InsideChips.VenturesTM Tracking Fabless, IP & Design-House Startups

Volume 6, Number 7 July 2005 Business Microscope

3-D Chip Trends … For more than 30 years, the yearly conference explores market and technology chipmakers have been riding the Moore’s Law speed opportunities in the 3-D space. and performance wave. Without fail, they have been Universities, institutes/consortia, IDMs and a able to rely on reductions in transistor size used in ICs handful of startups are conducting 3-D research to achieve predicted increases in speed and around the world. Table 1 (page 2) highlights the performance. Moore’s Law, which states that chip notable players. DARPA funds most of the university performance doubles approximately every two years, programs in the U.S. held true because the RC delay has been negligible in comparison with signal propagation delay. For Initial 3-D efforts involved package stacking or submicron technology, however, RC delay becomes chip stacking in a single package with wire bond a dominant factor. As the industry moves to submicron feature interconnects. Amkor is a good illustration of this approach. sizes, shrinking two-dimensional chips will become problematic. Begun in 1998, the technology was primarily used for memory stacks. One emerging solution is 3-D integration. The technology is not new but it is becoming increasingly important as researchers One of the early pioneers of 3-D, Irvine Sensors, developed look for solutions beyond the perceived limits of today’s two- stacked chips in which the connections are made over the edge of dimensional devices. the die. One limitation, however, is that all die must be the same size. If a die shrink is implemented, the process requires InsideChips’ Steve Szirom co-chaired the 3-D Architectures considerable retooling. for Semiconductor Integration and Packaging Conference in Tempe, Ariz., held June 13-15. Organized by RTI International, Ziptronix uses a patented ZiROC and ZiCON bonding process

: Business Microscope ...... 1

e Bits and Bytes ...... 3

u Semiconductor Stock Index ...... 3

s Stock Market Scan...... 4

s Finance: News, Funding and Acquisitions ...... 5 i

Analyzing the Analysts ...... 10

s Emerging Ventures ...... 11 i

Agreements and Marketing Alliances ...... 19 h

t ASICs, IP and Design Services ...... 21 The Fast Track ... People & Organizations ...... 22

n Companies Mentioned in This Issue ...... 24 i

COPYRIGHT 2005 by HTE Research, Inc. All rights reserved. Photocopying is a federal offense. No part of this report may be reproduced or distributed, in any form or by any means electronic or mechanical, without written permission from HTE Research, Inc. InsideChips.Ventures is published 12 times a year by HTE Research, Inc., PO Box 32237, Bellingham, WA 98228-4237. Telephone 360 676-2260. Web: www.insidechips.com, E-mail: [email protected]. Executive Editor: Steve Szirom; Associate Editor: Greg Friedman. Subscription rates and a sample issue are available upon request. A sample issue and brochure IC may also be downloaded from InsideChips.com's website. InsideChips.Ventures

that enables analog, memory and logic die —designed Worldwide High-Density NOR Flash Memory and produced in their optimum technologies — to be Revenue ($ Billions) integrated as true chip-scale SOCs. This approach eliminates future scaling issues, and designers no longer 10 need to compromise embedded memory or analog circuit 9 functions. 8 (See our profile of Ziptronix in the Aug. 2003 issue of 7 InsideChips.Ventures.) 6 Tezzaron Semiconductor (formerly Tachyon 5 Semiconductor), which started out as design house, has 4 moved into the 3-D arena and is developing its FaStack 3 wafer-stacking technology. We believe the firm uses its 2 own proprietary IP, licensed stacking technology and 1 wafer-bonding technology co-developed with IME. 0 Tezzaron’s 3-D wafer-stacking technique is best suited 2005 2006 2007 2008 2009 for memory (DRAM, PCRAM, FeRAM, and MRAM) Source: iSuppli and FPGAs. Figure 1 Continued on page 20 Worldwide Digital Audio Chip Sales ($ Millions) Table 1 -- Companies and organizations in the 3-D semiconductor space 350 Institutes/Consortia 300 ASET (1999-2001) Japan Fraunhofer Germany 250 IMEC Belgium 200 RTI U.S. 150 Universities Albany Nanocenter U.S. 100 Arkansas U.S. 50 Delft Netherlands Lincoln Labs U.S. 0 MIT U.S. 2005 2006 2007 2008 2009 2010 RPI U.S. Source: In-Stat Tohoku Univ. Japan Figure 2 IDMs IBM U.S. 2004 Automotive Semiconductor Vendor Market Shares Amkor U.S. Fujitsu Japan Freescale Infineon Germany 12% Infineon Intel U.S. 9% Micron U.S. Toshiba Japan STM 8% Startups Contour Semiconductor U.S. Others Renesas Matrix Semiconductor U.S. 58% 7% Irvine Sensors U.S. NEC Tezzaron Semiconductor U.S. 6% Vertical Circuits U.S. Ziptronix U.S. Source: Strategy Analytics ZyCube Japan Figure 3

July 2005 Page 2 InsideChips.Ventures Bits and Bytes

Cree to Close Silicon the company’s Cree Microwave segment • Disengage from certain activities. for financial reporting purposes. Although Microwave Business STMicroelectronics said it will attempt this segment will no longer be used for to minimize the social impact of this Cree has revealed plans to close the financial reporting purposes, Cree’s wide- reorganization by putting in place, whenever silicon RF and microwave semiconductor bandgap RF and microwave products based possible, measures that favor voluntary business of its wholly owned subsidiary, on SiC and GaN technology will continue to redundancy (early retirement measures, job Cree Microwave, located in Sunnyvale, be marketed under the Cree Microwave creation schemes, individual projects, Calif. This business manufactures silicon- brand. based laterally diffused metal oxide transition to part-time work). semiconductor (LDMOS) and bipolar STMicroelectronics Sheds More Lattice Places Two products. Light on European Restructuring Top Execs on Leave Cree said it closed the business to focus STMicroelectronics has specified the on wide-bandgap RF and microwave Lattice Semiconductor has placed CEO restructuring efforts the company announced products based on its silicon carbide (SiC) Cyrus Tsui and Rodney Sloss, VP of finance, on May 16. The company presented and gallium nitride (GaN) technology. The on paid leave of absence pending completion principles of the initiatives, which will bring company also considered the financial of an independent examination being the cumulative reduction of its workforce in outlook for the silicon RF and microwave undertaken by the company’s audit Europe — out of a total of 3,000 outside semiconductor operations. For the nine committee. Lattice named Stephen Skaggs Asia — to 2,300 jobs by mid-2006, including months ended March 27, 2005, Cree acting CEO and Patrick Jones acting the non-renewal of some temporary incurred net operating pre-tax losses of chairman of the board. positions. $9.2 million related to this segment of its The audit committee is examining issues business. The following are some of the company primarily associated with executive plans to reorganize its European activities: Cree Microwave will accept last time compensation and several related items buy orders for its silicon LDMOS products • Convert 6-inch production tools pertaining to the company’s internal through June 2005, and plans to wind down to 8 inches, in pursuit of the program already controls. Lattice said it is not aware of any the operations of this business by December undertaken; required adjustments to its historical 2005. The company estimates that it will financial results in connection with these incur a total of approximately $13 million • Optimize its EWS activities (wafer matters. The company has furnished to $15 million in pre-tax expenses to close test) on a global scale; information regarding the matters under the Sunnyvale facility. • Harmonize its support functions, examination to the Securities and Exchange The silicon RF business operated at the reduce its costs and rationalize its activities Commission, which is conducting an Sunnyvale facility has been referred to as (outside of manufacturing); and Continued on page 21 Semiconductor Stock Index

Short Term Long Term

InsideChips.Ventures reports on and analyzes the semiconductor industry based on information obtained from sources generally available to the public, and from industry contacts. Although these sources are considered reliable, we cannot guarantee their accuracy. The opinions and views expressed herein reflect the judgment of HTE Research, Inc., and are subject to change. We welcome the views of subscribers on the content and analyses found in this report. HTE Research, Inc., and its editor(s) do not have any equity positions in the companies profiled in InsideChips.Ventures unless specially noted at the end of the profile.

July 2005 Page 3 InsideChips.Ventures Stock Market Scan

AMD ATI Technologies

Broadcom Genesis Microchip

Maxim Integrated Products Sandisk

July 2005 Page 4 InsideChips.Ventures Finance: News, Funding and Acquisitions

Infineon Sells Wearable Rudolph Technologies, The new Rudolph will be headquartered Electronics in Management Buyout August Technology to Merge in Flanders, N.J., and maintain the inspection business in Bloomington, Minn., and the Within the framework of a management Rudolph Technologies, a provider of metrology business based in New Jersey. buyout (MBO), Infineon Technologies has process control equipment for thin film turned over its activities in the area of Contacts: measurement and macro defect inspection, Paul McLaughlin, Rudolph CEO; Tel: 973 wearable electronics to the company is acquiring the much-sought-after August 691-1300; www.rudolphtech.com. Interactive Wear of Wessling, Germany. Technology, a supplier of inspection and Jeff O’Dell, August CEO; Tel: 952 820-0080; Infineon, which had conducted research on defect analysis solutions for the www.augusttech.com. the integration of electronic functions into microelectronic industries. The companies Semtech Acquiring XEMICS textiles and developed this technology to expect the deal to close in Q4 2005. the point that it is ready for the market, High-performance analog and mixed- nevertheless discontinued these activities Each August shareholder will receive either $10.50 per share in cash or $10.50 signal semiconductor provider Semtech is as part of its strategic restructuring and buying XEMICS, a fabless developer of concentration on its core business. per share in Rudolph stock, reflecting an aggregate consideration of approximately ultra-low-power analog, RF and digital ICs. As part of this MBO, which has now $193 million. The agreement requires that Semtech International, Semtech’s wholly been completed, the rights to IP now belong the total consideration for the transaction owned Swiss subsidiary, is the business entity to Interactive Wear, along with will include a minimum of $37.2 million acquiring XEMICS, which will be known as developmental hardware and software and and a maximum of $60 million of cash the Wireless and Sensing Products business the existing customer base, as well as the subject to shareholder election. unit. parts inventory and the finished wearable Semtech International will pay $43 electronics products. The combined company, which will be known as Rudolph Technologies, will million in cash to the shareholders of The companies did not disclose financial employ approximately 600 people. The XEMICS and has agreed to pay up to an details of the transaction. combined companies’ 2004 revenues are additional $16 million if certain performance milestones are met within a 12-month period Infineon’s former head of engineering approximately $160 million. ending April 30, 2006. for wearable electronics and current CTO Rudolph’s Paul McLaughlin and Steven at Interactive Wear, Markus Strecker, is Roth will continue to serve as chairman/ XEMICS is an R&D-intensive company participating in the MBO. Strecker, a sensor CEO and CFO, respectively. August CEO with 77 employees, of which 56 are actively technology specialist, played a substantial Jeff O’Dell will join Rudolph’s board of engaged in the area of R&D. The company is role in the efforts that turned research results directors, and August CFO Stan Piekos will privately held and based in Switzerland. into marketable products. Former partner become Rudolph’s chief corporate XEMICS applies its low-power, low-voltage companies, consultants and industry insiders development officer. The company’s board design expertise across its core technologies: are supporting the MBO. will increase to 12 people, including eight sensor interfacing/data acquisition, 8-bit RISC microcontrollers, RF transceivers and Andreas Roepert will assume the role of members from Rudolph, three members audio codecs. CEO, and Awa Garlinska will chair the from August, and one additional board supervisory board. All the people serving member to be jointly appointed. XEMICS was established in 1997 as a in Interactive Wear’s management have August’s merger with Rudolph comes spin-off of the Swiss Center for Electronics either been in contact with Infineon (or after months of considering the pros and and Microtechnology (CSEM). CSEM, Siemens, before it spun off Infineon) for cons of several suitors that have been vying which is funded by both government and many years or have served as executives in for the equipment company. August signed industry sources, carries out applied research that company. a merger agreement with metrology and product development. XEMICS works closely with CSEM on commercializing new Stefan Jung, the former head of company Nanometrics in January, which technologies and expects to continue to do so Infineon’s activities in this field, has been was followed by an unsolicited takeover after the acquisition. appointed to Interactive Wear’s supervisory attempt by Rudolph one week later and an board, and the company will also employ offer by KLA-Tencor in February to In CY 2004, XEMICS generated net additional members of Infineon’s technical purchase August for $11.50 per share. sales of about $23 million, mostly from team. August paid a termination fee of $8.3 custom and standard IC products for battery- Contacts: million, plus expenses, to Nanometrics. powered applications, remote metering, Andreas Roepert, Interactive Wear CEO; Tel: embedded systems and medical devices. 08153-2819-45; www.interactive-wear.com August said it was concerned that an Gross margin during this period was 48%. August/KLA-Tencor transaction would Dominik Asam, Infineon corporate VP for Contacts: strategy, investor relations and mergers & involve significant antitrust risk, including Jason Carlson, Semtech president and CEO; acquisitions; Tel: 49 89 234 0; a lengthy investigation by the Department Tel: 805 498-2111; www.semtech.com. www.infineon.com. of Justice. Alain Dantec, XEMICS CEO; Tel: +41 32 729 4000; www.xemics.com.

July 2005 Page 5 InsideChips.Ventures

JDS Uniphase Acquires will serve as president and CEO of the savings over current infrared vision Photonic Power Systems combined company, and Hock Tan, ICS technology in part because its platform can president and CEO, will assume the role of transform virtually any standard commercial JDS Uniphase has acquired Photonic chairman of the board. Tan will also have an camera into a thermal camera. This ability Power Systems, a fabless semiconductor executive role in the integration of ICS with enables manufacturers to build on top of the company providing GaAs and InP-based IDT. The board of directors of the combined hundreds of millions of commodity CMOS/ solutions for delivering electrical power company will have nine members, with IDT CCD sensors that are produced annually over fiber for electronic applications. All designating five directors, including Lang, and to take advantage of the large, ongoing eight of Photonic Power Systems’ and ICS designating four directors, including industry investments to improve these employees, currently located in Cupertino, Tan. sensors’ performance and reduce their cost. Calif., will transition to JDSU’s corporate For the twelve months ending March 31, Originally developed at Princeton offices in San Jose. The group will form the 2005, the combined company had revenues University and further commercialized by nucleus of JDSU’s Photonic Power Business of approximately $645 million and Aegis, RedShift’s core technology is mature Unit, led by Jan-Gustav Werthen. The generated $86 million in operating cash — the Aegis technology from which it was companies did not disclose financial details flow. The combined company will retain born is now operating in major of the transaction. the IDT name and its stock will continue to telecommunications platforms — and may Photonic power is an inventive power trade on the Nasdaq national market under be manufactured using standard processes delivery system whereby light from a laser the ticker symbol “IDTI.” The merged in volume foundries. source illuminates a highly efficient company will be headquartered in San Jose, Matthias Wagner, co-founder of Aegis photovoltaic power converter to produce Calif. Semiconductor, has left Aegis to lead electrical power. It is a novel approach to Based on the most recent capitalization, RedShift Systems as its CEO. Wagner had power delivery in specialty applications. current IDT stockholders will own served as CEO of Aegis until February, Photonic power replaces copper and approximately 54% and current ICS when he handed off that post to Donald batteries for remote sensors, coaxial cable stockholders will own approximately 46% Bossi, who previously held a number of in wireless applications, and oil or gas- of the combined company. The companies senior management positions at JDS filled measurement transformers in high- expect the transaction to be completed in Uniphase. voltage applications. It delivers isolated fall 2005. Aegis co-founder and CTO Eugene Ma power that is immune to RF, EMI, high Contacts: has also joined RedShift, where he will voltage and lightning. Photonic Power Greg Lang, IDT president and CEO; Tel: 408 assume the same position. Systems has deployed more than 10,000 727-6116; www.idt.com. units to date, serving more than 50 Hock Tan, ICS president and CEO; Tel: 610 (See our profile of Aegis Semiconductor customers. 630-5300; www.icst.com. in the Dec. 2004 issue of InsideChips.Ventures.) Contacts: Aegis Spins Off Redshift Systems David Gudmundson, JDSU VP of corporate Contact: development; Tel: 408 546-5000; Aegis Semiconductor, a supplier of Matthias Wagner, RedShift CEO; Tel: 781 www.jdsu.com. wavelength monitoring and control 672-2660; www.redshiftsystems.com. Jan-Gustav Werthen, Photonic Power solutions, has spun off RedShift Systems, Systems founder and CEO; Tel: 408 725- Tehuti Networks Secures 7597; www.photonicpower.com. which will enable low-cost and high- performance thermal imaging solutions for $4.2 Million in Series A Funding IDT, Integrated Circuit mass markets. Aegis has provided seed Tehuti Networks, a semiconductor Systems to Merge financing to RedShift. company providing TCP/IP acceleration Integrated Device Technology (IDT) RedShift’s core technology enables processing for enterprise IT environments, and Integrated Circuit Systems (ICS) have manufacturers to include high-quality has completed a $4.2 million Series A signed a definitive agreement to combine thermal imaging capability in a wide variety financing round. New investor Alice the two companies in a strategic merger. of products, but at one-tenth the cost of Ventures led the round, which included Under the terms of the merger agreement, existing solutions. RedShift expects this previous investors Alice Lab and ProSeed which has been unanimously approved by price performance will not only position the Venture Capital Fund. In addition, the Chief the boards of directors of both companies, company to disrupt an established $2 billion Scientist of the Government of Israel ICS stockholders will receive 1.3 shares of market for military, firefighting and contributed funds. IDT common stock and $7.25 of cash for industrial thermal imaging, but also open Tehuti develops SOCs for accelerating each share of ICS stock. Based on closing up new markets for thermal imaging in TCP/IP processing. The company is prices as of June 15, 2005, this total price-sensitive markets such as automotive developing network traffic accelerator consideration values ICS at approximately safety, law enforcement, and video (NTA) chips that increase system $1.7 billion, or $23.54 per share. surveillance. performance up to five times, relieving the Greg Lang, IDT president and CEO, RedShift can offer such significant cost bottleneck that occurs as the speed in

July 2005 Page 6 InsideChips.Ventures

Ethernet networks increases faster than Tharas Secures have gone public or have been acquired, computer processor speeds. With no cost- $5.5 Million in Funding including AsiaInfo Holdings, a telecom adder over conventional, lower- software supplier; Chinacast performance implementations, Tehuti’s EDA startup Tharas Systems has raised Communications Holding Ltd., a total low-power chips are transparent to the $5.5 million in new venture capital funding. solution service provider for remote operating system and move specifically El Dorado Ventures led the financing round, education; Sohu.com, an Internet portal; selected TCP/IP processing functions from which included current investors NeoCarta Techfaith Holdings Ltd., an independent software onto hardware, redistributing Ventures; Alliance Venture Management; cell phone design house; and UTStarcom, a functions to remove TCP bottlenecks and Andy Bechtolsheim, co-founder of Sun telecom equipment manufacturer. reducing latency. Microsystems; and Tharas board member Examples of current Intel Capital Prabhu Goel. (See our profile of Tehuti in the Jan. investments in China include BCD 2005 issue of InsideChips.Ventures.) Founded in 1998, Tharas develops Semiconductor Manufacturing, an analog Contact: design verification appliances that lead to a power IC design and manufacturing Arie Brish, CEO; Tel: 972-9-951-4180; significant shortening of the overall company; Comlent Holdings, an RF chip www.tehutinetworks.com. verification cycle of complex ICs and maker; HiSoft Technology International, a electronic/embedded systems. The software outsourcing company; Maipu Agere Sells RF LDMOS Transistor company’s recently introduced Hammer S- Holdings, a router and data communications Portfolio to Peak Devices Class and M-Class product families company; and Pollex Mobile Holdings, a RF Transistor manufacturer Peak incorporate a patented, multi-core, custom- cellular phone software applications Devices has acquired Agere Systems’ RF processor hardware-assisted engine provider. Power LDMOS portfolio, including the developed by Tharas for use in Verilog- and Contact: production wafers, die, packages, lids and VHDL-based SOC and embedded system Arvind Sodhani, Intel Capital president; Tel: select specialized assembly equipment for verification. 408 765-8080; www.intel.com/capital. the manufacture and support of transistors Contact: Clear Shape Technologies Closes that produce more than 10 watts of RF Rahm Shastry, president and CEO; Tel: 408 Series B Financing Round power. 855-3200; www.tharas.com. LDMOS (laterally diffused metal oxide Intel Establishes $200 Million Clear Shape Technologies, a semiconductor) is a semiconductor China Venture Fund semiconductor design for manufacturing technology that produces exceptional RF (DFM) software and technologies startup, Intel has established a $200 million performance at frequencies up to 3 GHz, has raised more than $5 million in its second venture capital fund to invest in Chinese relative to traditional silicon device round of venture financing, bringing total technology companies developing technologies such as bipolar and VDMOS funding to more than $10 million. Intel innovative hardware, software and services. (vertically diffused metal oxide Capital led the most recent round, which Intel expects the Intel Capital China semiconductor). The LDMOS also included KT Venture Group (the Technology Fund to stimulate local semiconductor has the added benefit of investment partner of KLA-Tencor). Early technological innovation and accelerate low-cost packaging, as it does not require in 2004, U.S. Venture Partners led the Series technology adoption locally. an insulator between the semiconductor and A financing with participation from Telos the package in which it is encapsulated. The Intel Capital China Technology Ventures and AsiaTech Management. Fund will be used to invest in companies Founded in 2003 by a veteran team of The acquisition marks the completion that complement Intel’s technology experts in the semiconductor manufacturing Agere’s plan to divest its RF power-related initiatives and to further build out the Internet and EDA industries, Clear Shape assets. In April, Ciclon Semiconductor infrastructure in China. The fund will also Technologies develops design for Device, a developer of high-frequency provide local businesses with capital to manufacturing (DFM) software and LDMOS products, acquired the RF LDMOS help nurture important technologies and technologies that detect potentially product line of Agere Systems. products developed in China. Examples of catastrophic manufacturing failures during Both acquisitions are part of Agere’s initial focus areas include cellular design, improve yield, and enable designers plan to focus resources on core technologies. communications, broadband applications to control, manage and optimize the impact Contacts: for consumers, and semiconductor design. of systematic variation on chip performance, William McCalpin, Peak Devices CEO; Tel: Intel Capital, which has investment signal integrity, and leakage power while 720 406-1221; www.peakdevices.com protecting manufacturing IP. Carlos Garcia, Agere VP of marketing for managers based in Hong Kong, Shanghai Telecom division; Tel: 610 712-4323; and Beijing, made its first strategic Contact: www.agere.com. investment in China in 1998 and has since Atul Sharan, Clear Shape president and invested in close to 50 Chinese companies CEO; 408 833-7130; www.clearshape.com. across nine cities in mainland China and Hong Kong. Eleven of these companies

July 2005 Page 7 InsideChips.Ventures

MOSAID Withdraws Offer As a result of the two transactions, Winbond first acquired 54% of Nexflash to Acquire TriCN Flextronics will receive an aggregate upfront stock in Jan. 2001. With this acquisition of cash payment in excess of $550 million plus the remaining 46% of Nexflash stock, After signing a non-binding letter of intent additional deferred and contingent payments Winbond will now own 100% stock shares to acquire the assets of TriCN for $3.1 million and a 30% ownership stake in the merged of NexFlash. in May, MOSAID Technologies has decided network services company. Flextronics NexFlash Technology primarily focuses that, as a result of due diligence, it will not expects both transactions to close before on flash memory technology and related proceed with the acquisition. the end of the Sept. 30 fiscal quarter. products. It owns a variety of patents for TriCN filed for protection under Chapter Flextronics intends to concentrate its high-density data flash and code flash 11 of the United States Bankruptcy Code on efforts and resources on the core EMS products. NexFlash has a full spectrum of Dec. 30, 2004. business, which includes design, vertically serial flash products ranging from 2 MB to Founded in 1997, TriCN is based in San integrated manufacturing services and 32 MB capacities. These products are all Francisco, Calif., and is a developer of logistics. manufactured by Winbond’s 0.18-micron high-performance semiconductor interface Contacts: WinStack process technology in Winbond’s IP products. Michael Marks, Flextronics CEO; Tel: 408 8-inch fab. 576-7000; www.flextronics.com. Contact: Harald Mix, Altor CEO; Tel: +46 8 678 91 With serial flash memory’s low cost Peter Gillingham, VP and GM of IP Division; 00; www.altor.com. advantage, the technology trend for low- Tel: 613 599-9539; www.mosaid.com. Christine King, AMIS president and CEO; density flash has gradually moved from Tel: 208 233-4690; www.amis.com. parallel flash memory toward serial flash Flextronics Selling Network memory. The acquisition enables Winbond Services and Semi Groups ChipMOS Taiwan and Chantek to provide total solutions for its customers. Agree to Merge Flextronics has signed separate Winbond also named Arthur Y. C. Chiao agreements for the sale of Flextronics ChipMOS Technologies and Chantek as chairman and CEO of the company, C.C. Network Services (FNS) and Flextronics Electronic, a subsidiary 68% owned by Chang as vice chairman and deputy CEO, Semiconductor. ChipMOS, have agreed to merge in a stock- and I.S. Hsu president and COO (effective As previously announced in May, FNS for stock transaction. Aug. 1). will merge with Telavie, a company wholly Under the terms of the merger agreement, Chang, who took over the presidency in owned by Altor 2003 Fund, a Nordic private Chantek will be de-listed from the Taiwan Jan. 1999, led Winbond into the specialty equity firm. Under the terms of the GreTai market and merged into ChipMOS DRAM business. As vice chairman and agreement, Flextronics will receive an Taiwan, with ChipMOS Taiwan as the deputy CEO, he will continue to assist in the upfront cash payment, deferred and surviving entity. Chantek stock will be management of the company’s operations, contingent payments, and will also retain a exchangeable for ChipMOS Taiwan stock and he will also be in charge of technology 30% ownership stake in the merged at the ratio of 3.6 to 1. Shareholders of development, knowledge/MIS management company. FNS, a global network services Chantek may elect to receive cash payment and financial management. provider, has annual revenues of of approximately $0.19 per Chantek share approximately $770 million. Telavie, a in lieu of shares of ChipMOS Taiwan. Hsu has held various positions at Scandinavian network services group, has ChipMOS expects to close the merger on Winbond, including the director of the annual revenues of approximately $230 Nov. 1, 2005. Personal Computer Business division, the million. The merged company will employ sales AVP and VP, and the VP of the logic ChipMOS is an independent provider of nearly 10,000 people throughout 18 business group. semiconductor testing and assembly services countries with total revenues of Contact: primarily to customers in Taiwan, Japan, approximately $ 1 billion. C.C. Chang, vice chairman and deputy CEO; and the U.S. The company has advanced Tel: 886-3-5770066; www.winbond.com. In a separate agreement, Flextronics will facilities in Hsinchu and Southern Taiwan sell its semiconductor division for cash to Science Parks in Taiwan and in Shanghai, HelloSoft Completes $16 Million AMIS Holdings, parent company of AMI China. Series B Financing Round Semiconductor, for $135 million in cash. Contact: HelloSoft, a supplier of signal- Flextronics Semiconductor specializes in S.J. Cheng, ChipMOS CEO; Tel: 886-3-577- processing technology and software-defined custom mixed-signal products, imaging 0055; www.chipmos.com.tw. radio (SDR) solutions, has closed an sensors and digital ASICs, including FPGA oversubscribed $16 million series B conversion products. The proposed sale, Winbond Acquires financing. Boston-based TD Capital structured as an asset purchase agreement, NexFlash Technology Ventures led the round, which included new includes these three divisions, which Winbond Electronics has acquired 46% investors Mitsui & Company Venture collectively employ approximately 200 in stock shares of NexFlash Technology via Partners and Entrepia Ventures, and current people in the United States, the Netherlands Winbond’s wholly owned overseas investors Venrock Associates, Sofinnova and Israel. subsidiary, Winbond International.

July 2005 Page 8 InsideChips.Ventures

Ventures and Jump Startup. related to the applications, support and 53.4% to 58.7%. LanOptics’ business manufacturing of the CCD-i product line to consists exclusively of the business of Headquartered in San Jose, Calif., TEL. Therma-Wave supplied CCD-i EZchip, a company that is engaged in the HelloSoft is a pioneer in VOIP solutions systems to TEL through the end of the first development of high-performance network and maintains a WLAN and cellular IP quarter of fiscal year 2006, ended July 1, processors. portfolio. The company’s solutions enable 2005. As a result of this transaction, Therma- cost-efficient mass deployment of multi- LanOptics will acquire 3,611,243 Wave will remove $5.65 million in mode mobile communications devices for EZchip shares held by certain investors, in previously received orders from TEL for the converged market place. The company exchange for the issuance of 1,006,486 CCD-i products and services from the also has an R&D facility staffed with more LanOptics shares. The exchange ratio was company’s backlog. than 100 DSP engineers in Hyderabad, India. determined based solely on the parties’ Contacts: Contact: respective holdings in EZchip. As a result Boris Lipkin, Therma-Wave president and Krishna Yarlagadda, CEO; Tel: 408 441- of the exchange ratio mechanism, the CEO; Tel: 510 668-2200; 7110; www.hellosoft.com. www.thermawave.com. economic interest of each LanOptics Hikaru Ito, TEL VP and GM of Clean Track shareholder should remain unchanged picoChip Secures $20.5 Million Business Unit; Tel: 03-5561-7000; despite the resulting dilution in each in Third-Round Funding www.tel.com shareholder’s percentage of ownership. Wireless silicon solutions provider SCP Sells Single-Wafer Clean This transaction represents another step picoChip has secured $20.5 million in its Technology to Applied Materials in LanOptics’ long-term plan to acquire third round of funding. New investor Scottish 100% ownership of EZchip, authorized by Equity Partners led the round, which also SCP Global Technologies is selling its LanOptics’ shareholders in April 2003. included Rothschild and Intel Capital, along single-wafer cleaning technology and LanOptics will seek to further increase its with previous investors Pond Venture related IP for an undisclosed amount of holdings in EZchip by pursuing similar Partners and Atlas Venture. The round money to Applied Materials. The acquisition exchange agreements with other EZchip brings total company funding to $41.5 includes SCP’s single-wafer HF-last shareholders. million. immersion technology and Marangoni clean/ Contact: dry IP. Marangoni clean/dry technology is Founded in 2000, Bath, England-based Eli Fruchter, LanOptics president and CEO; an industry standard for 65-nm-and below picoChip developed a scalable, multi- Tel: +972-4-959-6644; www.lanoptics.com. wet clean processing. processor baseband IC that combines the Innovative Silicon Secures computational density of a dedicated ASIC The transaction is SCP’s first step in $16 Million in Series B Funding with the programmability of a traditional establishing its new strategy as a services high-end DSP. Equipment based on company to the wafer wet cleaning Innovative Silicon, the developer of Z- picoChip technology will enable telecom equipment industry. The initial focus will RAM zero-capacitor DRAM embedded operators to remotely re-configure and be on the extensive installed base of tools memory technology, has closed its $16- upgrade their equipment without the high SCP has sold to its customers globally. million series B round of investment. New costs of replacing obsolete hardware. Services will include upgrades to enhance investor Austin Ventures led the round, performance, spare parts, repairs and onsite which included existing investors Index (See our profile of picoChip in the Aug. maintenance contracts. Ventures, Auriga Partners and SOI specialist 2002 issue of InsideChips.Ventures.) SCP has an extensive IP portfolio it uses Soitec. Innovative will use the financing to Contact: expand sales and marketing initiatives for Guillaume d’Eyssautier, president and CEO; in its own equipment, as well as licenses to Tel: +44 (0)1225 469744; other manufacturers of surface cleaning its ultra-high-density memory technology. www.picochip.com. products. Founded in 2002, Innovative Silicon has developed a new kind of memory technology Therma-Wave Sells Integrated Contacts: Keith O’Leary, SCP executive VP and CFO; that can achieve five times the density of Metrology Module to TEL Tel: 208 685-5000; www.scpglobal.com. embedded SRAM and twice the density of Therma-Wave, a developer of process John T.C. Lee, Applied Materials GM of embedded DRAM while using a standard Cleans Product Group; Tel: 408 727-5555; control metrology systems used in www.appliedmaterials.com. SOI logic process. Z-RAM harnesses the semiconductor manufacturing, has entered floating body effect of SOI semiconductors into an agreement to sell its Compact Critical LanOptics Increases Equity to store the charge in the body of the transistor Dimension-integrated (CCD-i) product to Interest in EZchip Technologies and eliminate the capacitor. Tokyo Electron Limited (TEL) in a cash Network processor provider LanOptics (See our profile of Innovative Silicon in transaction valued at approximately $9.95 has entered into an exchange agreement the June 2005 issue of million. under which it will increase its ownership InsideChips.Ventures.) The transaction includes the transfer of interest in the outstanding share capital of Contact: certain tangible assets, IP and personnel its EZchip Technologies subsidiary from Mark-Eric Jones, president and CEO; Tel: 408 350-0494; www.z-ram.com.

July 2005 Page 9 InsideChips.Ventures Analyzing the Analysts

NAND Grew Faster than Any Other SEMI Reports 20 New Fabs Semiconductor Market in 2004 to be Built in China by 2008 According to a new report by Semico Research, NAND was the According to a new market research report from SEMI, new fastest-growing market in the semiconductor arena in 2004. semiconductor equipment sales in mainland China reached $2.73 Revenues jumped a whopping 80% to $7.2 billion. Even so, billion in 2004, used/refurbished equipment sales reached an NAND continued to trail NOR, which ended 2004 at $9.1 billion. estimated $180 million, fab materials sales totaled $391million, These two flash technologies lead the nonvolatile market, combining and the packaging materials market reached $781 million. to account for 91% of all nonvolatile memory revenues. ROM, The report, entitled, “China Capital Equipment and Electronic EPROM, and EEPROM revenues each accounted for less than $1 Materials Market Outlook,” points out that while China’s billion in revenues. semiconductor manufacturing is a relatively small share of the Samsung led the pack in total nonvolatile as well as in NAND, world total, 20 new fabs are expected to be built in China between owing to its dominant 54% share of NAND revenues. The company 2005 and 2008, many of which will be equipped with used and was able to take $2 billion of the $3.2 billion growth in 2004’s refurbished equipment. NAND market. Spansion displaced Intel for leadership in NOR, Furthermore, the number of silicon wafers consumed in China despite Spansion’s eroding share toward the end of the year. increased dramatically, while the first 300-mm fab began pilot Macronix, Oki, and Atmel took the top spots in ROM, EPROM, production in 2004. and EEPROM, respectively. The report identifies semiconductor market trends and forecasts The size of the NAND market came as something of a surprise for the markets in China for equipment, fab materials, packaging to Semico, as WSTS reported lower revenues for the same year of materials and indirect materials. Some of the key findings include: only $6.5 billion. Semico verified its findings with market participants to ascertain the accuracy of the survey’s findings, and • Installed 200-mm and 300-mm wafer capacity at the end of the larger number was confirmed. 2004 was equivalent to 106 million square inches (MSI) per year. Contact: • Many of the 150-mm (and smaller diameter) fabs have been Jim Handy, director of Nonvolatile Memory Service; Tel: 602 997- 0337; www.semico.com equipped with used or refurbished equipment. Chinese companies have lobbied the government to invest in 802.15.4 Market Could Grow 200% by 2009 • R&D for high-end tools. The market for 802.15.4, a wireless personal area networking (PAN) technology, and the ZigBee specification network layer, • The local supply chain remains immature because of financial/ are poised for skyrocketing growth, reports In-Stat. On an aggressive capital considerations and current limitations with locally available basis, 802.15.4 nodes/chipsets could grow by a compound annual skilled talent; some multinationals are cautious about working with growth rate (CAGR) of 200% from 2004 to 2009, with annual local companies because of intellectual property concerns. shipments surpassing 150 million units in 2009. • China is home to more than 35 domestic, joint venture and In December 2004, the ZigBee Alliance completed a major multinational semiconductor manufacturers with wafer-fabrication milestone -- final signoff of the ZigBee 1.0 specification. Even plants. considering proprietary competition, the benefits promised by • There are approximately 200 assembly and test companies, 20 802.15.4 and ZigBee standardization still hold true. Although multinational packaging materials suppliers, and 40 domestic standardization takes longer, a major advantage of 802.15.4 and manufacturers of equipment for the semiconductor and related ZigBee is that they provide OEMs with a menu of multiple silicon microelectronic industries in China. sources and ZigBee networking layer suppliers. Additional advantages include pricing competition and system vendor SEMI is selling the report for $3,000 (SEMI members/single partnering opportunities. user), and $4,000 (non-members/single user). Commercial building control is expected to capture the lion’s Contact: share of the 802.15.4 market, in terms of node/chipset volumes, SEMI; Tel: 408 943-6901; www.semi.org. but not design wins. InStat also expects that, together, system-in package (SiP) and system-on-chip (SOC) solutions will drive Table 2 — Estimated silicon wafer consumption in easier system/product development and lower the costs of adding China (annual wafer consumption) this wireless capability to sensor networks. Percent Diameter 2003 2004 The report, “802.15.4 SoC and SiP Surge as ZigBee Faces Growth Residential Competition,” is priced at $2,995. 100 mm or smaller 2,250,000 2,750,000 22% 125 mm 880,000 1,150,000 31% Contact: 150 mm 1,610,000 2,780,000 73% Joyce Putscher, director of converging markets & technologies; Tel: 200 mm 860,000 1,700,000 98% 480 483-4475; www.instat.com.

July 2005 Page 10 InsideChips.Ventures Emerging Ventures

Nethra Imaging to request that the sensor guys remove the (in some versions) in an 8-mm-square chip- image processing from the sensor. One kind scale package with 1.0- to 1.2-mm mounted Founded by former MediaQ executives, of emerging architecture, from companies thickness. System peripherals include pulse- Nethra Imaging is developing digital camera such as Qualcomm, Texas Instruments, width modulators, general-purpose input- chips intended to take cameras embedded nVIDIA and ATI Semiconductor, involves output devices and serial peripheral in phones to 3 megapixels. The company’s integrating the image-processing interfaces. objective is to provide imaging solutions functionality into their applications The NI-2080 and NI-2090 products have for phones and other mobile devices that processor or applications/baseband 8 MB and 2 MB, respectively, of integrated are as high quality as digital SLR cameras. processor. SDRAM, and the NI-2070 supports external Two MediaQ alumni, Ramesh Singh Nethra is pursuing a different SDRAM. However, Nethra does not believe and Murty Bhavana, co-founded Nethra architecture, in which a discrete image these three will be very high volume; the with Ravi Bhatnagar in late 2003. Singh, processor is embedded into the module or bread and butter for the company will be the who serves as president and CEO, was most sits on the main system board. The NI-2060, which does not include any recently VP of sales at NVIDIA. He joined company’s solution works with both CMOS SDRAM support in the package. NVIDIA through the acquisition of MediaQ, and CCD sensors. High-end digital still camera features in which he founded and where he served as the NI-2060 include: president and CEO and VP of sales. Prior to Although Nethra’s solution adds an founding MediaQ, Singh was the GM of the additional chip, a big advantage is that it • Auto white balance and auto exposure; Home Products Division (3D graphics eliminates the problem of software products) at S3, and he also held positions integration – which is significant, as the • Programmable lens shading with Chips & Technologies and Rockwell software integration challenge increases as compensation; Collins. functionality increases. Nethra’s architecture has an on-board CPU, • Adaptive low-light performance; and Bhavana, VP of marketing, was embedded flash, and optional integrated • Histogram and statistical engine. previously the director of marketing for SDRAM. The company’s products embed MediaQ and director of marketing at software needed to tune the picture quality The NI-2060, 2080 and 2090 are all pin- NuCORE Technology. He has also worked and system control in the embedded flash, compatible, enabling handset OEMs or as a consultant in the imaging industry, essentially limiting the OEMs’ integration module vendors to design a single platform where his clients included early-stage time to testing. or module and drop in the three different companies, such as Pixim (image sensors) parts for different price points. and Atsana (application processors). Nethra’s target space is mid-market to high-end phones that have the ability to Nethra also sells a bare-die version, the Bhatnagar, senior VP of engineering, produce print-quality images. This rules NI-2050, which primarily serves as a was senior VP of business development at out “give-away” phones, the basic phones replacement for NI-2060 designs in which NeoMagic. He came to NeoMagic through subsidized by carriers and provided to a thinner form factor is required. the acquisition of LinkUp Systems, which customers; those phones will continue to To compensate for any problems he founded and where he served as the employ the current integrated sensor/image- associated with the optics, Nethra employs president and CEO. Prior to LinkUp, processing architecture, which is correction algorithms that are sufficiently Bhatnagar was the VP of engineering for inexpensive, or the emerging architecture flexible and programmable to support any the Personal Systems Division at Cirrus discussed above in which image-processing kind of optics technology. In fact, an OEM Logic and VP and GM of the New Products functionality is integrated into the that was originally planning to go to market (microprocessor) and Systems Logic applications or applications/baseband with a CCD sensor can now consider the Divisions at Chips and Technologies. processor. possibility of using a CMOS sensor. Nethra Nethra, which means human eye in Nethra-enabled phones will be premium is not claiming it can make CMOS sensors Sanskrit, closed its second round of funding products that must provide print quality look as good as CCDs, but it maintains that in Nov. 2004, which brought the total images and no-compromise image its advancements have helped to bridge the funding raised so far to $10.5 million. processing. The company’s market begins gap. Today, CMOS image sensor vendors with phones for which carriers charge a $50 Nethra’s potential customers are split build the image processor into the sensor as or $100 premium, and goes all the way up to between module vendors and handset a monolithic system. As camera phones PDA-type phones. OEMs. While “candy bar” phones typically advance to 2 and 3 megapixels, however, Nethra’s first product line is the NI- integrate the image processor on the system space constraints prevent the sensor from 20x0 family of SOCs, which include an board, flip phones typically have the camera scaling up further, with the result that the image-processing engine, 32 KB of SRAM, embedded on the flip side and represent a quality of the image processing decreases. 64 KB of embedded flash memory, an module play. Handset makers, therefore, are starting embedded ARM7TDMI core and SDRAM Nethra is currently focused primarily on

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the module developers, which tend to be on at MediaQ’s Tokyo office. He has also generation consumer electronics, which led shorter design cycles. However, to get into worked at Cirrus Logic and TI. to the spin-off of Avio Digital as a separate certain key designs requires the company to Contact: company. get its chips onto the system board, and (Headquarters) Ramachandran, who serves as director Nethra is working with OEMs and existing Nethra Imaging of microelectronics, was design manager at partners to stack its die inside a packaged 10710 North Tantau Ave. Avio Digital. He held the same position at part from the partner vendor. Cupertino, CA 95014 Centillium after that company acquired Several other companies are also Tel: 408 257-5880 Avio. At National Semiconductor, he working on chipsets with a similar kind of Fax: 408 257-0882 managed the company’s IP reuse Web: www.nethra.us.com. discrete image processor architecture. methodology team and designed a co- SunPlus, WinBond and NEC, for example, (Japan office) processor for ARM-based systems. He supply just the image processor. Nethra Imaging began his career at LSI Logic. Room # 603, MTekVision and Texas Instruments, as with Ron Abruzzese and Suresh Ram round Nethra, are developing image processor + Welt Nihonbashi Bldg, Higashi-Nihonbashi 1-5-2, out the management team as VP of sales and CPU architectures. Nethra maintains that Chuo-ku, Tokyo 103-0004 director of product marketing, respectively. the amount of detail its image processor Abruzzese most recently spent seven years technology can pick up is far superior to Tel: 03-3861-2320 at Winbond Electronics America, where he Fax: 03-3861-2320 these competitors. was VP of sales. He began as an IC design Nethra’s management team includes Phil Optichron engineer at Texas Instruments, followed by Barnes as VP of sales. Barnes is a 25-year several years as a digital systems design industry veteran with engineering, marketing Optichron is a Fremont, Calif.-based engineer at the Raytheon Company. He has and sales experience at large corporations startup pioneering a new approach to also worked at TRW Electronics, Integrated such as LSI Logic, Cirrus Logic and Toshiba nonlinear signal processing for Device Technology and Pericom Electronics, as well as smaller organizations communications applications. Based on a Semiconductor. proprietary architecture, the company’s and startups such as Headland Technology During more than 10 years at National and MediaQ. linearization IC is the silicon engine at the heart of a line of high-speed nonlinear signal- Semiconductor, Ram served as marketing Ping Wah Wong, VP and chief imaging processing modules. manager for both the ADC and analog scientist, previously managed a research front-end product lines. He also held team at Hewlett-Packard Laboratories that Roy Batruni, Tim Ryan and Ravi engineering and management developed imaging algorithms and pipelines Ramachandran founded Optichron in Jan. responsibilities for quality assurance, for HP products. At HP’s Internet Imaging 2003. Batruni, who serves as CEO, began failure analysis and reliability for a number Organization, he managed a software team his career at National Semiconductor, of National’s product lines. that built imaging servers for multiple Unix where he spent 15 years in the company’s Optichron has raised two rounds of and Windows platforms. Telecom and Mass Storage groups. His last position there was director of the DSP funding. Its series A round came in two Surin Chowdhury serves as director of Group. After National, he worked at tranches; The $2 million tranche A1 came operations. Prior to joining Nethra, startups ControlNet and Enable in Dec. 2002 from U.S. Venture Partners, Chowdhury served as director of engineering Semiconductor. Later, Batruni served as which wanted to get the company off and at Platys Communications. After Adaptec VP of engineering for Avio Digital, running quickly. Tranche A2, for $7 million, acquired Platys in 2001, he set up a physical acquired by Centillium Communications. closed with TL Ventures and design team at Adaptec’s engineering At Centillium, he held the same title and VentureTechAlliance in June 2003. Battery subsidiary in Hyderabad, India. Chowdhury was responsible for the development of Ventures led the March 2005 $17 million was also director of multimedia engineering high-performance ADSL products. series B round, which included all of the A- operations at Sierra Semiconductor and round investors. operations manager at VLSI Technology, Ryan, the company’s director of systems engineering, previously co-founded Avio The company has not yet burned through and has held engineering manager roles at its initial $9 million investment, and expects National Semiconductor and AMI. Digital in 1998, serving as its principal systems architect until Centillium the latest series B round to last for two to Srini Amble, director of software Communications acquired the company. At two-and-a-half years. Optichron has 18 engineering, has worked for AT&T Bell Centillium, he managed development of employees, which will likely grow to about Labs, Fujitsu and several startups. customer premises equipment (CPE) 25 before the end of year. Katz Hanazaki, director of business products. Earlier in his career, he was a The problem Optichron is solving, development, Japan, was previously senior member of the research staff at Interval nonlinear distortion, is a form of signal- manager of the handheld division at Research Corporation, a Paul Allen-funded processing error that creates signals at NVIDIA’s Japan office. Prior to NVIDIA’s think tank. At Interval, Ryan worked on frequencies not present in the input and acquisition of MediaQ, Hanazaki was GM digital media networking and next- occurs when the output signal does not have

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a linear relation to the input signal. The new conversion stage, because the Turbolinear Xceive frequencies may be “harmonics,” which module can sample the signal at much exist at frequencies that are integer multiples higher frequencies and, according to the In the past, multi-standard TV tuners of the tones present in the input signal. An company, provide an output that is more were not especially important to TV everyday example of nonlinear distortion is linear than the use of a regular ADC in the manufacturers, which typically employed a concave or convex mirror, in which the 50-MHz range. different tuners for the world’s different image is a nonlinear rendition of the reflected regions and standards. But these days, TV Another initial market focus is automated object. makers not only have different analog test equipment, where linearity is important standards they have to address, they must In an electronics system, the output of just for its own sake. Optichron can enable also deal with the various digital standards signals traversing an amplifier, for example, these equipment vendors to build higher- adopted around the world. Xceive has or analog-to-digital converter (ADC) is performance systems with a 90-db linearity developed a single-chip multi-standard TV contorted in a way very similar to a concave spec, for example, as opposed to a 60-db tuner that will enable Asian TV products or convex mirror reflection. The resulting spec. manufacturers for worldwide markets to harmonics reduce bandwidth and Other ADC module applications include: standardize on one chip. performance. Multi-channel, multi-mode receivers; Founded in July 2001, Xceive is a 30- However, nonlinear distortion is • person company with a core team of deterministic, so with the right math and • Base transceiver stations; engineers that have worked together more technology it can be canceled. Optichron than 10 years. The company has raised $28 developed a new mathematical language • Medical imaging; million dollars over three rounds of funding that is the basis for its Turbolinear • Communications instrumentation; since inception, including a $13.5 million technology, which eliminates nonlinear June 2005 series C round led by new distortion in many signal-processing Test and measurement; • investor Sequoia Capital. Alliance applications. • Scientific instruments; and Ventures provided the $4 million series A Optichron’s technology can address round, and was joined by Ignite Group and nonlinear distortion in a number of • Military radios. BA Venture Partner Investors for the series applications, but the company is focusing The company divides its target markets $10.5 million series B round. initially on ADCs. Optichron claims its into four segments: Small accounts, where Xceive is headquartered in Santa Clara, Turbolinear family of nonlinear signal- 6,000 or 7,000 customers buy between Calif., and the company recently opened a processing modules removes more than 90% 100 and 300 chips each per year from design center in Switzerland and a five- of the nonlinear distortion caused by not distributors; medium accounts, which are person office in China. Xceive expects to only the ADC, but the buffer amplifier as companies that buy in the range of 1000 turn the China office into a design center as well. chips per year; large accounts, represented well, although it will focus on applications The company’s first two Turbolinear by companies that purchase 25,000 to and system development as opposed to IC module products linearize ADCs from 50,000 chips annually; and OEMs that buy development. Analog Devices and Texas Instruments: 150K to 500K per year. Xceive’s two primary founders, both • OM1400A module: Incorporates While Optichron will never sell 20 from Switzerland, are Pierre Favrat and Optichron’s linearizer chip + 14-bit ADI million chips per year, the company’s space Alain-Serge Porret. Favrat, who is president AD6645 ADC + ADI 8351 amp. is one where the prices and margins are and CEO, was previously with the high. Advanced System Technologies group at • OM1400T module: Incorporates the The company is currently working on STMicroelectronics, where he was analog/ linearizer + 14-bit Texas Instruments two other data-converter ICs that are both at RF project leader for multimode cell phone ADS5500 ADC + Watkins-Johnson first silicon, as well as two chips not yet circuits. Earlier, he worked for Motorola Company AH22S amp. taped. Optichron will begin releasing more in its video design center in Geneva, Optichron’s target applications are details this fall. Swityzerland. typically systems in which the imperative Contact: Porret, the company’s VP of is performance, not cost. Designers of Optichron engineering, was with a startup in San wireless receivers in base stations, for 4221 Technology Dr. Jose, Calif., as principal engineer in charge example, currently must do several stages Fremont, CA 94538 of the system-level analysis of the of RF down conversion to get the signal Tel: 510 249-5200 company’s VHF/UHF tuner chips. Prior to between 0 MHz and 50 MHz so it can be Fax: 510 249-5201 that he was a technical manager at quantized by an ADC; at higher Web: www.optichron.com. Electronics Laboratory (LEG) at the Swiss frequencies, the nonlinearities are too high Federal Institute of Technology and had to quantize the signal. Optichron enables co-founded a software development designers to eliminate the entire RF down- company.

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Jordan Du Val joined Xceive in Jan. handheld devices. The chip is intended for include PVRs, DVD recorders, and laptop 2002 as VP of sales. He was previously DVBH, which is the digital mobile standard and desktop PCs. TV-enabled mobile president and CEO of SpotNet, a provider emerging in Europe. phones will also likely emerge as a decent- of two-screen interactive TV infrastructure size market over the next few years. Xceive’s technology is centered on two services. He also held management developments. The first is its active filter Xceive’s sales are split about 50-50 positions at TeleCruz Technologies, S3, and tracking filter technologies. A small between the XC2028 and XC3028, but it and was a founding member of the sales microcontroller inside the chip constantly expects sales of the XC3028 to continue and marketing team at Genesis Microchip. measures the signal quality throughout the growing due to the growth of digital TV Alvin Wong, VP of marketing, joined tuner pipeline and, as the signal quality platforms. Xceive in Dec. 2004. Wong was most changes, adjusts the parameters of the filters Xceive works with a number of system recently at Infineon Technologies, where for optimal performance. This is very chip providers on joint solutions, reference he was VP of marketing. Prior to that, he different from a traditional can tuner designs and manufacturing kits for various was with Philips Semiconductors in a architecture, in which the tuning parameters TV products. The company works with number of key leadership roles. are set once and then shipped out in a Conexant, for example, on joint designs Xceive developed a single-chip TV product. and reference designs for PC-TV add-in terrestrial/cable tuner that is not only The other significant aspect of Xceive’s cards, and with Pixelworks, Trident and capable of tuning to any standard on Earth, chips is the very high level of integration. Genesis on reference designs and it is also very small, possesses high image No external SAW filters or LNA is manufacturing kits for LCD TVs. Other quality and supports any form factor (LCD- necessary. Instead of a bank of SAW filters, engineering partners include LSI Logic, TV, PCTV, cell phone TV, USBTV, Xceive employs a bandpass filter, ADC Zoran, ATI and Micronas. plasma, etc.). and DSP to form the equivalent of a SAW A number of customers are now in The company is in production with two filter. The company claims it can achieve production ramp-up with Xceive’s chips. products, and has engineering samples of a an 80-db rejection, as opposed to the 50- These include Leadtek, which is developing third. The company’s first two products db rejection achieved by the typical SAW an Xceive XC2028-based PC-TV tuner are the XC2028 and XC 3028. The XC2028 filter. Xceive’s chips therefore provide a card, and AVerMedia, which is developing is a multi-standard analog tuner that very clean channel out to the demodulation a mini-PCI TV card also based on the supports all analog TV standard worldwide, back end. XC2028. Xceive is not yet disclosing other while the XC3028 supports worldwide The biggest market opportunity for customers. digital TV standards as well as analog TV Xceive is the TV market, a segment that is The main competitors in the silicon TV standards. growing as people upgrade from analog to tuner market are the incumbent IDMs, digital or hybrid (see Figure 4). In addition The third product, the XC3510, is a especially Philips. On a bill of materials to TVs, applications adopting TV tuners highly integrated digital TV receiver for (BOM) comparison between the Philips TDA8275 and the XC2028, Xceive looks pretty good. The Philips TDA8275, for example, is a two-chip set plus an HPF and Figure 4 -- Global TV market (millions of units) switch, and requires a much larger board 200 area. According to Xceive, a PCI tuner Analog Hybrid card based on the TDA8275 has a BOM of $2.05, while a card based on its XC2028 has a BOM of $0.30. 150 Contact: Xceive 2730 San Tomas Expressway Suite 210 Santa Clara, CA 95051 100 Tel: 408 486-5610 Fax: 408 486-5615 Web: www.xceive.com. 50

0 1999 2000 2001 2002 2003 2004 2005 2006 2007 Source: Stanford Research and Allied Business Intelligence

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JAM Technologies design and development of electronic time. The company is currently operating controller architectures and real-time with quite a few contractors, so its true Although amplifiers built on operating systems for Chrysler concept headcount is a little fuzzy. However, after conventional analog technology are quite vehicles. At Coy Laboratory Products, he the funding comes through, JAM expects to inefficient and have high heat dissipation, was chief engineer of a medical equipment be in the 20-person range. they still comprise about 95% of all manufacturing firm, responsible for R & D While the audio in consumer electronics amplifiers on the market. Switching as well as production. is primarily digital, typical audio amplifiers amplifiers, or Class D amps, on the other Shanahan, the company’s VP of continue to take an analog input and employ hand, are very efficient and have low heat corporate marketing, developed JAM complex and/or expensive digital-to-analog dissipation, but they are difficult to Technologies from inception, executing all converters (DACs). Direct digital-input implement and the audio quality is often not operating roles in the company outside of amplifiers, therefore, are starting to emerge. very good. JAM Technologies has technology development. He has 15+ years However, the sigma-delta conversion developed what it maintains is the only new in sales, marketing and business technologies on which they are typically approach to audio amplification in decades. development, including the development of based are complex, require feedback loops The technology matches the sound quality complex competitive proposals and market and extensive signal processing, and result of analog amps and the size and low heat analysis. in higher silicon cost. generation of Class D amplifiers, and is sufficiently inexpensive to go into mass- Jean Hammond, a successful serial JAM calls its digital audio amplification market applications. entrepreneur who participated in JAM’s E-Bridge, which the company markets under seed funding, is currently serving as interim the trademark True Fidelity. E-Bridge refers In business since 1999, JAM pursued a CEO while the company conducts a CEO to the switching amplifier output stage licensing and IP strategy for the first four search. Hammond founded Quarry configuration, which bears a physical years. In the fall of 2003, the company Technologies in 1998 together with a core resemblance to the letter “E” (conventional brought in about $3 million in angel funding team from the BBN Technologies/ GTE switching amplifier output stages resemble and started down the path to a fabless model. Internetworking SuperRouter project and the letter “H”). E-Bridge-based True Fidelity JAM is currently in the middle of raising its served as president and CEO as well as amplifiers, according to JAM, significantly series A venture funding, which will likely chief strategy officer. In 1994, she co- outperform all competing Class D amp be in the $7 million range. founded AXON Networks, a developer of technologies as well as analog amplifiers. Larry Kirn and Jim Shanahan founded network management applications. All switch-mode amplifiers use output JAM. Kirn, who serves as president and Following 3Com’s $65 million acquisition power devices as switches, achieving power CTO, invented and patented JAM’s core of AXON, Hammond was responsible for amplification by converting the input signal technology for digital audio amplifier 3Com’s WAN strategy, led the first venture to a sequence of pulses whose averaged semiconductors as well as several key related investment by 3Com and the 3Com/ value is directly proportional to the technologies (18 issued and an additional Newbridge/ Siemens deal. She has also amplitude of the signal at that time. The 22 pending). Not surprisingly, he is an held product-marketing positions at Index output tends to create a lot of errors, accomplished musician and expert in Technology, Spider Systems, and Racal- nonlinearities and distortion, and many psychoacoustics. Previously, Kirn was an Redac. companies in this space focus on how to electrical engineering contractor to Chrysler, JAM expects to bring in the new CEO correct for the output stage. Ford and GM, and was responsible for and close its series A funding at the same JAM recognized that, no matter what measures are taken upstream, the maximum Figure 5 — Resolution required to play all 16 bits of a typical CD. resolution in a switching amplifier system is limited to the minimum controllable time period of the output device. JAM maintains Sample period: 44,100 that unless GHz processing is used, the best Data: 16 bits, or 216 resolution at the output stage for a 16-bit input is about 12 to 13 bits (If over-sampling or 65,536 bytes is taken into account, the numbers are even worse). See Figure 5. 16 bits of data in a 44,100 sample period equates to a JAM determined that the best solution resolution of 216 x 44,100 or one part in 2,890,137,600 was to work within the limitations of a low- cost standard output stage. Much of the For a Class D amplifier to match that resolution, it must company’s IP is based on taking the high- have switching speeds of 1/2,890,137,600, or 346 resolution incoming data stream and splitting it into one high-voltage low-resolution data -12 picoseconds (10 ) stream and one low-voltage high-resolution

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data stream of equal portions (8 bits and 8 channel, 20-watt-per-channel IC with the amplifiers, and they are generally eager to bits, for example in a 16-bit data stream). same features plus minimal heat sinking. speak with any company claiming to have The company amplifies the data streams The company’s second product, which the next great Class D amplifier. separately and then sums them across the samples in Q3 2005, is targeted at HTiB, Contact: load. Splitting the incoming digital data AV, DVD and radio applications. The two- JAM Technologies stream into two lower-resolution streams channel, 20-watt-per-channel chip has the 770 Boylston St. and summing them at the load enables E- Suite 15H same features as the first product, plus tone Boston, MA 02199 Bridge to achieve high quality with vastly control and AM avoidance. simplified logic. JAM sees other opportunities in games, Tel: 617 526-8666 In addition to sound quality, JAM claims Fax: 617 526-8667 playback stereo audio sources (FM radio, Web: www.jam-tech.com. it delivers a 30% cost advantage in the MP3, mobile TV, video clips), ringers, and audio sub-system BOM, as compared to multipoint video conferencing in which EdXact current solutions, because its simpler design different call-parties are associated to As the semiconductor industry moves to requires fewer external components. E- different speakers. Bridge eliminates the need for DACs, nanometer designs, the resulting explosion voltage regulators, PLLs, snubber circuits, The company also expects to work on in data is overwhelming timing and the need for discrete volume control, and integration plays with other companies, such simulation tools. France-based EdXact separate over/under voltage and current as integrating its chip with other in-path (which stands for Electronic Design: protection circuitry. chips, as well as finding opportunities in the eXtraction, Analysis and Control Tools) is cell phone and power management markets. developing EDA tools that dramatically A number of applications are already reduce the size of netlists, and consequently using Class D amps. JAM believes its Out of the $80 million in Class D amps the simulation time, of complex digital and technology is initially most attractive to shipped in 2004, TI is the market leader analog sub-100-nm ICs. The company makers of flat panel LCD and plasma TVs, with somewhere in the $30 million range of claims that its first commercial set of tools, which do not have the capacity to handle hot sales. Both Tripath and Apogee have each called JIVARO, can reduce netlist size by spots behind the screen. Other early adopters had yearly revenues as high as $15 million up to 99% and accelerate simulation by 10x include makers of bookshelf stereos, DVD or so, although they are both currently south to 100x, and more. and audio/video receivers. of that. National Semiconductor has a cell phone division for all types of amps, Three EDA veterans, Mathias Silvant, JAM will soon introduce its first including Class D devices. Philips, the late Stéphane Guédon and Frédéric Giroud, products, the MOZART family of digital- entrant in this market, has nonetheless made founded EdXact in April 2004. The founders input amplifiers. The MOZART products big inroads. came from Cadence Design Systems and, are comprised of a two-channel, 7-watts- before that, Snaketech and Simplex. The per-channel chip targeted at LCD, projection Fortunately for JAM, consumer entire 10-person team has worked together and flat-panel TV applications; and a two- electronics manufacturers have a strong desire for efficient and cost-effective for the last seven years. Silvant, who serves as EdXact’s Figure 6 -- Audio amplifiers market ($ millions). president, worked from 1994 to 1999 in industrial R&D projects with several 2500 companies, including Infineon Analog Digital Technologies, Philips Semiconductors and ZMD. He joined Snaketech, a company 2000 focusing on substrate parasitic extraction, in 1999, holding positions in customer support, R&D and management. Simplex 1500 Solutions acquired Snaketech in 2000, and Cadence subsequently acquired Simplex in 2002. 1000 Guedon is EdXact’s director of R&D. From 1994 to 1998, Guedon worked as a software project manager for GETRIS in 500 the image-processing domain. Following that, he worked for the European Research Center of Xerox, and then joined Snaketech 0 in 2000 as software manager. Following the 2003 2004 2005 2006 2007 2008 Simplex and Cadence acquisitions, he developed numerical calculus algorithms Source: Forward Concepts

July 2005 Page 16 InsideChips.Ventures

for various products. • Coupled, decoupled; Northern Lights Semiconductor Giroud, director development and • Inductance, Mutual Inductance; and Northern Lights Semiconductor Corp. industrialization, joined Snaketech in 1999 (NLSC) is a Minnesota-based company • Substrate. to develop interconnect and substrate developing high-performance magneto- parasitic extractions tools for custom ICs. The problem with current netlist- resistive random access memory (MRAM) Even armed with brilliant ideas, French reduction techniques, which typically ICs. NLSC’s technology, which it actually startups must often obtain their seed funding involve smart filtering methods inside calls “EMRAM” for electromagneto- from sources other than venture capital firms, extraction and simulation software, is that resistive RAM, is a non-volatile RAM that which are reluctant to invest in early-stage accuracy is lost. But for sub-100-nm designs, combines the fast read and write companies. EdXact obtained its initial funds as well as RF designs even at larger performance of SRAM with the high data by winning a governmental competition for geometries, users must take into account storage capability of DRAM. capacitive coupling and even inductive innovative companies sponsored by the EMRAM combines many of the best coupling. EdXact claims that JIVARO is Ministry for Education and Research in features of different memory types, and the first standalone netlist-reduction tool 2004. The approximately $350,000 enabled NLSC hopes it will eventually replace capable of accurately handling coupled EdXact to perform R&D for the first year. current memory technologies such as capacitors, inductors and mutual inductors. In May 2005, EdXact closed its first SRAM, DRAM, ROM, EEPROM, flash, seed round of financing with I-Source Jivaro is complementary to existing EDA NVRAM, and FeRAM. The technology is Gestion and Emertec Gestion, which tools from major vendors, and plugs into easily embedded, and has a very small provided the company with approximately existing flows via its transparent interfaces silicon footprint compared to other $2.5 million. based on SPICE, DSPF and SPECTRE file embedded memory technologies. (See formats. Table 3 on page 18.) Jivaro, EdXact’s netlist-reduction tool, is named after a South American tribe of EdXact introduced two versions of NLSC says that EMRAM is especially head shrinkers. JIVARO at the DAC Conference in June: effective in applications in which more JIVARO-A for analog and RF circuits, and than one memory type is deployed (such as Designers are integrating ever-increasing JIVARO-D for digital and mixed-signal SRAM + flash, SRAM+EEPROM, etc.) as amounts of functionality into smaller and circuits. well as in SOCs with a moderate or high smaller devices. Parasitic effects that in the percentage of silicon real estate committed past were insignificant must now be taken According to EdXact, several semiconductor partners have evaluated to embedded memory. EMRAM is also into account when verifying before they inherently radiation hardened. emerge as a source of failure at fabrication. JIVARO tools. For an RF circuit (LNA), The objective of netlist reduction is to reduce DC simulation time dropped from 33 min. NLSC’s primary founder is James Lai, the number of parasitic elements in a circuit to 6 sec., a 330x speedup; and S-parameter who serves as the company’s CEO and while maintaining its logical and electrical analysis time dropped from 1hr. 40 min. to president. Lai spent 25 years at Honeywell, behavior. 9 sec., a 666x speedup. For a mixed-signal where he was the principal investigator of circuit (1-GHz ADC), transient spice the Honeywell MRAM team that created Current techniques for dealing with simulation time dropped from one day to world’s first MRAM IC in operation today. parasitic effects explode the data volume five hours. A digital ring oscillator’s transient Lai originally launched the company in and make analysis impossible. By reducing simulation –which at first proved unable to 1999 under the name Union Semiconductor netlist data volumes, EdXact’s Jivaro tool reach convergence — achieved convergence Technology Corp. The company raised enables designers to perform multiple and correct results with the same simulator approximately $30 million from un-named simulations in situations where data volumes after adding JIVARO into the flow. previously prevented any kind of simulation. Taiwanese investors, and bought a small, EdXact employs a time-based license 6,000-square-foot fab from Cray While extracted parasitics overload model, typically for one or two years. The Supercomputers. Union reorganized in existing timing and circuit-simulation tools, company says its license fee is equivalently 2004, changing its name to NLSC. NLSC Jivaro’s netlist-reduction capabilities reduce priced to an option tool for a simulator. is headquartered in Plymouth, Minn., and the overload to an acceptable level. The its fab is about 100 miles away in Chippewa most significant benefit is reduced Contact: EdXact Falls, Minn. simulation turn-around times, which enable 347 Rue Aristide Berges designers to explore different layout Voreppe 38340 The management team also includes combinations and increase their chances of France CTO Hsing-Kuen Liou, a Lucent getting a design right. Technologies veteran with extensive Tel: +33 (0) 4 76 50 00 11 experience in IC design and manufacturing. Jivaro enables netlist reduction for all Fax: +33 (0) 4 76 50 00 12 types of parasitic netlist components: Web: www.edxact.com. John Wagner, director of manufacturing, was chief engineer/chief • R, RC, RLC, RLCK; scientist responsible for thin-film

July 2005 Page 17 InsideChips.Ventures

metallization at Cray Research. metallization process. In addition, multiple Available Q4 2005: (up to three) EMRAM layers can be stacked CFO Cynthia Schelske garnered on top of the chip, creating higher density • 4 Mb, extensive experience in financial without increasing the footprint. management and “Big Four” public • 8 Mb, accounting. Compared to battery-backed SRAM • 16 Mb, and K.C. Fong, VP of sales and marketing, and other NVRAM (such as FeRAM, has a background in aerospace engineering, SRAM flash packages), EMRAM offers • 32 Mb. equivalent performance at a far lower cost. systems and components marketing, and Available Q2 2006: general management. Typically, says NLSC, replacing NVRAM with EMRAM will save the user more than • 64 Mb, NLS employs about 20 people. Many 60% in component costs. are from Honeywell, and the company also • 128 Mb, and picked up a few Cray people when it bought For example, customers can use Cray’s fab. eEMRAM in a smartcard microcontroller • 256 Mb. to replace multiple memory types (RAM, Manufacturing EMRAM is currently a NLSC has significant metallization ROM and EEPROM). Another application two-fab procedure that requires a process capabilities and advanced is embedding eEMRAM on an RFID IC, conventional CMOS front-end process and packaging expertise, both central to the replacing discrete EEPROM components. a special back-end EMRAM metallization fabrication of embedded and stand-alone This lowers the cost of the resulting RFID process that occurs that the Chippewa Falls EMRAM ICs. The company has developed IC package by more than 30%, says NLSC. a family of parallel and serial standalone metallization plant. The company’s front- NLSC’s initial products, which will be EMRAM devices with storage densities end partners are Mosel Vitelic for first- launched this year, are embedded MRAM ranging from 4 Kb to 1 Mb. NLSC also generation 0.5-micron CMOS and TSMC (eMRAM) with density of up to 8 Mb, and offers embedded EMRAM (eEMRAM) for second-generation 0.18-micron CMOS MRAM devices with densities from 4 Kb up to 1 Mb for ASIC applications and products. to 16 Mb, which are targeted at battery- SOCs. NLSC expects to operate its back-end backed SRAM, SRAM-EEPROM fabrication plant at least through 2006. The memory elements in a CPU are package, SRAM-NOR flash combo- After the technology has gained greater typically laid out next to the logic section, memory and select EEPROM/flash acceptance in the market, NLSC plans to necessarily using up additional silicon real applications. estate. By contrast, EMRAM layers sit on work with one or more foundry partners to top of the logic CPU and any other NLSC currently has samples available establish a line at (or next to) the foundry. peripheral, like a crowded city building up of 1-Mb EMRAM, 64 Kb EMRAM, and At that point, the company’s business model and not out. According to NLSC, this is a RFID with eEMRAM. The company’s will shift and licensing/royalty would take very high-yield architecture, as the higher-density products will be available on a more prominent role. soon. EMRAM layers involve only a back-end NLSC licenses its fundamental MRAM technology from Honeywell, one of the leaders in the MRAM space. Others include Freescale (formerly Motorola), Altis (a Table 3 -- Standalone memory comparison joint venture between IBM and Infineon), and TSMC. The necessary long-term Attribute EMRAM DRAM SRAM FLASH EEPRO FeRAM High Density Yes Yes No Yes No No investment and commitment has caused a Low Power Yes No Yes Yes Yes Yes number of players to exit the MRAM space, Non-volatile Yes No No Yes Yes Yes the latest being Cypress Semiconductor, Random Access Yes Yes Yes No No Yes which divested itself of MRAM subsidiary Non-destructive Yes No Yes Yes Yes No Silicon Magnetics in spring 2005. No Wearout Yes Yes Yes No No No Fast READ Yes Yes Yes Yes Yes Yes Contact: Fast WRITE Yes Yes Yes No No Yes Northern Lights Semiconductor 15301 State Highway 55 West Low WRITE Power Yes Yes Yes No No Yes Plymouth, MN 55447 Ease to Embed Yes No No No No No READ cycle 5-100ns ~100ns 5-100ns ~150ns ~150ns 50-150ns Tel: 651 592-7412 WRITE cycle 5-100ns ~100ns 5-100ns >1us >10ms 50-150ns Fax: 651-646-1133. WRITE Voltage <5V <5V 1 <5V 12V 12V <5V Web: www.nlsemi.com. Data Retention INFINITE 0 0 >10Y >10Y >10Y Without Power Endurance (Number of Writes) >1E15 >1E15 >1E15 ~1E6 ~1E5 ~1E10 Relative Cel Size 1 14-Mar1 1-1.21

July 2005 Page 18 InsideChips.Ventures Agreements and Marketing Alliances

ASAT and LSI Logic Enter Into Flip- (See our profile of Calypto in the March extensively test the entire functionality of Chip Cross-License Agreement 2005 issue of InsideChips.Ventures.) their PCI Express-compliant devices. Contacts: Verification frameworks form complete Semiconductor package design, Michael Sanie, Calypto VP of marketing and testbench environments for endpoint, assembly and test services provider ASAT business development; Tel: 408 850-2300; switch, and bridge designs. Holdings has entered into a multi-year www.calypto.com. ASIC Architect develops high- cross-licensing agreement with LSI Logic, Shawn McCloud, Mentor high-level synthesis performance, feature-rich PCI Express and under which LSI Logic will provide ASAT product manager; Tel: 503 685-7000; www.mentor.com. advanced switching soft IP cores and with a license to use its Flip Chip solutions for FPGA and ASIC. ASIC semiconductor package assembly IBM, Chartered and Samsung Architect offers a wide range of PCI Express technology. In addition, LSI Logic will to Develop 65-nm Design Kits cores: endpoint cores, rootcomplex cores, certify ASAT’s assembly process using root/endpoint port dual cores, switch port copper/low K technology. IBM, Chartered Semiconductor Manufacturing and Samsung Electronics cores, and solution cores. Contacts: are jointly developing design kits for the Harry Rozakis, ASAT CEO; Tel: 925 398- Contacts: 0400; www.asat.com. 65-nm base and low-power processes. Kishore Mishra, ASIC Architect president and Maniam Algarathanam, LSI Logic VP of Specifically, the three companies will offer CEO; Tel: 408 247-9931; www.asic- advanced package development and 65-nm designers common design kits that architect.com. assembly; Tel: 408 954-3108; Chilai Huang, Avery Design president; Tel: consist of physical verification (design rule 978 689-7286; www.avery-design.com. www.lsilogic.com. checking (DRC) and layout versus schematic Calypto, Mentor Integrate Tools (LVS) matching) and parasitic extraction TI, Ember Team to Offer (RCX) technology files. Additionally, the Low-Power ZigBee Chipset EDA startup Calypto Design Systems companies will also make available common Texas Instruments and Ember have is collaborating with Mentor Graphics to SRAM kits for single- and dual-port established a collaboration to unveil the integrate the Calypto SLEC sequential memories, eFUSE kit and electrostatic world’s lowest-power-consuming ZigBee equivalence checker with Mentor Graphics’ discharge (ESD) kit. Catapult C Synthesis tool, providing IC networking and microcontroller (MCU) Contacts: platform. ZigBee is a wireless, standards- designers with a joint, verifiable, automated Steve Longoria, IBM VP of semiconductor flow from an algorithmic chip description technology platform; Tel: 845 892-5000; based radio technology for remote to an RTL description. To support these www.chips.ibm.com. monitoring, control and sensor network activities, Calypto has become a member Kevin Meyer, Chartered VP of worldwide applications. marketing; Tel: (65) 6362.2838; of the Mentor Graphics OpenDoor www.charteredsemi.com. Ember has paired its EM2420 802.15.4/ partnership program. KP Suh, Samsung exec. VP of technology ZigBee-compliant semiconductor platform With this integration, Catapult C users development; Tel: +82-2-751-2986; with TI’s MSP430F161x series of ultra- www.samsung.com. can automatically generate RTL from a low-power MCU for developers building low-power ZigBee applications. TI’s pure ANSI C/C++ description, then Avery Design, ASIC Architect Team MSP430 platform of MCUs will also support automatically create SystemC “wrappers” to Deliver PCI Express IP Solution containing verification directives and an Ember’s next-generation EM260 network interface mapping directly into the SLEC Avery Design Systems and ASIC processor, which the company recently environment. This allows users to quickly Architect have launched a cooperative effort introduced. verify functional equivalence between the to deliver a comprehensive PCI Express The new dual-chip network module pure ANSI C/C++ and RTL descriptions design and verification IP solution. Under provides a complete, integrated MSP430 and quickly verify additional design the terms of the agreement, ASIC Architect MCU, a radio and the ZigBee software optimizations before handing off to final and Avery will jointly promote their platform. To reduce the device’s footprint IC implementation. comprehensive solution to end users. and BOM, the MSP430F161x MCU series Additionally, ASIC Architect has licensed Founded in 2002, Calypto is attempting integrates all peripherals, including high- Avery’s PCI-Xactor solution to use for performance analog and up to 55 KB of to bridge the gap between electronic system internal development. level (ESL) design and IC implementation flash memory, which reduces the need for with technology that enables designers to The PCI-Xactor for PCI Express EEPROM. The device also features on- functionally verify their RTL designs much verification solution consists of Bus chip, high-precision control peripherals, more easily and efficiently. Calypto’s Function Model (BFM), SuperMonitor, and such as a 12-bit 200k samples per second sequential equivalency checker technology test suites and verification frameworks for (ksps) analog-to-digital converter (ADC) provides designers with a tool that can functional verification of PCI Express and a 12-bit digital-to-analog converter determine whether higher-level models are components. The PCI-Xactor allows design (DAC) with a settling time of 1 microsecond. functionally equivalent to their RTL and verification engineers to quickly and Spun out of MIT in 2001 and based in implementations.

July 2005 Page 19 InsideChips.Ventures

Boston, Mass., Ember develops ZigBee- interface to XDR DRAM memory sub- Business Microscope, Cont. compliant wireless semiconductor solutions systems. It is a versatile CMOS macro cell for applications that range from home that can be seamlessly integrated into a Continued from page 2 automation to making buildings consume wide variety of target processes. The less energy. general-purpose cell is independent of the Matrix Semiconductor’s 3-D (See our profile of Ember in the Dec. logical memory controller design, enabling architecture involves depositing multiple 2003 issue of InsideChips.Ventures.) support for a wide variety of memory layers of active memory elements on a applications needing high bandwidth and standard silicon substrate (or silicon surface) Contact: low latency. The XIO provides a wide, on- Venkat Bahl, Ember VP of marketing; Tel: so that active circuitry is no longer confined 617 951-0200; www.ember.com. chip, CMOS-level signaling interface to the to the silicon base, but extends vertically as memory controller logic and a narrow, high- well. The company has a ROM-type Faraday, Innovasic Enter speed Differential Rambus Signaling Level technology for building single-use flash into Strategic Partnership (DRSL) interface to the external XDR memories, which are ideal for applications memory system. such as game cards. However, Matrix does ASIC and IP provider Faraday not go beyond flash, and is unable to integrate Technology and Innovasic Semiconductor, Contacts: Tom Reeves, IBM VP of semiconductor analog and digital or multiple chips of a supplier of ICs to the industrial automation products and solutions; Tel: 845 892-5000; different design types. market, have entered into a multi-year www.chips.ibm.com. strategic partnership agreement. The Laura Stark, Rambus VP of platform (See our profile of Matrix in the Jan. agreement provides Innovasic and its solutions; Tel: 650) 947-5000; 2002 issue of InsideChips.Ventures.) www.rambus.com. customers with 10+ years of preferential A spin-off of Japan’s Tohoku University, supply in its upcoming products. In SMIC, Magma Form ZyCube is developing a novel wafer- exchange, Faraday receives expertise and Design Service Partnership stacking technology in which different LSI technologies that are necessary for mission- wafers, which are independently fabricated, Magma Design Automation and critical applications in harsh environmental are stacked in three layers. The company Semiconductor Manufacturing International conditions. The exchange is designed to has produced working prototypes of three- Corporation (SMIC) have established a enable both companies to expand their layer stacked image sensors, three-layer formal partnership between the two addressable markets. stacked memory chips, and three-layer companies. SMIC’s Design Service With the adoption of Ethernet and stacked MPUs. The process relies on wafer Division is adopting Magma’s integrated embedded processors, the industrial market alignment, wafer thinning, buried RTL-to-GDSII design solution — including seems destined to converge with the PC- interconnections, micro-bumping and using Blast Create, Blast Plan Pro, Blast Fusion peripheral market. However, issues such as an adhesive layer. and Blast Power — for its ASIC design soft error rate under high radiation projects, as well as the SiliconSmart products Vertical Circuits formed when TRW environment, and extremely low defective for characterization and model creation of Components International merged with 3- parts per million (PPM) — to name just two libraries and macros. To ensure successful D memory developer Cubic Memory in — are requirements quite different from adoption, a Magma support team will be on 1999. One of the company’s specialties is Faraday’s existing target markets. Through site at SMIC. manufacturing small-footprint, low-profile, this partnership, Faraday expects to be better stacked-die semiconductor packages for Each component of Magma’s integrated suited to address these issues. high-density, high-performance RTL-to-GDSII solution for nanometer Contacts: applications. H.P. Lin, Faraday president; Tel: +886-3- designs is based on a unified data model and 578-7888; www.faraday-tech.com. uses the same timing, power and signal- We believe Contour Semiconductor, still Keith Prettyjohns, Innovasic CEO; Tel: 505 integrity analysis and optimization engines. in stealth mode, is developing a 3-D 883-5263; www.innovasic.com. As a result, the Magma system enables architecture design and manufacturing process to serve the flash memory market. Rambus Signs Technology designers to address key nanometer design License Agreement with IBM issues such as on-chip variation 3-D technology will reach the considerations, complex physical design mainstream when design software and EDA IBM has signed a new license agreement rules and noise avoidance during tools become ubiquitous to designers, with Rambus to allow it access to Rambus’s implementation. thermal management solutions become XDR memory controller interface cell, Contacts: available, products demonstrate improved dubbed XIO. This agreement enables IBM Paul Ouyang, SMIC VP of design services; performance, yields prove to be acceptable, to provide an advanced, high-speed design Tel: +86 (21) 5080 2000; www.smics.com. and manufacturing costs can match current Michael Ma, Magma VP of foundry and IP for high-performance consumer applications 2-D solutions. using Rambus’s 90-nm ASIC process. relationships; Tel: 408 565-7500; www.magma-da.com. The Rambus XIO cell is a high- performance, low-latency controller

July 2005 Page 20 InsideChips.Ventures ASICs, IP and Design Services

(Sonics Methodology and Architecture for faster, gated clocks and multiple clock FS2 Introduces Trace Tools For Rapid Time to Market) Interconnect domains are increasingly used to manage Sonics SiliconBackplane hardware solution. Sonics technology is power; support multiple, varied First Silicon Solutions (FS2) has essentially an on-chip communications communication interfaces; and to re-use released the FS2 SB Navigator, a system, a network comprised of older IP that can demand different clock comprehensive trace and debug solution interconnections between “agents” that requirements. Synchronization issues are supporting Sonics SiliconBackplane communicate with each other and to an IP sometimes not discovered until the chip is SMART Interconnects. SB Navigator is a core. manufactured into silicon. In addition, implementing and managing control logic component of the Bus Navigator suite of (See our profile of FS2 in the Nov. 2004 around clock gating for power management FS2 products for system-level debug of issue of InsideChips.Ventures, and our is burdensome and contributes to design complex embedded systems. profile of Sonics in the May 2003 issue). errors. SB Navigator provides SOC developers Conact: with bus-level visibility to simplify and Rick Leatherman, FS2 president; Tel: 503 Bluespec has added integrated clock facilitate analysis of core-level 489-0311; www.fs2.com. management and formal clock connectivity intercommunications when developing verification to enhance its multiple clock complex SOCs. SB Navigator consists of Bluespec Targets domain (MCD) support. Bluespec’s toolset an on-chip instrumentation block that Low-Power ESL Synthesis automates gated-clock implementations for connects through the SiliconBackplane Bluespec, a developer of ESL synthesis power management by automatically snoop port to provide in-silicon-based for control logic and complex datapaths in identifying and managing interface triggering and trace, along with support for chip design, has added low-power ESL communications between active and inactive JTAG probe control and display system synthesis with integrated clock and power clock domains. By incorporating clocking analysis software intercommunications. SB management and formal clock verification into its semantic model, Bluespec’s toolset Navigator can be used standalone, or as capabilities to its ESL synthesis EDA toolset. simplifies complex clock topology part of FS2’s Multi-core Embedded Debug Bluespec provides ASIC and FPGA implementations and ensures that mis- on-chip instrumentation reference design engineers with the capability to validate connections are caught at the time of for embedded silicon analysis, which proper multiple clock domain synthesis. includes multi-core system HyperDebug implementations during the synthesis (See our profile of Bluespec in the March blocks, processor-specific in-system process rather than delaying the discovery 2004 issue of InsideChips.Ventures.) analyzer blocks, and other bus- and logic- of synchronization issues in working silicon specific instrumentation options. Contact: when they are hard and expensive to correct. Sathyam Pattanam, VP of engineering; Tel: Sonics is the developer of the SMART As SOCs continue to become larger and 781 250-2200; www.bluespec.com.

Bits and Bytes, Cont.

Continued from page 3 ongoing informal inquiry into Lattice’s prior PMC-Sierra Eliminates $12 million per year. restatement of financial results. 63 More Jobs PMCS currently has 902 full-time employees in its worldwide operations. The Lattice’s special litigation committee, As part of an ongoing effort to improve restructuring primarily relates to PMC’s which was established for the purpose of its operating efficiency, PMC-Sierra is design and operations center in Santa Clara, conducting a review and investigation of eliminating approximately 63 positions, Calif. the claims contained in two previously primarily related to R&D, at a restructuring announced shareholder derivative cost of approximately $5.9 million. The cuts The addition of the 63 job cuts comes complaints, brought these matters to the are in addition to the 26 positions the company despite PMCS’s expectation that its Q2 attention of the audit committee. said it was eliminating in April at a revenues will be at or near the high end of the The suspensions came amid allegations restructuring cost of approximately $1.5 revenue range provided in April. At that of excessive bonuses for management and million. PMCS therefore expects to eliminate time, the company provided a revenue outlook extravagant spending. The latest shareholder in aggregate approximately 89 positions — of $70 million to $72 million for Q2, or 6% suits revealed that a company event in a workforce reduction of approximately 10% to 9% sequential growth. In addition, by the Hawaii included a private performance by — at a total cost of approximately $7.4 end of Q2, the company expects its book-to- singer Paul Anka – who, according to The million in Q2 2005. PMCS estimates the bill ratio to exceed 1.1, as current quarter New York Times, receives up to $350,000 restructuring will reduce its operating bookings are already greater than the for these kinds of events. expenses by approximately $10 million to company’s Q2 revenue outlook.

July 2005 Page 21 InsideChips.Ventures The Fast Track ... People & Organizations

Sipex Appoints New CEO Thibault joins Forte as European Chellam will continue to oversee information applications manager, and has held a wide technology, internal audit, business and Ralph Schmitt has joined Sipex as the variety of technical and management positions strategy development, real estate and the company’s new CEO. Schmitt, who will at Synopsys and Sagem Group. Asia/Pacific headquarters located in also be elected to the board of directors, Singapore. most recently served as the executive VP of Solarflare Communications sales, marketing and business development Names VP of Marketing Intersil Promotes CTO to Exec. VP at Cypress Semiconductor, where he was of WW Operations and Technology responsible for the transformation of the Solarflare Communications has appointed organization and strategy from a product- Cyrus Namazi, formerly senior director of Intersil has promoted Rajeeva Lahri to based to a market-based approach. He has marketing and application engineering for exec. VP of the Worldwide Operations and also served on the boards of Cypress Infineon Technologies Wireline Technology Group. In addition, Lahri will subsidiaries Silicon Light Machines and Communications Group, as VP of marketing. continue to serve as the company’s CTO. Cypress Microsystems, and also on the Before joining Infineon, Namazi was The Worldwide Operations and Technology boards of privately held companies such as employed at Broadcom, where he led Group includes information systems, Azanda Networks and Stargen. Broadcom’s foray into the ADSL market and worldwide procurement, packaging, process spearheaded its market entry and strategic technology, operations planning, fab Schmitt started his career as a computer direction in the DSL market. Prior to operations, test and assembly, and foundry and communications system hardware Broadcom, he held various positions at AMD, operations. designer and, in the mid-1990s, founded where he was last responsible for strategic and ran his own manufacturers’ Lahri has more than 23 years of direction of communication and networking representative firm. experience in a variety of technology and platforms. In spring 1998, he led the creation operations roles. He joined Elantec in May and launch of the Home Phoneline 2001 as Sr. VP of technology and operations. Forte Expands Management Networking Alliance (HomePNA) and served and Sales Teams In May 2002, after Intersil’s acquisition of as its president and chairperson for more than Elantec, he became CTO of Intersil. In Aug. Forte Design Systems has appointed two years. Prior to AMD, he worked at IBM/ 2003, Lahri took on overall responsibility two key executives, and opened its Lexmark in a variety of engineering and for the company’s global operations and European headquarters in Grenoble, business positions. technology organizations. France. Solarflare develops high-performance Earlier, Lahri held positions as Sr. VP Industry veteran Tom Katsioulas has semiconductor solutions that enable existing and COO at Tessera Technologies, Sr. VP joined Forte as Sr. VP of strategy and networks to migrate to next-generation speeds and deputy CTO at Philips Semiconductor, business development, and Brett Cline, without replacing the physical infrastructure. and Sr. VP of R&D and customer engineering formerly VP of marketing, has been (See our profile of Solarflare in the July at VLSI Technology. promoted to VP of customer operations & 2004 issue of InsideChips.Ventures.) services and corporate communications. Silicon Dimensions Prior to joining Forte, Katsioulas was a Xilinx Appoints New CFO Names VP of Sales management consultant for EDA startups Xilinx has appointed Jon Olson to the Silicon Dimensions has appointed Craig following his tenure as the founder and position of VP finance and CFO. Olson, Robbins VP of sales. Robbins previously CEO of AmmoCore Technology. He has currently VP of finance and enterprise services served as VP of sales of Hier Design, a also held senior marketing positions at at Intel, will have the responsibility for finance, developer of next-generation hierarchical Cadence Design Systems and management tax, treasury and investor relations at Xilinx. floorplanning and analysis software for and engineering positions at Tangent FPGA design (acquired last year by Xilinx). Systems and Digital Equipment Corp. Since joining Intel in 1979, Olson has Prior to Hier, he was the VP of sales of held various senior financial positions, Cline’s role has been expanded to include Silicon Perspective, and held executive including VP of finance and enterprise customer operations and support, in addition management sales positions at Cadence services, director of finance, technology and to corporate communications. Design Systems, Redwood Design manufacturing group controller, and Automation and Gateway Design Francois Constant and Vincent Thibault semiconductor products group controller, as Automation. will lead Forte's European headquarters in well as system manufacturing group Grenoble. controller. Prior to Intel, he worked for four Founded in 2002, Silicon Dimensions Constant, head of European sales, years at General Signal. launched an EDA tool suite intended to bridge the gap between logic design and previously held management positions at Olson succeeds Kris Chellam, who will physical design. The goal is to enable logic Summit Design and Synopsys. He was also remain with the company in the role of senior designers to pass to the physical design team co-founder and CEO of Arexsys. VP, corporate and enterprise services. a netlist that has an 80% to 85% potential for

July 2005 Page 22 InsideChips.Ventures closure on the first pass. and server blade vendors. Clegg most recently served as Tyan’s VP of marketing and strategic sales. Prior to (See our profile of Silicon Dimensions in (See our profile of Aarohi in the Sept. Tyan, Clegg held senior sales and marketing the July 2004 issue of InsideChips.Ventures.) 2003 issue of InsideChips.Ventures.) management positions at OPTi and Chips and Technologies, both core-logic silicon Tensilica Hires Sr. VP Intel Vet Takes on Strategic companies. He began his career as a design of Worldwide Sales Planning Role at LSI Logic engineer for Northstar Computers and also Antonio Viana has joined Tensilica as LSI Logic has named Jeff Richardson held systems engineering positions at Wyse senior VP of worldwide sales. Viana worked executive VP of worldwide strategic Technologies. for ARM since 1998 and held a number of planning. Previously, Richardson was VP of Netcell develops host adapter storage- positions during his tenure there, including Intel’s Digital Enterprise Group and GM of acceleration devices for the ATA and SATA business unit manager of development Intel’s Server Platform Group. Earlier, he host bus adapter, consumer, server, systems, director of the ARM foundry was VP and GM of Intel’s Enterprise workstation and embedded storage markets. program, regional sales director and, for the Solutions and Services Division, focusing past three years, VP of North American on server and workstation building blocks StarGen Launches Major Expansion sales. Prior to ARM, he was director of sales for enterprise computing. Richardson became into Asian Markets for Encore Industries and worked for SGI Intel’s director of volume server development and Hughes Aircraft. in the Enterprise Platforms and Services StarGen is launching a major expansion Division in 1997. He first joined Intel in of its sales organization into core Asian SigmaTel Opens 1992 as a senior design engineer for the markets and has named Daniel Ip sales New Office in China company’s Servers Business Unit. He has director. Ip, who will manage sales also served as a field applications engineer organizations in China, Korea, Taiwan and SigmaTel has opened a new office in for Altera, senior microprocessor design Southeast Asia, has more than 15 years of Shenzhen, China. The Shenzhen office, which engineer for Chips and Technologies, and as international semiconductor sales and represents the third office opened by an ASIC design engineer for Amdahl. business-development experience with SigmaTel in Asia in six months, will provide companies such as PLX Technology and direct, local support to its electronics- Picolight Founder Joins Zarlink Adaptec. He will maintain an office in Hong manufacturing customers in China. Kong. Zarlink Semiconductor has appointed The Shenzhen office has 16,964 square Stan Swirhun Sr. VP and GM of the The company also appointed StarBridge feet, three times larger than its existing Hong company’s optical electronics business. as an authorized StarGen partner. StarBridge Kong Engineering Design Centre. Initially, Swirhun is a founder and CEO of Picolight, will maintain dedicated design and sales SigmaTel will staff its Shenzhen office with a company specializing in vertical-cavity resources for StarGen’s AXSys and up to 40 personnel, half of which will be surface-emitting laser (VCSEL) -based StarFabric technologies. engineers that will focus on applications optical components and transceivers. He led support and development. Eventually, the In addition, Fuji Electronics has signed Colorado-based Picolight from 1997 to 2004 facility will house more than 80 employees. with StarGen to distribute the company’s and, before that, was VP of engineering and AXSys family of ASI products, and Trend- then CTO at Vixel. Aarohi Adds Senior VP of Software Tek China Company will be StarGen’s and Systems Engineering Zarlink also named Peter Burke as Sr. VP distribution partner for China. and GM of network communications, and Bill Huber has joined Aarohi Mike McGinn as VP of marketing Conexant Hires New Senior VP Communications as senior VP of software communications and investor relations. of Worldwide Sales and systems engineering. Prior to joining Aarohi, Huber served as CTO and VP of Christian Scherp has joined Conexant Netcell Adds Two engineering at StoneFly Networks, a provider Systems as senior VP of worldwide sales. to Executive Team of cost-effective data protection and Prior to joining Conexant, Scherp was VP management solutions based on IP SANs. Storage processing specialist Netcell and GM of Infineon Technologies North Previously, he was VP of software appointed Sanjay Adkar VP of engineering America’s wireless/wireline communications engineering at Nishan Systems (acquired by and Don Clegg VP of marketing. group. Previously at Infineon, he served as VP of wireline communications products McData in 2003). Earlier, Huber co-founded Adkar joins Netcell from NeoMagic, test equipment company SIGnology marketing, and VP and GM of the where he was the corporate VP of engineering. communications group’s wide area (acquired by Tektronix), where he served as Previously, he was at National Semiconductor CEO. networking business. Before the spin-off and as senior director of engineering in the creation of Infineon, Scherp held positions Founded in 2001, Aarohi provides Information Appliance group and at LSI of increasing responsibility with Siemens in intelligent storage processors and intelligent Logic as director of ASIC design engineering, marketing, and business storage adapters to storage system, network methodology. planning.

July 2005 Page 23 InsideChips.Ventures Companies Mentioned in This Issue

A Mentor Graphics ...... 19 Aarohi Communications ...... 23 MOSAID Technologies ...... 8 Aegis Semiconductor ...... 6 N Agere Systems ...... 7 AMI Semiconductor ...... 8 Nanometrics ...... 5 Applied Materials ...... 9 Netcell...... 23 ASAT Holdings ...... 19 Nethra Imaging ...... 11 ASIC Architect...... 19 NexFlash Technology ...... 8 August Technology ...... 5 Northern Lights Semiconductor...... 17 Avery Design Systems ...... 19 O B Optichron ...... 12 Bluespec ...... 21 P C Peak Devices ...... 7 Calypto Design Systems ...... 19 Photonic Power Systems ...... 6 Chantek Electronic...... 8 picoChip ...... 9 Chartered Semiconductor Manufacturing ...... 19 PMC-Sierra ...... 21 ChipMOS Technologies...... 8 R Clear Shape Technologies...... 7 Rambus ...... 20 Conexant Systems ...... 23 RedShift Systems ...... 6 Contour Semiconductor ...... 20 Rudolph Technologies ...... 5 Cree...... 3 S E Samsung Electronics ...... 19 EdXact ...... 16 SCP Global Technologies ...... 9 Ember ...... 19 SEMI...... 10 EZchip Technologies ...... 9 Semico Research...... 10 F Semiconductor Manufacturing International Corp. (SMIC) .... 20 Faraday Technology...... 20 Semtech ...... 5 First Silicon Solutions (FS2) ...... 21 SigmaTel ...... 23 Flextronics ...... 8 Silicon Dimensions ...... 22 Forte Design Systems ...... 22 Sipex ...... 22 Solarflare Communications ...... 22 H Sonics ...... 21 HelloSoft...... 8 StarGen ...... 23 STMicroelectronics ...... 3 I IBM...... 19, 20 T In-Stat ...... 10 Tehuti Networks...... 6 Infineon Technologies...... 5 Telavie ...... 8 Innovasic Semiconductor...... 20 Tensilica ...... 23 Innovative Silicon ...... 9 Texas Instruments ...... 19 Integrated Circuit Systems (ICS) ...... 6 Tezzaron Semiconductor ...... 2 Integrated Device Technology (IDT)...... 6 Tharas Systems ...... 7 Intel ...... 7 Therma-Wave ...... 9 Interactive Wear ...... 5 Tokyo Electron Limited ...... 9 Intersil ...... 22 TriCN ...... 8 J V JAM Technologies ...... 15 Vertical Circuits ...... 20 JDS Uniphase ...... 6 W K Winbond Electronics ...... 8 KLA-Tencor...... 5 X L Xceive ...... 13 LanOptics...... 9 XEMICS ...... 5 Lattice Semiconductor ...... 3 Xilinx ...... 22 LSI Logic ...... 19, 23 Z M Zarlink Semiconductor ...... 23 Magma Design Automation ...... 20 Ziptronix ...... 1 Matrix Semiconductor ...... 20 ZyCube ...... 20

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