ICIC PACKAGEPACKAGE

FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/

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North and South America Asia Pacific FUJITSU MICROELECTRONICS AMERICA, INC. FUJITSU MICROELECTRONICS ASIA PTE LTD. 1250 E. Arques Avenue, M/S 333 151 Lorong Chuan, #05-08 Sunnyvale, CA 94085-5401, U.S.A. New Tech Park Tel: +1-408-737-5600 Fax: +1-408-737-5999 Singapore 556741 http://www.fma.fujitsu.com/ Tel : +65-6281-0770 Fax : +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Pittlerstrasse 47, 63225 Langen, Rm. 3102, Bund Center, No.222 Yan An Road (E), Germany Shanghai 200002, China Tel: +49-6103-690-0 Fax: +49-6103-690-122 Tel : +86-21-6335-1560 Fax : +86-21-6335-1605 http://emea.fujitsu.com/microelectronics/ http://cn.fujitsu.com/fmc

Korea FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. FUJITSU MICROELECTRONICS KOREA LTD. 10/F., World Commerce Centre, 11 Canton Road 206 KOSMO TOWER, 1002 Daechi-Dong, Tsimshatsui, Kowloon Kangnam-Gu,Seoul 135-280 Hong Kong Korea Tel : +852-2377-0226 Fax : +852-2376-3269 Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://cn.fujitsu.com/fmc/tw http://www.fmk.fujitsu.com/

Specifications are subject to change without notice. For further information please contact each office.

All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

2002-2008 FUJITSU MICROELECTRONICS LIMITED Printed in Japan FUJITSU MICROELECTRONICS AD81-00001-12Ea April, 2004 Edited: Strategic Business Development Dept. Technologies of the Future Available Now Package Overview and Cross -section Structure PACKAGES Supported by LSI technologies, the markets MCPs. Fujitsu also mass-produces multipin for personal computers, cellular telephones, packages, chiefly PBGAs, EBGAs and LGAs. Stacked Multi Chip Package mobile information terminals and other We continue to break new ground in the field electronic equipment continue to experience of , devoting tireless efforts to the Features sharp demand growth. Continuing into the development of packages for a wide variety of ● Stacked MCP (Multi Chip Package) stacks 2 chips in one future, electronic equipment is expected to applications, including next-generation and S-MCP package to correspond to increased capacities of memory. become thinner and more compact. LSI custom packages. ● One package can have the functions of two chips because packages allowing high-density mounting, ■ Multipin packages chips are stacked. Corresponds to high performance such as chip size packages or chip scale QFP, PBGA, EBGA, E-BGA, TAB-BGA, systems and smaller mounting area. packages (CSPs) and ball grid arrays (BGAs), FC-BGA, LGA ■ have been developed and become common Thin, compact packages Bottom View throughout the market. SSOP, TQFP, BCC, FBGA, CSOP, S-MCP, As packages grow ever more compact, Fujitsu Super CSP continues to lead the industry in CSPs by ■ Packages for card modules beginning mass-production of SON packages TSOP, TQFP Resin LSI Chip-2 Au Wire LSI Chip-1 that incorporate 16Mbit flash memories. ■ Packages featuring high power dissipation Further efforts to achieve more compact, high- or for large chips density mounting include the mass production HQFP, PBGA, EBGA, TAB-BGA, FC-BGA, LGA Top View Adhesive Solder Ball of FBGAs, CSOPs, MCPs and various stacked Polyimide Tape

Package Overview and Cross -section Structure CONTENTS A typical package is introduced with S-MCP PBGA EBGA 3 package overview and a cross- Features sectional structure figure. TAB-BGA FBGA FC-BGA 4 ● High cost performance by the sealing of plastic resin PBGA BCC HQFP CSOP 5 ● Excellent application to high pin count LSIs

Package Lineup SOP 7 SSOP 8 Dual lead TSOP 8 Bottom View CSOP 9 Flat type QFP 10 Au Wire Resin PC Board LQFP 11 Quad lead TQFP 11 LSI Chip Top View Solder Ball HQFP 19 C-lead type Dual lead CSOP 9 MCP S-MCP 12 Enhanced Ball Grid Array Super CSP 12 Features PBGA 13 ● High density mounting available Surface mounted type EBGA Package EBGA 13 ● Superior electrical characteristics from multilayre structure ● Low thermal resistance, and superior cost performance to BGA TAB-BGA 14 ceramic PGA Matrix type FDH-BGA 14 FBGA 15 Bottom View FC-BGA 15

LGA 16 LSI Chip Heat Spreader PC Board LGA FLGA 16

Bumped type Quad lead BCC 17 Potting Resin Au wire Solder Ball Top View Tape carrier Dual lead DTP 17

2 3 Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES

TAB-Ball Grid Array Bump

Features Features ● Excellent mulit-pin as signment applicability ● With the same packaging capabilities as those of SSOP, TAB-BGA BCC ● Excellent thiickness-reduction applicability this very small package provides space for COB ● High thermal dissipation ● 16-pin Bump chip carrier is about 40% smaller in packaging ● Excellent narrow-pitch and size-reduction applicability area and about 70% smaller in packaging capacity than ● Chip size reduction using narrow PAD conventional SSOP ● This plated resin bump package introduces selective etching technology to enable reductions in both size and cost Bottom View Bottom View

LSI Chip Au Wire

Heat Spreader LSI Chip Stiffener

Resin

Polyimide Tape Encapsulation Solder Ball Top View Top View Resin Bump attach material

Fine pitch Ball Grid Array QFP with Heat Sink

Features Features ● Low-cost assembly using existing facilities ● Excellent thermal dissipation FBGA HQFP-HS (current) ● Fan-in and fan-out types ● The same size as current packages (adopting high standoff ● Fine pitch using Polymide (PI) tape configuration)

Bottom View

Au Wire LSI Chip Adhesive Tape Resin Au Wire

Top View

PCB (2Layer) Adhesive LSI Chip Solder Ball Heat Spreader Resin Top View

Flip chip-Ball Grid Array C-lead Small Outline Package

Features Features ● Excellent ultra-multi-pin assignment and high-packaging ● Chip-size package FC-BGA CSOP density applicability ● High price -performance using TSOP packaging technology ● Superior electrical characteristics from multilayer structure of ● Packaging strength and reliability equal to or better than board with low dielectric constand and Low-resistivity wiring TOSP ● Low thermal resistance due to heat dissipation from ● Same packaging technology as TSOP back of chip ● 40% packaging density max. as compared to TOSP

Bottom View Bottom View

Thermal Compound Chip Capacitor Area Bump Au Wire Die Pad LSI Chip Encapsulation LSI Chip Lid

Resin Top View Outer Lead Top View Glass Ceramic (thick-film)

4 5 Surface mount device package

SOP (Small Outline L-leaded Package)

Nominal Dimensions Lead Pitch Pin Count EIAJ TYPE

600mil/VI 44

450mil/IV 28 1.27mm(50mil) 375mil/III 16 24 28

300mil/II 8 14 16 20 24

0.80mm : 30-PIN 1.00mm : 38-PIN 8 1.27mm : 8-PIN e g a k c a p e c i v e d t n u o m e c a f r u S

6 7 CSOP (C-lead Small Outline Package)

Body Size × (mm) 10 10

Pin Count 48

Lead Pitch 0.4 SSOP/TSSOP (mm) (Shrink Small Outline L-leaded Package) /(Thin Shrink Small Outline L-leaded Package)

Pin Count 8 16 20 24 30 34 Pin Count 16 20 24

Lead Pitch Lead Pitch (mm) 0.8 0.65 0.65 0.65 0.65 0.65 (mm) 0.65 0.65 0.65

Mounting Height Mounting Height 1.45 1.45 1.45 1.45 1.45 1.45 1.10 1.10 1.10 (mm) (mm) 1.20

TSOP TYPE I (Thin Small Outline L-leaded Package)

Body Size × × × × × × (mm) 8 18.4 10 18.4 12 18.4 12 12.4 14 18.4 12 12.4

Pin Count 32 40 48 48 56 56

Lead Pitch 0.50 0.50 0.50 0.50 0.50 0.40 (mm)

Mounting Height 1.20 1.20 1.20 1.20 1.20 1.20 (mm)

8 9 LQFP (Low-profile Quad Flat L-leaded Package)

Body Size × × × × × × × × × × × × × × × × (mm) 14 14 16 16 20 20 24 24 28 28 7 7 10 10 12 12 14 14 16 16 20 20 24 24 28 28 12 12 14 14 7 7

Pin Count 120 144 176 216 256 48 64 80 100 120 144 176 208 64 80 32

Lead Pitch 0.40 0.50 0.65 0.80 (mm)

TQFP (Thin Quad Flat L-leaded Package)

QFP (Quad Flat-leaded Package)

Body Size 28×28 32×32 20×20 24×24 28×28 32×32 40×40 14×20 28×28 10×10 12×12 14×20 28×28 14×20 (mm)

Pin Count 256 296 120 144 176 208 240 304 100 144 160 44 48 48 80 120 64

Lead Pitch 0.40 0.50 0.65 0.80 1.00 (mm)

Body Size × × × × × (mm ) 10 10 12 12 12 12 14 14 14 14

Pin Count 64 80 100 100 120

Lead Pitch 0.50 0.50 0.40 0.50 0.40 (mm)

Mounting Height 1.20 (mm)

10 11 Stacked MCP PBGA (Over mold Type) (Stacked Multi Chip Package) (Plastic Ball Grid Array)

Body Size Body Size × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × (mm) 7 7.2 1.2 7 9 1.2 9 9 1.4 9 9 1.34 8 11 1.4 7 12 1.2 7 11 1.2 8 11.6 1.4 8 11.6 1.34 10.4 10.8 1.3 11 12 1.34 10 9 1.4 9 10 1.4 9 12 1.4 (mm) 27 27 35 35 35 35

Ball Count 56 59 61 65 69 71 71 73 73 85 101 103 107 115 Ball Count 256 352 420

Stack 2 2 2 2 2 2 2 2 2 3 2 4 3 4 3 4 Ball Pitch (mm) 1.27 1.27 1.27 Ball Pitch 0.80 (mm)

Super CSP (Super Chip Size Package)

EBGA (Enhanced BGA) (Plastic Ball Grid Array)

Body Size Body Size × × × × 35×35×3.1 40×40×3.1 35×35×3.1 40×40×3.1 40×40×2.9 45×45×3.1 40×40×2.9 40×40×2.9 (mm) 3.51 7.05 3.51 7.05 3.51 4.70 3.51 4.70 (mm)

Ball Count 48 48 48 48 Ball Count 352 416 420 576 660 672 792 896

Package Type BGA LGA BGA LGA Ball Pitch (mm) 1.27 1.27 1.27 1.27 1.0 1.27 1.0 1.0 Ball Pitch (mm) 0.5 0.5 0.5 0.5

12 13 TAB-BGA (Tape Automated Bonding Ball Grid Array)

Body Size × × × × × × × × × × × × × × × × (mm) 21 21 1.4 23 23 1.4 27 27 1.3 31 31 1.3 35 35 1.3 40 40 1.4 40 40 1.3 40 40 1.3

Ball Count 304 352 400 480 560 576 660 720

Ball Pitch (mm) 0.8 0.8 1.0 1.0 1.0 1.27 1.0 1.0 FBGA/PFBGA (Fine-Pitch Ball Grid Array)/(Plastic Fine-Pitch Ball Grid Array)

Body Size × × × × × × × × × × × × × × × × × × × × × × × × × × × × (mm) 6 8 1.2 6 8 1.2 6 9 1.2 8 9 1.2 7 14.5 1.2 8 9 1.2 7 11 1.2 10 11 1.2 9 9 1.2 7 11 1.2 8 11 1.2 9 12 1.2 8 11 1.2 9.5 14.5 1.2

Ball Count 48 48 48 48 52 60 63 63 64 80 80 80 84 96

Package Type FBGA PFBGA FBGA FBGA FBGA PFBGA FBGA FBGA PFBGA PFBGA PFBGA PFBGA PFBGA FBGA

Ball Pitch 0.80 (mm)

Body Size × × × × × × × × (mm) 8 8 1.13 10 10 1.33 12 12 1.3 14 14 1.33

Ball Count 112 144 224 272 144 176 240 304 360 368 480

Package Type PFBGA PFBGA PFBGA PFBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA

Ball Pitch 0.80 0.50 (mm)

FC-BGA ( Ball Grid Array)

FDH-BGA (Face Down Heat spreader BGA)

Body Size 42.5×42.5×4.7 45.0×45.5×4.7 47.5×47.5×4.7 (mm)

Ball Count 1089 1225 1369 Body Size × × × × × (mm) 27 27 27 27 35 35 35 35 40 40 Ball Pitch 1.27 1.27 1.27 Ball Count 256* 264* 352 436 576* (mm)

Ball Pitch (mm) 1.27 1.0 1.27 1.0 1.27 Body Size 42.5×42.5×4.6 45.0×45.0×4.6 47.5×47.5×4.6 *: Under planning (mm)

Ball Count 1681 1849 2116

Ball Pitch 1.00 1.00 1.00 (mm) 14 15 LGA ()

Body Size (mm) 42.50 BCC (Bump Chip Carrier) Land Count 889

Land Pitch (mm) 1.27

Body Size × × × × × × × × × × × × × × × × × × × × × × × × × × (mm) 3.4 4.55 0.8 4.2 4.55 0.8 3.4 3.6 0.83.4 3.6 0.6 4.0 4.0 0.8 5.0 5.0 0.87.0 7.0 0.8 9.0 9.0 0.8 7.0 7.0 0.57.0 7.0 0.8 8.0 8.0 0.5 9.0 9.0 0.810.0 10.0 0.8

Pin Count 16 16 20 20 24 32 48 64 64 64 80 92 100

Lead Pitch (mm) 0.65 0.65 0.5 0.5 0.5 0.5 0.5 0.5 0.65 0.65 0.65 0.65 0.65

SLIM DTP (Slim Dual Tape-carrier Package)

FLGA (Fine pitch Land Grid Array)

Body Size × × × × × × × × × × × (mm) 9.0 9.0 4.0 5.5 7.0 7.0 5.0 5.0 7.0 7.0 7.0 7.0 11.0 11.011.0 11.012.0 12.014.3 14.316.0 16.0

Land Count 80 20 64 64 80 120 144 176 208 224 288

Land Pitch (mm) 0.8 0.65 0.65 0.5 0.5 0.5 0.65 0.65 0.65 0.65 0.65

Pin count 44 233 255 463

Lead Pitch 0.8 0.1 0.16 0.06 (mm) 16 17 Low thermal resistance package

HQFP (QFP with Heat Sink)

Pin count 160 208 240 256 304

Heat spreader Heat Spreader Heat Spreader Heat Spreader Heat Spreader Heat Spreader

Lead Pitch 0.65 0.50 0.50 0.40 0.50 (mm) e g a k c a p e c n a t s i s e r l a m r e h t w o L

18 24 19