ICIC PACKAGEPACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America Asia Pacific FUJITSU MICROELECTRONICS AMERICA, INC. FUJITSU MICROELECTRONICS ASIA PTE LTD. 1250 E. Arques Avenue, M/S 333 151 Lorong Chuan, #05-08 Sunnyvale, CA 94085-5401, U.S.A. New Tech Park Tel: +1-408-737-5600 Fax: +1-408-737-5999 Singapore 556741 http://www.fma.fujitsu.com/ Tel : +65-6281-0770 Fax : +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. 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Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. 2002-2008 FUJITSU MICROELECTRONICS LIMITED Printed in Japan FUJITSU MICROELECTRONICS AD81-00001-12Ea April, 2004 Edited: Strategic Business Development Dept. Technologies of the Future Available Now Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES Supported by LSI technologies, the markets MCPs. Fujitsu also mass-produces multipin for personal computers, cellular telephones, packages, chiefly PBGAs, EBGAs and LGAs. Stacked Multi Chip Package mobile information terminals and other We continue to break new ground in the field electronic equipment continue to experience of electronics, devoting tireless efforts to the Features sharp demand growth. Continuing into the development of packages for a wide variety of ● Stacked MCP (Multi Chip Package) stacks 2 chips in one future, electronic equipment is expected to applications, including next-generation and S-MCP package to correspond to increased capacities of memory. become thinner and more compact. LSI custom packages. ● One package can have the functions of two chips because packages allowing high-density mounting, ■ Multipin packages chips are stacked. Corresponds to high performance such as chip size packages or chip scale QFP, PBGA, EBGA, E-BGA, TAB-BGA, systems and smaller mounting area. packages (CSPs) and ball grid arrays (BGAs), FC-BGA, LGA ■ have been developed and become common Thin, compact packages Bottom View throughout the market. SSOP, TQFP, BCC, FBGA, CSOP, S-MCP, As packages grow ever more compact, Fujitsu Super CSP continues to lead the industry in CSPs by ■ Packages for card modules beginning mass-production of SON packages TSOP, TQFP Resin LSI Chip-2 Au Wire LSI Chip-1 that incorporate 16Mbit flash memories. ■ Packages featuring high power dissipation Further efforts to achieve more compact, high- or for large chips density mounting include the mass production HQFP, PBGA, EBGA, TAB-BGA, FC-BGA, LGA Top View Adhesive Solder Ball of FBGAs, CSOPs, MCPs and various stacked Polyimide Tape Package Overview and Cross -section Structure CONTENTS Plastic Ball Grid Array A typical package is introduced with S-MCP PBGA EBGA 3 package overview and a cross- Features sectional structure figure. TAB-BGA FBGA FC-BGA 4 ● High cost performance by the sealing of plastic resin PBGA BCC HQFP CSOP 5 ● Excellent application to high pin count LSIs Package Lineup SOP 7 SSOP 8 Dual lead TSOP 8 Bottom View CSOP 9 Flat type QFP 10 Au Wire Resin PC Board LQFP 11 Quad lead TQFP 11 LSI Chip Top View Solder Ball HQFP 19 C-lead type Dual lead CSOP 9 MCP S-MCP 12 Enhanced Ball Grid Array Super CSP 12 Features PBGA 13 ● High density mounting available Surface mounted type EBGA Package EBGA 13 ● Superior electrical characteristics from multilayre structure ● Low thermal resistance, and superior cost performance to BGA TAB-BGA 14 ceramic PGA Matrix type FDH-BGA 14 FBGA 15 Bottom View FC-BGA 15 LGA 16 LSI Chip Heat Spreader PC Board LGA FLGA 16 Bumped type Quad lead BCC 17 Potting Resin Au wire Solder Ball Top View Tape carrier Dual lead DTP 17 2 3 Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES TAB-Ball Grid Array Bump chip carrier Features Features ● Excellent mulit-pin as signment applicability ● With the same packaging capabilities as those of SSOP, TAB-BGA BCC ● Excellent thiickness-reduction applicability this very small package provides space for COB ● High thermal dissipation ● 16-pin Bump chip carrier is about 40% smaller in packaging ● Excellent narrow-pitch and size-reduction applicability area and about 70% smaller in packaging capacity than ● Chip size reduction using narrow PAD conventional SSOP ● This plated resin bump package introduces selective etching technology to enable reductions in both size and cost Bottom View Bottom View LSI Chip Au Wire Heat Spreader LSI Chip Stiffener Resin Polyimide Tape Encapsulation Solder Ball Top View Top View Resin Bump Die attach material Fine pitch Ball Grid Array QFP with Heat Sink Features Features ● Low-cost assembly using existing facilities ● Excellent thermal dissipation FBGA HQFP-HS (current) ● Fan-in and fan-out types ● The same size as current packages (adopting high standoff ● Fine pitch using Polymide (PI) tape configuration) Bottom View Au Wire LSI Chip Adhesive Tape Resin Au Wire Top View PCB (2Layer) Adhesive LSI Chip Solder Ball Lead Frame Heat Spreader Resin Top View Flip chip-Ball Grid Array C-lead Small Outline Package Features Features ● Excellent ultra-multi-pin assignment and high-packaging ● Chip-size package FC-BGA CSOP density applicability ● High price -performance using TSOP packaging technology ● Superior electrical characteristics from multilayer structure of ● Packaging strength and reliability equal to or better than board with low dielectric constand and Low-resistivity wiring TOSP ● Low thermal resistance due to heat dissipation from ● Same packaging technology as TSOP back of chip ● 40% packaging density max. as compared to TOSP Bottom View Bottom View Thermal Compound Chip