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Different Kinds of IC Packages 2012/09/01 09:08 1/9 General Note #1 :Different kinds of IC Packages General Note #1 :Different kinds of IC Packages Image Name Description & Examples BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, Ball Grid instead of just the perimeter.The leads are also Array aka on average shorter than with a perimeter-only BGA type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never Click to expand mounted in a socket in use. The Plastic Quad Flat Pack, or PQFP, is an IC package with leads extending from all four sides Plastic Quad of the package body. PQFP's are predominantly Flat Package square in shape, although rectangular variants aka PQFP do exist. The PQFP is just one of the many types of the quad flat pack (QFP) package. The Ceramic Column Grid Array, or CCGA, is a square-shaped or rectangular ceramic package that uses solder columns for external electrical Ceramic connection instead of leads or solder balls. Column Grid These solder columns are arranged in a grid or Array, or array at the bottom of the ceramic package CCGA body, hence the name 'ceramic column grid array'. The CCGA is basically just a CBGA package that has solder columns instead of solder balls. The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. PSOP - Power Small Outline Package PrayogWiki - http://wiki.electroons.com/ Last update: 2012/09/01 09:06 ic_packages http://wiki.electroons.com/doku.php?id=ic_packages The Ceramic Dual In-line Package, or CerDIP is CerDIP - one of the most mature IC packages still in use Ceremic Dual today. It is a rectangular ceramic package that In-line has leads extending from both of its longer Package sides, thus forming two sets of in-line pins. The Quad Flat No Leads package, or QFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. It is basically a quad flat package, except for the absence of leads protruding from its sides. Metal pads or lands around the periphery of the bottom of the QFN package serve as electrical QFN - Quad connection points to the outside world. Because Flat No Leads the QFN has no leads and has shorter bond wire lengths, it exhibits less inductance than leaded packages and therefore provides a higher electrical performance. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die. The Ceramic Package, or Cerpack, is a hermetically sealed rectangular ceramic Ceramic package that has leads extending from both of Package, or its longer sides, thus forming two sets of in-line Cerpack pins. It is therefore a type of dual-in-line package (DIP) like the CerDIP. The Quarter Size Outline Package, or QSOP, is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides.The QSOP comes in two QSOP - standard body widths: the narrow body QSOP Quarter Size which has a nominal body thickness of 150 mils Outline and the wide body QSOP which has a nominal Package body thickness of 300 mils. Typical QSOP lead counts range from 16 to 28 leads for the narrow body and 36 to 44 leads for the wide body. The QSOP lead pitch is typically 25 mils. http://wiki.electroons.com/ Printed on 2012/09/01 09:08 2012/09/01 09:08 3/9 General Note #1 :Different kinds of IC Packages The Ceramic Leadless Chip Carrier, or CLCC or LCC, is a square or rectangular surface-mount CLCC or LCC - ceramic package that has no leads. For Ceramic electrical connection to the outside world, the Leadless Chip LCC instead uses flat metal contacts (or Carrier metallized castellations) known as pads around the four sides of the package bottom. The Sidebraze Package, is one of the most mature IC packages still in use today. It is a rectangular ceramic package that has leads Sidebraze extending from both of its longer sides, thus Package forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP). Two other widely used DIP's are the PDIP and the CerDIP. The Ceramic Pin Grid Array, or CPGA, is a square or rectangular through-hole ceramic package whose pins or leads are arranged in a square array at the bottom of the package body. The CPGA - CPGA can either have a frit-sealed ceramic lid or Ceramic Pin a solder-sealed metal lid.The CPGA is just one of Grid Array several types of the PGA package. The PGA is a popular choice for devices with high I/O counts such as microprocessors because of its high pin density. Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two Small Outline long sides. Due to their low cost and low profile, Transistor SOT's are widely used in consumer electronics. (SOT) The SOT-23 and the SC-70 packages are two of Package the most widely used SOT packages today. Note that aside from these two, there are many other SOT package types used in the IC industry. The Ceramic Quad Flat Pack, or CQFP, is a ceramic IC package with leads extending from CQFP - all four sides of the package body. CQFP's are Ceramic predominantly square in shape, although Quad Flat rectangular variants do exist. The CQFP is just Pack one of the many types of the quad flat pack (QFP) package. PrayogWiki - http://wiki.electroons.com/ Last update: 2012/09/01 09:06 ic_packages http://wiki.electroons.com/doku.php?id=ic_packages The Single-in-Line Package, or SIP, is an IC package that has a single row of leads protruding from the bottom of its body. It is not Single-in-Line as widely used as dual-in-line packages such as Package (SIP) the PDIP and the CerDIP because of its limited number of pins. SIP's are often used in packaging networks of multiple resistors. The Double Decawatt Package, or D2PAK or DDPAK is the successor to the DPAK package, which was designed by Motorola to encase D2PAK or discrete high-power devices. The D2PAK is DDPAK - bigger than the DPAK, and comes in several Double versions with different terminal counts. The Decawatt D2PAK, which has a flat heat sink at the back, is Package basically the surface-mount equivalent of the TO-220 through-hole package and is therefore sometimes referred to as 'SMD-220'. The D2PAK is also known as 'TO-263'. The 'Small Outline Integrated Circuit', or SOIC, is SOIC - Small a small rectangular surface-mount Outline plastic-molded integrated circuit package with Integrated gull wing leads. The leads protrude from the Circuit longer edge of the package. It is one of the most commonly used surface mount packages today. The Decawatt Package 3, or D3PAK, is a bigger version of the D2PAK package. Just like the D2PAK (and the DPAK, the D2PAK's D3PAK - predecessor), the D3PAK is a surface-mount Decawatt plastic-molded package intended for high-power Package 3 discrete devices. The D3PAK is also known by other names such as 'TO-268' and 'Discrete Package 3'. The 'Small Outline J-Lead Package', or SOJ, is a SOJ: Small small rectangular surface-mount plastic-molded Outline integrated circuit package with J-formed leads. J-Lead The leads protrude from the longer edge of the Package package. The SOJ is also sometimes referred to as 'SOIJ', or J-leaded small outline IC package. http://wiki.electroons.com/ Printed on 2012/09/01 09:08 2012/09/01 09:08 5/9 General Note #1 :Different kinds of IC Packages The Dual Flat No Leads package, or DFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. Metal pads or lands along two sides of the DFN - Dual bottom of the DFN package serve as electrical Flat No Leads connection points to the outside world. The DFN is similar to the QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the DFN. The Decawatt Package, or DPAK, is an IC package developed by Motorola to encase DPAK - discrete high-power devices. The DPAK is also Decawatt known as the 'TO-252'. The acronym 'DPAK' can Package also stand for the term 'Discrete Package'.DPAKs can have 3 or 5 terminals. The Shrink Plastic Dual In-line Package, or SPDIP, is a rectangular plastic package with leads SPDIP - extending from both of its long sides, thus Shrink Plastic forming two sets of in-line pins. The SPDIP is Dual-in-Line actually just a 'shrink' version of the PDIP. As Package such, the SPDIP provides a smaller package size compared to a standard PDIP for the same lead count. The Fine Pitch Ball Grid Array, or FPBGA or FBGA, is a smaller version of the ball grid array (BGA) package. As in all BGA packages, FBGA's use FBGA - solder balls that are arranged in a grid or array Fine-Pitch at the bottom of the package body for external Ball Grid electrical connection.
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