other P Microcomp Other ICE Deb De Compiler IP di S Other n infra s a s u im hop, Foundry rdw ity (R&D), Con a 2 blic s s s PCB design tool s u ign ign ho ign d ign con lyzer u s s a l S gger S An PCB Other PCB l a s s s s s trib s re/ ter a s y tor chem s tion tructure (W a s s s a ter a oftw r s u ervice tem in Packa u a s re s log de s tion /cro r us t a s a s s u s su a a ign m ble proce ter CA yo e a re co-de s S lting s tic c ss s a s u a ervice s n t complier l integrity, ign/verific a a s S gement S s pt ortium /PC, Network) ign environment E u ss g s re e( s or S s s ip) tool a tion s s

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5 Hardware Solutions Hardware Development (EDA) S A MPU/MCU/D FPGA/PLD Other y S

s 1 IC/A IC design tools tem L S Logic de Te DFM(OPC/RET/P Other An Logic verific Phy Phy S s y ign SS s s tem level de a t(DFT/BI s s S log de a P ic ic I s l integrity l integrity a a S l verific l implement s P ign (RTL to net li s s ign/verific S ign (higher th a S T/ATPG/other M/LRC/ TCAD/other tion a a tion/ n a ly a a tion a s a n n RTL) i tion s a ly s s s s i ) t) s Booth No. Name of Exhibitor ) 704 Cadence Design Systems, Japan ● ● ● ● ● ● ● ● ● ● 003 Nihon Synopsys Co., Ltd. ● ● ● ● ● ● ● ● ● 407 Celoxica Japan K.K. ● ● ● ● 311 JAPAN NOVEL CORPORATION ● 313 NetWell Corporation ● 507 Novaﬂow, Inc. ● ● ● ● ● ● ● ● ● ● ● 312 BERKELEY DESIGN AUTOMATION, Inc. ● 408 PULSIC JAPAN Limited ● ● ● 307 PALTEK CORPORATION ● ● ● 606 Semiconductor Technology Academic Research Center ● ● ● ● ● ● ● ● ● 406 HANDSHAKE Solutions ● ● 004 Hitachi Information & Communication Engineering, Ltd. ● ● ● ● ● ● ● ● 607 Hitachi ULSI Systems Co., Ltd. 516 FISHTAIL DESIGN AUTOMATION ● ● ● 511 FORTE DESIGN SYSTEMS ● ● 301 FUKUOKA INDUSTRY, SCIENCE & TECHNOLOGY FOUNDATION ● ● 412 Brion Technologies Co., Ltd. ● 414 Primegate Ltd. ● ● 205 PLATFORM COMPUTING K.K. 401 PROTOtyping Japan Corp. ● ● ● 702 Magma Design Automation Co., Ltd. ● ● ● ● ● ● 209 Marubeni Solutions Corp. ● ● ● ● ● ● 206 MISH International Co., Ltd. ● 303 MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED ● 302 MITSUBISHI ELECTRIC MICRO-COPUTER APPLICATION SOFTWARE Co., LTD. ● ● ● ● 701 MENTOR GRAPHICS JAPAN CO., LTD. ● ● ● ● ● ● ● ● ● 501 MENTOR GRAPHICS JAPAN CO., LTD. ● ● ● ● ● ● ● ● ● 510 Reed Business Information Japan K.K. 405 OneSpin Solutions ● 236 ADVANCED RFIC (SINGAPORE) PTE LTD ● 234 ADVINNO TECHNOLOGIES PTE LTD ● ● ● ● ● ● ● ● ● ● ● 235 APRIO TECHNOLOGIES, INC. ● 230 AXIOM DESIGN AUTOMATION ● 237 AZURO, INC. ● 226 BEACH SOLUTIONS INC. ● ● ● 240 BITROUTER 223 CEBATECH, INC. ● ● 231 CHIPVISION DESIGN SYSTEMS AG ● 222 ENTASYS DESIGN, INC. ● ● ● ● ● 227 HELIC S.A. ● ● 228 LIBRARY TECHNOLOGIES, INC. ● ● ● 239 MUNEDA GMBH ● 220 PYXIS TECHNOLOGY, INC. ● ● 233 RIDGETOP GROUP INC. ● ● ● ● 224 SOFTJIN TECHNOLOGIES PRIVATE LIMITED ● ● ● 221 SOLIDO DESIGN AUTOMATION INC. ● 229 TARGET COMPILER TECHNOLOGIES N.V. ● 232 TENISON DESIGN AUTOMATION ● 225 THE SPIRIT CONSORTIUM INC. 238 VERIFIC DESIGN AUTOMATION ● ● ● ● 218 KYOSHIN TECHNOSONIC CO., LTD. 217 SIDENSE CORPORATION 219 SYNTEST JAPAN, LTD. ● 214 GIGA HERTZ TECHNOLOGY CORP. ● 216 KEIREX TECHNOLOGY INC. ● 214 SYSTEM JD CO., LTD. ● 215 MATHEMATICAL SYSTEMS INC. ● ● ● ● 213 JAPAN EDA VENTURE CONSORTIUM (JEVeC) ● ● ● ● ● ● ● ● ● ●

6 IP core, macro, cell librarie De Univer Embedded processor Design data Ma PR- s

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7 8.Emerging Company Area 29 Japanese and overseas venture companies brought together the latest information on solutions for speedy uptake by designers and developers at an exhibition booth that doubled as a presentation stage and negotiation area.

■Seminar for Overseas Venture Company Exhibitors At 6p.m. on Wednesday, January 24-one day before the fair began-a seminar was held for overseas Emerging Company Area under the instruction of Jan Goodsell, President of CoWare K.K. The practical lecture served as a springboard for businesses looking to enter Japan.

9.Suite Small, medium and large suites were set up within the Exhibition Hall, providing exhibitors with an undisturbed environment to introduce select customers to the details of their strategic and not-yet-released products. The suites were also utilized as a useful venue for meetings and negotiations with important customers and a variety of other creative purposes directly related to exhibitors' businesses.

Suite Exhibitors CoWare K.K., Nihon Synopsys Co., Ltd. Cadence Design Systems, Japan, HELIC S.A.

10.University Plaza EDSFair offers an opportunity for university research institutes to present the results of their research projects while promoting increased collaboration between business and academia. In 2007, 17 university laboratories from across Japan came together to present demonstrations of research achievements related to design technologies.

11.Keynote Speech Title: System LSI creating a ubiquitous information societ Speaker: Mr.Tadahiro Kuroda, Professor of Science and Technology at Keio University Date: Thursday, January 25, 10:30 a.m. to 11:30 a.m. Place: Pacifico Yokohama Annex Hall Admission: Free Attendees: 343

12.Exhibitor Seminars EDSFair2007 hosted exhibitor seminars for concentrated PR activities targeting limited number of 30 to 100 customers per 45-minute session. The Conference hosted 120 sessions in 11 rooms. Number of total Attendees: 3042

8 13.Special Lecture

Title: Outlook for EDA and advanced research in the United States in the age of post-45 nm design. Speaker: Dr. Lucio Lanza, Tech Ventures Managing Director (Visiting professor at Carnegie Mellon University) Date: Friday, January 26, 11:30 a.m. to 12:50 p.m. Place: Pacifico Yokohama Annex Hall F202 Admission: Free Attendees: 97

14.SPIRIT Lecture

Title: Achieving Multi-Vendor Tool and IP Integrathion Using IP-XACT from The Sprit Consortiumtechnology Speaker: Mr. Bill Chown, The SPIRIT Consortium Roadmap Presenter (Mentor Graphics) Date: Thursday, January 25, 17:15 p.m. to 17:45 p.m. Place: Exhibition Hall Special Presentation Stage Admission: Free Attendees: 30

15.Special Presentation Stage At the Special Presentation Stage in the Exhibition Hall we held a session entitled “Understand What It's Too Late to Ask!” catering to young engineers and designers. Place: Exhibition Hall Admission: Free Number of total Attendees: 960

■Emerging Company Presentations The Special Presentation Stage also saw Japanese and overseas companies that participated in the Emerging Company Area conducting PR and product presentations.

16.EDAC Seminar and Party (held under cooperation between EDSFair and EDAC)

EDAC (Electronic Design Automation Consortium), a cooperating organization for EDSFair, held a seminar for Japanese EDA companies at the Harbor Lounge at 6:15p.m. on Thursday, January 25, attracting 36 attendees. EDAC continued with an exchange party from 6:50p.m. for EDSFair exhibitors and related people, to which 86 attended. These events were held under cooperation between EDSFair and EDAC.

17.Jointly held event ■14th FPGA/PLD Design Conference ・User's Presentations ・IP(Intellectual Property)Flea Market in EDSFair ・Evening session

18.Concurrently held conference

■System Design Forum 2007

■ASP-DAC2007 ASP-DAC is an international conference in its 12th session focused on electronic system design automation, covering LSI physical design, logic and function design, testing, system LSI design methodology, processors for use in embedded systems based on electronic system specification descriptions, and all manner of technology required in the design of such software.

ASP-DAC 2007 was held from Tuesday, January 23 to Friday, January 26 at Pacifico Yokohama Conference Center. 131 academic articles were presented in 11 topic areas, with Japanese and overseas university attendees numbering 343 and business attendees at 373, for a total of 716 participants. Three keynote speeches and tutorials, a Designers' Forum catering to on-site designers and two panel discussions all made for lively discussions covering a broad range from fundamentals to applications. The conference was conducted in concert with the University LSI Design Contest and Student Forum, thereby supporting the students' presentations.

9 19.PR Activities

(1) Press Releases qDissemination of release for commencement of exhibit application period (June 14) wDissemination of release for EDSFair overseas (November 28) eDissemination of release for EDSFair in Japan (December 11) rDissemination of release welcoming press coverage (January 18) tOpening announcement (January 24) yRelease of closing report (January 26) (2) Press Reception at the Fair Pressroom set up and run (January 25 and 26) (3) Mailings Ten mailings of EDSFair2007 Official News sent to those in our past visitor database and this year's pre-registrants (4) Creation of PR Tools (printed literature) qGuide to the fair and its exhibitions (Japanese, English) wGuide to the Emerging Company Area (English) eDAC leaflets for distribution (English) rPR Magazine (prior DM)/Envelope (Japanese) tPosters (Japanese) yVenue Guide Map (Japanese) uGuidebook (Japanese)

(1) Official Website

qURL www.edsfair.com

wOutline This is the official EDSFair website, covering information for exhibitors as well as visitors. Many people access the website throughout the year. We have taken steps to further improve the usefulness of the site for exhibitors and visitors by allowing exhibitors to upload exhibit information and their latest releases in real-time, as well as by posting up-to-date industry news. ePage Views

Total requests for html and other ﬁles by site visitors

Apr.2006 Total: 906,170 ～Feb.2007

rWeb server (website scale)

File Size No. of Files 2007 Japanese Approx. 23.5MB 507 2007 English Approx. 12.5MB 307 System Settings Approx. 3.5MB 167

tNo. of uses of data registration system for exhibitors 838 (November 8, 2006 to January 26, 2007)

10 ・What authority do you have to introduce products?

No response 4.1% 20.Number and Date of Vistors Authority to decide and authorize introduction 8.9%

Business

Others 5.8% No answer 3.1% Authority to plan, evaluate and Print media/Press 0.9% Not involved recommend 37.9% introduction Tool vendors 5.3% 49.1%

Trading/ Sales 6.0% Semiconductor/ electronic component Design and manufacturing related services 42.5% 10.5% ・How did you learn about the Electronic Design and Solution Fair? Newspaper or magazine 4.8% No response 4.9% E-mail from Equipment an exhibitor Link to an exhibitor’s manufacturing 25.1% 25.9% home page 7.5%

E-mail from the EDSFair Occupation Secretariat 10.7% Others 8.0% No answer 3.1% Procurement 0.3% Link from a Distribution 0.5% search site 11.0% Other Manufacturing/ 22.9% Inspection 1.9% Direct mail (EDSFair Report) Planning/ 13.2% Promotion/ Design 36.4% Marketing 7.2% ・For what applications are you responsible?

Sales 9.9% Medical equipment 1.5% Broadcasting equipment 2.2% Communications equipment 4.4% Civilian equipment Amusement 4.5% 23.4% R&D 13.1% Networks Design environment 5.3% conﬁguration Industrial 19.6% equipment 8.0%

Other Computers 11.3% 9.2% ・How many times have you attended the exhibition?

In-vehicle Mobile communications No response (automobiles) equipment 3.5% 10.0% Image processing 10.1% 10.1% Second time 13.9% ・How much time did you spend at the fair? One hour or less 2.1% No response 2.4% This was the first time About two hours 8.6% 37.7%

Six times or more （including the EDA TechnoFair, its predecessor） About three hours Five hours or 15.9% 16.0% more 51.7%

Third‒fifth time 28.9% About four hours 19.2%

11 Next Schedule Electronic Design and Solution Fair 2008 2008, Jan. 24（Thu）25（Fri） Pacifico Yokohama

122 Sponsored by Japan Electronics and Information Technology Industries Association (JEITA) Sumitomo Kaijo Bldg. Annex 11, Kanda-Surugadai 3-chome, Chiyoda-ku, Tokyo 101-0062, Japan http://www.jeita.or.jp

Managed by Japan Electronics Show Association (JESA)

5F, Sumitomo Shibadaimon Bldg. 1-12-16, Shibadaimon, Minato-ku, Tokyo, 105-0012, Japan Phone: +81-3-5402-7601 Fax: +81-3-5402-7605 E-mail : [email protected]