FCBGA : Flip Chip Ball Grid Array

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FCBGA : Flip Chip Ball Grid Array Image Reference Image Description The fcBGA package is the main platform in flip Chip package family, which includes bare die, a thermally enhanced type with one/two piece heat spreader or lid (Lidded fcBGA), SiP (SiP fcBGA) types and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package (MCM fcBGA). Options also include configurations with thin core, Pb‐free and Cu Pillar bump. The variety of FCBGA package options allows package selection to be tailored to the specific thermal needs of the end product. High performance ASIC products typically utilize a Lidded format that features a controlled bondline die attach direct to a copper heat spreader. This feature produces the lowest possible thermal resistance (Theta JC) between the package and any externally applied thermal solution. The copper heat spreader effectively spreads heat laterally away from the die to the package perimeter and into the motherboard. Lower wattage products generally utilize Bare Die or Molded configurations. In these cases, the flip chip construction, with solder bumps and core vias, provides a lower resistance path from the active side of the die through the substrate, allowing heat dissipation both from the package surface and into the motherboard. Application Feature Computing / Consumer / Automotive • Substrate Layer : 4~8 Graphics/chipsets for PC, Server, Game console and • Bump pitch : Min.130um (Solder bump) High‐end application, Microprocessor for PC & Server • Die size : Max. 25mm memory, IoT, Navigation • Heat Spreader : One/Two piece, Customization Telecommunications • Package size : Max. 45mm (50~60mm in develop.) Network products (LAN), Switching Transmission • BGA pitch : Min 0.4mm (0.5~1.0mm) Cellular Base Stations Reliability Bill of Materials and Process Specification • PCB : BT or Equivalent (2~6 Layer) • MRT : JEDEC Level 4 • Bump : Eutectic, Pbfree, Cu Pillar • TC‐B : ‐55°C/125°C, 1000 cycles • Flux : Water Soluble • HTS : 150°C, 1000 hrs • Underfill : CUF • uHAST : 130°C, 85% RH, 96 hrs • TIM : Thermal Interface Material, Adhesive • Lid : Cu + Al plating • Solder ball : Sn3.0Ag0.5Cu (Standard) • Marking : Laser • Packing : JEDEC Tray FCBGA : Flip Chip Ball Grid Array Package Line‐up PKG Type Body Size Ball Count Ball Pitch Die Size Bare 15 x 15 403 0.8mm 5.53 x 5.35 Bare 15 x 15 403 0.8mm 7.33 x 7.67 Lidded 17 x 17 196 1.0mm 6.0 x 6.0 Bare 19 x 19 608 0.8mm 5.53 x 5.35 Bare 19 x 19 608 0.8mm 7.33 x 7.67 Lidded 21 x 21 400 1.0mm 6.83 x 6.83 Lidded 21 x 21 625 0.8mm 7.33 x 7.67 Bare 21 x 21 625 0.8mm 6.2 x 6.5 Bare 25 x 25 818 0.8mm 7.33 x 7.67 Lidded 25 x 25 818 0.8mm 7.33 x 7.67 Bare 25 x 25 576 1.0mm 9.74 x 10.24 Lidded 25 x 25 576 1.0mm 9.74 x 10.24 Lidded 27 x 25 672 1.0mm 10.05 x 10.63 Lidded 29 x 29 784 1.0mm 9.82 x 10.40 Lidded 40 x 40 1521 1.0mm 15.0X10.0 Lidded 42.5 x 42.5 1681 1.0mm 15.0 x 15.0 Lidded 45 x 45 1936 1.0mm 20.0 x 20.0 .

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