Appendix A* Surface Mount Standards
This appendix lists various standards, specifications, and guidelines that have an impact on surface mount technology from U.S. and international • bodies, including the U.S. Department of Defense, although DoD is now committed to using industry standards.
These documents can be obtained from the following sources:
• INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS (IPC): 2215 Sanders Road, Northbrook, IL 60062-6135 Telephone 847-509-9700; FAX 847-509-9798 • ELECTRONIC INDUSTRIES ASSOCIATION (EIA) 2001 Pennsylvania Avenue, NW Washington, D.C. 20006-1813 Telephone 703-907-7500; FAX 703-907-7501 • GLOBAL ENGINEERING DOCUMENTS 2805 McGaw Avenue, Irvine, CA 92713 Telephone: 800-854-7179; FAX 314-726-6418
Military documents are available from:
• STANDARDIZATION DOCUMENTS Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094 Telephone 215-697-2667
Central office of the IEC:
*Adapted from Surface Mount Council Status of the Technology, Industry Activities and Action Plan, September 8-12, 1996, available from IPC. 726 Appendix A
• INTERNATIONAL ELECTROTECHNICAL COMMISSION (1EC) Rue de Varembe, 1211 Geneva 20, Switzerland lEe documents are also available from:
• AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) 11 West 42nd Street, New York, NY 10036
The letter prefix of each document indicates the organization responsible for that document:
EIA Electronic Industries Association JEDEC Joint Electron Devices Engineering Council of the EIA IPC Institute for Interconnecting and Packaging Elec• tronic Circuits MIL Military DoD Department of Defense J-Std Joint Industry Standards
Components, General
EIA-886-E Standard Test Methods for Passive Electronic Com• ponent Parts-General Instructions and Index (this document is an umbrella document that consists of a series of uniform test methods for electronic compo• nent parts), EIA-481-A Taping of Surface Mount Components for Auto• matic Placement EIA-481-1 8 mm and 2 mm Taping of Surface Mount Compo• nents for Automatic Handling EIA-481-2 16 mm and 24 mm Embossed Carrier Taping of Sur• face Mount Components for Automated Handling EIA-48 1-3 32 mm, 44 mm, and 56 mm Embossed Carrier Tap• ing of Surface Mount Components for Automated Handling EIAlIS-47 Contact Termination Finish Standard for Surface Mount Devices EIA-PDP-lOO Registered and Standard Mechanical Outlines for Electronic Parts EIA-JEP-95 JEDEC Registered and Standard Mechanical Out• lines for Semiconductor Devices Surface Mount Standards 727
EIA-JESD30 Descriptive Designation System for Semiconductor Device Packages EIA-JESD95-1 Design Requirements for Outlines of Solid-State and Related Products IPC-9501 Component Qualification for the Assembly Process IPC-SM-786A Recommended Procedure for Handling of Moisture Sensitive Plastic IC Packages J-Std-020 MoisturelReflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
Components, Passive
Capacitors:
EIA-198-D Ceramic Dielectric Capacitors Classes I, II, III, and IV EIA-469-B Standard Test Method for Destructive Physical Anal• ysis of High Reliability Ceramic Monolithic Capac• itors EIA-479 Film-Paper, Film Dielectric Capacitors for Micro• wave Ovens EIA-51O Standard Test Method for Destructive Physical Anal• ysis of Industrial Grade Ceramic Monolithic Capac• itors EIA-535 Series of Detail Specifications on Fixed Tantalum Capacitors that have been adopted by the National Electronic Components Quality (NECQ) Assessment System EIA-CB-ll Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors EIAlIS-28 Fixed Tantalum Chip Capacitor Style 1 Protected• Standard Capacitance Range EIAlIS-29 Fixed Tantalum Chip Capacitor Style I Protected• Extended Capacitance Range EIAIIS-35 Two-Pin Dual In-Line Capacitors EIAlIS-36 Chip Capacitors, Multi-Layer (Ceramic Dielectric) EIA/IS-37 Multiple Layer High Voltage Capacitors (Radial Lead Chip Capacitors) EIAlIS-38 Radial Lead Capacitors (Conformally Coated) EIAlIS-39 Ceramic Dielectric Axial Capacitors (Glass Encapsu• lated) IEC-384-3 Sectional Specification, Tantalum Chip Capacitors 728 Appendix A
IEC-384-10 Sectional Specification, Fixed Multilayer Ceramic Chip Capacitors IECQ draft Blank Detail Specification, Fixed Multilayer Ce• ramic Chip Capacitors IECQ-PQC-31 Sectional Specification, Fixed Tantalum Chip Capaci• tors with Solid Electrolyte IECQ-PQC-32 Blank Detail Specification, Fixed Tantalum Chip Ca• pacitor
Resistors:
EIA-575 Resistors, Rectangular, Surface Mount, General Purpose EIA-576 Resistors, Rectangular, Surface Mount, Precision EINIS-34 Leaded Surface Mount Resistor Networks Fixed Film
Components, Active
EIA-JEP-95 JEDEC Registered and Standard Outlines for Semi• conductor Devices EIA-JESDII Chip Carrier Pinouts Standardized for CMOS 4000, HC, and HCT Series of Logic Circuits EIA-JESD21-C Configurations for Solid State Memories EIA-JESD22-B Test Methods and Procedures for Solid State De• vices Used in TransporatationiAutomotive Applica• tions (Series format-consists of over 16 different test procedure documents.) EIA-JESD-26A General Requirements, PEM, Rugged Environments EIA-JESD30 Descriptive Designation System for Semiconductor Device Packages EIA-JESD95-1 Design Requirements for Outlines of Solid-State and Related Products
Components, Electromechanical
Connectors:
EIA-429 Industry Standard for Connectors, Electrical Flat Ca• ble Type (IPC-FC-218B) EIA-364-B Electrical Connector Test Procedures Including Envi• ronmental Classifications (Series format consisting of over 60 electrical connector test procedures.) Surface Mount Standards 729
EIA-506 Dimensional and Functional Characteristics Defining Sockets for Leadless Type A Chip Carriers (.050 Spacing) EIA-507 Dimensional Characteristics Defining Edge Clips for Use with Hybrid and Chip Carriers EIA-IS-47 Contact Termination Finish Standard for Surface Mount Devices EIAlIS-64 Two Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes
Sockets:
EIA-5400000 Generic Specification for Sockets for Integrated Cir• cuit (IC) Packages for Use in Electronic Equipment (Series format with over 20 sectional, blank detail, and detail specifications, approved for use in the NECQ system.)
Switches:
IECQ-PQC-41 Detail Specification, Dual-in-Line Switch, Surface -US00003 Mountable, Slide Actuated EIA-448-23 Surface Mountable Switches, Qualification Test EIA-5200000-A Generic Specification for Special-Use Electrome• chanical Switches of Certified Quality (Series format with over 25 sectional, blank detail and detail speci• fications, approved for use in the NECQ system.)
Printed Boards:
IPC-FC-250 Performance Specification for Single and Double• sided Flexible Printed Boards IPC-RF-245 Performance Specification for Rigid-Flex Multilayer Printed Boards IPC-RB-276 Performance Specification for Rigid Printed Boards IPC-MC-324 Performance Specification for Metal Core Boards IPC-HM-860 Performance Specification for Hybrid Multilayer IPC-6105 Performance Specification for Organic Multichip Module Structures (MCM-L) MIL-P-50884 Military Specfication Printed Wiring, Flexible, and Rigid Flex MIL-P-55110 Military Specification Printed Wiring Boards, Gen• eral Specification For 730 Appendix A
IPC-DW-42S/424 Discrete Wiring Technology MIL-P-PRF-31032 Printed Circuit BoardlPrinted Wiring Board Manu• facturing, General Specification For
Materials:
IPC-L-IOSB Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards IPC-L-I09B Specification for Resin Preimpregnated Fabric (Pre• preg) for Multilayer Printed Boards IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications IPC-L-llSB Specification for Rigid Metal Clad Base Materials for Printed Boards IPC-CF-14S Resin Coated Metal for Multilayer Printed Boards IPC-MF-lS0F Metal Foil for Printed Wiring Applications IPC-CF-lS2A Metallic Foil Specification for CopperlInvar/Copper (CIC) for Printed Wiring and Other Related Applica• tions IPC-SM-S17 General Requirements for SMT Adhesives IPC-3406 Guidelines for Conductive Adhesives IPC-3407 General Requirements for Isotropically Conductive Adhesives-Paste Types IPC-340S General Requirements for Anistropically Conductive Adhesive Films IPC-CC-S30 Qualification and Performance of Electrical Insula• tion Compounds for Printed Board Assemblies IPC-SM-S40C Qualification and Performance of Permanent Poly• mer Coating (Solder Mask) for Printed Boards J-Std-004 Requirements for Soldering Fluxes J-Std-OOS General Requirements and Test Methods for Elec• tronic Grade Solder Paste J-Std-006 General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Sol• ders for Electronic Soldering Applications
Design Activities
IPC-D-249 Design Standard for Flexible Single and Double• Sided Printed Boards IPC-D-27S Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies Surface Mount Standards 731
IPC-D-279 Reliability Design Guidelines for Surface Mount Technology Printed Board Assemblies IPC-D-317 Design Standard for Electronic Packaging Utilizing High Speed Techniques IPC-C-406 Design and Application Guidelines for Surface Mount Connectors IPC-SM-782 Surface Mount Land Patterns (Configuration and De• sign Rules) IPC-H-855 Hybrid Microcircuit Design Guide IPC-D-859 Design Standard for Multilayer Hybrid Circuits IPC-2105 Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies MIL-Std-2118 Design Standard for Flexible Printed Wiring
Component Mounting
EIA-CB-ll Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors IPC-CM-770D Guidelines for Printed Board Component Mounting IPC-SM-784 Guidelines for Direct Chip Attachment SMC-TR-OOl Introduction to Tape Automated Bonding and Fine Pitch Technology IPC-SM-780 Electronic Component Packaging and Interconnec• tion with Emphasis on Surface Mounting IPC-MC-790 Guidelines for Multichip Module Technology Utili• zation J-Std-012 Implementation of Flip Chip and Chip Scale Tech• nology J-Std-013 Implementation of Ball Grid Array and Other High Density Technology
Soldering and Solderability
EIAlIS-46 Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices EIAlIS-49-A Solderability Test Method for Leads and Termina• tions EIA-448-19 Method 19 Test Standard for Electromechanical Components Environmental Effects of Machine Sol• dering Using a Vapor Phase System IPC-TR-460A Trouble Shooting Checklist for Wave Soldering Prin• ted Wiring Boards 732 Appendix A
IPC-TR-462 Solderability Evaluation of Printed Boards with Pro• tective Coatings Over Long-Term Storage IPC-TR-464 Accelerated Aging for Solderability Evaluations J-Std-OOI Requirements for Soldered Electrical and Electronic Assemblies J-Std-002 Solderability Tests for Component Leads, Termina• tions, Lugs, Terminals, and Wires J-Std-003 Solderability Tests of Printed Boards IPC-S-816 Troubleshooting for Surface Mount Soldering IPC-AJ-820 Assembly and Joining Handbook
Quality Assessment
EIA-469-B Standard Test Method for Destructive Physical Anal• ysis of High Reliability Ceramic Monolithic Capac• itors EIA-51O Standard Test Method for Destructive Physical Anal• ysis of Industrial Grade Ceramic Monolithic Capac• itors IPC-A-600 Acceptability of Printed Boards IPC-A-61O Acceptability of Printed Board Assemblies MIL-Std-883 Methods and Procedures for Microelectronics IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Compo• nents Reliability IPC-A-24 Flux/Board Interaction Board IPC-A-36 Cleaning Alternatives Artwork IPC-A-38 Fine Line Round Robin Test Pattern IPC-A-48 Surface Mount Artwork IPC-AI-640 User Requirements for Automatic Inspection of Un• populated Thick Film Hybrid Substrates IPC-AI-641 User Guidelines for Automated Solder Joint Inspec• tion Systems IPC-AI-642 User Guidelines for Automated Inspection of Art• work and Inner Layers IPC-AI-643 User Guidelines for Automatic Optical Inspection of Populated Packaging and Interconnection
Surface Mount Process
IPC-SC-60 Post Solder Solvent Cleaning Handbook IPC-SC-61 Post Solder Semi-Aqueous Cleaning Handbook IPC-AC-62 Post Solder Aqueous Cleaning Handbook Surface Mount Standards 733
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results Reliability
Reliability
IPC-SM-785 Guidelines for Accelerated Surface Mount Attach• ment Reliability Testing IPC-D-279 Design Guidelines for Reliable Surface Mount Tech• nology Printed Board Assemblies
Numerical Control Standards
IPC-NC-349 Computer Numerical Formatting for Drilling and Routing Equipment IPC-D-350D Printed Board Description in Digital Form IEC-1182-1 Printed Board Description in Digital Form Compan• ion Documents IPC-D-351 Printed Wiring Documentation in Digital Form IPC-D-352 Electronic Design Database Description for Printed Boards IPC-D-354 Library Format Description for Printed Boards in Digital Form IPC-D-356 Bare Board Electrical Test Information in Digital Form EIA-224-B Character Code for Numerical Machine Control Per• forated Tape EIA-227-A One-Inch Perforated Tape EIA-267-B Axis and Motion Nomenclature for Numerically Controlled Machines EIA-274-D Interchangeable Variable Block Data Format for Po• sitioning, Contouring, and Contouring/Positioning Numerically Controlled Machines EIA-281-B Electrical and Construction Standards for Numerical Machine Control EIA-358-B Subset of American National Standard Code for In• formation Interchange for Numerical Machine Con• trol Perforated Tape EIA-408 Interface Between Numerical Control Equipment on Data Terminal Equipment Employing Parallel Bi• nary Data Interchange EIA-431 Electrical Interface Between Numerical Control and Machine Tools EIA-441 Operator Interface Function of Numerical Controls 734 Appendix A
EIA-474 Flexible Disk Format for Numerical Control Equip• ment Information Interchange EIA-484 Electrical and Mechanical Interface Characteristics and Line Control Protocol Using Communication Control Characters for Serial Data Link Between a Direct Numerical Control System and Numerical Control Equipment Employing Asynchronous Full Duplex Transmission EIA-494 32 BIT Binary CL Exchange (BCL) Input Format for Numerically Controlled Machines
Test Methods
EIA-JEDEC Method B 105-A, Lead Integrity-Plastic Leaded Chip Carrier (PLCC) Packages EIA-JEDEC Method B 102, Surface Mount Solderability Test (JESD22-B) EIA-JEDEC Method B 108, Coplanarity (intended for inclusion into JESD22-C) IPC-TM-650 Test Methods Manual
Repair
IPC-R-700C Guidelines for Repair and Modification of Printed Board Assemblies
Outsourcing
IPC-I720 OEM Standards for Electronics Manufacturing Ser• vices Industry Qualification Profile
Terms and Definitions
IPC-T-50F Terms and Definitions for Interconnecting and Pack• aging Electronic Circuits Appendix 8 Detailed Questionnaire for Evaluating SMT Equipment: Pick-and-Place (Appendix 81), Screen Printer (Appendix 82), and Reflow Oven (Appendix 83).
Appendix 81: Questionnaire for Evaluating SMT Pick-and-Place Equipment for Surface Mounting
Name of company machine: Model #: ____
Contact name: Telephone number: ______
Date ______
Does the equipment comply with Surface Mount Equipment Manufacturers
Association (SMEMA) standards? Yes No ___
Comments
BOARD SIZE HANDLING CAPACITY
Maximum board size? ____ Minimum board size? ____
Maximum board thickness? __ Minimum board thickness? __
Maximum board warpage allowable? ______736 Appendix B
Larger board size capability available? Yes No ___
If Yes: Maximum board size? __ Minimum board size? ___
If the larger board size capability is forecasted but is not yet available, then when will the size above be available? ______
COMMENTS: ______~------
FEEDER TYPES AND SLOT CAPACITY
Part feeders acceptable: Tape ___ Tube ___ Bulk ______
Maximum reel diameter that can be mounted on the machine? ____
Sizes of tape that can be handled (i.e., 8mm, 12mm, etc.)? ______
Maximum number of 8mm feeders that can be mounted on the machine? ______
Number of input slots that each feeder requires (8mm feeder = 1):
12mm 16mm 24mm 32mm Other ___
Tape types handled? Paper ___ Plastic ___ Other ___
COMMENTS: ______
TYPES AND SIZES OF COMPONENTS
What size ranges of components can be placed? (part type and minimax di• mensions)
Chips 1206 and larger __ 0805 __ 0603 __ 0402 __
SOT ______
PLCC Max size and pin count ______
sorC-shrink body __ sorC-narrow body __ sorC-wide body __ Detailed Questionnaire for Evaluating SMT Equipment 737
Fine pitch (20 and 25 mil pitch) __ Ultra fine pitch (specify the pitch) __
Ball grid array (BGA) _ Maximum body size (for any component) _
Otherpackages ______
PLACEMENT RATE
Is this machine dedicated only to certain size components? Large parts __ Small parts __
Average throughput (partslhour) ______
Placement rate for 0805 and 1206 chips (partslhr) ______
Placement rate for 0603 and 0402 chips (partslhr) ______
Typical placement rate for SOICs and PLCCs (partslhr) ______
Typical placement rate for 20125 mil pitch PQFP (partslhr) _____
Typical placement rate for parts under 0.5 mm (20 mil) pitch (partslhr) __
Conditions under which the above speeds are valid? _____~ ___
COMMENTS: ______
PLACEMENT ACCURACY/REPEATABILITY ITEST CAPABILITY
Is on line component test/verification available? ______
If yes, what is the brand of tester used? __ Passive parts only? __
Does the system have auto recovery system for repairing misplaced parts?
__ If yes, describe ______
Placement reliability (with auto recovery)? ______
Placement reliability (without auto recovery)? ______738 Appendix B
Placement Head Details:
Type (i.e. drum, XY, etc.)? ______
Resolution (min increments) X __ Y __ Z __ Theta __
Repeatability (in mils/degrees) X __ Y __ Z __ Theta __
Placement accuracy (in mils) Minimum part spacing _____
Does the head rotate the parts? ______
Are centering fingers used to center the parts? ______
Chuck changes required for different parts? ______
VISION CAPABILITY
Vision system: Standard __ Optional __ Can be added later ($) __
Single Camera _____ Dual Camera _____
Binary imaging system (Back lighting system) __ Gray scale imaging system __
Level of Gray scale (256 levels?) __ Field of view (Largest part in mm)
BGA Placement capability (Gray Scale VisionIFront lighting system) __
COMMENTS: ______
ADHESIVE DISPENSING CAPABILITY
Adhesive Head Details:
Type (i.e., syringe, etc.)? ______Qty. of dispensers? __
Programmable location? __ Programmable amount (time, pressure) __ Detailed Questionnaire for Evaluating SMT Equipment 739
Adhesive viscosity required or common adhesives supported? _____
Thermal jacket for adhesive? __ Positive displacement capability for ad• hesive? __
Programmable patterns of adhesive? __ Max qty patterns? __
Is dispensing unit integral to the machine or is it a separate unit? _____
Maximum speed of the adhesive dispenser? ______
COMMENTS: ______
BOARD HANDLING
Direction of machine flow (i.e. right to left)? ______
Is track width adjustable? _____ If yes, then how is it done:
Manual (crank) __ Fully automatic __
Does the board ever get rotated? _____ If so, why? ______
Is manualload/unload available as an option? ______
Are centering stations available that locate using:
Tooling pins _____ Edge of board _____ Other _____
Can the machine handle pallets that carry circuit boards? ______
Does your company design the pallets? ______
What types of pallets? ______
Will your board handler and centering station work if leaded components are auto inserted prior to SMT placement?
COMMENTS: ______740 Appendix B
PROGRAMMING
Any particular orientation for pin 1 required for CAD library? _____
Capability to identify bad board in a panel (in order to skip placing on it)? __
Methods available to program:
CAD down load __ Manual coordinate entry __ Teach __
Is an off line programming station available? ______
Estimated time to create a program consisting of __ total components with adhesive, and __ different types of parts using one or all of the following:
CAD down load __ Manual coordinate entry __ Teach __
Maximum number of steps per program? ______
Step and repeat capability of multipak boards? ______
Maximum number of steps and repeats per program? ______
NC tape code (i.e., ASCII parity, etc.)? ______
COMPUTER INFORMATION
Does each machine come with a separate computer or do they link into a host computer system? ______
Maximum number of machines per host computer? ______
Computer brand: _____ Model: _____ CPU _____
Amount of RAM in computer? _____ Megabytes
How many programs at one time can be placed in RAM? ______
Type of host interface (i.e., RS232, IEEE, etc.) ______Detailed Questionnaire for Evaluating SMT Equipment 741
PRODUCTION CHANGEOVER TIMES
Estimated time to load a tape feeder? ______
Estimated time to replace a reel on the input carriage? ______
Estimated time to down load a program? ______
Estimated time to change from one board width to another (assume tooling holes in same locations) _____
COMMENTS: ______
MAINTENANCEIW ARRANTY
Standard warranty on parts? ______
Standard warranty on labor? ______
What is your guaranteed lead time for spares and service on down equipment:
Spare parts _____ Service _____
Where are parts and service centers located?
Location(s)
Estimated frequency of repair? ______
Estimated average time per repair? ______
Estimated total up time? ______
Power requirements? ______Air requirements? ______
COMMENTS: ______
TRAININGIDOCUMENTATION
In addition to training on equipment, do you provide SMT process training to your customers? _____
Documentation included: Training: ____ Maintenance: ____ 742 Appendix B
Schematics: ______Operation manual: ______
Programming manual: ______Other: ______
How much training is included at: Factory ____ Installation ____
Maximum number of people who can participate in this training? ___
How long does installation team stay at our factory? ______
How long does a typical acceptance test at your factory take? _____
Where is your factory located? ______
COMMENTS: ______
REFERENCES
Names and telephone numbers of users
Appendix 82: Questionnaire for Evaluating SMT Screen Printing Equipment
Name of company/machine: ______Model #: _____
Contact name: ______Telephone number: _____
Date ______Detailed Questionnaire for Evaluating SMT Equipment 743
BOARD SIZE
Maximum board size? _____ Minimum board size? ______
Maximum board thickness? Minimum board thickness? ____
Maximum board warpage allowable? ______
Larger board size capability available? Yes __ No __
If Yes: Maximum board size? __ Minimum board size? __
Maximum stencil/screen frame holding capability ______
Maximum print area ______
Stencil wipe feature available? ______
Vision alignment feature available? _____ Cost $ _____
COMMENTS: ______
SPEED
Print rate Minimum ___ Maximum ___ Range ___
Print rate adjustment mechanism ______
Print force adjustment ______
Snap-off adjustment ______
COMMENTS: ______
BOARD HANDLING
Direction of machine flow (i.e., right to left)? ______
Is track width adjustable? If yes, then how is it done:
Manual (crank) Fully automatic _____
Does the board ever get rotated? _____ If so, why? ______744 Appendix B
Is manualloadlunload available as an option? ______~
Are centering stations available that locate using:
Tooling pins _____ Edge of board _____ Other ____
Vacuum hold ______
COMMENTS: ______
ADDITIONAL QUESTIONNAIRE
See Appendix B 1 for questionnaire on: computer information, production change-over times, maintenance/warranty, training/documentation, and refer• ences.
Appendix 83: Questionnaire for Evaluating Reflow Oven for Surface Mounting
Name of company/machine: ______Model #: _____
Contact name: ______Telephone number: _____
Date _____
TYPE OF HEAT SOURCEITEMPERATURE UNIFORMITYINITROGEN CAPABILITY
Class I: It is an IR dominant system ______
Class II: It is an IRiconvection dominant system ______
Class III: It is a convection dominant system ______
Heat circulation mechanism ____.______Detailed Questionnaire for Evaluating SMT Equipment 745
Number of heating zones _____ Top heating zones _____ Bottom heating zones _____
Can the temperature of each zone be controlled individually? _____
Fan at the end of the oven for cooling? ______
Ever experienced fire hazard from deposited flux inside the cooling fan? __
Explmn ______
Uniformity of temperature across board ______
Center of the board ______Edge of the board ______
Use heated rails? _____ Nitrogen inerting capability _____
Can it be retrofitted with nitrogen inerting capability later? ______
Cost of retrofit _____ Consumption of Nz/hour __ $Ihr ___
Temperature control mechanism ______
Time to ramp to reflow temperature _____
Time to ramp down to adhesive cure temperature from reflow temper- ature _____
COMMENTS: ______
BOARD SIZE AND THROUGHPUT
Maximum board size? _____ Minimum board size? _____
Conveyor speed: Minimum ___ Maximum ___ Range ____
List the applicable (a) conveyor speed and (b) temperature uniformity for ovens with different number of zones (4, 5, 7, 10, etc.) to achieve the same profile for a particular board under evaluation: 746 Appendix B
(a) Conveyor speed __ in __ zone oven __ in __ zone oven __ in __ zone oven
(b) Temperature uniformity __ Dp (DC) in __ zone oven __ DP(DC) in __ zone oven
BOARD HANDLING
Direction of machine flow (i.e., right to left)? ______
How do you reflow double-sided SMT board? ______
Impact of pallets on thermal profile ______
Is track width adjustable? _____ If yes, then how is it done:
Manual (crank) ______Pully automatic ______
Is manualloadlunload available as an option? ______
COMMENTS: ______
ADDITIONAL QUESTIONNAIRE:
See Appendix B 1 for questionnaire on: computer information, production change-over times, maintenance/warranty, training/documentation, and refer• ences. Appendix C Glossary
A-Stage. The condition of low molecular weight of a resin polymer during which the resin is readily soluble and fusible. Anisotropic Adhesive. A material filled with a low concentration of large conductive particles designed to conduct electricity in the Z axis but not the X or Y axis. Also called a Z axis adhesive. Annular Ring. The conductive material around a drilled hole. Aqueous Cleaning. A water-based cleaning methodology which may in• clude the addition of the following chemicals: neutralizers, saponifiers, and surfactants. May also use DI (deionized) water only. Aspect Ratio. A ratio of the thickness of the board to its preplated diameter. A via hole with aspect ratio greater than 3 may be susecptible to cracking. Azeotrope. A blend of two or more polar and nonpolar solvents that behaves as a single solvent to remove polar and nonpolar contaminants. It has one boiling point like any other single component solvent, but it boils at a lower temperature than either of its constituents. The constituents of the azeotrope cannot be separated by distillation. B. Stage. -See Prepreg Ball Grid Array (BGA). Integrated circuit package in which the input and output points are solder balls arranged in a grid pattern. Blind Via. A via extending from an inner layer to the surface. See also Via Hole. Blowhole. A large void in a solder connection created by rapid outgassing during the soldering process. Bridge. Solder that "bridges" across two conductors that should not be electrically connected, thus causing an electrical short. Buried Via. A via hole connecting internal layers that does not extend to the board surface. Butt Joint. A surface mount device lead that is sheared, so that the end of the lead contacts the board land pattern. (Also called "I-Lead"). C-Stage Resin. A resin in a final state of cure. See also B-Stage and Prepreg. 748 Appendix C
Capillary Action. The combination of force, adhesion, and cohesion which causes liquids such as molten metal to flow between closely spaced solid surfaces against the force of gravity. Castellation. Metallized semicircular radial features on the edges of LCCC's that interconnect conducting surfaces. Castellations are typically found on all four edges of a leadless chip carrier. Each lies within the termination area for direct attachment to the land patterns. CFC. Chlorinated flurocarbon, cause depletion of ozone layer and sched• uled for restricted use by the environmental protection agency. CFCs are used in air conditioning, foam insulation and solvents, etc. Characteristic Impedance. The voltage-to-current ratio in a propagation wave, i.e., the impedance which is offered to the wave at any point of the line. In printed wiring its value depends on the width of the conductor to ground plane(s) and the dielectric constant to the media between them. Chip Component. Generic term for any two-terminal leadless surface mount passive devices, such as resistors and capacitors. Chip-on-Board Technology. Generic term for any component assembly technology in which an unpackaged silicon die is mounted directly on the printed wiring board. Connections to the board can be made by wire bonding, tape automated bonding (TAB), or flip-chip bonding. CLCC. Ceramic leaded chip carrier. Cold Solder Joint. A solder connection exhibiting poor wetting and a grayish, porous appearance due to insufficient heat or excessive impurities in the solder. Column Grid Array (CGA). Integrated circuit package in which the inpit and output points are high temperature solder cylinders or columns arranged in a grid pattern. Component Side. A term used in through-hole technology to indicate the component side of the PWB. See also Primary Side and Secondary Side. Condensation Inert Heating. A general term referring to condensation heating where the part to be heated is submerged into a hot, relatively oxygen-free vapor. The part, being cooler than the vapor, causes the vapor to condense on the part transferring its latent heat of vaporization to the part. Also known as vapor phase soldering. Constraining Core Substrate. A composite printed wiring board consist• ing of epoxy-glass layers bound to a low thermal-expansion core material, such as copper-invar-copper, graphite-epoxy, and aramid fiber-epoxy. The core constrains the expansion of the outer layers to match the expansion coefficient of ceramic chip carriers. Contact Angle. The angle of wetting between the solder fillet and the termination or land pattern. A contact angle is measured by constructing a line tangent to the solder fillet that passes through a point of origin located at the plane of intersection between the solder fillet and termination Glossary 749
or land pattern. Contact angles of less than 90°C (positive wetting angles) are acceptable. Contact angles greater than 90°C (negative wetting angles) are unacceptable. Control Chart. A chart that tracts process performance over time. Trends in the chart are used to identify process problems that may require corrective action to bring the process under control. Coplanarity. The maximum distance between the lowest and the highest pin when the package rests on a perfectly flat surface. 0.004 inch maximum coplanarity is acceptable for peripheral packages and 0.008 inch maximum for BGA. Crazing. An internal condition that occurs in the laminated base material in which the glass fibers are separated from the resin at the weave intersec• tions. This condition manifests itself in the form of connected white spots, of "crosses," below the surface of the base material, and is usually related to mechanically induced stress. CTE (Coefficient of Thermal Expansion). The ratio of the change in dimensions to a unit change in temperature. CTE is commonly expressed in ppm/°C. Delamination. A separation between plies within the base material, or between the base material and the conductive foil, or both. Dendritic Growth. Metallic filament growth between conductors in the presence of condensed moisture and electrical bias. (Also known as "whiskers.") Design for Manufacturability. Designing a product to be produced in the most efficient manner possible in terms of time, money, and resources taking into consideration how the product will be processed, utilizing the existing skill base (and avoiding the learning curve) to achieve the highest yields possible. Dewetting. A condition that occurs when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film. Voids may also be seen in the dewetted areas. Dewetting is difficult to identify since solder can be wetted at some locations and base metal may be exposed at other locations. Dielectric Constant. A property that is a measure of a material's ability to store electrical energy. DIP (Dual In-Line Package). A package intended for through-hole mount• ing that has two rows of leads extending at right angles from the base with standard spacing between leads and row. Disturbed Solder Joint. A condition that results from motion between the joined members during solder solidification. Disturbed solder joints exhibit an irregular surface appearance, although they may also appear lustrous. Drawbridging. A solder open condition during reflow in which chip resis• tors and capacitor resemble a draw bridge. See also Tombstoning. 750 Appendix C
Dual-Wave Soldering. A wave soldering process that uses a turbulent wave with a subsequent laminar wave. The turbulent wave ensures complete solder coverage in tight areas and the laminar wave removes bridges and icicles. Designed for soldering surface mount devices glued to the bottom of the board. Electroless Copper. Copper plating deposited from a plating solution as a result of a chemical reaction and without the application of an electri• cal current. Electrolytic Copper. Copper plating deposited from a plating solution by the application of an electrical curent. Etchback. The controlled removal of all components of base material by a chemical process on the side wall of holes in order to expose additional internal conductor areas. Eutectic. The alloy of two or more metals that has a lower melting point than either of its constituents. Eutectic alloys, when heated, transform directly from a solid to a liquid and do not show pasty regions. Fiducial. A geometric shape incorporated in the artwork of a printed wiring board, and used by a vision system to identify the exact artwork location and orientation. Generally three fiducial marks are used per board. Fiducial marks are necessary for the accurate placement of fine pitch packages. Both global and local fiducials can be used. Global fiducials (generally three) locate the overall circuitry pattern to the PCB, whereas local fiducials (one or two) are used at component locations, typically fine pitch patterns, to increase the placement accuracy. Also known as alignment target. Fillet. (1) A radius or curvature imparted to inside meeting surfaces. (2) The concave junction formed by the solder between the footprint pad and the SMC lead or pad. Fine Pitch. A center to center lead distance of surface mount packages of 0.025 inch or less. Flatpack. An integrated circuit package with gull wing or flat leads on two or four sides, with standard spacing between leads. Commonly the lead pitches are at 50 mil centers, but lower pitches may also be used. The packages with lower pitches are generally referred to as fine pitch packages. Flip Chip. A leadless structure which is electrically and mechanically con• nected to the substrate via contact lands or solder bumps. Flip-Chip Technology. A chip-on-board technology in which the silicon die is inverted and mounted directly to the printed wiring board. Solder is deposited on the bonding pads in vacuum. When inverted, they make contact with the corresponding board lands and the die rests directly above the board surface. It provides the ultimate in densification also known as C4 (controlled collapse chip connection). Footprint. A nonpreferred term for Land Pattern. See Land Pattern. Glossary 751
Functional Test. An electrical test of an entire assembly that simulates the intended function of the product. Glass Transition Temperature. The temperature at which a polymer changes from a hard and relatively brittle condition to a viscous or rubbery condition. This transition generally occurs over a relatively narrow tempera• ture range. It is not a phase transition. In this temperature region, many physical properties undergo significant and rapid changes. Some of those properties are hardness, brittleness, thermal expansion, and specific heat. Gull Wing Lead. A lead configuration typically used on small outline packages where leads bend and out. An end view of the package resembles a gull in flight. Icicle (Solder). A sharp point of solder that protrudes out of a solder joint, but does not make contact with another conductor. Icicles are not ac• ceptable. In-Circuit Test. An electrical test of an assembly in which each component is tested individually, even though many components are soldered to the board. Ionograph. An instrument designed to measure board cleanliness (the amount of ions present on a surface). It extracts ionizable materials from the surfaces of the part to be measured and records the rate of extraction and the quantity. JEDEC. Joint Electronic Device Engineering Council. J-Lead. A lead configuration typically used on plastic chip carrier packages which have leads that are bent underneath the package body. A side view of the formed lead resembles the shape of the letter "J." Known Good Die. Semiconductor die that has been tested and is known to function to specification. Laminar Wave. A smoothly flowing solder wave with no turbulence. See Dual-Wave Soldering. Land. A portion of a conductive pattern usually, but not exclusively, used for the connection, or attachment, or both of components. (Also called a "pad"). Land Pattern. Component mounting sites located on the substrate that are intended for the interconnection of a compatible Surface Mount Compo• nent. Land patterns are also referred to as "lands" or "pads." LCC. A nonpreferred term for "leadless ceramic chip carrier." LCCC (Leadless Ceramic Chip Carrier). A ceramic, hermetically-sealed, integrated circuit package commonly used for military applications. The package has metallized castellations on four sides for interconnecting to the substrate. (Also known as LCC). Leaching. The dissolution of a metal coating, such as silver and gold, into liquid solder. Nickel barrier underplating is used to prevent leaching. Also known as scavenging. 752 Appendix C
Lead Configuration. The solid formed conductors that extend from a com• ponent and serve as a mechnical and electrical connection that is readily formed to a desired configuration. The gull wing and the J-Iead are the most common surface mount lead configurations. Less cOl1)IIlon are butt leads formed by cutting standard DIP package leads at the knee. See also Butt Joint. Lead Pitch. The distance between successive centers of the leads of a component package. The lower the lead pitch, the smaller the package area for a given pin count in a package. In DIP, the lead pitch is 100 mil; in surface mount packages it is 50 mil. For fine pitch, commonly used lead pitches are 33 (Japanese), 25, and 20 mils. In tape automated bonding (see TAB), generally 10 mil pitches are used. Legend. Letters, numbers, symbols, and/or patterns on the PCB that are used to identify component locations and orientation for aid in assembly and rework/repair operations. Manhattan Effect. See Drawbridging. Mass Lamination. The simultaneous lamination of a number of pre-etched, multiple image, C-stage panels or sheets, sandwiched between layers of prep reg (B-stage) and copper foil. Mealing. A condition at the interface of the conformal coating and base material, in the form of discrete spots or patches, which reveals a separation of the conformal coating from the surface of the printed board, or from the surfaces of attached components, or from both. Measling. An internal condition that occurs in laminated base material in which the glass fibers are separated from the resin at the weave intersection. This condition manifests itself in the form of discrete white spots or "crosses" below the surface of the base material, and is usually related to the thermally induced stress. MELF. A metal electrode leadless face surface mount device that is a round, cylindrical passive component with a metallic cap termination located at each end. Metallization. A metallic deposited on substrates and component termina• tions by itself, or over a base metal, to enable electrical and mechnical interconnections. Multichip Module (MCM). A circuit comprised of two or more silicon devices bonded directly to a substrate by wire bond, TAB, or flip chip. Multilayer Board. A printed wiring board that uses more than two layers for conductor routing. Internal layers are connected to the outer layers by way of plated via holes. Neutralizer. An alkaline chemical added to water to improve its ability to dissolve organic acid flux residues. No-Clean Soldering. A soldering process that uses a specially formulated Glossary 753
solder paste that does not require the residues to be cleaned after solder pro• cessing. Node. An electrical junction connecting two or more component termina• tions. Nonwetting. A condition whereby a surface has contacted molten solder, but has had part or none of the solder adhere to it. N onwetting is recognized by the fact that the bare base metal is visible. It is usually caused by the presence of contamination on the surface to be soldered. Omegameter. An instrument used to measure board cleanliness (ionic resi• dues on the surface of PCB assemblies). The measurement is taken by immersing the assembly into a predetermined volume of a water-alcohol mixture with a known high resistivity. The instrument records and measures the drop of resistivity caused by ionic residue over a specified period of time. Also see Ionograph. Ounces of Copper. This refers to the thickness of copper foil on the surface of the laminate: 112 ounce copper, 1 ounce copper, and 2 ounces copper are common thicknesses. One ounce copper foil contains 1 ounce of copper per square foot of foil. The foil on the surface of the laminate may be designated for the copper thickness on both sides by: III = 1 ounce, two sides; 212 = 2 ounces, two sides; and 211 = 2 ounces on one side and 1 ounce on the other side. 112 ounce = 0.72 mil = 0.00072 inch; 1 ounce = 1.44 mils = 0.00144 inch; 2 ounces = 2.88 mils = 0.00288 inch. Outgassing. De-aeration or other gaseous emission from a printed circuit board or solder joint. PAD. A portion of a conductive pattern usually, but not exclusively, used for the connection, attachment, or both of components. Also called a "Land." Pin Grid Array (PGA). Integrated circuit package in which the input and output points are through-hole pins arranged in a grid pattern. P/I Structure. Packaging and interconnecting structure. See Printed Cir• cuit Board PCBIPrinting Wiring Board (PWB). PLCC (Plastic Leaded Chip Carrier). A component package that has J• leads on four sides with standard spacing between leads. Prepreg. Sheet material (e.g., glass fabric) impregnated with a resin cured to an intermediate stage (B-stage resin). Primary Side. The side of the assembly that is commonly referred to as the component side in through-hole technology. In SMT, the primary side is reflow soldered. Printed Circuit Board (PCB)IPrinted Wiring Board (PWB). The general term for completely processed printed circuit configurations. It includes rigid or flexible, single, double, or multilayer boards. A substrate of epoxy glass, clad metal, or other material upon which a pattern of conductive traces is formed to interconnect components. 754 Appendix C
Printed Wiring Assembly (PWA). A printed wiring board on which sepa• rately manufactured components and parts have been added. The generic term for a printed wiring board after all electronic components have been completely attached. Also called "printed circuit assembly." Profile. A graph of time versus temperature. PTH (Plated Through Hole). A plated via used as an interconnection between top and bottom sides or inner layers of a PWB. Intended for mounting component leads into through-hole technology. Quadpack. Generic term for SMT packages with leads on all four sides. Most commonly used to describe packages with gull wing leads. Also known as a flat pack, but flat packs may have gull wing leads on either two or four sides. Reference Designators. A combination of letters and numbers that identify the class of the component on an assembly drawing. Reflow Soldering. A process of joining metallic surfaces (without the melt• ing of base metals) through the mass heating of preplaced solder paste to solder fillets in the metallized areas. Resin Recession. The presence of voids between the barrel of the plated through hole and the wall of the holes, seen in cross-sections of plated through holes in boards that have been exposed to high temperatures. Resin Smear. A condition usually caused by drilling in which the resin is transferred from the base material to the wall of a drilled hole covering the exposed edge of the conductive pattern. Resist. Coating material used to mask or protect selected areas of a pattern from the action of an etchant, solder, or plating. Saponifier. An alkaline chemical, when added to water, makes it soapy and improves its ability to dissolve rosin flux residues. Secondary Side. The side of the assembly that is commonly referred to as the solder side in through hole technology. In SMT, the secondary side may be either reflow soldered (active component) or wave soldered (pas• sive component). Self-Alignment. Due to the surface tension of molten solder, the tendency of slightly misaligned components (during placement) to self align with respect to their land pattern during reflow soldering. Minor self-alignment is possible, but one should not count on it. Semi-Aqueous Cleaning. This cleaning technique involves a solvent clean• ing step, hot water rinses, and a drying cycle. Shadowing (Infrared Reflow). A condition in which component bodies block radiated infrared energy from striking certain areas of the board directly. Shadowed areas receive less energy than their surroundings and may not reach a temperature sufficient to completely melt the solder paste. Shadowing (Solder). A condition in which solder fails to wet the surface mount device leads during the wave soldering process. Generally the trail- Glossary 755
ing terminations of a component are affected, because the component body blocks the proper flow of solder. Requires proper component orientation during wave soldering to correct the problem. Single-Layer Board. A printed wiring board that contains metallized con• ductors on only one side of the board. Through-holes are unplated. Single-Wave Soldering. A wave soldering process that uses only a single, laminar wave to form the solder joints. Generally not used for wave sol• dering. SMC. A surface mount component. SMD. A surface mount device. Registered service mark of North American Philips Corporation to denote resistor, capacitor, SOIC, and SOT. SMOBC (Solder Mask Over Bare Copper). The technology of using solder mask to protect the external bare copper circuitry from oxidation, and for coating the exposed copper circuitry with tin-lead solder [usually by using the hot air level (HAL) manufacturing process]. SMT (Surface Mount Technolgy). A method of assembling printed wiring boards or hybrid circuits, where components are mounted onto the surface rather than inserted into through-holes. SOIC (Small Outline Integrated Circuit). An integrated circuit surface mount package with two parallel rows of gull-wing leads, with standard spacing between leads and rows. SOJ (Small Outline J-Leaded). An integrated circuit surface mount pack• age with two parallel rows of J-Leads, with standard spacing between leads and rows. Generally used for memory devices. Solder Balls. Small spheres of solder adhering to laminate, mask, or con• ductors. Solder balls are most often associated with the use of solder paste containing oxides. Baking of paste may minimize formation of solder balls, but overbaking may cause excessive balling. Solder Bridging. The undesirable formation of a conductive path by solder between conductors. Solder Cream. See Solder Paste. Solder Fillet. A general term used to describe the configuration of a solder joint that was formed with a component lead or termination and a PWB land pattern. Solder Paste. A homogeneous combination of minute spherical solder parti• cles, flux, solvent, and a gelling or suspension agent used in surface mount reflow soldering. Solder paste can be deposited on a substrate via solder dispensing and screen or stencil print. Solder Side. A term used in through-hole technology to indicate the sol• dered side of the PWB. See Primary Side and Secondary Side. Solder Wicking. The capillary action of molten solder to a pad or compo• nent lead. In the case of leaded packages, excessive wicking can lead to an insufficient amount of solder at the lead/pad interface. It is caused by 756 Appendix C
rapid heating during reflow or excessive lead coplanarity, and is more common in the vapor phase than in IR soldering. Solvent. Any solution capable of dissolving a solute. In the electronics industry, aqueous, semi-aqueous and non-ozone-depleting solvents are used. Solvent Cleaning. The removal of organic and inorganic soils using a blend of polar and nonpolar organic solvents. SOT (Small Outline Transistor). A discrete semiconductor surface mount package that has two gull wing leads on one side of the package and one on the other. Squeegee. A rubber or metal blade used in screen and stencil printing to wipe across the screen/stencil to force the solder paste through the screen mesh or stencil apertures onto the land pattern of the PCB. Stencil. A thick sheet of metallic material with a circuit pattern cut into it. Surface Insulation Resistance (SIR). A measure in ohms of the insulating material's electrical resistance between conductors. Surfactant. Contraction of "surface active agent." A chemical added to water in order to lower surface tension and allow penetration of water under tighter spaces. TAB (Tape Automated Bonding). The process of mounting the integrated circuit die directly to the surface of the substrate, and interconnecting the two together using a fine lead frame. Tape Carrier Package (TCP). See TAB. Tenting. A printed board fabrication method of covering over plated via holes and the surrounding conductive pattern with a resist, usually dry film. (See Via hole and PTH.) Termination. The metallization surfaces, or in some cases, metal end clips on the ends of passive chip components. Thixotropic. The characteristic of a liquid or gel that is viscous when static, yet fluid when physically "worked." Tombstoning. See Drawbridging. Type I Assembly. An exclusive SMT PCB assembly with components mounted on one or both sides of the substrate. Type II Assembly. A mixed technology PCB assembly with SMT compo• nents mounted on one or both sides of the substrate and through-hole components mounted to the primary or component side. Type III Assembly. A mixed technology PCB assembly with passive SMT components and occasionally SOICs (small outline integrated circuits) mounted on the secondary side of the substrate and through-hole compo• nents mounted to the primary or component side. Typically this type of assembly is wave soldered in a single pass. Ultra Fine Pitch. A center to center lead distance of surface mount packages of O.4mm or less. Glossary 757
Vapor Phase Soldering. See Condensation Inert Heating. Via Hole. A plated through hole connecting two or more conductor layers of a multilayer printed board. There is no intention to insert a component lead inside a via hole. Void. The absence of material in a localized area. See also Blowhole. Wave Soldering. A process of joining metallic surfaces (without the melt• ing of the base metals) through the introduction of molten solder to metal• lized areas. Surface mount devices are attached using adhesive and are mounted on the secondary side of the PWB. Weave Exposure. A surface condition of base material in which the unbro• ken fibers of woven glass cloth are not completely covered by resin. Wetting. A physical phenomenon ofliquids, usually in contact with solids, wherein the surface tension of the liquid has been reduced so that the liquid flows and makes intimate contact in a very thin layer over the entire substrate surface. Regarding wetting of a metal surface by a solder, flux reduces the surface tension of the metal surface and the solder, resulting in the droplets of solder collapsing into a very thin film, spreading, and making intimate contact over the entire surface. Wicking. Absorption of liquid by capillary action along the fibers of the base metal. See also Solder Wickering. Index
Accelerated test, of solder joint reliability, 254, Approved qualification status, for suppliers, 69 256 Aqueous cleaning solvents, 623, 630-36 Accept/reject criteria, for solder joints, See Assembly. See also Manufacturing workmanship costs of as design consideration, 225-26 Accept/reject criteria, for voids in adhesive, quality control and testing of, 709-15 367, 368 Automated inspection, of solder joints, 683-90 Accuracy, of placement machines, 503-505 Automated placement, of parts, 496 Acrylic adhesives, 345-46, 375, 376, 377, 378, Automated test equipment (ATE) 379 fixtures for, 711-14 Active SMT components guidelines for, 331-34 characteristics of, 103-109 issues in, 714-15 plastic packages as, 109-29 solder joint inspection and, 683 standards for, 728 Automatic printers, for solder paste, 404 Adhesives acrylic adhesives, 345-46 application methods, 350-58 Baking, high and low temperature cycles for, conductive adhesives, 346-50 247-48. See also Curinglbaking ovens curing of, 341, 358-69 Ball grid array (BOA) packages defects related to, 663-64 alignment of components for placement, differential scanning calorimetry and evalua• 300-302, 506 tion of, 369-80 characteristics of as SMT components, dispensing capability of placement equip- 129-36 ment, 508, 509 design considerations for, 211 epoxy adhesives, 344-45 inspection of, 683, 685-90 introduction to, 339 land pattern design for, 291-92 postcure properties of, 342-43 moisture-related cracking of, 29 precure properties of, 340-41 repair of, 701-707 single-step soldering and, 556-58 solder paste printing and, 437 void in adhesive, 362-368 Ball-wedge bonding, and chip-and-wire technol- wave soldering and contamination of, 678, ogy, 36 679 Barrel plating cracks, 199, 200 Alignment targets, for placement of compo• Barrier underplating. See Nickel nents, 300-302, 506 Base limiting layer (BLM), for flip chip, 46 Alumina, advantages and disadvantages of as Batch-to-batch variation, in adhesives, 369 substrate, 158, 167 Batch cleaners, 624-25, 626-29, 634 Aluminum, and contamination of solder, 459 BeryIlia, and composition of ceramic sub- Anisotropic electrically conductive adhesives, strates, 167 348, 349 Binary phase diagram, 445-47 Application specific integrated circuit (ASIC) Binary vision imaging system, for component devices, 126, 305 placement, 506, 507 760 Index
Bismaleimide triazene (BT) resin, 134 Ceramic substrates, characteristics of, 167-69 Bismuth, in lead-free solders, 461, 463 Chelation, of water, 633-34 Bismuth-tin, phase diagram, 465 Chemically etched stencils, 432-34, 435, Black ball phenomenon, in solder paste, 401 436 Blind vias, cost of, 220 Chip-on-board (COB) technology Board warpage description of processes, 33-36 quality control and, 659-60 tape-automated bonding (TAB) compared to, solder paste printing and, 431 39 Body sizes, of BGAs, 130-31 Chip capacitors, at SIR site, 647-48 Bond strength, and thermal cure profile of ad• Chip scale packaging (CSP), characteristics of, hesive, 359-62 136-37 Brazing, definition of, 533 Chip-and-wire technology, description of pro• Bridging, and wave soldering, 537-39, 549, cesses in, 36-38 550, 677-78 Chlorofluorocarbons (CFCs), environmental im• Brookfield viscometer, 395-96, 426, See also pact and decline in use of, 25, 552, 558, Maleom viscometer 598, 615, 616-19 Bulk feeders, 518 Cleaning and cleanliness, selection of pro- Bumped tape-automated bonding (BTAB), cesses for 39-40 adhesives and tests for, 367 Buried vias, cost of, 220 alternatives to CFCs, 623 Butt leads, 142-43, 673, 674 aqueous cleaning, 630-36 Butt mounting, 287-89 capital investment in equipment for, 25 cleanliness testing and requirements, 636- 46 Capacitors concerns in, 599-601 characteristics of ceramic, 92-97 contaminants and, 612-15 cracking of, 95, 661-63 designing for, 330, 646-48 land patterns for, 269-70 introduction to, 598-99 standards for, 727-28 organic solvents and, 623-25 tantalum, 97-101 selection of materials for, 615-21 wave soldering and shift in tolerance, 539 semi-aqueous cleaning, 625-30 Capital investment, in SMT equipment, 20-27, solder paste and, 393 493 test methods for, 636-46 Carbon dioxide lasers, 585 Coatings, alternative for board surfaces, 191- Case sizes 94. See also Surface finish of ceramic capacitors, 96-97 Coefficients of thermal expansion (CTEs) of molded tantalum capacitors, 99, 100 characteristics of substrates, 152-55 of resistors, 90 constraining core substrates, 169-73 Castellations, of leadless ceramic chip carriers, LCCCs and mismatch of, 5 104 package cracking and, 234 Ceramic ball grid array (CBGA) solder joint cracking and, 251-52 characteristics of, 131-32 substrate selection and compatibility, solder ball composition in, 706, 707 163-65 Ceramic capacitors, characteristics of, 92-97, Cohesive failure, in adhesives, 342 648 Colored adhesives, 340 Ceramic column grid array (CCGA), 132-33 Colored resistive layer, of surface mount resis• Ceramic leaded chip carriers, characteristics of, tor, 90-91 108-109 Color legends, and solder mask application, Ceramic packages 183-84 characteristics of, 103-109 Column diameter, for CCGAs, 132-33 cracking of plated-through holes, 30 Compliant layer substrates, 173-74 Index 761
Components, for SMT. See also Placement, of Cost components benefits of SMT, 19-20 ball grid arrays (BGAs), 129-36 design and considerations of, 208, 218-26 characteristics of, 86-87 hot bar soldering and, 590 chip scale packaging (CSP), 136-37 metal composition of solder paste and, 385, cleaning materials and, 620 387 cost and, 224-25 selection of cleaning materials and, 619-20 defects related to, 660-63 selection of soldering options and, 593-94 design issues, 211-12 Cover plates, and wave soldering, 308, 309 design-for-manufacturability and orientation Cracking. See also Moisture-induced cracking of,311-16 as component-related defect, 661-63 design-for-manufacturability and selection DIP leads and, 306 of,302-305 mechanisms of, 234-44 introduction to, 85-86 moisture-sensitivity classification for, 233- land patterns for, 266-72 34, 248-50 lead configuration, 140-43 reliability of plastic packages and, 233-34 lead coplanarity, 138-39 solutions to, 244-48 passive surface mount components, 87- of via holes in substrate, 198-201 102 Curing, of adhesives, 358-69 procurement guidelines for, 144-46 Curinglbaking ovens, capital investment in, solder paste printing and types of, 436-41 23-24 standards for, 144, 726-30 Cyanoacrylate adhesives, 346 types and sizes of and selection of place• Cyclic hysteresis loop, 254--55 ment equipment, 502 Cylindrical components, solder joint require• Computer-assisted design (CAD) ments for, 669, 670 design and layout considerations, 260-61 Cylindrical passive (MELF) devices, land pat• land patterns and, 267 terns for, 272-75 pad-to-pad spacing and, 317 placement equipment and, 510 tooling of for SMT, 30 Data loggers, and wave soldering, 543 Condensation soldering. See Vapor phase sol• Deionization, of water for cleaning, 631, dering 633-34 Conditional qualification status, of suppliers, Deming, W. Edwards, 652, 653 68-69 Department of Defense, and SMT standards, Conductive adhesives, 343, 346-50 62. See also Military Conductive tooling, for repair and rework, 26 Desiccants Constraining core substrates, 149, 169-73 classification and floor life of components Contaminants, and cleaning, 612-15 packed in, 240 Controlled collapse bonding, 41-47 shipping of baked packages in, 245 Convection ovens Design, of SMT. See also Design for manufact- for adhesive curing, 358, 359, 364, 366 urability (DFM) for reflow soldering, 24 CAD layout and, 260-61 Cooling zone, in reflow soldering, 582 cleaning and, 646-48 Copper, and glass epoxy substrates, 175. See cost as factor in, 218-26 also Copper plating defects related to, 665-66 Copper plating, electroless and electrolytic pro• interconnections and, 257-60 cesses of, 186-89 introduction to, 204-205 Corner bumpers, and fine pitch packages, 127, land pattern, 264-95 128 manufacturing considerations in, 214, Cosmetic defects, 668-69 217-18 Cosolvent cleaning, 623-24 package drivers, 207-12 762 Index
reliability of package and, 232-50 Elasticity, and compatible CTE approach to solder joint reliability and, 250-57 substrate selection, 164-65 space concerns in, 212-14 Elastomeric adhesives, 343 specifications of rules and guidelines for, 59 Electrically conductive adhesives, 346-48, 349 standards for, 730-31 Electrical system, and package design, 208 system considerations in, 205-206 Electroformed stencils, 434-36 thermal considerations in, 226-32 Electroless plating wave soldering and, 536-40 copper plating, 186-89 Design for manufacturability (DFM). See also definition of, 184 Design Electrolytic plating, and copper, 186-89 cleanliness and, 330 Electromechanical components, standards for, component orientation and, 311-16 728-30 general considerations in, 299-302 Electromigration, of polar contaminants in in-house documents for, 265 cleaners, 614 inter-package spacing, 316-17 Electronics Industries Association (EIA), 60, introduction to, 296-97 61-62,264,2655 organizational structure for, 297-99 Electronics Industries Association of Japan repairability and, 328-29 (ElAJ), 126-29,264,265 soldering and, 305-11 Electroplating, definition of, 184 solder mask and, 326-28 Encapsulated tantalum capacitors, 303 testability and, 330-34 Epoxy adhesives, 344-45, 372, 373, 374, 375 via holes and, 322-26 Epoxy aramid fiber and paper, advantages and Design team, and organizational structure for disadvantages of, 156 DFM,297-99 Equipment, for surface mount technology. See Dewetting, of solder, 469-71 also Placement; Printing; Solder and sol• Die size, and package cracking, 239-40 dering Differential scanning calorimetry, and evalua- capital investment required, 20-27 tion of adhesives, 369-80 specifications for, 58-59 Dip and look test, 476-79 Etched stencils, 432-34, 435, 436 Dispensing, and solder paste printing, 423-24 Eutectic solder, 456 Dissolution, of metals in solder, 452, 453, See Eutectic temperature, and phase diagram, 447 also leaching Evaluation. See also Tests and testing Double-sided boards of adhesives through differential scanning single-step soldering of, 556-58 calorimetry, 369-80 solder considerations in design of, 310-11 of suppliers, 67 Drawbridging, and component misalignment, Excess solder joints, 677 678 Experience, SMT processes and hands-on, 57 Driclad resin, 134 External SMT infrastructure, and standards, Dry film solder masks, 195-97, 198, 327, 539 60-62 Dual in-line packages (DIPs) butt mounting of, 143 development of, 3, 4 Fabrication, of glass epoxy substrates, 178-84 gull wing or J leads and cracking of, 306 Fatigue resistance, of solder alloys, 456 land patterns for, 287-89 Feeders, for placement machines moisture-related cracking of, 29 input rates of, 500, 502 Dual-wave soldering, 545-47 selection of, 514-22 Dul! solder joints, 459-60 Fiberglass/aramid composite fiber, advantages Dynachem Conformask, 327 and disadvantages of, 157 Fiberglass/Tefion laminates, advantages and dis• advantages of, 157 ECD Inc. (Portland, OR), 543, 577 Fiducials, for placement, 300-302 EDI Inc. (San Diego, CAl, 543, 577 Filler metals, in adhesives, 347, 348 Index 763
Fillet size, and metal content in solder paste, Gritty solder joints, 459 388 G-lO laminates, 176 Fine pitch packages GT laminate, 176 alignment targets for component placement, Guidelines 508 for acceptable solderability in dip and look characteristics of, 126-29 test, 478 design considerations for, 211 for adhesive dot sizes, 352 land patterns for, 289-91 for ATE testing, 331-34 solder paste printing and, 437-38 for component selection, 302-305 Fire hazard, cleaning solvents as, 621 for manual placement of components, Fit, as design consideration, 206 495-96 Flash point, of solvents, 621 Gull wing leads Flat packs, development of, 3-4 configuration of, 140-41 Flex on cap (FOC), 47 land patterns for fine pitch packages and, Flexible dielectric, advantages and disadvan- 289-91 tages of, 157 solder joint requirements for, 671 Flexible metal mask stencils, 420-21 GX laminate, 176 Flip chip, 41-47 Flux activators in solder paste, 391-93 Halide-free fluxes, 603-605 classification of, 603-12 Halons, 616, 618 entrapment of and adhesive cure profile, Heating zones, and infrared reflow soldering, 362, 364, 367 569 function of, 601-602 Heat sinks, 349, 350 introduction to, 598-99 Heat spreaders selection of, 602-603 package design and, 227-28, 230 solderability testing and, 476 cracking and, 240, 244 wave soldering and activity monitoring, Heat transfer mechanism 540-41 in convection dominant soldering systems, Form, as design consideration, 206 571-73 FR-4 laminates, 176 in infrared dominant soldering systems, Function, as design consideration, 206-207 570-71 Functional cycling, as solder joint reliability in vapor phase soldering, 561-63 test, 253 Hermetic leadless ceramic chip carriers, types of, 104-105, 107-108 Hexamethyldisilazane (HMDS) vapor, 244 Gang bonding, and TAB, 38 HFE-7100, 623 Glass epoxy substrates, characteristics of, High temperature baking, 247 174-84 Hollis turbulent wave, 550, 551 Glass transition temperature, and substrate lami- Horizontal tube feeders, 519 nates, 150-52 Hot air repair/rework tools, 26, 328-29, 694- Global warming, and CFCs, 617, 618, 623 97,699-701 Globule test, 482 Hot air solder leveling (HASL), 190, 484 Gold Hot bar soldering, 588-91 as alternative coating for board surface, Hot belt reflow soldering, 592 193-94 Hot dipping process, 485, 487-88 ceramic substrates and, 167-68 Humidity indicator cards (HIC), 245, 246, indium-lead alloy solders and, 385 248 plating with, 189 Hybrid technology, and development of SMT, 4 Gray scale vision imaging systems, for BGA Hydrochloric acid, as polar contaminant, 615 placement, 506, 507 Hydrofluorocarbon (HFC) solvents, 623 Greenhouse effect, and CFCs, 617, 618 Hydrofluoroether (HFE) cleaning solvent, 623 764 Index
Icicles, and wave soldering, 549-50, 678 Joint Electron Device Engineering Council I leads, 142-43 (JEDEC),61 Implementation, of SMT as new technology Junction-to-ambient thermal resistance, 227, introduction to, 51-52 228, 231-32 oflSO 9000, 719-20 manufacturing strategies and, 63-64 risk management and, 78-80 KIC (EDI Inc.), 543, 577 selection of outside assembly houses, 64-77 Kyzen Ionox MC, 625 setting of strategy, 52-55 of statistical process control, 657-58 Indium, in lead-free solders, 461, 462, 463 Laboratory, in-house SMT, 57 Indium-lead alloy solders, 385 Laminate substrate, definition of, 149 Inert environment, and soldering, 552-55, Land patterns 575-76 for ball grid arrays, 291-92 Infrared (IR) ovens for cylindrical passive (MELF) devices, for adhesive curing, 358, 359, 364, 365, 366 272-75 for reflow soldering, 24-25 for DIP packages, 287-89 Infrared reflow soldering, 567-76 for fine pitch, gull wing packages, 289-91 Infrastructure, building of for SMT, 55-62 introduction to, 264-65 In-line cleaning systems, 629, 634 for leadless ceramic chip carriers, 281-83 Inner lead bonding, for TAB, 40 for passive components, 266-72 Inorganic fluxes, 605-606 for plastic leaded chip carriers, 275-81 Inspection for small outline integrated circuits and R• equipment for, 26-27, 683-687 packs, 283-85 of solder joints, 681-90 for small outline J-Iead devices, 286, 287 Institute of Interconnecting and Packaging Elec- for solder paste and solder mask screens, tronic Circuits (IPC), 60-62, 233, 264-65 294 Insufficient solder joints, 677 spacing requirements for selected compo• Insulation resistance, of adhesives, 342 nents,215-16 Interconnections, as design consideration, for TAB, 293 257-60 for transistors, 275 Internal pad-tubelet separation, 693 Lasers Internal reviews, and ISO certification, 717 automated inspection of solder joints, 685 Internal SMT infrastructure, development of, cut stencils, 434, 435, 436 56-60 reflow soldering, 584-88 International Electrotechnical Commission Leaching (lEC), address of, 725-26 metallization leaching in passive compo• ISO 9000 quality standards and certification, nents, 451-54, 539-40 715-21 nickel barrier underplating and prevention of, 304 Lead, in semi-aqueous solvents, 619. See also Japan Lead-free solder butt leads, 143 Lead chloride, as polar contaminant, 614-15 COB technology, 34 Leaded ceramic packages, and substrates with development of SMT, 5, 533-34 unmatched CTEs, 165 quality control, 651, 652 Lead-free solder, metallurgy of, 460-66 SOlCs and, 115, 117 Leadless ceramic chip carriers (LCCCs) surface mount resistors and capacitors, 87 characteristics of, 104-108 J-Ieads military and development of, 5 configuration of, 142 land patterns for, 281-83 development of SMT and, 6 solder joint reliability and, 252 solder joint requirements for, 672, 673 solder joint requirements for, 674-75 Index 765
Leads. See also Gull wing leads; J-Ieads phase diagrams, 445-51 configuration of and surface mount compo• properties of alloys, 454-60 nents, 140-43 solderability and, 466-73 coplanarity and surface mount components, substrate surface finish and, 482, 484-85 138-39 test methods and requirements, 473-82 finish on and solderability of, 485-90 Metals, and composition of solder paste, 385- Lead-tin solder plating, 189-91 88. See also Metallurgy Lid orientations, for ceramic chip carriers, 107 Metal squeegees, 429-30 Liquid photoimageable (LPI) solder masks, Microcracking, and nickel/palladium coated 327, 539 leads, 489 Low residue fluxes, 599, 608-12 Military. See also Department of Defense Low solid fluxes (LSFs), 609 development of SMT, 5 Low temperature baking, 247-48 leaded ceramic packages, 252 standard documents, 725 Miniaturization, and COB technology, 34 Malcom viscometer, 395-96, 398, 399, 426 Misalignment, of components, 677 Management Modified wave soldering, 549-50 of relationships with suppliers, 76-77 Moisture. See also Moisture-induced cracking review of SMT infrastructure, 56-57 package cracking and absorption data, 238 Manual placement, of parts, 494-96 plastic packages and sensitivity to, 110 Manufacturing. See also Assembly; Design reflow soldering and, 232 for manufacturability; sensitivity classification for package crack• Fabrication ing, 233-34, 248-50 implementation of in-house strategy, 63-64 Moisture-induced cracking questionnaires for rating of suppliers, 74-75 of BGAs, 29 substrate selection and, 165-67 of DIPs, 29 technical issues in, 31 of tantalum capacitors, 98, 100-101 Marketing, and ISO certification, 716 Molded plastic tantalum capacitors, 97, 270, 272 Materials MOLE (ECD Inc.), 543, 577 quality control and defects related to, Montreal Protocol, 598, 618 658-66 Multichip modules, description of processes specifications for, 58 for, 47-49 standards for, 730 Multicore Prozone, 625 for substrates, 155-67 Multilayer ceramic capacitors, 92-96 Maximum power rating, and thermal design Multilayer printed circuit boards rules, 231 glass-epoxy substrates and fabrication of, Mechanical cycling, as test of solder joint relia- 178-84 bility, 255-56 thermal expansion of, 153-55 Melting point, of solders, 386-87 Multilevel stencils, 421, 422 Mesh designation, of solder paste, 389 Metal electrode leadless faces (MELFs) characteristics of, 10 1-102 Networks, surface mount resistor, 91-92 disadvantages of, 304 Nickel land patterns for, 272-75 barrier underplating and prevention of leach- Metallurgy, of solders ing, 304, 452, 540 component lead or termination finish and, lead finishes and solderability of, 488-90 485-90 plating of board surface with, 189 introduction to, 444-45 underplating of via holes with, 199, 200 lead-free solder, 460-66 Nitrogen metallization leaching in passive compo• IR reflow soldering in, 575-76 nents, 451-54 wave soldering in inert environment and, Ni-Pd lead finish and, 488-90 552-55 766 Index
Noble metal coatings, for board surfaces, 191, Petroferm solvents, 621 193-94 Phase diagrams, and metallurgy of solder, No-clean fluxes, 392-93, 599, 608-12 445-51 Non-equipment-dependent processes, specifica- Photoimageable solder masks, 197-98 tions for, 58 Pick-and-place equipment. See also Placement Noneutectic solder, 449, 450, 456 adhesive dispensing head, 354, 355, 356 Nonpolar contaminants, in cleaners, 612-13 capital investment, 22-23, 493 Nonwetting, of solder, 469 flip chip assembly and, 44, 45 Numerical control standards, 733-34 questionnaire evaluating, 735-42 Pin numbering system, for PLCCs, 121 Pin transfer, of adhesives, 353 Odor, of cleaning solvents, 621 Placement, of components. See also Pick-and• Omega Wave, 547-49 place equipment Organic acid (OA) fluxes, 392, 606-607 automated, 496 Organic based substrates, advantages and disad- capital investment in placement machines, vantages of, 156 22-23, 493 Organic solderability protection (OSP), 191, commercially available equipment for, 193, 194 522-31 Organic solvents, 623-25 introduction to, 493-94 Organizational structure, for DFM, 297-99 manual placement of, 494-96 Original equipment manufacturers (OEMs), selection criteria for equipment, 497-514 and package design, 210 selection of feeders for, 514-22 Outer lead bonding, for TAB, 40-41 Plan, writing of for internal SMT infrastruc• Outgassing, and wave soldering, 537 ture,56 Outsourcing, standards for, 734 Plastic ball grid array (PBGA), 133-35, 706, Over molded plastic pad array (OMPAC), 133 707 Oxidation, of solder powder particles, 401, 403 Plastic leaded chip carriers (PLCCs) Ozone layer, CFCs and depletion of, 598, 617, as active SMT components, 121-24 618 development of SMT and, 5-6 land patterns for, 275-81 lead coplanarity in, 138, 139 Palladium, as coating for board surface, 193, wave soldering and, 310 194 Plastic packages, as active SMT components, Parasitics 109-29 multichip modules and, 48 Plating processes, for substrates, 184-91 SMTs and reduction in, 17 Polar contaminants, in cleaners, 612-13, Particulate contaminants, in cleaners, 612-14 614-15 Particle size, and shape in solder paste, 388-91 Polymers, and glass transition temperature, Part movement, and reflow soldering, 583 150-52 Partnership, and relationships with suppliers, Polymide aramid fiber, advantages and disad• 76-77 vantages of, 157 Passivation layer, of resistor, 88-89 Polymide fiberglass, advantages and disadvan• Passive surface mount components tages of, 156 characteristics of, 87-102 Polymide quartz, advantages and disadvantages land patterns for, 266-72 of, 157 metallization leaching in, 451-54, 539-40 Polymides, and substrate laminates, 176 standards for, 727-28 Porcelainized steel substrates, 168-69 Peelable masks, for solder, 195 Postleaded chip carriers, 109 Pentaerythritol tetrabenzoate, 608-609 Pot life, of adhesives, 340 Perfluorocarbons, 623 Powder size, of solder paste, 388-91 Personnel. See Organizational structure; Preheat zone, and reflow soldering, 581 Training Preleaded ceramic chip carriers, 108-109 Index 767
Preliminary survey, for supplier qualification, Rating, of suppliers, 69-76 68 Real estate. See Size reduction; Spacing Printability, of solder paste, 403-404 Records, for ISO 9000, 719 Printed circuit boards (PCBs) Rectangular chip components, solder joint re• cost and design of, 218, 220, 222, 224 quirements for, 668, 669 impact of contaminants on, 612 Rectangular passive components, and land pat• solder paste screen printers and, 23 tern design, 269-70 standards for, 729-30 Rellow ovens, questionnaire for evaluating, Printing equipment and processes, for solder 744-46 paste. See also Screen printing; Stencil Rellow soldering printing capital investment in equipment for, 24-25 different types of components and, 436-41 common defects in, 582-84 equipment for, 23, 404-409 curinglbaking ovens and, 23-24 processes of, 409-25 development of, 534 variables in, 426-36 hot belt rellow soldering, 592 Process-related defects, 664-65 infrared rellow soldering, 567-75 Procurement, of SMT components, 144-46 laser rellow soldering, 584-88 Profile development moisture and, 232 rellow soldering and, 576-82 no-clean Iluxes and, 611 wave soldering and, 542-44 profile development, 576-82 Programmable logic devices (PLDs) via hole location and, 325-26 manual placement of, 496 Rellow zone, and rellow soldering, 581-82 placement equipment and, 513 Relationships, management of with suppliers, thermal problems and, 229 76-77 Propagation delay, and interconnect design con• Relative humidity, and moisture absorption, siderations, 259-60 239 Reliability of compliant layer substrates, 174 Quad packs, and development of SMT, 5 as package design consideration, 232-50 Qualification, of suppliers, 67-69 of solder joints as design concern, 250-57 Qualification requirements, for components, standards for, 733 304 via hole diameter and, 164, 199, 200 Quality manuals, for ISO 9000, 719 wave soldering and, 539 Quality and quality control. See also Reliabil- Repairs. See also Reworking ity; Testing electrically conductive adhesives and, 348 assembly testing and, 709-15 equipment for and processes of, 26-27, introduction to, 651 690-709 ISO 9000 standards and certification, of BGA, 701-07 715-21 repairability as consideration in design, materials and, 658-66 328-29 solder joints and, 666-79, 681-90 standards for, 734 standards for, 732 Repeatability, and selection of placement ma• statistical quality control, 652-58 chines, 503-505 of via holes, 201 Required paste volume (RPV), for solder paste Questionnaires printing of through hole components, 440 for evaluating SMT equipment, 735-46 Resins for rating of suppliers, 70-76 for PBGAs, 134 thermoplastic as substrate, 156 Resistors Ramp rate land patterns for, 269-70 cure profile for adhesive and, 364, 367 networks of, 91-92 package cracking and, 235 standards for, 728 768 Index
surface mount discrete, 88-91 Size reduction, as benefit of SMT, 15-17, 18. wave soldering and shift in tolerance, 539 See also Spacing Reworking. See also Repairs Skipping adhesives and, 342 of adhesive, 358 profiles for, 707-709 of solder, 537, 538 Rheological properties, of solder paste, Ski-slope feeders, 519 393-400 Slot capacity, of placement machines, 500, 502 Risk management, and implementation of Slug packages, 228, 229, 230 SMT,78-80 Slump, of solder paste, 398, 664 Robber pads, SOlC orientation with, 315 Small outline integrated circuit (SOlC) Robotic placement, 22-23 packages Rosin-based fluxes, 391-92, 607-608 characteristics of, 114-20 Rotational accuracy, of placement machines, development of SMT and, 5, 9 504-505 land patterns for, 283-85 R02800 (substrate material), 164-65 robber pads and orientation of, 315 R-packs, 92, 283-85 wave soldering and design of, 310, 316, 317 Rubber squeegees, 428-29 Small outline J packages (SOJ s) characteristics of, 124-26 land patterns for, 286, 287 Saponifiers, 630 Small outline packages (SOPs) Scanned beam laminography inspection, of sol• characteristics of, 118, 119 der joints, 685-90 land patterns for, 283-86 Screen printers and printing Small outline transistors (SOTs) questionnaire for evaluating, 742-44 characteristics of, 112-14 for solder paste, 23, 405-419, 421-23, 431 land pattern design for, 275 Seating planes, for ceramic chip carriers, 107 low versus high profile, 303 Selection Soak zone, and reflow soldering, 581 of cleaning materials, 615-21 Socketing, and package design, 210 of components and design-for-manufactura- Sockets, standards for, 729 bility, 302-305 SOD 123 transistor/diode, land pattern for, 278 of fluxes, 602-603 Software, programs for placement equipment, of placement equipment, 497-522 508,510-11 of printing equipment for solder paste, Solder balls, 400-403, 612 405-409 Solder bumping, for flip chip, 46-47 of soldering process and equipment, 593-94 Soldering irons, for repair, 697-99 of solder mask, 194-98 Solder joint requirements, 666-79 of substrate material, 155-67 Solder mask of suppliers, 64-77 cleanliness and, 647 of processes for SMT, 58-59 design for manufacturability (DFM) and, Selective printing, 421-22 326-28 Semi-aqueous solvents, 619, 620, 623, 625-30 reflow soldering and discoloration of, 584 Semi-automatic printers, for solder paste, 404- selection of, 194-98 405, 407, 414-18 solder mask over bare copper (SMOBC) and Service, of placement equipment, 511-12 glass epoxy substrates, 179, 182 Shelf life, of adhesives, 340, 345 Solder paste Shock resistance, as benefit of SMT, 17-18 defects related to, 664 Silver, in tin-lead solders, 385, 387 introduction to, 383 Single-camera systems, for alignment of com- no-clean, 609, 610 ponents, 505 printing for different components, 436-41 Single-step soldering printing equipment for, 404-409 of double-sided boards, 556-58 printing processes for, 409-25 of mixed assemblies, 555-56 printing variables, 426-36 Index 769
properties of, 383-404 Statistical quality control, 652-58 screen printers for, 23 Steam aging requirements, 474-75 Solder and soldering. See also Cleaning; Flux; Steel, and porcelainized steel substrates, Land patterns; Reflow soldering; Solder 168-69 mask; Solder paste; Wave soldering Stencil printing design for manufacturability and, 305-11 of adhesives, 351, 353 hot bar soldering, 588-91 of solder paste, 23, 410-14, 419-23, 431-36 introduction to, 533-35 Stencils, aperture width and powder size of sol- land patterns for paste and mask screens, der paste, 390, 391 294 Step soldering, 459 lead-tin plating and, 189-91 Stick feeders, 519-521 metallurgy of, 444-90 Storage rack, for stencils, 415 quality control and solder joints, 666-79, Streaking properties, of cleaning materials, 621 681-90 Stress-deformation curves, for epoxy-glass lam- reliability of joints as design consideration, inate, 151 250-57 Stringing, of adhesive, 356-57 selection of process and equipment for, Stylus, for pin transfer of adhesive, 354 593-94 Subcontractors single-step of double-sided boards, 556-58 as alternative to in-house manufacturing, single-step for mixed assemblies, 555-56 63-64 standards for, 731-32 selection of, 64-77 of ultra fine pitch packages by hot bar pro• Substrates, for surface mounting cess, 10-11 alternative coatings for board surfaces, vapor phase soldering (VPS), 558-66 191-94 Solid solder deposition (SSD), 191 ceramic, 167-69 Solvent extraction, as test for cleanliness, coefficients of thermal expansion (CTE) and, 636-37 152-55 Solvents. See Cleaning and cleanliness; compliant layer substrates, 173-74 Flux constraining core substrates, 169-73 SOT 143 transistor/diode, land pattern for, 278 glass epoxy substrates, 174-84 SOT 223 transistor/diode, land pattern for, 279 glass transition temperature, 150-52 Spacing, interpackage. See also Size reduction introduction to, 149-50 ATE testing and, 332, 333 material selection for, 155-67 as design consideration, 208-209, 212-14 placement machines and maximum size of, design-for-manufacturability and, 316-22 500,501 minimums for, 324 plating processes for, 184-91 requirements for selected components, quality control and defects related to, 215-16 659-60 Specifications, categories of for SMT solder mask selection, 194-98 Squeegees, and solder paste printing, 428-30 surface finishes and solderability of, 482, S-shaped leads, 252 484-85 Staggered components, 313-14 via hole cracking in, 198-201 Staggered vias, 222 Suppliers, selection of, 64-77 Standard form factor, 299-300 Surface finishes, and solderability, 482, Standards and standardization 484-90 external SMT infrastructure and, 60-62 Surface insulation resistance (SIR) for land patterns, 264-65 of adhesives, 343, 367 list of, 725-34 as cleanliness measurement method, 614, on moisture sensitive package classification, 637-46, 647-48 233-34 Surface Mount Council, 62, 233, 264, 265 SMT components and, 144 Surface Mount Equipment Manufacturers Asso• Stand-off clearance, for components, 600 ciation (SMEMA), 62 770 Index
Surface mount technology (SMT) decomposition of fluxes and, 607 adhesives for, 339-81 dissolution rate of metals in solder, 453-54 applications appropriate for, 27-28 glass epoxy boards and operating, 178, 179 benefits of, 14-20 package cracking and threshold for, 235 capital investment in equipment for, 20-27 plastic packages and, 110 cleaning of, 598-651 of soldering as factor in component selec• components for, 85-147 tion, 303 design considerations, 204-61 substrate selection and, 166 design for manufacturability (DFM), substrate laminates and glass transition, 296-335 150-52 flux and cleaning processes for, 598-649 viscosity of adhesives and, 357 future of, 33-49 viscosity of solder pastes and, 426-27 history of, 3-7 Tensile strength, of copper plating, 188 infrastructure and implementation of as new Terminations, surface finish and solderability technology, 51-81 of, 485-90 inspection of, 681 Tessera Micro BOA, 137 land pattern design, 264-95 Tests and testing. See also Evaluation metallurgy of solder, 444-90 of adhesives, 367 placement of components, 493-532 of assemblies, 709-11 quality control for, 651-722 capital investment in equipment for, 31 repair of, 690-94 of cleanliness, 636-46 soldering of components, 533-95 design for manufacturability and, 330-34 solder paste and, 383-441 of placement equipment, 513 substrates for, 149-202 slump test of solder paste, 398 technical issues in, 28-31 of solderability, 473-82 test of, 330-331, 709-11 of solder joint reliability, 253-57 trends in, 31-33 standards for, 734 types of, 7-14 of via holes, 20 I Surface Mount Technology Association Test points (TPs), guidelines for, 332 (SMTA),62 Thermal cure, of adhesives, 358 Surface tension, of cleaning solutions, 620-21 Thermal cycling, as solder joint reliability test, Switches, standards for, 729 253-54, 255, 256 Syringing, of adhesives, 353-54, 356-58 Thermal expansion. See Coefficients of thermal expansion Thermally conductive adhesives, 349-50 Tackiness, of solder paste, 400 Thermal management, and package design, Tantalum capacitors 208, 226-32 characteristics of, 97-10 I Thermal shock encapsulated, 303 cracking of capacities, 95, 660-63 . land pattern designs for, 270-72 dry film solder masks, 196 Tape-automated bonding (TAB) hot air solder leveling and, 190 description of processes, 38-41 reflow soldering and, 583 hot air soldering and, 588, 589 Thermocouples, and wave soldering, 543 land pattern design for, 293 Thermodes, and hot bar soldering, 589 Tape ball grid array (TBOA), 135-36,706-707 Thermoplastic adhesives, 343-44 Tape and reel feeders, 514-18 Thermoplastic resin, advantages and disadvan- Tape and reel packaging, standardization of, tages of as substrate, 156 144 Thermosetting adhesives, 344 Temperature Thick film technology curing of adhesives and, 341, 360-61, 362 ceramic substrates and, 167, 168 decomposition of adhesives and, 375 characteristics of resistors for, 88 Index 771
Thin film technology Vapor degreasers, 624-25 ceramic substrates and, 167, 168 Vapor phase soldering (VPS), 24, 558-66 characteristics of resistors for, 88 Vendors. See Suppliers Thixotropic fluids, solder pastes as, 394 Vertrel SMT, 623 3M Corporation, 623 Via holes Through-hole mount assembly (THMA) cracking problems in substrates, 198-201 cost of compared to SMT, 218 design for manufacturability and, 322-26 solder paste printing and mixed assemblies, prevention of cracking, 251 438-41 size of and cost, 222, 224 Tin-lead plating, of glass epoxy substrates, size of and plate-through-hole (PTH) reliabil• 179, 182 ity, 164 Tin-lead solders Vibrating wave soldering, 547-49 composition of, 385, 387 Viscosity phase diagrams for, 445, 447-49 of adhesives, 357 Tin-zinc, phase diagram, 465 of solder paste, 394-97, 426-27, 664 Titanium, as cover plate material, 309 Vision capability, of placement machines, Tombstoning 505-508 component misalignment and, 678 Visual inspection land patterns and, 268 for cleanliness, 636 reflow soldering and, 583 of solder joints, 680, 681-83 TO 252 (DPAK) transistor/diode, land pattern Voids for, 279 in adhesives, 362, 364 Training, of personnel in solder joints, 678-79 effective SMT implementation and, 59-60 solder paste and formation of, 393 placement equipment and, 511-12 Transistors, land patterns for, 275 Transistor-transistor logic (TTL) devices, 229 Waffle packs Transmission X -ray inspection, of solder fine pitch packages and, 128, 522 joints, 685-90 placement equipment and, 521-22 Tube feeders, 519, 520, 521 Warpage Tubular MELF devices, land pattern design of boards and quality control, 659-60 for, 274 of PBGA packages, 134-35 Tubular passive components, 101-102 Washable masks, for solder, 195 Two-camera systems, for alignment of compo• Water cleaning, 630 nents, 505 Water-soluble fluxes, 392 2,3 dihydrodecafluoropentane compound, 623 Watt ratings, of resistors, 89 Wave soldering capital investment in equipment for, 25-26 Ultra fine pitch (UFP) packages cover plates and, 308, 309 soldering of by hot bar process, 10-11 development of, 533 solder paste printing and, 437-38 epoxy adhesives and, 375 Ultrasonic cleaning, 629 inert environment and, 552-55 Ultraviolet (UV) light, and curing of adhe• leaching and, 454 sives, 345, 367, 369 lead-free solder, 466 Undercutting, of chemically etched stencils, nickel barrier underplating, 304 432-33 no-clean fluxes and, 611 Urethane adhesives, 346 of plastic packages, 119 process of, 535-42 profile development for, 542-44 Vacuum pipette, for placement of components, SOlCs and, 9, 316, 317 495 types of, 544-50, 551 772 Index
Wedge-wedge bonding, and chip-and-wire tech- X-ray laminography, 690 nology, 36-37 X7R capacitors, 303, 663 Weight reduction, as benefit of SMT, 14-15 XXXPC laminate, 176, 178 Welding, definition of, 533 X-Y tables, for placement of components, Weller Pick-a-Chip apparatus, 699,700 504-505, 508, 512 Wet film solder masks, 195-97, 327 Wetting, and solderability, 467-68, 469 Wetting balance test, 479-82 YAG-Nd lasers, 585, 586 Wicking, of solder joints, 456-57, 564-66, 678 Working life, of solder paste, 399 Z-axis adhesives, 348 Work instructions, for ISO 9000, 719 Z5U capacitors, 303, 663 Workmanhip,666-69 Zinc-tin lead-free solder, 464, 465