Appendix A* Surface Mount Standards This appendix lists various standards, specifications, and guidelines that have an impact on surface mount technology from U.S. and international • bodies, including the U.S. Department of Defense, although DoD is now committed to using industry standards. These documents can be obtained from the following sources: • INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS (IPC): 2215 Sanders Road, Northbrook, IL 60062-6135 Telephone 847-509-9700; FAX 847-509-9798 • ELECTRONIC INDUSTRIES ASSOCIATION (EIA) 2001 Pennsylvania Avenue, NW Washington, D.C. 20006-1813 Telephone 703-907-7500; FAX 703-907-7501 • GLOBAL ENGINEERING DOCUMENTS 2805 McGaw Avenue, Irvine, CA 92713 Telephone: 800-854-7179; FAX 314-726-6418 Military documents are available from: • STANDARDIZATION DOCUMENTS Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094 Telephone 215-697-2667 Central office of the IEC: *Adapted from Surface Mount Council Status of the Technology, Industry Activities and Action Plan, September 8-12, 1996, available from IPC. 726 Appendix A • INTERNATIONAL ELECTROTECHNICAL COMMISSION (1EC) Rue de Varembe, 1211 Geneva 20, Switzerland lEe documents are also available from: • AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) 11 West 42nd Street, New York, NY 10036 The letter prefix of each document indicates the organization responsible for that document: EIA Electronic Industries Association JEDEC Joint Electron Devices Engineering Council of the EIA IPC Institute for Interconnecting and Packaging Elec­ tronic Circuits MIL Military DoD Department of Defense J-Std Joint Industry Standards Components, General EIA-886-E Standard Test Methods for Passive Electronic Com­ ponent Parts-General Instructions and Index (this document is an umbrella document that consists of a series of uniform test methods for electronic compo­ nent parts), EIA-481-A Taping of Surface Mount Components for Auto­ matic Placement EIA-481-1 8 mm and 2 mm Taping of Surface Mount Compo­ nents for Automatic Handling EIA-481-2 16 mm and 24 mm Embossed Carrier Taping of Sur­ face Mount Components for Automated Handling EIA-48 1-3 32 mm, 44 mm, and 56 mm Embossed Carrier Tap­ ing of Surface Mount Components for Automated Handling EIAlIS-47 Contact Termination Finish Standard for Surface Mount Devices EIA-PDP-lOO Registered and Standard Mechanical Outlines for Electronic Parts EIA-JEP-95 JEDEC Registered and Standard Mechanical Out­ lines for Semiconductor Devices Surface Mount Standards 727 EIA-JESD30 Descriptive Designation System for Semiconductor Device Packages EIA-JESD95-1 Design Requirements for Outlines of Solid-State and Related Products IPC-9501 Component Qualification for the Assembly Process IPC-SM-786A Recommended Procedure for Handling of Moisture Sensitive Plastic IC Packages J-Std-020 MoisturelReflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices Components, Passive Capacitors: EIA-198-D Ceramic Dielectric Capacitors Classes I, II, III, and IV EIA-469-B Standard Test Method for Destructive Physical Anal­ ysis of High Reliability Ceramic Monolithic Capac­ itors EIA-479 Film-Paper, Film Dielectric Capacitors for Micro­ wave Ovens EIA-51O Standard Test Method for Destructive Physical Anal­ ysis of Industrial Grade Ceramic Monolithic Capac­ itors EIA-535 Series of Detail Specifications on Fixed Tantalum Capacitors that have been adopted by the National Electronic Components Quality (NECQ) Assessment System EIA-CB-ll Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors EIAlIS-28 Fixed Tantalum Chip Capacitor Style 1 Protected­ Standard Capacitance Range EIAlIS-29 Fixed Tantalum Chip Capacitor Style I Protected­ Extended Capacitance Range EIAIIS-35 Two-Pin Dual In-Line Capacitors EIAlIS-36 Chip Capacitors, Multi-Layer (Ceramic Dielectric) EIA/IS-37 Multiple Layer High Voltage Capacitors (Radial Lead Chip Capacitors) EIAlIS-38 Radial Lead Capacitors (Conformally Coated) EIAlIS-39 Ceramic Dielectric Axial Capacitors (Glass Encapsu­ lated) IEC-384-3 Sectional Specification, Tantalum Chip Capacitors 728 Appendix A IEC-384-10 Sectional Specification, Fixed Multilayer Ceramic Chip Capacitors IECQ draft Blank Detail Specification, Fixed Multilayer Ce­ ramic Chip Capacitors IECQ-PQC-31 Sectional Specification, Fixed Tantalum Chip Capaci­ tors with Solid Electrolyte IECQ-PQC-32 Blank Detail Specification, Fixed Tantalum Chip Ca­ pacitor Resistors: EIA-575 Resistors, Rectangular, Surface Mount, General Purpose EIA-576 Resistors, Rectangular, Surface Mount, Precision EINIS-34 Leaded Surface Mount Resistor Networks Fixed Film Components, Active EIA-JEP-95 JEDEC Registered and Standard Outlines for Semi­ conductor Devices EIA-JESDII Chip Carrier Pinouts Standardized for CMOS 4000, HC, and HCT Series of Logic Circuits EIA-JESD21-C Configurations for Solid State Memories EIA-JESD22-B Test Methods and Procedures for Solid State De­ vices Used in TransporatationiAutomotive Applica­ tions (Series format-consists of over 16 different test procedure documents.) EIA-JESD-26A General Requirements, PEM, Rugged Environments EIA-JESD30 Descriptive Designation System for Semiconductor Device Packages EIA-JESD95-1 Design Requirements for Outlines of Solid-State and Related Products Components, Electromechanical Connectors: EIA-429 Industry Standard for Connectors, Electrical Flat Ca­ ble Type (IPC-FC-218B) EIA-364-B Electrical Connector Test Procedures Including Envi­ ronmental Classifications (Series format consisting of over 60 electrical connector test procedures.) Surface Mount Standards 729 EIA-506 Dimensional and Functional Characteristics Defining Sockets for Leadless Type A Chip Carriers (.050 Spacing) EIA-507 Dimensional Characteristics Defining Edge Clips for Use with Hybrid and Chip Carriers EIA-IS-47 Contact Termination Finish Standard for Surface Mount Devices EIAlIS-64 Two Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes Sockets: EIA-5400000 Generic Specification for Sockets for Integrated Cir­ cuit (IC) Packages for Use in Electronic Equipment (Series format with over 20 sectional, blank detail, and detail specifications, approved for use in the NECQ system.) Switches: IECQ-PQC-41 Detail Specification, Dual-in-Line Switch, Surface -US00003 Mountable, Slide Actuated EIA-448-23 Surface Mountable Switches, Qualification Test EIA-5200000-A Generic Specification for Special-Use Electrome­ chanical Switches of Certified Quality (Series format with over 25 sectional, blank detail and detail speci­ fications, approved for use in the NECQ system.) Printed Boards: IPC-FC-250 Performance Specification for Single and Double­ sided Flexible Printed Boards IPC-RF-245 Performance Specification for Rigid-Flex Multilayer Printed Boards IPC-RB-276 Performance Specification for Rigid Printed Boards IPC-MC-324 Performance Specification for Metal Core Boards IPC-HM-860 Performance Specification for Hybrid Multilayer IPC-6105 Performance Specification for Organic Multichip Module Structures (MCM-L) MIL-P-50884 Military Specfication Printed Wiring, Flexible, and Rigid Flex MIL-P-55110 Military Specification Printed Wiring Boards, Gen­ eral Specification For 730 Appendix A IPC-DW-42S/424 Discrete Wiring Technology MIL-P-PRF-31032 Printed Circuit BoardlPrinted Wiring Board Manu­ facturing, General Specification For Materials: IPC-L-IOSB Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards IPC-L-I09B Specification for Resin Preimpregnated Fabric (Pre­ preg) for Multilayer Printed Boards IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications IPC-L-llSB Specification for Rigid Metal Clad Base Materials for Printed Boards IPC-CF-14S Resin Coated Metal for Multilayer Printed Boards IPC-MF-lS0F Metal Foil for Printed Wiring Applications IPC-CF-lS2A Metallic Foil Specification for CopperlInvar/Copper (CIC) for Printed Wiring and Other Related Applica­ tions IPC-SM-S17 General Requirements for SMT Adhesives IPC-3406 Guidelines for Conductive Adhesives IPC-3407 General Requirements for Isotropically Conductive Adhesives-Paste Types IPC-340S General Requirements for Anistropically Conductive Adhesive Films IPC-CC-S30 Qualification and Performance of Electrical Insula­ tion Compounds for Printed Board Assemblies IPC-SM-S40C Qualification and Performance of Permanent Poly­ mer Coating (Solder Mask) for Printed Boards J-Std-004 Requirements for Soldering Fluxes J-Std-OOS General Requirements and Test Methods for Elec­ tronic Grade Solder Paste J-Std-006 General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Sol­ ders for Electronic Soldering Applications Design Activities IPC-D-249 Design Standard for Flexible Single and Double­ Sided Printed Boards IPC-D-27S Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies Surface Mount Standards 731 IPC-D-279 Reliability Design Guidelines for Surface Mount Technology Printed Board Assemblies IPC-D-317 Design Standard for Electronic Packaging Utilizing High Speed Techniques IPC-C-406 Design and Application Guidelines for Surface Mount Connectors IPC-SM-782 Surface Mount Land Patterns (Configuration and De­ sign Rules) IPC-H-855 Hybrid Microcircuit Design Guide IPC-D-859 Design Standard for Multilayer Hybrid Circuits IPC-2105 Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies MIL-Std-2118 Design Standard for Flexible Printed Wiring Component Mounting EIA-CB-ll Guidelines for the