ELEC 6740 Electronics Manufacturing

Chapter 3 – Surface Mount Components Passives

! Resistors ! Capacitors ! Inductors Chip Resistors

! Thick film ! Doped glass resistive film ! Thin film ! NiCr thin film ! TaN thin film ! Metal film Chip Resistors Chip Resistor Dimensions Chip Resistor Dimensions (inches)

Designation Length (L) Width (W) Height (H) Termination (T) Nom. Nom. Max. Min. R0201 0.020 0.010 R0402 0.040 0.020 0.016 0.004 R0603 0.060 0.030 0.024 0.006 R0805 0.080 0.050 0.028 0.006 R1206 0.120 0.060 0.028 0.010 R1210 0.120 0.100 0.028 0.010 R2010 0.200 0.100 0.028 0.014 R2512 0.250 0.120 0.028 0.014 Power Dissipation Capacitors

! Ceramic multilayer ! Tantalum ! Film Ceramic Multilayer Ceramic Multilayer Capacitors

! NPO ! Low capacitance values ! Temperature, voltage & frequency stable ! X7R, Y5V & Z5U ! Higher capacitance values ! Poorer temperature, voltage & frequency stablity Capacitance Ranges

NPO X7R Y5V Z5U

Case Sizes 0402 - 0402 - 0402 – 0603 – 2225 2225 1210 2225 Capacitance 0.5pF 100pF 1000pF 0.001µF Range 0.056µF 2.2µF 0.47µF 4.7µF Capacitance Dimensions Capacitance Dimensions

Designation Length (L) Width (W) Height (H) Termination (T) Nom. Nom. Max. Min. C0201 0.020 0.010 C0402 0.040 0.020 0.024 0.004 C0603 0.060 0.030 0.034 0.008 C0805 0.060 0.050 0.050 0.010 C1206 0.120 0.060 0.054 0.010 C1210 0.120 0.100 0.054 0.010 C1812 0.180 0.120 0.054 0.010 C1825 0.180 0.250 0.054 0.010 Capacitor Cracking ! Mechanical force ! Placement ! Board bending ! Thermal shock ! During assembly

! Wave soldering " Coefficient of thermal expansion (CTE) o " Nickel: 16 ppm/ C o " Silver: 18 ppm/ C o " Ceramic: 9.5-11.5 ppm/ C ! In application

! Coefficient of thermal expansion (CTE) o " Capacitor: 9.5-11.5 ppm/ C o " Printed circuit board: 14-18 ppm/ C o " Solder: 23-25 ppm/ C Capacitor Cracking Capacitor Cracking

! Wave solder cracking ! Worse if thickness > 0.040” ! Topside preheat = 220 – 240oF ! Solder pot = 475oF ! Z5U worse than X7R Tantalum Capacitors Tantalum Capacitors Tantalum Capacitors

EIA Case Size Capacitance (µF)

A (3216) 0.1 – 10 µF

B (3528) 0.22 – 22 µF

C (6032) 0.68 – 68 µF

D (7343) 3.3 – 100 µF

Voltage rating = 4 – 50Vdc Tantalum Capacitors MELF (Metal Electrode Leadless Face)

! Resistors ! Capacitors ! Diodes MELF Active Components Ceramic Chip Carriers Ceramic Packages

! Hermetic cavity ! Controlled environment for semiconductor die ! Military applications ! Higher thermal conductivity ! CTE mismatch to PWB o ! Ceramic (Al2O3) = 6.5 ppm/ C ! PWB = 14 - 18 ppm/oC ! Leads to solder fatigue Ceramic Packages Ceramic Packages Leadless Ceramic Chip Carrier - LCCC Package Real Estate Efficiencies

3.0 PGA

2.0 PQFP (25mil) DIP PLCC

1.0 PQFP (15mil) Package (sq. in.) Area

0.0 100 0.0 Pin Count 300 400 Package Real Estate Requirements

0.65mm 0.5mm 80 Fine Pitch 0.4mm Package

60 0.3mm

40 0.2mm Area Array Packages 0.1mm 20 (Ball Grid Practical Package Body Size Arrays – BGAs) 0 200 400 600 800 Lead Count Dual Inline Package (DIP) DIP DIP

Stamped metal leadframe

Dispense die attach adhesive DIP

Place Si die

Cure die attach DIP

Wire bond

Transfer mold DIP

Transfer mold DIP

Post mold cure

Plate leadframe DIP

Trim

Lead form Small Outline Transistor (SOT)

Passivated Semiconductor Die Epoxy Body

Collector Lead

Emitter Lead Wire Bond Base Lead SOT 23 SOT -23

K KK Profile Min-Max ‘K’ (inches) High Profile 0.004-0.010

Medium 0.003-0.005 Profile Low Profile 0.0004-0.004 SOT - 23 SOT 89 SOT 89 SOD 123 SOT 143 SOT 143 TO 252 or DPAK TO 252 or DPAK SOIC-8 SOIC TSSOP PLCC SOJ PQFP

Plastic Quad Flatpack: PQFP PQFP PQFP PQFP PQFP BGA PACKAGES Comparison to Fine Pitch SMT (QFP’s) Issues with Fine Pitch

! Coplanarity ! Distance between highest and lowest lead ! Fine leads easily bent ! Wicking – solder climbing up the lead leaving no solder on the PWB pad ! Shorting BGA PACKAGES Advantages Relative to Fine Pitch SMT

Comparison of BGA and QFP “Footprints” for the Same Product BGA PACKAGES Best Uses of Various Package Types BGA PACKAGES Major Types of BGA’s in Production CBGA PACKAGES Wire Bonded CBGA with Cap CBGA PACKAGES Flip Chip CBGA - Cross-Sectional Photograph CBGA PACKAGES IBM CBGA and CCGA Configurations

Ceramic Column Grid Array (CCGA) Ceramic Ball Grid Array (BGA)

Cast SCC SCC 63Sn37Pb

90Pb10Sn 90Pb10Sn SBC 63Sn37Pb 63Sn37Pb

Old IBM Names: SBC = Solder Ball Connect SCC = Solder Column Connect CBGA PACKAGES CBGA Solder Ball Cross-Sectional Schematic

Ceramic Carrier Pad 10/90 solder 0.85 mm dia. ball - 0.875mm Eutectic dia. Solder Pad 0.6mm dia. Board CBGA PACKAGES CCGA Solder Column Cross-Sectional Schematic

Carrier

Eutectic Solder Lead Column 0.5 mm diameter

Eutectic Pad Solder Board CBGA PACKAGES CBGA Standard Sizes (JEDEC) PBGA PACKAGES PBGA PACKAGES Over-Molded Plastic Ball Grid Array PBGA PACKAGES Over-Molded Plastic Ball Grid Array

Single Layer Construction

Multilayer Construction PBGA PACKAGES Over-Molded Plastic Ball Grid Array

Engineering Schematic Perimeter Array PBGA PACKAGES Over-Molded Plastic Ball Grid Array - Example PBGA PACKAGES Over-Molded Plastic Ball Grid Array - Example

Pentium II Motherboard AGP Chipset PBGA PACKAGES Cavity Filled Plastic Ball Grid Array

Bottom-Side Cavity

Interconnect Via BT/Glass Cu Slug Laminate Solder Die Mask

Wire Bond Solder Ball Epoxy Encapsulant PBGA PACKAGES Cavity Filled Plastic Ball Grid Array - Example PBGA PACKAGES “Super” Ball Grid Array - Cavity Filled with Heat Spreader PBGA PACKAGES “Super” Ball Grid Array - Example

PBGA with Cavity Down Construction and Heat Spreader Tape BGA Chip Scale Packages

CSPs - Linear dimensions of package < 1.2x the dimensions of the die Comparison CSP Types

! Rigid Interposer ! Typically a Ball Grid Array Type Package with Higher Density, Smaller Solder Ball Diameter, Smaller Solder Ball Pitch, Thinner but Fairly Stiff Interposer Board. ! Flex Interposer ! Typically a Ball Grid Array Type Package with Higher Density, Smaller Solder Ball Diameter, Smaller Solder Ball Pitch, Thinner and Flexible Interposer Board. CSP Types

! Lead Frame Interposer ! Typically Similar to a Plastic Encapsulated Package but with a Leadframe that Extends Over the Chip ! Wafer Level Assembly / Wafer Scale ! Various Technologies (Most Look Like Flip Chips with large solder balls) Where the Packaging is Performed on the Chips in Wafer Form CSP PACKAGES Example - Rigid Interposer

FBGA - Fine Pitch BGA CSP PACKAGES Example - Flex Interposer

µBGA

Eutectic Solder Ball 0.33 mm diameter Coverlay Material 0.25 mm high 25-50 microns Thick

Seal Plate Adhesive Layer 10-15 microns Copper/Gold

Polyimide Tape Bond Ribbon 25-75 microns Copper/Gold

Low Modulus Encapsulant 100 microns Encapsulation Material

Low Modulus Encapsulation IC Die 250 micron Edge Bumper Standard Al Die Pads +/- 50 microns (rel. to bumps) Low Modulus Elastomer Die Attach Bare Backside Low Modulus Elastomer Nubbin <25 microns 100 microns Encapsulation Material Encapsulation Material CSP PACKAGES Example - Lead Frame Interposer CSP PACKAGES Example - Wafer Scale Processing Stacked etCSP™

Courtesy: Amkor Technology

2 stacked

4 stacked Stacked etCSP™ Isometric Side View

Courtesy: Amkor Technology Stacked CSP Structure (Rigid)

Mold Die Attach Film Gold Wire Compound (or Paste) Die Attach Paste

0.75 1.40 mm mm (max.)

0.3 mm (min.)

Dielectric Solderball Soldermask Semi-rigid 2-layer laminate - 63 Sn/37 Pb (shown) - 0.4 mm Diameter - 0.8 mm Ball Pitch Note: Via Capture Pad will be offset from Courtesy: Amkor Technology SB Land – not as shown Stacked CSP Structure

Courtesy: Amkor Technology Summary Gull J Butt BGA Wing Lead Lead Ball Hi I/O VG G P E Thickness VG G P E Lead Rigidity P VG G E Repair/Rework G VG G P Self Align VG VG P E Inspection G VG G P Clean P E E E Reel Estate Eff. P VG P E