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Chip carrier
Ceramic Leadless Chip Carrier (LCC)
Quad Flat No-Lead (QFN) Evauation Test
Packaging Product Specification
Package Reliability As Affected by Material and Processes
LM117/LM317A/LM317 3-Terminal Adjustable Regulator
Package Information
Lm317mdt/Nopb
8 Evolutionary Advances in Conventional Packaging
Standard Package Outlines
Appendix A* Surface Mount Standards
On Single Chip Package for Dual-In Integrated Circuit Packages Called Marriage IC with Switch Tests Simulation
Of Components, Packaging and Manufacturing Technology
Carriers on Various Printed Circuit Board Type Substrates* I.G
Lm317mdt/Nopb
The Effect of Coating and Potting on the Reliability of QFN Devices
Ceramic Chip Carrier
Packaging Specification
CHAPTER I Introduction
Top View
Transistors, Low Power, Npnbased on Type 2N2222a
Packing Considerations(Methods, Materials And
Packing Datasheet
Ordering Information
Ic Packagepackage
The Hermetic Surface Mount Device (SMD), Its Advantages and Solutions to Assembly Integration
National Semiconductor Corporation DS009063 Connection Diagrams
Bulletin20130903 QFN Package Popularity
Plastic Leaded Chip Carrier
Allegro (Page 1)
Semiconductor Packaging Lo
Hermetic Packages
Master Index for Jedec Publication No
Considerations for Soldering Accelerometers in LCC-8 Packages Onto Printed Circuit Boards by Hubert Geitner
IPC-SM-780 Table of Contents
Transistor Standards
LM185-2.5/LM285-2.5/LM385-2.5 Micropower Voltage Reference
1 Attachment a Whitepaper on Semiconductor Die and Packaging
Dummyclass101.Pdf
SMT Nomenclature
Thermal Resistance Theory and Practice
A Semiconductor Packaging Hardware Donation to Semiconductor Equipment and Materials International
Integrated Circuit Packaging
Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability